公开(公告)号：US09480151B2

公开(公告)日：2016-10-25

申请号：US13574789

申请日：2011-01-31

Applicant: Margaretha Maria De Kok ,  Jeroen Van Den Brand ,  Gerardus Titus Van Heck

Inventor： Margaretha Maria De Kok ,  Jeroen Van Den Brand ,  Gerardus Titus Van Heck

IPC: H05K1/00 ,  H05K1/02 ,  H01L27/32 ,  H01L51/52 ,  H01R4/70 ,  H05K3/36 ,  H05B33/08 ,  H05B33/10 ,  H05K13/04 ,  H01L31/0392 ,  H01L31/042 ,  G09F9/00 ,  G09F19/22 ,  H01R4/04 ,  H01R12/70 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: An assembly of a plurality of tiles (1) with a carrier (40), wherein the tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier, and the tiles overlay according to a fish scale pattern.

Abstract translation: 具有载体（40）的多个瓦片（1）的组件，其中瓦片（1）包括具有电 - 物理换能器（10）的箔（20）和到所述换能器的电连接器（24,28）。 瓦片机械地和电耦合到载体上，并且瓦片根据鱼鳞图案覆盖。

公开(公告)号：US20160288272A1

公开(公告)日：2016-10-06

申请号：US15038177

申请日：2013-11-21

Applicant: HERAEUS DEUTSCHLAND GMBH & CO. KG

Inventor： Annette LUKAS ,  Patrick WENZEL ,  Michael DEUSCHLE ,  Eugen MILKE ,  Sven THOMAS ,  Jürgen SCHARF

IPC: B23K35/40 ,  B23K35/02 ,  H01L23/00 ,  B23K35/32 ,  C23F17/00 ,  C23C18/08 ,  B23K35/30

CPC classification number: B23K35/40 ,  B23K20/007 ,  B23K20/10 ,  B23K35/0261 ,  B23K35/0272 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/322 ,  B23K35/404 ,  B23K2101/42 ,  C22F1/08 ,  C23C14/14 ,  C23C18/08 ,  C23C28/00 ,  C23C30/00 ,  C23F17/00 ,  C25D5/34 ,  C25D7/0607 ,  H01B1/026 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/745 ,  H01L24/85 ,  H01L2224/05124 ,  H01L2224/05624 ,  H01L2224/4321 ,  H01L2224/43823 ,  H01L2224/43825 ,  H01L2224/43826 ,  H01L2224/43848 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45663 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45673 ,  H01L2224/45676 ,  H01L2224/45678 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48824 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01076 ,  H01L2924/12044 ,  H01L2924/181 ,  H05K1/09 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T428/12875 ,  Y10T428/12889 ,  H01L2924/00 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01046 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/01014 ,  H01L2924/013 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20305 ,  H01L2924/00012 ,  H01L2924/01006 ,  H01L2924/01001 ,  H01L2924/01008 ,  H01L2924/01007 ,  H01L2924/01204 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/00013 ,  H01L2924/01049 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/206

Abstract: A bonding wire according to the invention contains a core having a surface and a coating layer which is at least partially superimposed over the surface of the core. The core contains a core main component selected from copper and silver and the coating layer contains a coating component selected from palladium, platinum, gold, rhodium, ruthenium, osmium and iridium. The coating layer is applied on the surface of the core by depositing a film of a liquid containing a coating component precursor onto a wire core precursor and heating the deposited film to decompose the coating component precursor into a metallic phase.

Abstract translation: 根据本发明的接合线包含具有表面的芯和至少部分地叠置在芯的表面上的涂层。 芯包含选自铜和银的核心主要成分，涂层含有选自钯，铂，金，铑，钌，锇和铱的涂层成分。 通过将含有涂层组分前体的液体的膜沉积到芯芯前体上并加热沉积膜以将涂层组分前体分解成金属相，将涂层施加在芯的表面上。

公开(公告)号：US20160286651A1

公开(公告)日：2016-09-29

申请号：US14905507

申请日：2015-06-16

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Defeng MAO ,  Yanbing WU

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/30 ,  H05K1/09 ,  H05K3/40 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K1/18 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/141 ,  H05K3/30 ,  H05K3/4007 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/10136 ,  H05K2201/10287 ,  H05K2203/049

Abstract: The present invention provides a circuit board, a manufacturing method thereof and a display device. The circuit board comprises a base substrate, a circuit module and a pad, the circuit module and the pad are arranged on the base substrate and are connected. The present invention uses base substrate to replace PCB in the prior art; and therefore, the production cycle of product can be shortened; moreover, the base substrate has a smaller thickness than the PCB, and the thickness of a display device is thus decreased; in the present invention, circuit modules are all provided on the same base substrate, therefore, the space occupied by the circuit modules is decreased, integration is improved, circuit impedance and path length are reduced, and operating speed of the circuit modules is enhanced.

Abstract translation: 本发明提供一种电路板及其制造方法和显示装置。 电路板包括基底，电路模块和衬垫，电路模块和衬垫布置在基底上并被连接。 本发明使用基底来替代现有技术中的PCB; 因此，可以缩短产品的生产周期; 此外，基底基板具有比PCB更薄的厚度，因此显示装置的厚度减小; 在本发明中，电路模块全部设置在同一基板上，因此电路模块占用的空间减小，集成度提高，电路阻抗和路径长度减小，电路模块的运行速度提高。

公开(公告)号：US20160284637A1

公开(公告)日：2016-09-29

申请号：US15172029

申请日：2016-06-02

Applicant: Qing Ma ,  Quan A. Tran ,  Robert L. Sankman ,  Johanna M. Swan ,  Valluri R. Rao

Inventor： Qing Ma ,  Quan A. Tran ,  Robert L. Sankman ,  Johanna M. Swan ,  Valluri R. Rao

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/367 ,  H01L23/15

CPC classification number: H05K1/112 ,  H01L21/4803 ,  H01L21/486 ,  H01L23/15 ,  H01L23/3675 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/10253 ,  H05K3/0014 ,  H05K3/4605 ,  H05K3/4644 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10287 ,  H05K2201/10371 ,  H05K2201/10674 ,  H05K2203/0108 ,  H05K2203/0228 ,  H05K2203/025 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Disclosed are embodiments of a glass core substrate for an integrated circuit (IC) device. The glass core substrate includes a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.

Abstract translation: 公开了用于集成电路（IC）装置的玻璃芯基板的实施例。 玻璃芯基板包括在玻璃芯的相对侧上的玻璃芯和堆积结构。 导电端子可以形成在玻璃芯基板的两侧。 IC芯片可以与衬底的一侧上的端子耦合，而相对侧上的端子可以与诸如电路板的下一级组件耦合。 玻璃芯可以包括其中已经形成导体的单片玻璃，或者玻璃芯可以包括已经连接在一起的两个或更多个玻璃部分，每个部分具有导体。 导体延伸穿过玻璃芯，并且一个或多个导体可以与设置在玻璃芯上的积聚结构电耦合。 描述和要求保护其他实施例。

公开(公告)号：US09417344B1

公开(公告)日：2016-08-16

申请号：US14630968

申请日：2015-02-25

Applicant: Teledyne DALSA, Inc.

Inventor： Anton Petrus Maria van Arendonk

IPC: G01T1/10 ,  G01T7/00 ,  G01T1/20 ,  G01T1/24 ,  H05K3/32

CPC classification number: H05K1/117 ,  H01L24/01 ,  H05K3/3426 ,  H05K2201/10151 ,  H05K2201/10287 ,  H05K2201/10977

Abstract: Wirebond protection is provided for imaging tiles in which the imaging sensor and PCB are mounted side-by-side on a tile carrier for use in X or Gamma Ray indirect imaging detectors without use of a “glob top” encapsulant. A glass cap comprising a bead of adhesive material and a lid is formed to provide an enclosed open-air cavity around the wire bonds. As such, any expansion of the bead material does not produce mechanical stress on the wire bonds.

Abstract translation: 提供了用于成像瓦片的成像瓦片，其中成像传感器和PCB并排安装在瓦片载体上以用于X或伽马射线间接成像检测器，而不使用“球顶”密封剂。 形成包括粘合剂材料珠和盖的玻璃盖，以在引线接合周围提供封闭的露天空腔。 因此，珠粒材料的任何膨胀不会对引线接合产生机械应力。

公开(公告)号：US09408305B2

公开(公告)日：2016-08-02

申请号：US14947558

申请日：2015-11-20

Applicant: MC10, Inc.

Inventor： Yung-Yu Hsu

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03 ,  H05K1/16 ,  H01R9/00 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/185 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/118 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09245 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2009

Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

公开(公告)号：US09360814B2

公开(公告)日：2016-06-07

申请号：US14601720

申请日：2015-01-21

Applicant: CANON KABUSHIKI KAISHA

Inventor： Shinsuke Serizawa

IPC: G03G15/00 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K1/0296 ,  G03G15/50 ,  G03G15/80 ,  G03G21/1652 ,  H05K1/0269 ,  H05K1/117 ,  H05K3/4015 ,  H05K3/403 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/09181 ,  H05K2201/10287 ,  H05K2201/10363

Abstract: The printed board includes a slit portion and a first conductive member that is provided straddling the slit portion. In a state in which the printed board is attached to an apparatus to which one end of a second conductive member having an elastic force is connected, another end of the second conductive member contacts the first conductive member, and the another end of the second conductive member passes through the slit portion.

Abstract translation: 印刷电路板包括狭缝部分和跨越狭缝部分设置的第一导电部件。 在印刷电路板连接到具有弹性力的第二导电构件的一端连接的装置的状态下，第二导电构件的另一端接触第一导电构件，而第二导电构件的另一端 构件穿过狭缝部分。

公开(公告)号：US20160129629A1

公开(公告)日：2016-05-12

申请号：US14885079

申请日：2015-10-16

Applicant: Smart Res Societa' per Azioni

Inventor： Marcello Lolli

IPC: B29C65/48

CPC classification number: B29C65/4815 ,  B29L2031/34 ,  B32B7/12 ,  G06K19/07718 ,  H01Q7/00 ,  H05K3/20 ,  H05K2201/10287 ,  Y10T156/1089

Abstract: A transferring assembly for transferring onto an object a RFID identification device consisting of a microchip connected to an antenna made of electrically conductive material, wherein a film of adhesive material is applied to a supporting element, the microchip is applied on the film of adhesive material in a zone of the supporting element, the antenna is formed by applying the wire made of electrically conductive material to the film of adhesive material and electrically connecting the antenna to the microchip, and the zone is pressed against a surface of the object, with the RFID identification device facing the surface, the adhesive material, and/or the supporting element, being chosen so that the adhesive material has an adhesiveness on the surface of the object that is significantly greater than the adhesiveness of the film on the supporting element.

Abstract translation: 一种传送组件，用于将物体上的RFID识别装置传送到由导电材料制成的天线连接的RFID识别装置，其中将粘合剂材料膜施加到支撑元件上，将微芯片施加到粘合剂材料的膜上 支撑元件的区域，天线通过将由导电材料制成的线施加到粘合剂材料的膜并且将天线电连接到微芯片而形成，并且该区域被压靠在物体的表面上，其中RFID 面向表面的识别装置，粘合剂材料和/或支撑元件被选择为使得粘合剂材料在物体表面上具有明显大于膜在支撑元件上的粘附性的粘附性。

公开(公告)号：US20160050763A1

公开(公告)日：2016-02-18

申请号：US14460296

申请日：2014-08-14

Applicant: Apple Inc.

Inventor： Chiu-Yu Tang ,  Ibuki Kamei ,  Timothy J. Rasmussen

IPC: H05K3/28 ,  H05K1/11 ,  B23K1/20 ,  H05K3/34 ,  H05K13/04 ,  B23K1/00 ,  H05K1/18 ,  H05K1/02

CPC classification number: B23K1/20 ,  B23K1/0016 ,  B23K3/0471 ,  H05K3/284 ,  H05K3/34 ,  H05K3/3494 ,  H05K2201/10287 ,  H05K2203/1322 ,  H05K2203/304

Abstract: A method for connecting or terminating wires to a printed circuit is disclosed. The method includes applying layers, such as a first layer and a second layer, to the printed circuit. The first layer is applied over several active components on the printed circuit, and provides a sealant against ingress of contaminants in the active components. The second layer is a rigid layer applied over the first layer. When the printed circuit is placed in a fixture, a metallic element, such as a thermode or hot bar, presses against the wires to hold the wires against several terminals on the printed circuit. The metallic element is heated to melt solder between the wires and the terminals. The second layer is configured to resist compressive forces from the metallic element and the fixture, such that the printed circuit and the active components are not damaged during the connection process.

Abstract translation: 公开了一种用于将电线连接或接线到印刷电路的方法。 该方法包括将诸如第一层和第二层的层施加到印刷电路。 第一层施加在印刷电路上的几个活性组分上，并且提供了防止活性组分中的污染物侵入的密封剂。 第二层是施加在第一层上的刚性层。 当印刷电路放置在固定装置中时，诸如热电极或热棒之类的金属元件压在电线上，以将电线固定在印刷电路上的几个端子上。 金属元件被加热以在焊丝和端子之间熔化焊料。 第二层被配置为抵抗来自金属元件和夹具的压缩力，使得印刷电路和有源部件在连接过程中不被损坏。

公开(公告)号：US20150360316A1

公开(公告)日：2015-12-17

申请号：US14762556

申请日：2013-12-18

Applicant: HERAEUS DEUTSCHLAND GMBH & CO. KG

Inventor： Eugen MILKE ,  Jürgen SCHARF

IPC: B23K20/00 ,  B23K35/30 ,  B23K35/40 ,  H05K3/34 ,  C25D5/34 ,  H01L23/00 ,  H05K1/09 ,  B23K35/02 ,  C25D7/06

CPC classification number: B23K20/007 ,  B23K20/10 ,  B23K35/0261 ,  B23K35/0272 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/322 ,  B23K35/40 ,  B23K35/404 ,  B23K2101/42 ,  C23C14/14 ,  C23C18/08 ,  C23C28/00 ,  C23C30/00 ,  C25D5/34 ,  C25D7/0607 ,  H01B1/026 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/745 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/43125 ,  H01L2224/432 ,  H01L2224/4321 ,  H01L2224/435 ,  H01L2224/43823 ,  H01L2224/43825 ,  H01L2224/43826 ,  H01L2224/43848 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45663 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45673 ,  H01L2224/45676 ,  H01L2224/45678 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48824 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01076 ,  H01L2924/12044 ,  H01L2924/181 ,  H05K1/09 ,  H05K3/34 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T428/12875 ,  Y10T428/12889 ,  H01L2924/00 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/01046 ,  H01L2924/01006 ,  H01L2924/01001 ,  H01L2924/01008 ,  H01L2924/01007 ,  H01L2924/01204 ,  H01L2924/013 ,  H01L2924/20751 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20752 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/00013 ,  H01L2924/00012 ,  H01L2924/01049 ,  H01L2924/01005 ,  H01L2924/01004 ,  H01L2924/01033 ,  H01L2924/206

Abstract: The invention is related to a bonding wire which contains a core having a surface and a coating layer which is at least partially superimposed over the surface of the core. The core contains a core main component selected from copper and silver. The coating layer contains a coating component selected from palladium, platinum, gold, rhodium, ruthenium, osmium and iridium in an amount of at least 10% and further contains the core main component in an amount of at least 10%.

Abstract translation: 本发明涉及一种接合线，其包含具有表面的芯和至少部分地叠置在芯的表面上的涂层。 核心包含选自铜和银的核心主要成分。 涂层含有至少10％量的选自钯，铂，金，铑，钌，锇和铱的涂层组分，并且还含有至少10％的核心主要组分。