公开(公告)号：US3557300A

公开(公告)日：1971-01-19

申请号：US3557300D

申请日：1968-06-27

Applicant: BOSCH GMBH ROBERT

Inventor： WERNER FRITHJOF

IPC: H01R4/02 ,  H01R4/06 ,  H02K11/04 ,  H05K3/34 ,  H05K3/42 ,  H05K1/18

CPC classification number: H05K3/34 ,  H01R12/515 ,  H05K3/3447 ,  H05K2201/10287 ,  H05K2201/10401 ,  H05K2201/10962

Abstract: To interconnect the output windings of automotive type alternators with rectifiers, and other circuits placed on an insulating circuit board, a connection element is mounted through an opening in the circuit board, the connection element being formed as a hollow cylindrical body having a flange intermediate its length, which may connect with a printed circuit and bearing against one side of the board, a second flange, for example formed by peening over the end of the body to grip the other side of the board; the connector is slit lengthwise, and an alternator output conductor is clamped in the slit, as well as a rectifier pin of lesser diameter than the cylindrical body passed axially through the element, the element being deformed to hold all conductors together; additionally, the joint may be soldered.

公开(公告)号：US3548369A

公开(公告)日：1970-12-15

申请号：US3548369D

申请日：1968-07-30

Applicant: AMP INC

Inventor： GARVER WILLIAM JOSEPH

IPC: H01R12/58 ,  H05K3/34 ,  H05K13/04 ,  H01R11/06 ,  H05K1/04

CPC classification number: H05K13/0478 ,  H01R12/58 ,  H05K3/3447 ,  H05K2201/10401 ,  H05K2201/10916

公开(公告)号：US3500290A

公开(公告)日：1970-03-10

申请号：US3500290D

申请日：1968-07-01

Applicant: BECKMAN INSTRUMENTS INC

Inventor： HALL LLOYD E ,  BRANT ROY GENE ,  DOERING JOHN PETER JR

IPC: H01R4/02 ,  H01R9/20 ,  H01R12/57 ,  H05K1/18 ,  H05K3/34 ,  H05K1/08

CPC classification number: H01R12/57 ,  H01R9/20 ,  H05K3/3405 ,  H05K3/3421 ,  H05K2201/1034 ,  H05K2201/10401 ,  H05K2201/10598 ,  H05K2201/10916 ,  Y10T29/49105

公开(公告)号：US3163709A

公开(公告)日：1964-12-29

申请号：US17056262

申请日：1962-02-02

Applicant: HUGHES AIRCRAFT CO

Inventor： EDWARD FOX CARL

IPC: B23K35/22 ,  H01R12/51 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01R12/58 ,  B23K35/224 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/4046 ,  H05K2201/10401 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2201/10962 ,  H05K2203/176

公开(公告)号：US2915678A

公开(公告)日：1959-12-01

申请号：US51532555

申请日：1955-06-14

Applicant: HUGHES AIRCRAFT CO

Inventor： DOUGLAS FRAZIER WILLIAM ,  WISELEY WILLIAM E

IPC: H05K3/34 ,  H05K3/40

CPC classification number: H05K3/3447 ,  H01R12/585 ,  H05K3/4046 ,  H05K2201/10401 ,  H05K2201/10916 ,  Y10T29/49888 ,  Y10T29/4992 ,  Y10T29/4994

公开(公告)号：US10050358B2

公开(公告)日：2018-08-14

申请号：US14436681

申请日：2014-11-13

Applicant: Leukert GmbH

Inventor： Matthias Müller ,  Rudi Heinz Kolb

IPC: H01R11/11 ,  H01R12/52 ,  H01R13/11 ,  H05K1/14 ,  H05K1/02

CPC classification number: H01R12/523 ,  H01R13/111 ,  H05K1/0263 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/10303 ,  H05K2201/10401

Abstract: A power contacting device includes a contact pin (1) and at least one contact pin receptacle (2) penetrated by the contact pin in the operating state. To provide a power contact which permanently ensures high-quality contacting, even when the contacted components move relative to one another, the contact pin receptacle (2) has a first guide arrangement (3) which is fixed to a component in the operating state and a second guide arrangement (4) which is conductively connected to the first guide arrangement, the second guide arrangement (4) being arranged displaceably on the first guide arrangement (3) and the contact pin (1) conductively contacting at least the second guide arrangement (4) in the operating state.

公开(公告)号：US09648721B2

公开(公告)日：2017-05-09

申请号：US14199294

申请日：2014-03-06

Applicant: TRW Automotive U.S. LLC

Inventor： Neil Gordon Murray, Jr. ,  Mark Ramsay

IPC: H05K1/18 ,  H05K1/02 ,  H05K5/00 ,  H05K5/02

CPC classification number: H05K1/02 ,  H05K1/18 ,  H05K5/0034 ,  H05K5/0073 ,  H05K5/0078 ,  H05K5/0221 ,  H05K2201/09063 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2203/1327 ,  Y10T403/471 ,  Y10T403/472 ,  Y10T403/49

Abstract: A circuit board mounting arrangement is provided including a circuit board and a press fit mounting bushing including a cylindrical inner piece and an outer piece secured to the inner piece. The outer piece has a plurality of radially projecting, deformable elements and the circuit board has a cylindrical opening having a diameter less than an outer diameter of the radially projecting deformable elements. The deformable elements deform when the mounting bushing is pushed into the cylindrical opening of the circuit board so as to hold the mounting bushing to the circuit board. The circuit board and press fit bushing are then overmolded.

公开(公告)号：US20150247629A1

公开(公告)日：2015-09-03

申请号：US14436261

申请日：2013-09-03

Applicant: TOSHIBA LIGHTING & TECHNOLOGY CORPORATION

Inventor： Kiyokazu Hino ,  Takahiro Kurihara

IPC: F21V23/00 ,  F21V19/00

CPC classification number: F21V23/002 ,  F21S43/195 ,  F21S43/37 ,  F21S45/50 ,  F21V19/0025 ,  F21V19/003 ,  F21V19/005 ,  F21V19/0055 ,  F21V23/06 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2105/00 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/30 ,  H01R12/58 ,  H01R43/0256 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10106 ,  H05K2201/1025 ,  H05K2201/1031 ,  H05K2201/10401 ,  Y02P70/611

Abstract: A light emitting device according to the present embodiment includes a substrate on which a wiring portion is provided; a light emitting element which is provided on the substrate and is electrically connected to the wiring portion; a feeding portion to which an electric power is supplied from the outside; a first connection portion which is provided on the substrate and is electrically connected to the wiring portion; a second connection portion which is joined to the first connection portion through soldering and includes a first opening portion into which the feeding portion is inserted; and a soldering portion which is provided between the first opening portion and the feeding portion.

Abstract translation: 根据本实施例的发光器件包括其上设置有布线部分的基板; 发光元件，其设置在所述基板上并与所述布线部电连接; 从外部供给电力的供给部; 第一连接部，其设置在所述基板上并电连接到所述布线部; 第二连接部，其通过焊接接合到所述第一连接部，并且包括第一开口部，所述供给部插入所述第一开口部; 以及设置在第一开口部和供给部之间的焊接部。

公开(公告)号：US20140126207A1

公开(公告)日：2014-05-08

申请号：US13671148

申请日：2012-11-07

Applicant: Chao-Chin YEH

Inventor： Chao-Chin YEH

IPC: F21V29/00

CPC classification number: H05K1/0209 ,  F21V29/85 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K2201/10106 ,  H05K2201/10401 ,  H05K2201/10416

Abstract: A LED cooling structure includes a substrate having a circuit layout and one or a number of thermally conductive plates arranged on the top wall thereof, one or a plurality of through holes cut through the opposing top and bottom walls thereof and a thermally conductive post mounted in each through hole and connected with the thermally conductive plates, and one or a number of light-emitting devices mounted at the substrate and electrically connected to the circuit layout with the bottom side thereof kept in contact with one respective thermally conductive plate for quick dissipation of heat.

Abstract translation: LED冷却结构包括具有电路布局的基板和布置在其顶壁上的一个或多个导热板，一个或多个通孔切穿其相对的顶壁和底壁，并且导热柱安装在 每个通孔与导热板连接，并且一个或多个发光装置安装在基板上并电连接到电路布局，其底侧保持与一个相应的导热板接触，以便快速消散 热。

公开(公告)号：US20130063903A1

公开(公告)日：2013-03-14

申请号：US13635606

申请日：2011-03-16

Applicant: Michael Heim ,  Sigmund Braun

Inventor： Michael Heim ,  Sigmund Braun

IPC: H05K7/06

CPC classification number: H05K3/325 ,  H01L2224/4903 ,  H01L2224/49175 ,  H05K1/18 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/0969 ,  H05K2201/1009 ,  H05K2201/10401 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2201/1081 ,  H05K2201/10863

Abstract: The invention relates to an arrangement comprising an electric and/or electronic module (10) and a circuit carrier (12), wherein at least one electric connecting line (14) of the electric and/or electronic module (10) can be accommodated in a recess (16) of the circuit carrier (12). The arrangement comprises at least one clamping element (18a, 18b, 18c, 18d) which immobilizes the at least one connecting line (14) in the recess (16) once it has been introduced into the recess (16).

Abstract translation: 本发明涉及一种包括电和/或电子模块（10）和电路载体（12）的装置，其中电和/或电子模块（10）的至少一个电连接线（14）可以容纳在 电路载体（12）的凹部（16）。 该装置包括至少一个夹紧元件（18a，18b，18c，18d），一旦其已经被引入到凹部（16）中就将至少一个连接线（14）固定在凹部（16）中。