公开(公告)号：US09837041B2

公开(公告)日：2017-12-05

申请号：US15078268

申请日：2016-03-23

Applicant: FANUC Corporation

Inventor： Hiroshi Okita ,  Tohru Nishi

IPC: G09G5/00 ,  G09G5/36 ,  H05K1/02 ,  G06F1/16

CPC classification number: G09G5/005 ,  G06F1/16 ,  G06F1/1601 ,  G09G5/006 ,  G09G5/363 ,  G09G2320/08 ,  G09G2370/042 ,  H05K1/02 ,  H05K1/144 ,  H05K1/147 ,  H05K2201/10128 ,  H05K2201/10227

Abstract: Disclosed is a display unit provided with a display control printed circuit board with a circuit configured to generate a display signal for display by a display panel and a fixing metal plate for securing the display control printed circuit board. The display control printed circuit board is provided with identification information reading means for reading identification information of the display panel, a memory stored with set values for generating display signals corresponding to the sizes of a plurality of display panels, and a display controller configured to generate the display signals. The fixing metal plate comprises one or more members electrically connected to the display control printed circuit board and configured to transmit the identification information of the display unit to the display control printed circuit board. The identification information reading means reads a set value for the display panel from the memory, based on the identification information of the display panel derived from the one or more electrically connected members, and sets the set values in the display controller configured to generate the display signals.

公开(公告)号：US20170171970A1

公开(公告)日：2017-06-15

申请号：US15373583

申请日：2016-12-09

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki TANABE ,  Naohiro TERADA ,  Yuu SUGIMOTO ,  Daisuke YAMAUCHI

IPC: H05K1/05 ,  H05K3/22 ,  H05K3/46

CPC classification number: H05K1/05 ,  G11B5/483 ,  G11B5/4853 ,  H05K1/117 ,  H05K3/22 ,  H05K3/3442 ,  H05K3/4608 ,  H05K3/4644 ,  H05K2201/10151 ,  H05K2201/10227 ,  Y02P70/613

Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider, a cover insulating layer covering the conductor layer so as to expose the connecting terminal and disposed at the one side in the thickness direction of the base insulating layer, and a plating layer covering the connecting terminal. The cover insulating layer includes a first cover insulating layer disposed at the one side in the thickness direction of the base insulating layer and a second cover insulating layer disposed at one side in the thickness direction of the first cover insulating layer, and the thickness of the plating layer is not more than the total sum of the thickness of the first cover insulating layer and that of the second cover insulating layer.

公开(公告)号：US20170013714A1

公开(公告)日：2017-01-12

申请号：US15276073

申请日：2016-09-26

Applicant: International Business Machines Corporation

Inventor： Ai Kiar Ang ,  Michael Lauri

IPC: H05K1/11 ,  H05K1/03 ,  H01L23/495 ,  H01L25/10 ,  H01L25/00 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/11 ,  H01L21/4839 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49565 ,  H01L23/49575 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/1029 ,  H01L2924/181 ,  H05K1/0313 ,  H05K1/144 ,  H05K1/18 ,  H05K1/181 ,  H05K3/328 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10227 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10962 ,  Y02P70/613 ,  H01L2924/00012

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

Abstract translation: 一种方法包括形成具有两个或多个电子部件的多层电子器件，每个电子部件包括引线框，每个电子部件的引线框架使用非焊接金属接合工艺物理地接合在一起以形成接头，并且 接头位于焊接连接区域的外侧。

公开(公告)号：US20130048343A1

公开(公告)日：2013-02-28

申请号：US13235451

申请日：2011-09-18

Applicant: HAI-QING ZHOU

Inventor： HAI-QING ZHOU

IPC: H05K1/00

CPC classification number: G06F1/186 ,  H05K1/02 ,  H05K2201/09063 ,  H05K2201/10227 ,  H05K2201/10409

Abstract: The circuit board includes a main body, at least one handle, and at least one connecting element. The main body defines at least one through hole. One end of each of the at least one handle defines a positioning portion. The positioning portion of each of the at least one handle extends through a corresponding one of the at least one through hole and is engaged with one of the at least one connecting elements.

Abstract translation: 电路板包括主体，至少一个把手和至少一个连接元件。 主体限定至少一个通孔。 所述至少一个手柄中的每一个的一端限定定位部分。 所述至少一个手柄中的每一个的定位部分延伸穿过所述至少一个通孔中的对应的一个，并且与所述至少一个连接元件中的一个接合。

公开(公告)号：US12052823B2

公开(公告)日：2024-07-30

申请号：US17864562

申请日：2022-07-14

Applicant: Fulian Precision Electronics (Tianjin) Co., LTD.

Inventor： Chia-Kang Wu ,  Kun-Yang Cheng

IPC: H05K1/14

CPC classification number: H05K1/14 ,  H05K2201/09063 ,  H05K2201/10227 ,  H05K2201/2027

Abstract: A guiding device includes a first telescopic member, a second telescopic member, and an elastic member. The first telescopic member includes a main body with a sliding cavity. The second telescopic member includes a connecting portion and a guiding portion connected to the connecting portion. The guiding portion is slidably inserted into the sliding cavity. Opposite ends of the elastic member are respectively connected to the connecting portion and the main body. The elastic member pushes the main body in a direction away from the connecting portion. The disclosure also provides a mainboard connection structure having the above guiding device.

公开(公告)号：US20180027657A1

公开(公告)日：2018-01-25

申请号：US15491921

申请日：2017-04-19

Applicant: MACOM Technology Solutions Holdings, Inc.

Inventor： Jessica Aldrich ,  Paul Hogan

IPC: H05K1/18 ,  H05K3/32 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/11 ,  H05K3/301 ,  H05K3/32 ,  H05K2201/1003 ,  H05K2201/10227 ,  H05K2201/10265 ,  H05K2201/10484

Abstract: A system and method for placing an inductor on a circuit board. This method includes providing a circuit board, a pedestal, and an inductor, the pedestal has a top surface and a bottom surface and the circuit board has one or more electrical conductors, the inductor having a first inductor terminal and a second inductor terminal. Adhesive is placed on the circuit board and the bottom surface of the pedestal is placed on the adhesive located on the circuit board to secure the pedestal to the circuit board. Next, adhesive is placed on the top surface of the pedestal and the inductor is placed on the adhesive located on the top surface of the pedestal to secure the inductor to the pedestal. The inductor is electrically connected to the circuit board.

公开(公告)号：US09860982B1

公开(公告)日：2018-01-02

申请号：US15442699

申请日：2017-02-26

Applicant: XSENSOR Technology Corporation

Inventor： Ian Main ,  Timothy Carl Gorjanc

IPC: H05K1/09 ,  H05K3/32 ,  H05K1/05 ,  H05K1/03 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K1/09 ,  H05K1/028 ,  H05K1/038 ,  H05K1/05 ,  H05K3/32 ,  H05K3/328 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/0137 ,  H05K2201/10227 ,  H05K2203/11

Abstract: A process makes electrical connections between electrical wires and flexible conductive elements, such as conductive fabrics. The process makes strong electrical connections that are mechanically flexible and can simultaneously create multiple electrical connections. The process involves creating an assembly that includes at least a TPE layer, an electrical wire, an insulating layer, and a flexible conductive element, and applying heat and pressure to the assembly. For example, a conductive fabric is disposed on an insulating layer, a wire is positioned onto a surface of the insulating layer, and a TPE layer is disposed over the wire and overlaps the conductive fabric element. When applying the heat and pressure, the wire melts through the insulating layer to make electrical contact with the conductive fabric element, and the TPE layer conforms to an exterior of the wire and bonds to the insulating layer.

公开(公告)号：US20170339790A1

公开(公告)日：2017-11-23

申请号：US15674273

申请日：2017-08-10

Applicant: Conti Temic microelectronic GmbH

Inventor： Frieder Wittmann ,  Karin Beart ,  Stefan Müller ,  Thomas Schmidt ,  Bernhard Schuch

IPC: H05K1/18 ,  H05K3/34 ,  H05K1/11 ,  H05K3/32

CPC classification number: H05K1/181 ,  H05K1/0204 ,  H05K1/11 ,  H05K3/0061 ,  H05K3/321 ,  H05K3/341 ,  H05K7/205 ,  H05K2201/066 ,  H05K2201/09745 ,  H05K2201/10227 ,  H05K2201/10545 ,  H05K2201/1056 ,  H05K2203/049

Abstract: The disclosure relates to an electronic component that includes a printed circuit board with two opposite flat sides and a plurality of electronic components, and a base plate. A number of the electronic components are each fixed on and electrically conductively connected to a rear flat side of the printed circuit board and a further number of the electronic components are each fixed on and electrically conductively connected to a front flat side of the printed circuit board. The base plate has at least one first cutout for receiving electronic components that are arranged on the rear flat side of the printed circuit board. The disclosure also relates to a method for producing an electronic component of this kind.

公开(公告)号：US09474153B2

公开(公告)日：2016-10-18

申请号：US14885405

申请日：2015-10-16

Applicant: International Business Machines Corporation

Inventor： Ai Kiar Ang ,  Michael Lauri

IPC: H01L23/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K1/14 ,  H01L23/495 ,  H01L25/10 ,  H01L25/00

CPC classification number: H05K1/11 ,  H01L21/4839 ,  H01L23/49537 ,  H01L23/49555 ,  H01L23/49565 ,  H01L23/49575 ,  H01L25/105 ,  H01L25/50 ,  H01L2225/1029 ,  H01L2924/181 ,  H05K1/0313 ,  H05K1/144 ,  H05K1/18 ,  H05K1/181 ,  H05K3/328 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10227 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10962 ,  Y02P70/613 ,  H01L2924/00012

Abstract: A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region.

公开(公告)号：US20160284310A1

公开(公告)日：2016-09-29

申请号：US15078268

申请日：2016-03-23

Applicant: FANUC Corporation

Inventor： Hiroshi OKITA ,  Tohru NISHI

IPC: G09G5/00 ,  G09G5/36 ,  H05K1/02

CPC classification number: G09G5/005 ,  G06F1/16 ,  G06F1/1601 ,  G09G5/006 ,  G09G5/363 ,  G09G2320/08 ,  G09G2370/042 ,  H05K1/02 ,  H05K1/144 ,  H05K1/147 ,  H05K2201/10128 ,  H05K2201/10227

Abstract: Disclosed is a display unit provided with a display control printed circuit board with a circuit configured to generate a display signal for display by a display panel and a fixing metal plate for securing the display control printed circuit board. The display control printed circuit board is provided with identification information reading means for reading identification information of the display panel, a memory stored with set values for generating display signals corresponding to the sizes of a plurality of display panels, and a display controller configured to generate the display signals. The fixing metal plate comprises one or more members electrically connected to the display control printed circuit board and configured to transmit the identification information of the display unit to the display control printed circuit board. The identification information reading means reads a set value for the display panel from the memory, based on the identification information of the display panel derived from the one or more electrically connected members, and sets the set values in the display controller configured to generate the display signals.

Abstract translation: 公开了一种具有显示控制印刷电路板的显示单元，电路被配置为产生用于显示面板显示的显示信号和用于固定显示控制印刷电路板的固定金属板。 显示控制印刷电路板设置有用于读取显示面板的识别信息的识别信息读取装置，存储有用于生成对应于多个显示面板的尺寸的显示信号的设定值的存储器和被配置为产生 显示信号。 固定金属板包括电连接到显示控制印刷电路板的一个或多个构件，并被配置为将显示单元的识别信息传送到显示控制印刷电路板。 识别信息读取装置基于从一个或多个电气连接的构件导出的显示面板的识别信息，从存储器读取显示面板的设定值，并且将配置为生成显示的显示控制器中的设定值 信号。