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    ELECTRONIC DEVICE
    22.
    发明申请
    ELECTRONIC DEVICE 有权
    电子设备

    公开(公告)号：US20140177184A1

    公开(公告)日：2014-06-26

    申请号：US14013942

    申请日：2013-08-29

    Applicant: Kabushiki Kaisha Toshiba

    Inventor： Takiharu Yamada ,  Tsutomu Sato

    IPC: H05K7/14

    CPC classification number: H05K7/1417 ,  G06F1/203 ,  H01L23/4006 ,  H01L23/427 ,  H01L2023/4062 ,  H01L2924/0002 ,  H05K1/02 ,  H05K2201/09063 ,  H05K2201/10598 ,  H01L2924/00

    Abstract: According to one embodiment, electronic device includes casing, circuit board, joint component, and bonding agent. The circuit board is held in the casing, includes first face and second face opposite the first face, and includes a first opening provided on the first face. The joint component includes: insertion portion that is inserted into the first opening; protruding portion that protrudes from the insertion portion toward a side opposite the second face; first end of the protruding portion provided at a side opposite the second face; and support portion extended along the first face. The joint component includes a second opening provided on the first end, extended to the insertion portion, and into which a joint tool is inserted. The bonding agent is provided between the insertion portion and the first opening and between the support portion and the first face, and bonds the circuit board and the joint component.

    Abstract translation: 根据一个实施例，电子设备包括壳体，电路板，接合部件和粘合剂。 电路板被保持在壳体中，包括与第一面相对的第一面和第二面，并且包括设置在第一面上的第一开口。 接头部件包括：插入到第一开口中的插入部; 从所述插入部朝向与所述第二面相反的一侧突出的突出部; 突出部的第一端设置在与第二面相反的一侧; 并且沿着第一面延伸的支撑部分。 接头部件包括设置在第一端部上的延伸到插入部分的第二开口，并且接合工具插入该第二开口部。 接合剂设置在插入部分和第一开口之间以及支撑部分和第一面之间，并且将电路板和接头部件结合。

    OPTICAL MODULE
    25.
    发明申请
    OPTICAL MODULE 有权
    光学模块

    公开(公告)号：US20140064675A1

    公开(公告)日：2014-03-06

    申请号：US13974232

    申请日：2013-08-23

    Applicant: FUJIKURA LTD.

    Inventor： Takayuki TANAKA ,  Sawako YAMAI ,  Osamu KIKUCHI ,  Susumu OKABE

    IPC: G02B6/43 ,  G02B6/42

    CPC classification number: G02B6/4292 ,  G02B6/42 ,  G02B6/4206 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4259 ,  G02B6/4269 ,  G02B6/4284 ,  G02B6/43 ,  H05K1/0274 ,  H05K1/141 ,  H05K2201/09063 ,  H05K2201/10121 ,  H05K2201/10189 ,  H05K2201/10393 ,  H05K2201/10598

    Abstract: An optical module includes: a transparent substrate through which light can pass; a photoelectric conversion element mounted on the transparent substrate and emitting light toward the transparent substrate or receiving light having passed through the transparent substrate; and a support member supporting an optical fiber for transmitting light, the support member and the transparent substrate forming an optical path between the photoelectric conversion element and the optical fiber. A positioning hole is formed in the transparent substrate. A positioning pin having a tapered surface is formed on the support member. The transparent substrate and the support member are positioned with respect to one another by inserting the positioning pin into the positioning hole along the optical axis direction of light between the transparent substrate and the support member and by making the tapered surface of the positioning pin contact the edge of the positioning hole without leaving any space therebetween.

    Abstract translation: 光学模块包括：光可通过的透明基板; 安装在透明基板上的光电转换元件，朝向透明基板发射光，或接收透过透明基板的光; 以及支撑部件，其支撑用于透光的光纤，所述支撑部件和所述透明基板在所述光电转换元件与所述光纤之间形成光路。 在透明基板中形成定位孔。 具有锥形表面的定位销形成在支撑构件上。 通过将透明基板和支撑部件之间的光轴方向的定位销插入定位孔，并且通过使定位销的锥形表面接触定位销，透明基板和支撑部件相对于彼此定位 定位孔的边缘，而不在其间留下任何空间。

    Solid state disk assembly
    26.
    发明授权
    Solid state disk assembly 失效
    固态磁盘组件

    公开(公告)号：US08659904B2

    公开(公告)日：2014-02-25

    申请号：US13310716

    申请日：2011-12-03

    Applicant: Kang Wu ,  Guo-Yi Chen

    Inventor： Kang Wu ,  Guo-Yi Chen

    IPC: H05K7/20

    CPC classification number: H05K1/0203 ,  H05K3/0061 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10598

    Abstract: A solid state disk assembly includes a solid state disk, a first heat conducting member and a second heat conducting member. The solid state disk includes a printed circuit board (PCB) and a chipset. The PCB includes a front surface, a rear surface, a first end, and a second end. The chipset is mounted on the front surface. The first heat conducting member abuts the chipset for absorbing heat generated by the solid state disk and includes at least a pair of elastic arms. The second heat conducting member attaches on the rear surface and includes at least a pair of engaging arms spatially corresponding to the at least one pair of elastic arms. The first end and the second end are clamped between the at least one pair of elastic arms. Each elastic arm engages with a respective one of the engaging arms.

    Abstract translation: 固态盘组件包括固态盘，第一导热构件和第二导热构件。 固态盘包括印刷电路板（PCB）和芯片组。 PCB包括前表面，后表面，第一端和第二端。 芯片组安装在前表面。 第一导热构件邻接芯片组以吸收由固态盘产生的热量，并且至少包括一对弹性臂。 第二导热构件附接在后表面上，并且至少包括一对在空间上对应于至少一对弹性臂的接合臂。 第一端和第二端夹在至少一对弹性臂之间。 每个弹性臂与相应的一个接合臂接合。

    Illumination system
    27.
    发明授权
    Illumination system 有权
    照明系统

    公开(公告)号：US08622579B2

    公开(公告)日：2014-01-07

    申请号：US13315824

    申请日：2011-12-09

    Applicant: Hyun-Gu Kang

    Inventor： Hyun-Gu Kang

    IPC: F21V33/00 ,  H05B37/03

    CPC classification number: H05K3/325 ,  F21V19/0015 ,  F21V23/0442 ,  F21Y2115/10 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K3/301 ,  H05K3/326 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10598 ,  H01L2924/00014

    Abstract: An illumination system according to an exemplary embodiment of the present invention includes at least one light emitting apparatus including at least one light emitting module detachably coupled to the at least one light emitting apparatus, the at least one light emitting module including an information storage unit to store characteristic information of the at least one light emitting module. The at least one light emitting apparatus also includes a controller configured to detect whether the at least one light emitting module is connected to or disconnected from the at least one light emitting apparatus, and to read out the characteristic information of the at least one light emitting module according to a detection result, wherein the characteristic information includes unique identification information or absolute lifetime information of the at least one light emitting module.

    Abstract translation: 根据本发明的示例性实施例的照明系统包括至少一个发光装置，其包括可拆卸地耦合到所述至少一个发光装置的至少一个发光模块，所述至少一个发光模块包括信息存储单元， 存储所述至少一个发光模块的特征信息。 所述至少一个发光装置还包括被配置为检测所述至少一个发光模块是否连接到所述至少一个发光装置或从所述至少一个发光装置断开的控制器，以及读出所述至少一个发光装置的特征信息 模块，其中所述特征信息包括所述至少一个发光模块的唯一识别信息或绝对寿命信息。

    Dipole Strength Clip
    28.
    发明申请
    Dipole Strength Clip 有权
    偶极强度剪辑

    公开(公告)号：US20130314292A1

    公开(公告)日：2013-11-28

    申请号：US13479599

    申请日：2012-05-24

    Applicant: Gregory Joseph MALEY

    Inventor： Gregory Joseph MALEY

    IPC: H01Q9/16 ,  H01Q21/26

    CPC classification number: H01Q9/16 ,  H01Q1/1207 ,  H01Q21/26 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09027 ,  H05K2201/09145 ,  H05K2201/10598

    Abstract: An antenna comprising PCB elements mechanically secured by a clip is provided. The antenna has a feedboard printed circuit board having a feed network, at least one radiating element, and the clip. The radiating element includes first and second printed circuit boards, each having a base disposed on a surface of the feedboard printed circuit board. In one example, the printed circuit boards each further include a dipole disposed above the feedboard. In another example, the PCBs are supports and a cross-polarized radiating may be mounted on top. The first and second PCBs may include slots so that the boards may be assembled together. The PCBs also include an extension extending through a first slot on the feedboard PCB, and indentations disposed on the first extension. The clip may have retainers that engage the indentations of the extensions.

    Abstract translation: 提供了包括通过夹子机械固定的PCB元件的天线。 天线具有馈电板印刷电路板，其具有馈电网络，至少一个辐射元件和夹子。 辐射元件包括第一和第二印刷电路板，每个印刷电路板具有设置在馈电板印刷电路板的表面上的基座。 在一个示例中，印刷电路板各自还包括设置在馈电板上方的偶极子。 在另一示例中，PCB是支撑件，并且可以在顶部安装交叉极化辐射。 第一和第二PCB可以包括槽，使得板可以组装在一起。 PCB还包括延伸穿过馈送板PCB上的第一槽的延伸部和设置在第一延伸部上的压痕。 夹子可以具有接合延伸部的凹槽的保持器。

    ULTRASONIC PROBE
    29.
    发明申请
    ULTRASONIC PROBE 有权
    超声探头

    公开(公告)号：US20130286593A1

    公开(公告)日：2013-10-31

    申请号：US13873342

    申请日：2013-04-30

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Kyung Il CHO ,  Seung Heun LEE ,  Bae Hyung KIM ,  Young Il KIM ,  Jong Keun SONG

    IPC: H05K7/20

    CPC classification number: H05K7/20336 ,  B06B1/0292 ,  G01N29/2406 ,  G01N29/326 ,  H05K1/0204 ,  H05K2201/064 ,  H05K2201/09072 ,  H05K2201/10598

    Abstract: An ultrasonic probe, from which heat generated in an integrated circuit which is bonded to a cMUT is released, is provided. The ultrasonic probe includes a transducer which is configured to generate ultrasound radiation, an integrated circuit which is installed on the rear surface of the transducer, a printed circuit board which is installed on the rear surface of the integrated circuit and has an opening via which the rear surface of the integrated circuit is at least partially exposed, a heat spreader which has a protrusion inserted into the opening of the printed circuit board and is configured to absorb heat generated in the integrated circuit, and a heat dissipation module which is configured to release heat absorbed by the heat spreader to the outside.

    Abstract translation: 提供了一种超声波探头，其中释放了结合到cMUT的集成电路中产生的热量。 超声波探头包括被配置为产生超声波的换能器，安装在换能器的后表面上的集成电路，安装在集成电路的后表面上的印刷电路板，并且具有开口， 集成电路的后表面至少部分地露出，散热器具有插入印刷电路板的开口中的突起，并且被构造成吸收集成电路中产生的热量，散热模块被配置为释放 散热器吸收的热量到外面。

    ILLUMINATION DEVICE AND DISPLAY DEVICE
    30.
    发明申请
    ILLUMINATION DEVICE AND DISPLAY DEVICE 审中-公开
    照明装置和显示装置

    公开(公告)号：US20130148332A1

    公开(公告)日：2013-06-13

    申请号：US13817944

    申请日：2011-09-08

    Applicant: Yuuki Namekata

    Inventor： Yuuki Namekata

    IPC: G09F13/14 ,  F21V7/00

    CPC classification number: G09F13/14 ,  F16B2/065 ,  F16B5/04 ,  F16B5/0642 ,  F16B19/1081 ,  F21V7/00 ,  G02F1/133603 ,  G02F1/133605 ,  G02F1/133608 ,  G02F1/133611 ,  H05K1/02 ,  H05K2201/0355 ,  H05K2201/10409 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2201/2054

    Abstract: An illumination device capable of suppressing the generation of uneven luminescence is provided. The illumination device comprises: an LED package (25); a reflective sheet (23) with an exposure hole (23c) for exposing the LED package (25); and a pressing member (27) for pressing down the reflective sheet (23). The pressing member (27) has a sheet pressing section (27a) arranged so to surround the circumference of the LED package (25), and an edge section (23d) of the exposure hole (23c) is pressed down by the sheet pressing section (27a).

    Abstract translation: 提供能够抑制不均匀发光的发光的照明装置。 所述照明装置包括：LED封装（25）; 具有暴露所述LED封装（25）的曝光孔（23c）的反射片（23）; 和用于按压反射片（23）的按压部件（27）。 按压部件（27）具有设置成包围LED封装（25）的周围的片材按压部（27a），曝光孔（23c）的边缘部（23d）被片材按压部 （27a）。

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