公开(公告)号：US20150264809A1

公开(公告)日：2015-09-17

申请号：US14475209

申请日：2014-09-02

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Masayuki AOYAMA ,  Atsushi WATANABE

IPC: H05K1/11 ,  H01L23/31 ,  H05K3/24 ,  H05K1/02 ,  H05K3/06 ,  H01L23/00 ,  H01L23/498

CPC classification number: H05K1/111 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/45144 ,  H01L2224/48228 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/2064 ,  H05K1/0284 ,  H05K1/113 ,  H05K3/061 ,  H05K3/24 ,  H05K3/3452 ,  H05K3/4007 ,  H05K2201/09845 ,  H05K2201/099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: According to one embodiment, a wiring substrate includes a second wiring layer, including a plurality of metal lands provided on a second surface of an insulating base material, and an insulating layer formed on the second surface of the insulating base material and including openings exposing the plurality of metal lands. The metal land includes a center portion with a first height and an outer peripheral portion with a second height lower than the first height, which is provided at least about the periphery of the insulating base. The openings expose the metal lands, such that the center portion of the metal land is exposed and at least a portion of the outer peripheral portion of the metal land is covered with the insulating layer.

Abstract translation: 根据一个实施例，布线基板包括第二布线层，第二布线层包括设置在绝缘基材的第二表面上的多个金属焊盘，以及形成在绝缘基材的第二表面上的绝缘层， 多个金属土地。 金属焊盘包括至少围绕绝缘基体周边设置的具有第一高度的中心部分和具有比第一高度低的第二高度的外周部分。 这些开口使金属焊盘露出，使得金属焊盘的中心部分露出，金属焊盘的外周部的至少一部分被绝缘层覆盖。

公开(公告)号：US20150208501A1

公开(公告)日：2015-07-23

申请号：US14417751

申请日：2013-05-17

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Takahiro Hayashi ,  Makoto Nagai ,  Seiji Mori ,  Tomohiro Nishida ,  Makoto Wakazono ,  Tatsuya Ito

IPC: H05K1/11 ,  G03F7/30 ,  G03F7/20 ,  H05K1/02

CPC classification number: H05K1/111 ,  G03F7/038 ,  G03F7/20 ,  G03F7/2024 ,  G03F7/30 ,  H01L23/49822 ,  H01L2224/16237 ,  H05K1/0298 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/4644 ,  H05K2201/09409 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2201/09845 ,  H05K2201/099 ,  H05K2201/10674 ,  H05K2203/058 ,  H05K2203/0594 ,  H05K2203/1476

Abstract: To provide a wiring board excellent in connection reliability with a semiconductor chip. A first buildup layer 31 where resin insulating layers 21 and 22 and a conductor layer 24 are laminated is formed at a substrate main surface 11 side of an organic wiring board 10. The conductor layer 24 for an outermost layer in the first buildup layer 31 includes a plurality of connecting terminal portions 41 for flip-chip mounting a semiconductor chip. The plurality of connecting terminal portions 41 is exposed through an opening portion 43 of a solder resist layer 25. Each connecting terminal portion 41 includes a connection region 51 for a semiconductor chip and a wiring region 52 disposed to extend from the connection region 51 along the planar direction. The solder resist layer 25 includes, within the opening portion 43, a side-surface covering portion 55 that covers the side surface of the connecting terminal portion 41 and a projecting wall portion 56 that is integrally formed with the side-surface covering portion 55 and disposed to project so as to intersect with the connection region 51.

Abstract translation: 提供与半导体芯片的连接可靠性优异的布线板。 在有机布线板10的基板主表面11侧形成有树脂绝缘层21,22和导体层24层叠的第一堆积层31.第一堆积层31中的最外层的导体层24包括 多个用于倒装芯片安装半导体芯片的连接端子部分41。 多个连接端子部分41通过阻焊层25的开口部分43露出。每个连接端子部分41包括用于半导体芯片的连接区域51和从连接区域51延伸的布线区域52 平面方向。 阻焊层25在开口部43内具有覆盖连接端子部41的侧面的侧面覆盖部55和与侧面覆盖部55一体形成的突出壁部56， 被设置为突出以与连接区域51相交。

公开(公告)号：US08993892B2

公开(公告)日：2015-03-31

申请号：US13353527

申请日：2012-01-19

Applicant: Toru Yamashita

Inventor： Toru Yamashita

IPC: H05K1/00 ,  B05D5/12 ,  H05K1/11 ,  H05K3/28 ,  H05K1/03 ,  H05K3/46 ,  H05K1/02 ,  H05K1/18 ,  H05K3/36

CPC classification number: H05K1/118 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/28 ,  H05K3/361 ,  H05K3/4691 ,  H05K2201/09481 ,  H05K2201/0969 ,  H05K2201/099

Abstract: A wiring board includes: a substrate; first connection electrode portions which are disposed on a surface of the substrate and which are to be connected to individual-electrode connection terminals of an actuator via first bumps; first wires having electrical continuity with the first connection electrode portions; a second connecting electrode portion which is disposed on the surface of the substrate and which is to be connected to the a common-electrode connection terminal of the actuator via a second bump; and a second wire having electrical continuity with the second connection electrode portion. The second connecting electrode portion is located in an edge portion of the substrate. The second wire has a conducive-material absent portion that is located between an edge of the substrate and the second connecting electrode portion.

Abstract translation: 布线基板包括：基板; 第一连接电极部，其设置在基板的表面上，并且经由第一凸块与致动器的各个电极连接端子连接; 与第一连接电极部分具有电连续性的第一布线; 第二连接电极部，其设置在所述基板的表面上，并且经由第二凸块与所述致动器的公共电极连接端子连接; 以及与所述第二连接电极部分具有导电性的第二导线。 第二连接电极部位于基板的边缘部。 第二线具有位于基板的边缘和第二连接电极部分之间的导电材料缺失部分。

公开(公告)号：US08987899B2

公开(公告)日：2015-03-24

申请号：US13357046

申请日：2012-01-24

Applicant: Hiroshi Asami

Inventor： Hiroshi Asami

IPC: H01L23/48 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H05K1/11 ,  H05K3/34 ,  H05K3/28 ,  H01L23/00

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/3142 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/73204 ,  H01L2224/81024 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2924/00013 ,  H01L2924/12042 ,  H05K1/111 ,  H05K3/28 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/099 ,  H05K2203/0315 ,  H05K2203/043 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49155 ,  H01L2224/11 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/00

Abstract: A circuit board includes: an electrode portion which has a copper layer, a copper oxide layer formed thereon, and a removal portion formed by partially removing the copper oxide layer so as to partially expose the copper layer from the copper oxide layer; and a solder bump for flip chip mounting formed on the copper layer exposed by the removal portion.

Abstract translation: 电路板包括：具有铜层，形成在其上的氧化铜层的电极部分和通过部分去除氧化铜层而形成的去除部分，以从铜氧化物层部分地露出铜层; 以及在由去除部分露出的铜层上形成的用于倒装芯片安装的焊料凸块。

公开(公告)号：US20150053456A1

公开(公告)日：2015-02-26

申请号：US14134534

申请日：2013-12-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： CHANG BO LEE ,  MYEONG HO HONG ,  DAE JO HONG ,  YOUNG KYU LIM

IPC: H05K1/11 ,  H05K3/22

CPC classification number: H05K3/3452 ,  H05K2201/099 ,  H05K2203/0574

Abstract: A printed circuit board and a manufacturing method thereof. The manufacturing method of the printed circuit board includes: coating a first solder resist on an upper surface of a substrate having a circuit pattern formed thereon; removing the first solder resist in the remaining portion except a first specific area by performing primary development after exposing the substrate coated with the first solder resist; coating a second solder resist, which has different properties from the first solder resist, on the upper surface of the substrate having the first solder resist remaining in the first specific area; and removing the second solder resist in the remaining portion except a second specific area by performing secondary development after exposing the substrate coated with the second solder resist.

Abstract translation: 印刷电路板及其制造方法。 印刷电路板的制造方法包括：在其上形成有电路图案的基板的上表面上涂覆第一阻焊剂; 通过在涂覆有第一阻焊剂的基板曝光之后进行初步显影，除去除第一特定区域之外的剩余部分中的第一阻焊层; 在具有保留在第一特定区域中的第一阻焊层的基板的上表面上涂覆具有与第一阻焊剂不同的性质的第二阻焊剂; 以及通过在涂覆有第二阻焊剂的基板曝光之后进行二次显影，除去第二比表面积之外的剩余部分中的第二阻焊剂。

公开(公告)号：US08958211B2

公开(公告)日：2015-02-17

申请号：US13300701

申请日：2011-11-21

Applicant: Yoshiyuki Hiroshima ,  Akiko Matsui ,  Mitsuhiko Sugane ,  Takahide Mukoyama ,  Tetsuro Yamada ,  Takahiro Ooi

Inventor： Yoshiyuki Hiroshima ,  Akiko Matsui ,  Mitsuhiko Sugane ,  Takahide Mukoyama ,  Tetsuro Yamada ,  Takahiro Ooi

IPC: H05K7/10 ,  H05K1/18

CPC classification number: H05K1/181 ,  H05K1/18 ,  H05K2201/099

Abstract: An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings.

Abstract translation: 一种电子设备包括一个包括多个端子的电子部件和一个安装有电子部件的电路板。 电路板包括板体，布置在板体上的多个电极焊盘，每个电极焊盘通过焊料连接到每个端子;第一阻焊剂，形成在电路板主体上，并具有多个第一开口 每个所述第一开口容纳每个所述电极焊盘;以及第二阻焊剂，形成在所述第一阻焊层上，并且具有多个第二开口，每个所述第二开口大于每个所述第一开口， 第一个开口。

公开(公告)号：US20140326486A1

公开(公告)日：2014-11-06

申请号：US14265475

申请日：2014-04-30

Applicant: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： CHAO-RONG LAI

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/113 ,  H05K1/0206 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10727 ,  H05K2203/0591

Abstract: A printed circuit board (PCB) comprising a base board, the base board defines a thermal pad and a plurality of pin pads for solder an integrated circuit (IC) with a Quad Flat No-lead (QFN) package, wherein a plurality of thermal vias are defined on the thermal pad through the base board, a solder mask is defined around each of the thermal vias.

Abstract translation: 一种包括基板的印刷电路板（PCB），所述基板限定了散热焊盘和用于焊接具有四方扁平无引线（QFN）封装的集成电路（IC））的多个焊盘，其中多个热 通过基板在热垫上限定通孔，围绕每个热通孔限定焊接掩模。

公开(公告)号：US20140313682A1

公开(公告)日：2014-10-23

申请号：US14257006

申请日：2014-04-21

Applicant: NIHON DEMPA KOGYO CO., LTD.

Inventor： HIROYUKI MITOME

IPC: H05K1/02

CPC classification number: H05K3/3452 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3426 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10424 ,  H05K2201/10462 ,  H05K2201/10553 ,  H05K2201/10651 ,  H05K2201/10969 ,  Y02P70/613

Abstract: A composite electronic component includes a metal component with a wide surface terminal, a printed circuit board with a wide surface mounting pad; and a plurality of small area solder films partitioned into small sectioned regions. The small sectioned regions are sectioned by grid-shaped solder resist banks on the wide surface mounting pad. A cream solder is applied on the individual small sectioned regions to form the plurality of small area solder films. The grid-shaped solder resist bank has a width configured to: reduce a bubble that occurs in the sectioned region at one side of the grid-shaped solder resist bank from merging with a bubble that occurs in the sectioned region at another side of the grid-shaped solder resist bank; and act as an escaping route for a bubble that occur in the small area solder film.

Abstract translation: 复合电子部件包括具有宽表面端子的金属部件，具有宽表面安装焊盘的印刷电路板; 以及划分成小截面区域的多个小面积焊料膜。 小截面区域由宽表面安装垫上的格栅状阻焊堤分段。 在各个小截面区域上施加膏状焊料以形成多个小面积的焊料膜。 栅格形阻焊堤具有一宽度，该宽度被配置为：减小在栅极阻焊堤一侧的截面区域中发生的气泡，与在栅格另一侧的截面区域中发生的气泡合并 形阻焊银行; 并作为发生在小面积焊料膜中的气泡的逸出路线。

公开(公告)号：US20140174811A1

公开(公告)日：2014-06-26

申请号：US14070072

申请日：2013-11-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Soon KIM

IPC: H05K3/40 ,  H05K1/11

CPC classification number: H05K3/4007 ,  H05K3/1283 ,  H05K3/3436 ,  H05K2201/099 ,  H05K2203/0571 ,  H05K2203/107 ,  Y10T29/49165

Abstract: Disclosed herein are a printed circuit board and a manufacturing method thereof. The manufacturing method of the printed circuit board according to an exemplary embodiment of the present invention includes forming an insulating layer for a circuit pattern protection on a base substrate having a predetermined circuit pattern on at least one surface thereof; removing a part of the insulating layer to form an opened region having a predetermined pattern; applying copper particles onto the insulating layer including the opened region and then irradiating laser on a portion corresponding to the opened region; and fusing the copper particles applied onto the opened region by the laser irradiation to one another to form a copper post on the opened region.

Abstract translation: 这里公开了一种印刷电路板及其制造方法。 根据本发明的示例性实施例的印刷电路板的制造方法包括在其至少一个表面上在具有预定电路图案的基底基板上形成用于电路图案保护的绝缘层; 去除所述绝缘层的一部分以形成具有预定图案的开口区域; 将铜颗粒施加到包括开放区域的绝缘层上，然后在与开放区域对应的部分上照射激光; 并且通过激光照射将施加到打开区域上的铜颗粒彼此熔合，以在开放区域上形成铜柱。

公开(公告)号：US20140158751A1

公开(公告)日：2014-06-12

申请号：US14119148

申请日：2013-02-26

Applicant: PANASONIC CORPORATION

Inventor： Koji Motomura ,  Arata Kishi ,  Hiroki Maruo ,  Yasuhiro Suzuki ,  Hironori Munakata

IPC: H05K13/04

CPC classification number: H05K13/0465 ,  H01L21/4867 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/98 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/0556 ,  H01L2224/06181 ,  H01L2224/06187 ,  H01L2224/16235 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/81192 ,  H01L2224/8159 ,  H01L2224/816 ,  H01L2224/81815 ,  H01L2224/81862 ,  H01L2224/81885 ,  H01L2224/83886 ,  H01L2924/01322 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A wiring board on which an electronic component is to be mounted includes a resist having an opening exposing a joint face which is part of the surface of a wiring layer and to which a terminal of the electronic component is to be joined. In the placing step, the electronic component is placed on the wiring board such that the terminal covers the opening entirely and contacts the solder paste applied onto the joint face. Next, the solder paste applied onto the joint face is heated to melt solder and soften thermosetting resin. This allows the solder to gather in a first space within the opening closed with the wiring layer and the electronic component, while allowing the thermosetting resin to gather in a second space formed between a top side of the resist and a lateral side of the electronic component.

Abstract translation: 要安装电子部件的布线板包括具有露出作为布线层的表面的一部分的接合面的开口的抗蚀剂，并且电子部件的端子要被接合。 在放置步骤中，将电子部件放置在布线板上，使得端子完全覆盖开口并且接触施加到接合面上的焊膏。 接下来，将涂覆在接合面上的焊膏加热熔化焊料并软化热固性树脂。 这允许焊料在布线层和电子部件闭合的开口内的第一空间中聚集，同时允许热固性树脂聚集在形成在抗蚀剂的顶侧和电子部件的侧面之间的第二空间中 。