公开(公告)号：US20110155425A1

公开(公告)日：2011-06-30

申请号：US13041007

申请日：2011-03-04

Applicant: Keiji Matsumoto

Inventor： Keiji Matsumoto

IPC: H05K1/00

CPC classification number: H01L23/36 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K3/305 ,  H05K2201/1028 ,  H05K2201/10575 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/00

Abstract: An underfill film for an electronic device includes a thermally conductive sheet. The electronic device may include a printed circuit board, an electrical component, an underfill, and the thermally conductive sheet. The underfill is situated between the circuit board and the component. The thermally conductive sheet is situated within the underfill, and together with the underfill, constitutes the underfill film. The device may include solder bumps affixing the component to the circuit board, the underfill film having holes within which the solder bumps are aligned. There may be solder bumps on the underside of the circuit board promoting heat dissipation. There may be heat sinks on the circuit board to which the thermally conductive sheet is affixed promoting heat dissipation. The thermally conductive sheet may be affixed to a chassis promoting heat dissipation. The thermally conductive sheet thus promotes heat dissipation from the component to at least the circuit board.

公开(公告)号：US07821791B2

公开(公告)日：2010-10-26

申请号：US11983350

申请日：2007-11-08

Applicant: Rainer Popp ,  Marco Lederer

Inventor： Rainer Popp ,  Marco Lederer

IPC: H05K7/12

CPC classification number: H05K5/069 ,  H05K1/141 ,  H05K3/325 ,  H05K2201/10575 ,  H05K2203/1147

Abstract: A circuit arrangement includes a power module combined with a printed circuit board. The power module and the printed circuit board are disposed between a heat sink and a pressing device and are contact-connected to one another by pressure contact elements. The power module has at least one module board element and a housing formed with shafts for the pressure contact elements. The shafts open out from the housing base facing printed circuit board at opening orifices. The base is formed with orifice sealing ribs around the opening orifices. Moreover, the base of the housing may have a peripheral edge sealing rib along its outer edge. Furthermore, a sealing area element can be provided between the printed circuit board and the base of the housing.

Abstract translation: 电路装置包括与印刷电路板组合的功率模块。 功率模块和印刷电路板设置在散热器和加压装置之间，并通过压力接触元件彼此接触连接。 功率模块具有至少一个模块板元件和形成有用于压力接触元件的轴的壳体。 这些轴在开口孔处从外壳底座朝向印刷电路板开口。 底座在开口孔周围形成孔口密封肋。 此外，壳体的底部可以沿其外边缘具有周边边缘密封肋。 此外，可以在印刷电路板和壳体的基座之间设置密封区域元件。

公开(公告)号：US20090021922A1

公开(公告)日：2009-01-22

申请号：US11983350

申请日：2007-11-08

Applicant: Rainer Popp ,  Marco Lederer

Inventor： Rainer Popp ,  Marco Lederer

IPC: H05K5/00 ,  H01L23/02

CPC classification number: H05K5/069 ,  H05K1/141 ,  H05K3/325 ,  H05K2201/10575 ,  H05K2203/1147

Abstract: A circuit arrangement includes a power module combined with a printed circuit board. The power module and the printed circuit board are disposed between a heat sink and a pressing device and are contact-connected to one another by pressure contact elements. The power module has at least one module board element and a housing formed with shafts for the pressure contact elements. The shafts open out from the housing base facing printed circuit board at opening orifices. The base is formed with orifice sealing ribs around the opening orifices. Moreover, the base of the housing may have a peripheral edge sealing rib along its outer edge. Furthermore, a sealing area element can be provided between the printed circuit board and the base of the housing.

Abstract translation: 电路装置包括与印刷电路板组合的功率模块。 功率模块和印刷电路板设置在散热器和加压装置之间，并通过压力接触元件彼此接触连接。 功率模块具有至少一个模块板元件和形成有用于压力接触元件的轴的壳体。 这些轴在开口孔处从外壳底座朝向印刷电路板开口。 底座在开口孔周围形成孔口密封肋。 此外，壳体的底部可以沿其外边缘具有周边边缘密封肋。 此外，可以在印刷电路板和壳体的基座之间设置密封区域元件。

公开(公告)号：US20080135865A1

公开(公告)日：2008-06-12

申请号：US11985946

申请日：2007-11-19

Applicant: Harald Stoyan ,  Markus Hofmann ,  Alexander Wilm ,  Michael Sailer ,  Rainer Huber ,  Monika Rose

Inventor： Harald Stoyan ,  Markus Hofmann ,  Alexander Wilm ,  Michael Sailer ,  Rainer Huber ,  Monika Rose

IPC: H01L33/00

CPC classification number: H05K3/305 ,  F21V19/0035 ,  F21V19/004 ,  F21V19/0055 ,  F21Y2115/10 ,  H05K3/303 ,  H05K3/325 ,  H05K2201/10106 ,  H05K2201/10295 ,  H05K2201/10393 ,  H05K2201/10575 ,  H05K2201/10598 ,  H05K2201/2036 ,  Y02P70/613

Abstract: An illumination device comprising a connection carrier (1), at least one light-emitting diode (10), an electrically insulating layer (3) and a fixing device (4) is specified. The connection carrier (1) has a first main area (1a) and a second main area (1b) remote from the first main area. The light-emitting diode (10) is fixed on the first main area (1a) of the connection carrier (1). The electrically insulating layer (3) is fitted to the second main area (1b) of the connection carrier (1) and projects laterally beyond the second main area (1b) of the connection carrier (1). The fixing device (4) is suitable for fixing the illumination device to a mounting area (2a) of a carrier (2), wherein the electrically insulating layer (3) is arranged between the second main area (1b) of the connection carrier (1) and the mounting area (2a) of the carrier (2). Furthermore, the fixing device (4) presses the connection carrier (1) against the mounting area (2a). The pressure exerted in this way is used to effect a fixing of the insulating layer (3) between the second main area (1b) of the connection carrier (1) and the mounting area (2a). The fixing device (4) is connected to an optical element (8), which optically influences the light generated by the light-emitting diode (10) during operation.

Abstract translation: 规定了包括连接载体（1），至少一个发光二极管（10），电绝缘层（3）和固定装置（4）的照明装置。 连接托架（1）具有远离第一主区域的第一主区域（1a）和第二主区域（1b）。 发光二极管（10）固定在连接载体（1）的第一主区域（1a）上。 电绝缘层（3）装配到连接载体（1）的第二主区域（1b）上并横向延伸超过连接载体（1）的第二主区域（1b）。 固定装置（4）适于将照明装置固定到载体（2）的安装区域（2a）上，其中电绝缘层（3）布置在连接件的第二主区域（1b）之间 载体（1）和载体（2）的安装区域（2a）。 此外，固定装置（4）将连接托架（1）压靠在安装区域（2a）上。 以这种方式施加的压力用于实现绝缘层（3）在连接载体（1）的第二主区域（1b）和安装区域（2a）之间的固定。 固定装置（4）连接到光学元件（8），其在操作期间光学地影响由发光二极管（10）产生的光。

公开(公告)号：US07108172B2

公开(公告)日：2006-09-19

申请号：US10865103

申请日：2004-06-10

Applicant: Walter Parsadayan ,  Hagop Sakadjian

Inventor： Walter Parsadayan ,  Hagop Sakadjian

IPC: G06F17/00

CPC classification number: G06K19/0775 ,  H05K1/0266 ,  H05K1/18 ,  H05K2201/055 ,  H05K2201/09936 ,  H05K2201/10575

Abstract: Information regarding electrical components and their use is provided with a foldable information sheet having instructions thereon. The sheet has apertures which fit over the electrical components and information is printed on the sheet in proximity to the electrical component or components to which it applies. A portion of the information sheet may be adhered to a planar surface on which the components are mounted and non-adhered portions of the information sheet may be folded over the components.

Abstract translation: 关于电气部件及其使用的信息被提供有具有指令的可折叠信息表。 纸张具有适合于电气部件的孔，并且信息被印刷在靠近其所应用的电气部件或组件的片材上。 信息表的一部分可以附着在其上安装有部件的平面上，并且信息表的非粘附部分可以在部件上折叠。

公开(公告)号：US5659161A

公开(公告)日：1997-08-19

申请号：US650999

申请日：1996-05-21

Applicant: Daisuke Takanohashi ,  Keizo Nishitani ,  Masataka Nishijima ,  Tsuyoshi Oshima

Inventor： Daisuke Takanohashi ,  Keizo Nishitani ,  Masataka Nishijima ,  Tsuyoshi Oshima

IPC: B60R16/02 ,  H01H9/16 ,  H01H9/18 ,  H01H13/02 ,  H01H23/02 ,  H01H23/06 ,  H05K3/28 ,  H05K3/30 ,  H01H9/26 ,  H01H1/10

CPC classification number: H05K3/306 ,  H01H23/025 ,  H05K2201/10106 ,  H05K2201/10424 ,  H05K2201/10575 ,  H05K2201/10651 ,  H05K3/281 ,  H05K3/301

Abstract: In a rubber contact switch in which ends of lead lines of an LED extend to the rear surface of a printed board through holes of a rubber contact sheet to be soldered on the printed board, a recessed portion is formed in the peripheral portions of the holes on the rear surface of the rubber contact sheet, and heat generated by soldering of the lead lines is prevented from being directly transmitted to the rubber contact sheet.

Abstract translation: 在一个橡胶接触开关中，LED的引线端部通过要焊接在印刷电路板上的橡胶接触片的孔延伸到印刷电路板的后表面，在孔的周边部分形成凹部 在橡胶接触片的后表面上，并且防止引线的焊接产生的热直接传递到橡胶接触片。

公开(公告)号：US5107587A

公开(公告)日：1992-04-28

申请号：US477251

申请日：1990-02-07

Applicant: Claude Thepault

Inventor： Claude Thepault

IPC: H05K1/02 ,  H05K3/34

CPC classification number: H05K3/3447 ,  H05K1/0201 ,  H05K2201/0209 ,  H05K2201/10575 ,  H05K2203/081 ,  H05K2203/111 ,  H05K2203/304 ,  H05K3/3484 ,  H05K3/3494 ,  Y10T29/49142 ,  Y10T29/49149

Abstract: A method for the construction and application of a plate interface for the electrical interconnection in control and monitoring devices with terminal outlets of the plate type, using the steps of:making a rigid printed circuit having apertures disposed according to the layout of the output terminals of the control device;applying by screen-printing a soldering paste onto the locations of the printed circuit corresponding to the terminals to be brought into electrical contact;preheating only the terminals of the control device;assembling the electrical interconnection plate on the control device with the interposition of a further plate for the thermal protection of the control device itself; andmelting of the soldering paste according to a thermal cycle comprising an associated programming and monitoring device having output terminals for connectors of the plate-type, electrically interconnected and functionally arranged by means of an interface having a rigid plate electrically connected to the terminals by welding, intended especially for use in washing machines, drying machines and the like.

公开(公告)号：US4914259A

公开(公告)日：1990-04-03

申请号：US311838

申请日：1989-02-16

Applicant: Kenzo Kobayashi ,  Hirokazu Shiroishi

Inventor： Kenzo Kobayashi ,  Hirokazu Shiroishi

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/0058 ,  H05K3/306 ,  H05K3/3415 ,  H05K1/0393 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10575 ,  H05K2201/10636 ,  H05K2201/10863 ,  H05K2201/10977 ,  H05K2201/2036 ,  H05K2203/1327 ,  H05K2203/1572 ,  H05K3/28 ,  H05K3/3447 ,  Y02P70/611 ,  Y02P70/613

Abstract: A molded circuit board formed by molding a resin substrate to one side of a circuit film made by forming a desired circuit pattern to an insulating film in a manner to form an integral body. In the circuit film, there are provided soldering pad regions for mounting surface-mounting parts in a surface of the circuit film opposite the other surface in contact with resin substrate and through-holes at locations of the circuit film where insert-mounting parts are mounted. In the resin substrate, holes for receiving insert-mounting parts are formed in the molding process at the locations corresponding to the through-holes of the circuit film.

公开(公告)号：US20180159499A1

公开(公告)日：2018-06-07

申请号：US15803699

申请日：2017-11-03

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Hidetaro NAKAZAWA ,  Takashi MATSUDA

IPC: H03H9/02 ,  H03H9/05 ,  H05K1/02 ,  H03H9/72

CPC classification number: H03H9/02834 ,  H03H9/02102 ,  H03H9/02535 ,  H03H9/0523 ,  H03H9/0571 ,  H03H9/0576 ,  H03H9/059 ,  H03H9/1042 ,  H03H9/1085 ,  H03H9/72 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0243 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2203/1327

Abstract: An electronic component includes: a first substrate; a second substrate that includes a functional element formed on a lower surface of the second substrate, the second substrate being mounted on the first substrate so that the functional element faces an upper surface of the first substrate across an air gap; and an insulating film that is located on the upper surface of the first substrate, overlaps with at least a part of the functional element in plan view, faces the functional element across the air gap, and has a film thickness that is more than half of a distance between a lower surface of the functional element and the upper surface of the first substrate.

公开(公告)号：US08269339B2

公开(公告)日：2012-09-18

申请号：US13041007

申请日：2011-03-04

Applicant: Keiji Matsumoto

Inventor： Keiji Matsumoto

IPC: H01L23/10 ,  H01L23/34

CPC classification number: H01L23/36 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K3/305 ,  H05K2201/1028 ,  H05K2201/10575 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/00

Abstract: An underfill film for an electronic device includes a thermally conductive sheet. The electronic device may include a printed circuit board, an electrical component, an underfill, and the thermally conductive sheet. The underfill is situated between the circuit board and the component. The thermally conductive sheet is situated within the underfill, and together with the underfill, constitutes the underfill film. The device may include solder bumps affixing the component to the circuit board, the underfill film having holes within which the solder bumps are aligned. There may be solder bumps on the underside of the circuit board promoting heat dissipation. There may be heat sinks on the circuit board to which the thermally conductive sheet is affixed promoting heat dissipation. The thermally conductive sheet may be affixed to a chassis promoting heat dissipation. The thermally conductive sheet thus promotes heat dissipation from the component to at least the circuit board.

Abstract translation: 用于电子设备的底部填充膜包括导热片。 电子设备可以包括印刷电路板，电气部件，底部填充物和导热片。 底部填料位于电路板和组件之间。 导热片位于底部填充物内，并与底部填充物一起构成底部填充膜。 该装置可以包括将组件固定到电路板的焊料凸块，底部填充膜具有其中焊料凸块对准的孔。 电路板底面可能有焊锡凸块，有助于散热。 电路板上可能有散热片，导热片固定到散热片上，有助于散热。 导热片可以固定到促进散热的底盘上。 因此，导热片促进了从部件到至少电路板的散热。