公开(公告)号：US08941228B2

公开(公告)日：2015-01-27

申请号：US14002043

申请日：2011-11-15

Applicant: Yoshihiro Kodaira

Inventor： Yoshihiro Kodaira

IPC: H01L23/498 ,  H01L21/768 ,  H01L23/14 ,  H01L23/24 ,  H01L25/07

CPC classification number: H01L23/498 ,  H01L21/76838 ,  H01L23/142 ,  H01L23/24 ,  H01L23/49811 ,  H01L25/072 ,  H01L2924/0002 ,  H05K2201/10166 ,  H05K2201/1031 ,  Y02P70/611 ,  H01L2924/00

Abstract: A semiconductor module is manufactured by bonding a resin case having a first opening through which surfaces of main circuit terminals and control terminals are exposed, onto a metal heat-dissipating substrate onto which is bonded, a conductive-patterned insulating substrate onto which are bonded, semiconductor chips, the main circuit terminals, and the control terminals; inserting into and attaching to a second opening formed on a side wall constituting a resin case, a resin body having a nut embedded therein to fix the main circuit terminals and the control terminals; and filling the resin case with a resin material. A side wall of the first opening is tapered toward the surface thereof; a tapered contact portion contacting the tapered side wall is disposed on the control terminal; and the resin body having the embedded nut fixes the control terminal having a one-footing structure that is an independent terminal.

Abstract translation: 半导体模块通过将具有第一开口的主体电路端子和控制端子露出的第一开口的树脂壳体接合到粘合的导电图案化绝缘基板上的金属散热基板上， 半导体芯片，主电路端子和控制端子; 插入并附接到形成在构成树脂壳体的侧壁上的第二开口，具有嵌入其中的螺母的树脂体，以固定主电路端子和控制端子; 并用树脂材料填充树脂壳体。 第一开口的侧壁朝向其表面逐渐变细; 在所述控制端子上设置与所述锥形侧壁接触的锥形接触部; 并且具有嵌入螺母的树脂体固定具有作为独立端子的单脚结构的控制端子。

公开(公告)号：US08934257B1

公开(公告)日：2015-01-13

申请号：US13484023

申请日：2012-05-30

Applicant: Boris Reynov ,  Jack Kohn ,  Victor Mei ,  Shreeram Siddhaye ,  Ben Nitzan ,  Venkata Penmetsa

Inventor： Boris Reynov ,  Jack Kohn ,  Victor Mei ,  Shreeram Siddhaye ,  Ben Nitzan ,  Venkata Penmetsa

IPC: H05K1/18

CPC classification number: H05K3/368 ,  H05K1/0243 ,  H05K1/025 ,  H05K2201/09445 ,  H05K2201/09736 ,  H05K2201/10272 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2203/162 ,  Y02P70/611

Abstract: In some embodiments, an apparatus includes a first substrate, a second substrate, a first coupler, and a second coupler. The first substrate is formed from a first material and includes an electrical pad. The second substrate is formed from a second material and includes an electrical pad. The first coupler is configured to mechanically couple the first substrate to the second substrate without a soldered connection. The second coupler includes a first end portion, configured to be soldered to the electrical pad of the first substrate, and a second end portion, configured to be soldered to the electrical pad of the second substrate. The second coupler configured to electrically couple the first substrate to the second substrate.

Abstract translation: 在一些实施例中，装置包括第一基板，第二基板，第一耦合器和第二耦合器。 第一衬底由第一材料形成并且包括电焊盘。 第二基板由第二材料形成并且包括电焊盘。 第一耦合器被配置为将第一衬底机械地耦合到第二衬底而没有焊接连接。 第二耦合器包括构造成焊接到第一衬底的电焊盘的第一端部分和被配置为焊接到第二衬底的电焊盘的第二端部。 第二耦合器被配置为将第一衬底电耦合到第二衬底。

公开(公告)号：US08931167B2

公开(公告)日：2015-01-13

申请号：US12929726

申请日：2011-02-11

Applicant: Shadi A. Abughazaleh ,  Joseph E. Dupuis ,  Christopher W. Gribble ,  Naved S. Khan ,  Douglas P. O'Connor

Inventor： Shadi A. Abughazaleh ,  Joseph E. Dupuis ,  Christopher W. Gribble ,  Naved S. Khan ,  Douglas P. O'Connor

IPC: H01R9/00 ,  H01R13/6466 ,  H05K3/32 ,  H01R24/64 ,  H01R13/24 ,  H01R13/405 ,  H01R13/66 ,  H01R107/00 ,  H05K1/18 ,  H05K3/40

CPC classification number: H01R24/64 ,  H01R13/24 ,  H01R13/2442 ,  H01R13/405 ,  H01R13/6466 ,  H01R13/6625 ,  H01R13/6658 ,  H01R24/62 ,  H01R43/20 ,  H01R43/205 ,  H01R2107/00 ,  H05K1/18 ,  H05K1/182 ,  H05K3/325 ,  H05K3/4015 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/1031 ,  H05K2201/10424 ,  H05K2201/10446 ,  Y02P70/611 ,  Y10S439/941 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151

Abstract: An electrical connector adapted to receive a mating plug utilizes low-profile jack terminal contacts that can flex in their PCB-anchored base portions, which are substantially parallel to the PCB. Any bend in the distal connecting portion or in the intermediate transition portion of each terminal contact is gradual and forms an obtuse angle, thus minimizing stress concentrations. The contacts preferably are arranged in two oppositely facing and interdigitating rows of four contacts each. In one embodiment, the terminal contacts are anchored to the PCB by a contact cradle that constrains the base portion of each terminal contact at two spaced anchoring locations, allowing the base portion to flex therebetween. In another embodiment, the base portions of the terminal contacts are embedded in at least one elastomeric member, which is fitted to the PCB.

Abstract translation: 适于接收配合插头的电连接器利用能够在其PCB固定的基座部分上弯曲的低轮廓的插座端子触头，其基本上平行于PCB。 每个末端接触件的远端连接部分或中间过渡部分中的任何弯曲是渐进的并且形成钝角，从而最小化应力集中。 触点优选地布置在两个相互面对的和交叉的四行触点中。 在一个实施例中，端子触头通过接触支架锚固到PCB，该接触支架将两个间隔开的锚固位置限制每个端子触头的基部，从而允许基部在其间弯曲。 在另一个实施例中，端子触点的基部嵌入至少一个弹性体构件中，该弹性构件安装到PCB上。

公开(公告)号：US08851930B2

公开(公告)日：2014-10-07

申请号：US13572010

申请日：2012-08-10

Applicant: Sheng-Wen Peng

Inventor： Sheng-Wen Peng

IPC: H01R24/00 ,  H01R13/6594 ,  H01R13/6461 ,  H05K1/11 ,  H05K1/02 ,  H01R12/57

CPC classification number: H01R13/6594 ,  H01R12/57 ,  H01R13/6461 ,  H05K1/0248 ,  H05K1/115 ,  H05K2201/09709 ,  H05K2201/10295 ,  H05K2201/1031 ,  Y02P70/611

Abstract: An electrical connector for connection with a circuit board having a plurality of through holes and a plurality of SMT contacts. The electrical connector having a plurality of through hole terminals positioned according to the plurality of through holes and arranged in a top-down manner along an upper row and a lower row, and a plurality of SMT terminals positioned sequentially adjacent to each other along a common row in corresponding position to the plurality of SMT contacts on the circuit board.

Abstract translation: 一种用于与具有多个通孔和多个SMT触点的电路板连接的电连接器。 所述电连接器具有多个通孔端子，所述通孔端子根据所述多个通孔定位，并且沿着上排和下排以自顶向下的方式布置;以及多个SMT端子，沿着共同的顺序相邻地布置 行对应于电路板上的多个SMT触点。

公开(公告)号：US20140225130A1

公开(公告)日：2014-08-14

申请号：US14255394

申请日：2014-04-17

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Takeshi Fukunaga

IPC: H01L27/12 ,  H01L31/153

CPC classification number: H01L51/524 ,  G01N33/497 ,  H01L27/1218 ,  H01L27/124 ,  H01L27/3227 ,  H01L27/3262 ,  H01L27/3276 ,  H01L27/3279 ,  H01L27/3288 ,  H01L27/329 ,  H01L31/153 ,  H01L33/62 ,  H01L51/0097 ,  H01L51/5203 ,  H01L51/56 ,  H01L2227/323 ,  H01L2251/5315 ,  H01L2251/5338 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/093 ,  H05K2201/10128 ,  H05K2201/1031 ,  Y02P70/611 ,  H01L2924/00

Abstract: A light-emitting device having the quality of an image high in homogeneity is provided. A printed wiring board (second substrate) (107) is provided facing a substrate (first substrate) (101) that has a luminous element (102) formed thereon. A PWB side wiring (second group of wirings) (110) on the printed wiring board (107) is electrically connected to element side wirings (first group of wirings) (103, 104) by anisotropic conductive films (105a, 105b). At this point, because a low resistant copper foil is used to form the PWB side wiring (110), a voltage drop of the element side wirings (103, 104) and a delay of a signal can be reduced. Accordingly, the homogeneity of the quality of an image is improved, and the operating speed of a driver circuit portion is enhanced.

Abstract translation: 提供具有均匀性高的图像质量的发光装置。 面向其上形成有发光元件（102）的基板（第一基板）（101）设置有印刷布线板（第二基板）（107）。 印刷电路板（107）上的PWB侧布线（第二组布线）（110）通过各向异性导电膜（105a，105b）与元件侧布线（第一组布线）（103,104）电连接。 此时，由于使用低电阻铜箔来形成PWB侧布线（110），可以降低元件侧布线（103,104）的电压降和信号的延迟。 因此，提高了图像质量的均匀性，并且提高了驱动器电路部分的操作速度。

公开(公告)号：US20140185256A1

公开(公告)日：2014-07-03

申请号：US14199327

申请日：2014-03-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Nobuaki Ogawa ,  Yoshihito Otsubo

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/28 ,  H05K3/30

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/5389 ,  H01L23/552 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2924/1531 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/181 ,  H05K3/284 ,  H05K3/303 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/4644 ,  H05K2201/0715 ,  H05K2201/10242 ,  H05K2201/1031 ,  H05K2201/10515 ,  H05K2203/1316 ,  Y02P70/611 ,  Y10T29/49146

Abstract: When forming a module 100 having a configuration in which a column-shaped connection terminal 11, which forms an interlayer connection conductor, and an electronic component 102 are mounted on a wiring substrate 101 and sealed with a resin, the column-shaped connection terminal 11 which has a substantially T-shaped cross section and in which a first end portion has a larger diameter than a second end portion is prepared (the preparation step), an electronic component 102 is mounted on one main surface of the wiring substrate 101 and the connection terminal 11 is mounted on the one main surface in such a manner that the second end portion of the connection terminal 11 having a smaller diameter is connected to the wiring substrate 101 (the mounting step), and the electronic component 102 and the connection terminal 11 are sealed with a resin layer 103 (the sealing step).

Abstract translation: 当形成具有其中形成层间连接导体的柱状连接端子11和电子部件102的结构的模块100安装在布线基板101上并用树脂密封时，柱形连接端子11 其具有大致T形的横截面并且其中第一端部具有比第二端部更大的直径（制备步骤），电子部件102安装在布线基板101的一个主表面上，并且 连接端子11安装在一个主表面上，使得具有较小直径的连接端子11的第二端部连接到布线基板101（安装步骤），并且电子部件102和连接端子 11用树脂层103密封（密封步骤）。

公开(公告)号：US20140182932A1

公开(公告)日：2014-07-03

申请号：US14115091

申请日：2012-04-17

Applicant: Harald Cholewa ,  Christoph Degen ,  Bernhard Reul ,  Mitja Rateiczak ,  Andreas Schlarb ,  Lothar Lesmeister

Inventor： Harald Cholewa ,  Christoph Degen ,  Bernhard Reul ,  Mitja Rateiczak ,  Andreas Schlarb ,  Lothar Lesmeister

IPC: H01R4/02

CPC classification number: H01R4/02 ,  H01L2924/0002 ,  H05B3/84 ,  H05B2203/016 ,  H05K3/3463 ,  H05K3/3494 ,  H05K3/4015 ,  H05K2201/1028 ,  H05K2201/1031 ,  H05K2203/0465 ,  Y02P70/611 ,  H01L2924/0001

Abstract: A disk having at least one electric connecting element is described. The disk has a substrate, an electrically conductive structure on a region of the substrate, a connecting element containing at least chromium-containing steel, and a layer of a soldering compound that electrically connects the connecting element to sub-regions of the electrically conductive structure.

Abstract translation: 描述具有至少一个电连接元件的盘。 盘具有基板，在基板的区域上的导电结构，至少含有含铬钢的连接元件和将连接元件电连接到导电结构的子区域的焊料化合物层 。

公开(公告)号：US08678633B2

公开(公告)日：2014-03-25

申请号：US12153267

申请日：2008-05-15

Applicant: Byung-Jin Choi ,  Hong-Sung Song ,  Woong-Ki Min

Inventor： Byung-Jin Choi ,  Hong-Sung Song ,  Woong-Ki Min

IPC: F21V7/04

CPC classification number: H05K1/111 ,  G02F1/133604 ,  G02F1/133608 ,  G02F2001/133612 ,  H05K1/118 ,  H05K1/148 ,  H05K3/301 ,  H05K3/3405 ,  H05K3/361 ,  H05K2201/09036 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/10113 ,  H05K2201/10136 ,  H05K2201/10287 ,  H05K2201/1031 ,  Y02P70/611

Abstract: A lamp electrode printed circuit board of a backlight unit includes an insulating substrate, first and second conductive patterns on the insulating substrates along a first direction and in parallel, a connecting pattern extending from one of the first and second conductive patterns, a connecting pad at one end of the connecting pattern, auxiliary patterns extending from an edge of the connecting pad, and lamp holders electrically connected to the first and second conductive patterns and spaced apart from each other along the first direction.

Abstract translation: 背光单元的灯电极印刷电路板包括绝缘基板，绝缘基板上的沿着第一方向并且平行的第一和第二导电图案，从第一和第二导电图案之一延伸的连接图案， 连接图案的一端，从连接焊盘的边缘延伸的辅助图案和电连接到第一和第二导电图案并沿着第一方向彼此间隔开的灯座。

公开(公告)号：US08672689B2

公开(公告)日：2014-03-18

申请号：US13609590

申请日：2012-09-11

Applicant: Ting Chang Tseng

Inventor： Ting Chang Tseng

IPC: H01R12/00

CPC classification number: H01R12/62 ,  H01R24/62 ,  H01R2107/00 ,  H05K1/117 ,  H05K3/34 ,  H05K2201/0715 ,  H05K2201/1031 ,  H05K2201/10356 ,  Y02P70/611

Abstract: An electrical connector assembly is provided with an insulating housing, a PCB, and an FFC. The insulating housing includes a plurality of terminals and two side extensions The FFC and the terminals are electrically connected together by the PCB. A plurality of contacts of the PCB are provided on a top surface of the PCB. A space is defined by the extensions and two rearward inclined members on both sides of the insulating housing respectively with each rearward inclined member joining the insulating housing and the extension. The PCB is disposed in the space.

Abstract translation: 电连接器组件设置有绝缘壳体，PCB和FFC。 绝缘壳体包括多个端子和两个侧向延伸部分FFC和端子通过PCB电连接在一起。 PCB的多个触点设置在PCB的顶表面上。 绝缘壳体的两侧分别由延伸部和两个向后倾斜部件限定空间，每个后倾斜部件连接绝缘壳体和延伸部。 PCB布置在空间中。

公开(公告)号：US20140028417A1

公开(公告)日：2014-01-30

申请号：US13995323

申请日：2011-10-13

Applicant: Danilo Falchi ,  Dominique Dupuis ,  Guillaume Bonvallat ,  Fabrice Herault

Inventor： Danilo Falchi ,  Dominique Dupuis ,  Guillaume Bonvallat ,  Fabrice Herault

IPC: H01R13/22

CPC classification number: H01R13/22 ,  F01L9/04 ,  F01L2009/0401 ,  F01L2009/0405 ,  F01L2009/0457 ,  F01L2009/0463 ,  H01R12/55 ,  H01R12/57 ,  H01R12/718 ,  H05K1/14 ,  H05K2201/1031 ,  Y02P70/611

Abstract: The invention relates to an electromagnetic actuator comprising a housing (9) having several faces (20, 21) and an electronic control circuit (14) split into at least two parts (14a, 14b) distributed over at least two adjacent faces (20, 21) of the housing (9), each part (14a) of the circuit comprising at least one metallic connector (25a) arranged so as to be connected electrically and mechanically with a metallic connector (25b) of another part of the circuit (14b) so as to form an electrical connection (24).

Abstract translation: 本发明涉及电磁致动器，其包括具有多个面（20,21）的壳体（9）和分成至少两个分布在至少两个相邻面（20,21）上的至少两个部分（14a，14b）的电子控制电路， 该电路的每个部分（14a）包括至少一个金属连接器（25a），该金属连接器（25a）布置成与电路（14b）的另一部分的金属连接器（25b）电连接和机械地连接 ）以形成电连接（24）。