公开(公告)号：US20180019173A1

公开(公告)日：2018-01-18

申请号：US15606816

申请日：2017-05-26

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Kousuke KOMATSU

IPC: H01L23/053 ,  H01L23/492 ,  H01L23/48 ,  H01L23/14 ,  H01L23/13 ,  H01L23/495 ,  H01L23/08

CPC classification number: H01L23/053 ,  H01L23/08 ,  H01L23/13 ,  H01L23/14 ,  H01L23/481 ,  H01L23/492 ,  H01L23/4951 ,  H01L23/49811 ,  H01L2224/01 ,  H01R12/7082 ,  H01R12/73 ,  H01R13/2492 ,  H05K3/325 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10325 ,  H05K2201/10409

Abstract: A semiconductor device includes a box-shaped casing including a ceiling wall with a first window, a semiconductor chip having an output electrode and assembled in the casing, a first conductive block disposed in the casing, and a first connection terminal being bent so as to implement an elongated U-shape. The semiconductor device is adapted for electrical connection to a circuit board having a first land. The circuit board is placed on the ceiling wall. The first window is at a position corresponding to the first land. A lower end of the first conductive block is connected to a surface of the output electrode and the first connection terminal contacts to the first conductive block.

公开(公告)号：US09820394B2

公开(公告)日：2017-11-14

申请号：US15288755

申请日：2016-10-07

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Hiromichi Suzuki ,  Masataka Tokoro

IPC: H05K5/00 ,  H05K9/00 ,  H01R12/71 ,  H05K1/02 ,  H05K5/02 ,  G06F1/16 ,  H01R12/52

CPC classification number: H05K5/0069 ,  G06F1/16 ,  G06F1/1626 ,  G06F1/1658 ,  H01R12/52 ,  H01R12/71 ,  H05K1/0215 ,  H05K5/0204 ,  H05K5/0247 ,  H05K9/0015 ,  H05K2201/0311 ,  H05K2201/10409

Abstract: According to one embodiment, a circuit board attachment structure comprise a housing to which the circuit board is attached, a mount provided on the housing and provided outside a portion of the housing where the circuit board is attached, a holding piece extending from the mount to and on the circuit board and sandwiching the circuit board with the housing, and a conductive gasket contacting the circuit board. The gasket is provided at least in a region where the circuit board is sandwiched between the holding piece and the housing, and the gasket is pressed between the holding piece and the housing, and the circuit board and the housing is electrically connected to each other via the pressed gasket.

公开(公告)号：US09788411B2

公开(公告)日：2017-10-10

申请号：US15090207

申请日：2016-04-04

Applicant: DENSO CORPORATION

Inventor： Tsuyoshi Tashima

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K1/0209 ,  H05K2201/066 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10545 ,  H05K2201/1056

Abstract: An electronic control unit includes a substrate, an electronic component, a heat sink, a cover, a heat accumulator, and a screw. A wiring pattern is formed on the substrate. The electronic component is mounted on the substrate and generates heat upon energization thereof. The heat sink is provided on one side of the substrate in its thickness direction. The cover is made of resin and is provided on the other side of the substrate in its thickness direction. The heat accumulator is fixed to a part of the cover on the substrate-side and is in contact with a surface of the substrate on the cover-side. One end of the screw is connected to the heat sink. A central portion of the screw is inserted through a hole passing through the substrate in its thickness direction. The other end of the screw is connected to the heat accumulator.

公开(公告)号：US09772688B2

公开(公告)日：2017-09-26

申请号：US15045628

申请日：2016-02-17

Applicant: Apple Inc.

Inventor： Dhaval Chandrakant Patel ,  Jonah A. Harley ,  Peteris K. Augenbergs ,  Derryk C. Davis ,  Scott J. McEuen ,  John M. Brock

IPC: G06F3/01 ,  G06F3/041 ,  G06F3/0354 ,  G06F1/16 ,  H01F7/126 ,  H05K3/32

CPC classification number: G06F3/016 ,  G06F1/169 ,  G06F3/03547 ,  G06F3/041 ,  G06F3/0414 ,  G06F2203/04103 ,  G06F2203/04105 ,  H01F7/126 ,  H05K3/325 ,  H05K2201/10409

Abstract: A haptic feedback assembly includes interconnections for mechanically and electrically securing a haptic actuator in a track pad assembly so as to securely and efficiently provide haptic feedback to a user.

公开(公告)号：US09756719B2

公开(公告)日：2017-09-05

申请号：US15141722

申请日：2016-04-28

Applicant: KYOCERA Document Solutions Inc.

Inventor： Yasuyoshi Kobayashi

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0216 ,  H05K9/0022 ,  H05K2201/10371 ,  H05K2201/10409

Abstract: Provided is an electronic equipment which can effectively reduce unexpected unnecessary radiation. In the electronic equipment, a circuit board on which a noise source that is an electronic part becoming a source of the unnecessary radiation is mounted and a circuit board mounting plate on which the circuit board is mounted are disposed substantially parallel with a space put therebetween. In the electronic equipment, a partition plate is disposed, which functions as a noise reflecting surface on which an indirect wave emitted from the noise source towards the circuit board mounting plate is reflected. Further, an indirect wave dispersing member is disposed between the circuit board and the circuit board mounting plate so as to block spacing between the noise source and the partition plate.

公开(公告)号：US20170231109A1

公开(公告)日：2017-08-10

申请号：US15518867

申请日：2015-06-10

Applicant: ZTE CORPORATION

Inventor： Zhengdong YANG ,  Jitao LI ,  Minhua ZHANG ,  Yi TANG ,  Kun FAN

IPC: H05K7/18 ,  H05K1/18 ,  H05K1/02 ,  H05K7/20 ,  H05K7/14

CPC classification number: H05K7/18 ,  H05K1/0206 ,  H05K1/18 ,  H05K7/1407 ,  H05K7/20 ,  H05K7/20481 ,  H05K7/20536 ,  H05K2201/10409

Abstract: Provided are a communication system and a communication apparatus thereof, the communication apparatus includes: a bottom case and a printed circuit board mounted on the bottom case, the communication apparatus further includes a heat-conductive mounting strip, the printed circuit board being mounted on the bottom case by means of the heat-conductive mounting strip, wherein a lower end surface of the heat-conductive mounting strip is connected to the bottom case, and an upper end surface of the heat-conductive mounting strip is connected to the printed circuit board.

公开(公告)号：US20170207010A1

公开(公告)日：2017-07-20

申请号：US15410409

申请日：2017-01-19

Applicant: Fluke Corporation

Inventor： Mark Steven BUCKNER ,  Steven Wayne HIGGINS ,  Donald A. GESSLING ,  Bryan Charles HOOG ,  Michael A. SCHOCH

IPC: H01C13/02 ,  H05K1/18

CPC classification number: H01C13/02 ,  H01C1/01 ,  H01C1/082 ,  H05K1/181 ,  H05K3/301 ,  H05K2201/10022 ,  H05K2201/10227 ,  H05K2201/10409 ,  H05K2201/10583 ,  H05K2201/10606

Abstract: A resistor support assembly includes first, second, third, and fourth support members. Each of the first and second support members includes one or more resistor contact regions and apertures extending therethrough. Each third support member is at least partially disposed within one of the apertures of one of the first support members and one of the apertures of one of the second support members. Recesses may be formed in the resistor contact regions of the first and the second support members, and one or more load resistors may be at least partially disposed within the recesses. The resistor support assembly may be used to mount one or more load resistors to a printed circuit board, without obstructing airflow through hollow portions of the load resistors. To reduce parasitic capacitance and inductance, the first support members and the second support members are formed from non-conductive materials.

公开(公告)号：US09701335B2

公开(公告)日：2017-07-11

申请号：US14913784

申请日：2014-08-20

Applicant: Hitachi Automotive Systems, Ltd.

Inventor： Katsumasa Hagiwara

IPC: H05K5/00 ,  B62D5/04 ,  H01R12/70 ,  H05K3/00 ,  H05K3/40 ,  H01R12/52

CPC classification number: B62D5/0406 ,  H01R12/523 ,  H01R12/7088 ,  H05K3/0061 ,  H05K3/4015 ,  H05K5/0004 ,  H05K5/0017 ,  H05K5/0047 ,  H05K5/0069 ,  H05K2201/0999 ,  H05K2201/1031 ,  H05K2201/10409 ,  Y02P70/611

Abstract: An electronic control unit includes a casing and a cover which are mutually bonded. A drive circuit board which drives a motor unit is fixed to the cover and, on the other hand, a control circuit board which controls the drive circuit board is fixed to the casing. An electrical connector which supplies an electric power to each board and a motor unit is attached on an opening section of the casing. First power supply terminals of this electrical connector and the motor unit and second power supply terminals of the drive circuit board are directly electrically connected by a bonding of both of casing and the cover.

公开(公告)号：US20170187156A1

公开(公告)日：2017-06-29

申请号：US15388456

申请日：2016-12-22

Applicant: UNIVERSITY OF SOUTHAMPTON

Inventor： REUBEN WILCOCK ,  THOMAS REDMAN

IPC: H01R33/945 ,  H05K1/03 ,  H04N5/225 ,  H05K1/14 ,  F21V21/005 ,  H04N5/247 ,  H05K1/18 ,  H05K1/11

CPC classification number: H01R33/9453 ,  F21S2/00 ,  F21V21/005 ,  F21Y2107/20 ,  F21Y2115/10 ,  G03B17/561 ,  H04N5/2251 ,  H04N5/2256 ,  H04N5/247 ,  H05K1/0313 ,  H05K1/115 ,  H05K1/142 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10409

Abstract: A modular structural member (100) comprising: at least two connection portions (102), and a structural portion (101), the connection portions arranged to provide electrical and mechanical connection to other structural members, and wherein, electronic componentry (125) is provided on the structural portion, and/or the connection portions are arranged to receive a fastener (240; 260), to connect multiple connection portions together, which is provided with electronic componentry, and further wherein, a plurality of the structural members arranged to be connected together to form a structure.

公开(公告)号：US20170171960A1

公开(公告)日：2017-06-15

申请号：US15366575

申请日：2016-12-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-Hee YANG

IPC: H05K1/02 ,  H05K5/00

CPC classification number: H05K1/0215 ,  G06F1/16 ,  H04M1/0277 ,  H04M1/185 ,  H05K1/0216 ,  H05K5/0017 ,  H05K2201/10371 ,  H05K2201/10409

Abstract: Disclosed is an electronic device having a housing including an inner space, a board including a first face and a second face opposite to the first face, the board being disposed such that the second face directly faces the inner space of the housing, at least one washer member mounted on the first face of the board and having at least a portion being soldered to a conductive exposure portion exposed to the first face of the board, a fastening member that anchors the board to the housing, and at least one electronic component disposed in the housing to directly face the first face of the board.