公开(公告)号：US09736932B1

公开(公告)日：2017-08-15

申请号：US14601072

申请日：2015-01-20

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Anwar Mohammed ,  Murad Kurwa

IPC: H01K3/10 ,  H05K1/02 ,  H05K1/18 ,  H05K1/09 ,  H05K3/32

CPC classification number: H05K1/0284 ,  H01L24/00 ,  H05K3/103 ,  H05K2201/10356 ,  H05K2203/107 ,  H05K2203/1469 ,  Y10T29/49162

Abstract: A method of and device for making a three dimensional electronic circuit. The method comprises coupling one or more magnet wires with a substrate along a surface contour of the substrate, immobilizing the one or more magnet wires on the substrate, and forming the electronic circuit by electrically coupling the one or more magnet wires with an integrated circuit chip.

公开(公告)号：US20170211791A1

公开(公告)日：2017-07-27

申请号：US15039605

申请日：2014-11-26

Applicant: CERAMTEC GMBH

Inventor： Marco HEINRICH ,  Anton GSCHWANDLER

IPC: F21V23/00 ,  F21V29/85 ,  F21V3/04 ,  H05K1/18 ,  F21V23/06

CPC classification number: F21V23/005 ,  F21K9/20 ,  F21V3/062 ,  F21V23/001 ,  F21V23/06 ,  F21V29/86 ,  F21V31/00 ,  F21V31/005 ,  F21V31/04 ,  F21Y2103/10 ,  F21Y2103/30 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10356

Abstract: The invention relates to an LED module having a support body, on the surface of which metallization regions forming a circuit board are arranged and on which LEDs are mounted. In order that the LED module is immediately ready for use, i.e. can be connected directly to a power supply, according to the invention, it is proposed that, in addition to the LEDs, the driver modules thereof are also mounted on the metallization regions and at least the LEDs together with the driver modules are covered by a light-transmitting material, electrical connecting elements are connected to the LEDs or driver modules and are fed out of the translucent material.

公开(公告)号：US09693460B2

公开(公告)日：2017-06-27

申请号：US14017849

申请日：2013-09-04

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki Fujimori

IPC: H05K1/00 ,  H05K1/18 ,  A61B1/05 ,  H04N5/225 ,  H05K3/40 ,  H05K3/10 ,  A61B1/00 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K1/181 ,  A61B1/0011 ,  A61B1/051 ,  H04N5/2251 ,  H05K1/18 ,  H05K1/186 ,  H05K3/0052 ,  H05K3/10 ,  H05K3/403 ,  H05K3/4602 ,  H05K2201/0919 ,  H05K2201/10121 ,  H05K2201/10356 ,  H05K2201/10416 ,  H05K2201/10446 ,  Y10T29/49162

Abstract: A wiring board includes a plurality of wiring layers, a plurality of insulating layers, and an electrode member made of a conductive material, the electrode member being incorporated in the wiring board in a state in which the electrode member includes exposed sections on side surfaces that cross the plurality of wiring layers and the plurality of insulating layers.

公开(公告)号：US20170079155A1

公开(公告)日：2017-03-16

申请号：US15363429

申请日：2016-11-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Guodong ZHANG ,  Jian ZHANG ,  Jianping SHU

IPC: H05K7/14 ,  H01R12/70 ,  H01R12/79 ,  H01R12/75 ,  H05K1/14

CPC classification number: H05K7/1439 ,  H01R12/7005 ,  H01R12/75 ,  H01R12/79 ,  H04Q1/15 ,  H05K1/141 ,  H05K1/18 ,  H05K7/1449 ,  H05K7/1451 ,  H05K7/1452 ,  H05K2201/044 ,  H05K2201/10318 ,  H05K2201/10356

Abstract: A backplane and a communications device are disclosed. The backplane includes: at least one fixing plate, multiple connectors, and multiple flexible cables, where signal connection is implemented between corresponding connectors by means of the flexible cables, each of the connectors is provided with a housing and multiple signal pins installed on the housing, and the housing is installed on the fixing plate and is provided with a jack for insertion of a connector of a subcard in the communications device; one end of each signal pin is inserted into the jack, and the other end is connected to each flexible cable. When the communications device provided with the backplane transmits a high-rate signal, transmission quality and a transmission rate are relatively high.

Abstract translation: 公开了背板和通信设备。 背板包括：至少一个固定板，多个连接器和多个柔性电缆，其中通过柔性电缆在相应的连接器之间实现信号连接，每个连接器设置有壳体和安装在壳体上的多个信号销 并且所述壳体安装在所述固定板上并且设置有用于将子卡的连接器插入所述通信装置中的插孔; 每个信号针的一端插入插孔，另一端连接到每根柔性线。 当设置有背板的通信设备发送高速率信号时，传输质量和传输速率相对较高。

公开(公告)号：US09590321B2

公开(公告)日：2017-03-07

申请号：US14234596

申请日：2012-07-02

Applicant: Sangyeal Han ,  Heungsun Kim ,  Bumsig Cho

Inventor： Sangyeal Han ,  Heungsun Kim ,  Bumsig Cho

IPC: H01R4/02 ,  H01R13/405 ,  H05K3/34 ,  H01R12/59 ,  H01R13/66 ,  H01R13/58 ,  G08B13/196 ,  G03B17/02 ,  H04N5/225 ,  H05K1/18

CPC classification number: H01R4/02 ,  G03B17/02 ,  G08B13/19634 ,  H01R12/59 ,  H01R13/405 ,  H01R13/5845 ,  H01R13/6658 ,  H01R13/6666 ,  H01R13/6683 ,  H01R2201/26 ,  H04N5/2257 ,  H05K1/189 ,  H05K3/3405 ,  H05K2201/10356

Abstract: Disclosed is a cable connection structure of a camera module for a vehicle, the cable connection structure including a cable unit having at least one wire member, a flexible printed circuit board (FPCB) having a terminal on one end thereof and having a connecting portion on the other end, the terminal being soldered to a wire metal piece exposed at an end of the wire member and having a number corresponding to a number of the wire member, the connecting portion being connected to the camera module, and a molded connector surrounding a joining portion between the cable unit and the FPCB.

Abstract translation: 公开了一种用于车辆的照相机模块的电缆连接结构，电缆连接结构包括具有至少一个线构件的电缆单元，柔性印刷电路板（FPCB），其一端具有端子并具有连接部分 另一方面，端子被焊接到在线构件的端部露出的金属片，并且具有与线构件的数量相对应的数量，连接部分连接到相机模块，以及围绕 电缆单元和FPCB之间的接合部分。

公开(公告)号：US20170040739A1

公开(公告)日：2017-02-09

申请号：US14817886

申请日：2015-08-04

Applicant: GOODRICH CORPORATION

Inventor： Michael Abbott ,  Andrew Slanker ,  Brian Syverson ,  Eric Joseph Reed ,  Scott R. Durkee ,  Alexander White

IPC: H01R13/58 ,  H01R12/70 ,  H05K1/11 ,  H01R43/20

CPC classification number: H01R13/58 ,  H01R12/7076 ,  H01R43/205 ,  H05K1/0257 ,  H05K1/0271 ,  H05K1/115 ,  H05K1/116 ,  H05K2201/09063 ,  H05K2201/09936 ,  H05K2201/10287 ,  H05K2201/10356

Abstract: A circuit card is disclosed. The circuit card may have a strain relief aperture and a conductor contact. A conductor may extend through the strain relief aperture and connect in electrical continuity with the conductor contact. The circuit card may have a conformal coating, such as poly(p-xylylene) polymer applied. The conformal coating may be applied in layers, and the layers may have different thicknesses.

Abstract translation: 公开了电路卡。 电路卡可以具有应变消除孔和导体接触。 导体可以延伸穿过应变消除孔，并与导体触点电连接。 电路卡可以具有适形涂层，例如施加的聚（对二甲苯）聚合物。 保形涂层可以以层施加，并且这些层可以具有不同的厚度。

公开(公告)号：US09560752B2

公开(公告)日：2017-01-31

申请号：US14261749

申请日：2014-04-25

Applicant: HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： Jerry Wu ,  Jun Chen ,  Fan-Bo Meng

IPC: H05K1/00 ,  H05K1/09 ,  H05K1/03 ,  H01R24/00 ,  H05K1/02 ,  H01R13/66 ,  H01R24/62 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/0298 ,  H01R13/6658 ,  H01R24/62 ,  H05K1/0242 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/111 ,  H05K1/117 ,  H05K3/341 ,  H05K2201/09736 ,  H05K2201/10356

Abstract: An printed circuit board (14) includes a first insulative layer (140), a first conductive path (141), a second conductive path (142) and an insulative substrate (143) stacked together. The first conductive path is disposed between the insulative substrate and the first insulative layer. The first conductive path includes an engaging portion (146), a middle portion (148) having an end connected with the engaging portion, and a soldering portion (147) connected with an opposite end of the middle portion. The second conductive path is aligned with the middle portion of the first conductive path along a vertical direction, the second conductive path electrically connected with the middle portion of the first conductive path to increase a thickness thereon.

Abstract translation: 印刷电路板（14）包括堆叠在一起的第一绝缘层（140），第一导电路径（141），第二导电路径（142）和绝缘衬底（143）。 第一导电路径设置在绝缘基板和第一绝缘层之间。 第一导电路径包括接合部分（146），具有与接合部分连接的端部的中间部分（148）和与中间部分的相对端连接的焊接部分（147）。 第二导电路径沿着垂直方向与第一导电路径的中间部分对准，第二导电路径与第一导电路径的中间部分电连接以增加其上的厚度。

公开(公告)号：US20170018864A1

公开(公告)日：2017-01-19

申请号：US15171257

申请日：2016-06-02

Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED

Inventor： Shuichi MASUYAMA ,  Tatsuya SHIODA ,  Daisuke HIRAO ,  Tetsuya TAKEBE ,  Hiroyasu KOIZUMI

IPC: H01R12/53 ,  H05K1/18 ,  H01B11/18

CPC classification number: H05K1/18 ,  H01R12/598 ,  H05K3/3405 ,  H05K2201/10356

Abstract: A cable arranging part of the present invention has a fixed shape and comprises a position determining portion, a plurality of cable through holes, and an opening. In a state in which the position determining portion is secured to a position reference portion, the cable arranging part is in a predetermined position on a substrate. The cable through holes become perpendicular to a line of the electrodes and parallel to the substrate in the predetermined position. The opening is provided somewhere midway through the cable through holes and a ground cable through hole. As for the sizes of the cable through holes in a perpendicular direction to the substrate in the predetermined position, the size of the cable through hole on the side where the electrodes are located relative to the opening is greater than the size of the cable through hole on the side opposite to the electrodes.

Abstract translation: 本发明的电缆布置部分具有固定的形状，包括位置确定部分，多个电缆通孔和开口。 在位置决定部固定于位置基准部的状态下，电缆配置部位于基板上的规定位置。 电缆通孔在预定位置上垂直于电极线并平行于衬底。 开口位于中途穿过电缆通孔和地电缆通孔。 对于在预定位置上与基板垂直的电缆通孔的尺寸，电极相对于开口位于一侧的电缆通孔的尺寸大于电缆通孔的尺寸 在与电极相对的一侧。

公开(公告)号：US09532458B2

公开(公告)日：2016-12-27

申请号：US14543089

申请日：2014-11-17

Applicant: Tyco Electronics Corporation

Inventor： Abraham L. Shocket ,  Lyle S. Bryan ,  John S. Cowan ,  Kevin J. Peterson

IPC: H01R12/70 ,  H05K1/18 ,  H05K1/02 ,  H05K5/00 ,  H05K7/20 ,  H01R12/51

CPC classification number: H05K1/181 ,  H01R12/515 ,  H05K1/0203 ,  H05K5/0069 ,  H05K7/20854 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2201/10537

Abstract: An electrical assembly configured to be fixed in a housing of an electrical connector includes an electrical package disposed on a substrate and electrically connected to the substrate. The electrical assembly also includes a conductor terminated to the substrate at a spaced apart location from the electrical package to provide at least one of power or control signals to the substrate. A terminating segment of the conductor is thermally coupled to the electrical package to receive heat generated at the electrical package and dissipate the heat through the conductor away from the electrical package.

Abstract translation: 构造成固定在电连接器的壳体中的电组件包括设置在基板上并电连接到基板的电气封装。 电组件还包括在与电气封装间隔开的位置处终止于衬底的导体，以向衬底提供功率或控制信号中的至少一个。 导体的端接部分热耦合到电气封装，以接收在电气封装处产生的热量，并将热量通过导体散发远离电气封装。

公开(公告)号：US09509107B2

公开(公告)日：2016-11-29

申请号：US14708366

申请日：2015-05-11

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher ,  Scott Lynn Michaelis

IPC: H01R24/00 ,  H01R24/64 ,  H01R13/6466 ,  H01R13/6469 ,  H01R13/66 ,  H05K1/11 ,  H01R12/53 ,  H01R24/28 ,  H05K1/02

CPC classification number: H01R24/64 ,  H01R12/53 ,  H01R13/6466 ,  H01R13/6469 ,  H01R13/665 ,  H01R13/6658 ,  H01R23/005 ,  H01R24/28 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/0245 ,  H05K1/115 ,  H05K1/117 ,  H05K2201/04 ,  H05K2201/0949 ,  H05K2201/09845 ,  H05K2201/1034 ,  H05K2201/10356 ,  Y10T29/49124

Abstract: Communications plugs are provided which include a printed circuit board having a plurality of elongated conductive traces and a plurality of plug blades. Each plug blade has a first section that extends along a top surface of the printed circuit board and a second section that extends along a front edge of the printed circuit board. Additionally, each plug blade may have a thickness that is at least twice the thickness of the elongated conductive traces. The plug blades may be low profile plug blades that are manufactured separately from the printed circuit board.

Abstract translation: 提供了通信插头，其包括具有多个细长导电迹线和多个插头片的印刷电路板。 每个插头片具有沿着印刷电路板的顶表面延伸的第一部分和沿着印刷电路板的前边缘延伸的第二部分。 此外，每个插头刀片可以具有至少是细长导电迹线的厚度的两倍的厚度。 插头片可以是与印刷电路板分开制造的低剖面插头片。