公开(公告)号：US09125313B2

公开(公告)日：2015-09-01

申请号：US14548805

申请日：2014-11-20

Applicant: Carmen Rapisarda

Inventor： Carmen Rapisarda

IPC: H05K7/20 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H01R12/70 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K1/11 ,  H01R12/7076 ,  H05K1/0203 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/284 ,  H05K3/325 ,  H05K2201/035 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10393 ,  H05K2201/10454 ,  H05K2201/10598 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/611

Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that is in contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

Abstract translation: 电子电路包含具有导电轨道的电路板，一个或多个具有导电触点的电子部件定位在导电轨道的上部，并且每个这样的电子部件通过夹具保持在适当的位置，所述夹具与 电子部件，以便将其导电触点保持与电路板的导电轨道电接触。 夹具可以包括保持在电子部件的顶表面和刚性夹紧片之间的弹性层。

公开(公告)号：US20050156012A1

公开(公告)日：2005-07-21

申请号：US10759962

申请日：2004-01-16

Applicant: Ted Ju

Inventor： Ted Ju

IPC: B23K1/00 ,  B23K31/02 ,  H05K3/34

CPC classification number: H05K3/3426 ,  B23K1/0016 ,  B23K2101/40 ,  H05K2201/10424 ,  H05K2201/1078 ,  H05K2201/1084 ,  H05K2201/10931 ,  Y02P70/613

Abstract: A method of soldering an electrical connection is described. A plurality of terminals is formed on an insulating casing, a plurality of slots being formed on a bottom of the insulating casing to communicate respectively with the terminals. A solder material is applied over electrical contacts of a circuit board for bonding the electrical connection to the circuit board, wherein the slots in the bottom of the insulating casing correspond to the solder material. The solder material is melted by heating, and the height of the solder material increases due to a cohesion effect so as to extend into the slots and bond to the terminals. The terminals need not contact the solder material before being soldered. Therefore, soldering quality is improved, while problems of short circuits and soldering failure due to deformation of the terminals are eliminated.

Abstract translation: 描述了焊接电连接的方法。 多个端子形成在绝缘壳体上，多个槽形成在绝缘壳体的底部上，分别与端子相通。 焊接材料被施加在电路板的电触头上，用于将电连接连接到电路板，其中绝缘壳体的底部中的槽对应于焊料材料。 焊料通过加热熔化，焊料的高度由于内聚效应而增加，从而延伸到槽中并结合到端子上。 在焊接之前，端子不需要接触焊料。 因此，提高了焊接质量，而消除了由于端子的变形导致的短路和焊接故障的问题。

公开(公告)号：US06570280B2

公开(公告)日：2003-05-27

申请号：US09920863

申请日：2001-08-03

Applicant: Hideyuki Takahashi

Inventor： Hideyuki Takahashi

IPC: H05K334

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H02K3/50 ,  H02K11/33 ,  H05K3/4046 ,  H05K2201/09854 ,  H05K2201/1078 ,  H05K2201/10818 ,  H05K2201/10856

Abstract: A bonding portion of a connector terminal includes embossed portions and a slit. Each embossed portion is formed by embossing the bonding portion in a thicknesswise direction of the bonding portion to provide an embossed recess on one of opposed sides of the bonding portion. Each embossed recess communicates opposed open ends of an elongated hole provided in a circuit board with each other when the bonding portion is inserted to a predetermined position in the elongated hole. The slit penetrates through the bonding portion. The slit extends over at least one of the opposed open ends of the elongated hole in the thickensswise direction of the circuit board when the bonding portion is inserted to the predetermined position in the elongated hole.

公开(公告)号：US6049125A

公开(公告)日：2000-04-11

申请号：US999074

申请日：1997-12-29

Applicant: Mike Brooks ,  Walter L. Moden

Inventor： Mike Brooks ,  Walter L. Moden

IPC: H01L23/36 ,  H01L23/433 ,  H05K3/34 ,  H01L23/34

CPC classification number: H01L23/36 ,  H01L23/4334 ,  H05K3/341 ,  H01L2924/0002 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H05K2201/10689 ,  H05K2201/1078 ,  H05K2201/1084 ,  H05K2201/10969 ,  H05K2201/2036 ,  Y02P70/613

Abstract: A semiconductor package and method for fabricating the package are provided. The package includes a semiconductor die and a heat sink in thermal communication with the die. The heat sink includes one or more pad structures adapted to form bonded connections, and thermal paths to contacts on a substrate. The method includes forming multiple heat sinks on a frame similar to a lead frame, and etching or stamping the pad structures on the heat sink. The frame can then be attached to a leadframe containing encapsulated dice, and the assembly singulated to form separate packages. The packages can be used to form electronic assemblies such as circuit board assemblies and multi chip modules.

Abstract translation: 提供一种用于制造封装的半导体封装和方法。 封装包括半导体管芯和与管芯热连通的散热器。 散热器包括适于形成接合连接的一个或多个焊盘结构，以及衬底上的触点的热路径。 该方法包括在类似于引线框架的框架上形成多个散热器，以及蚀刻或冲压散热器上的焊盘结构。 然后可以将该框架连接到包含封装的骰子的引线框架上，并且该组件被单个化以形成单独的封装。 这些封装可用于形成诸如电路板组件和多芯片模块之类的电子组件。

公开(公告)号：US4347552A

公开(公告)日：1982-08-31

申请号：US140263

申请日：1980-04-14

Applicant: Robert E. Pearcy ,  James E. Raus

Inventor： Robert E. Pearcy ,  James E. Raus

IPC: H05K1/11 ,  H05K3/30 ,  H05K3/34 ,  H05K1/00

CPC classification number: H05K3/308 ,  H01R12/65 ,  H05K1/118 ,  H05K2201/10651 ,  H05K2201/1078 ,  H05K2201/10878 ,  H05K3/3447

Abstract: A lead (12) of an electrical component (10) is formed with an arrowhead-shaped tip (20) that functions to mechanically fasten the lead and component to a substrate (14), such as a flexible printed circuit (11). The tip is formed with barbs (21) extending rearwardly from the end (22) of the tip and having a width (W) across the barbs greater than the diameter (d) of a mounting hole (13) in the substrate. With this arrangement, the barbed tips may be inserted into and through the hole, with the barbs being compressed relatively inward with respect to the hole as the tip passes through the hole, so as to fasten the tips to the substrate in preparation for a soldering operation, in which the tips are soldered (30) to conductive pad areas (16) deposited on the surface of the substrate adjacent to the tips.

Abstract translation: 电气部件（10）的引线（12）形成有用于将引线和部件机械地紧固到诸如柔性印刷电路（11）的基板（14）的箭头形尖端（20）。 尖端形成有从尖端的端部（22）向后延伸的倒钩（21），并且跨越倒钩的宽度（W）大于衬底中的安装孔（13）的直径（d）。 通过这种布置，倒钩尖可以插入孔中并穿过孔，当尖端穿过孔时，倒钩相对于孔相对地被压缩，以便将尖端紧固到基底以准备焊接 操作，其中尖端焊接（30）到沉积在邻近尖端的衬底的表面上的导电焊盘区域（16）。

公开(公告)号：US4246627A

公开(公告)日：1981-01-20

申请号：US20328

申请日：1979-03-14

Applicant: Helmut H. Poensgen

Inventor： Helmut H. Poensgen

IPC: H01G2/06 ,  H01G2/12 ,  H01R4/02 ,  H05K3/30 ,  H05K3/34 ,  H05K1/04

CPC classification number: H01G2/06 ,  H01G2/12 ,  H05K3/308 ,  H01R4/02 ,  H05K2201/10651 ,  H05K2201/1078 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2203/1178 ,  H05K3/3447

Abstract: To seat an electrical circuit element in a metallized opening of a circuit board and permit escape of solder gases, a bead is placed on the insertion pin and formed with a surface facing the support board which is non-symmetrical with respect to the axis of the pin, and of the insertion opening. Preferably, the surface is conical, and on adjacent pins the cone angles are tilted in opposite directions to provide for the non-symmetrical positioning of any one cone and centered placement of the insertion pins in the insertion openings.

Abstract translation: 为了将电路元件放置在电路板的金属化开口中并允许焊接气体逸出，珠子被放置在插入销上并形成有面向支撑板的表面，该表面相对于轴线是不对称的 销和插入开口。 优选地，表面是圆锥形的，并且在相邻的销上，锥角在相反的方向上倾斜以提供将插入销的任何一个锥体和居中放置在插入开口中的非对称定位。

公开(公告)号：US3927471A

公开(公告)日：1975-12-23

申请号：US43730574

申请日：1974-01-28

Applicant: TRICKER KEITH ARTHUR

Inventor： TRICKER KEITH ARTHUR

IPC: H01R12/70 ,  H05K1/00 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K3/308 ,  H01R12/7076 ,  H05K1/0287 ,  H05K2201/10287 ,  H05K2201/10325 ,  H05K2201/1053 ,  H05K2201/1059 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2203/1446 ,  Y10T29/4914 ,  Y10T29/49167

Abstract: A method of fabricating an electrical circuit - usually employing small electronic components - on a generally rigid electrically conductive panel. The panel has apertures through which insulating collars are inserted, the necessary wiring and components then being built up on the panel by inserting the wires through the collars. The wires through each collar respectively are then united into electrical connection by crimping of the collars.

Abstract translation: 在通常刚性的导电面板上制造通常采用小型电子部件的电路的方法。 面板具有插入绝缘套环的孔，然后通过将线穿过套环将所需的布线和部件组装在面板上。 然后通过每个衣领的电线通过套环的卷曲结合成电连接。

公开(公告)号：US3327284A

公开(公告)日：1967-06-20

申请号：US40139464

申请日：1964-10-05

Applicant: THOMAS & BETTS COMPANY INC

Inventor： CRIMMINS DAVID J

IPC: H01R4/10 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01R4/10 ,  H01R12/58 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/0281 ,  H05K2201/10765 ,  H05K2201/1078 ,  H05K2201/10878 ,  Y10T29/49833 ,  Y10T29/49945

公开(公告)号：US2994057A

公开(公告)日：1961-07-25

申请号：US67809557

申请日：1957-08-14

Applicant: SPRAGUE ELECTRIC CO

Inventor： DONOHUE FRANK L ,  TEEPLE JAMES R

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/308 ,  H05K3/3447 ,  H05K2201/10651 ,  H05K2201/1078 ,  H05K2201/10878 ,  Y10T29/49169

公开(公告)号：US11862898B2

公开(公告)日：2024-01-02

申请号：US17334457

申请日：2021-05-28

Applicant: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD

Inventor： Tao Song ,  Kun Liu ,  Rongzhe Guo ,  Chuanqi Gong ,  Xiaogang Liu ,  Ming Li

IPC: H01R13/6471 ,  H01R13/6587 ,  H01R13/6585 ,  H01R13/40 ,  H01R13/6591 ,  H01R13/514 ,  H01R13/518 ,  H01R12/72 ,  H01R13/6586 ,  H01R12/58 ,  H05K1/11 ,  H01R13/6588 ,  H01R13/6583 ,  H01R13/6582 ,  H01R43/24 ,  H01R12/71 ,  H01R13/20 ,  H01R13/504 ,  H01R13/6461 ,  H01R13/6584 ,  H05K3/30 ,  H01R13/02 ,  H05K3/34 ,  H01R13/6474 ,  H01R13/502 ,  H01R13/46 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6581

CPC classification number: H01R13/6471 ,  H01R12/585 ,  H01R12/716 ,  H01R12/724 ,  H01R13/02 ,  H01R13/20 ,  H01R13/40 ,  H01R13/504 ,  H01R13/514 ,  H01R13/518 ,  H01R13/6461 ,  H01R13/6582 ,  H01R13/6583 ,  H01R13/6584 ,  H01R13/6585 ,  H01R13/6586 ,  H01R13/6587 ,  H01R13/6588 ,  H01R13/6591 ,  H01R43/24 ,  H05K1/115 ,  H05K3/306 ,  H05K3/3447 ,  H01R12/71 ,  H01R12/712 ,  H01R12/722 ,  H01R13/46 ,  H01R13/502 ,  H01R13/646 ,  H01R13/6473 ,  H01R13/6474 ,  H01R13/6581 ,  H05K2201/09236 ,  H05K2201/1078 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10871

Abstract: A shielding shell used to at least partially surround signal terminals includes a first side wall, a second side wall and a third side wall. The second side wall connects the first side wall and the third side wall. The first side wall and the third side wall are disposed face to face. An end of at least one of the first side wall, the second side wall and the third side wall includes a deflection portion bent inwardly. The deflection portion is used to guide insertion of the shielding shell into a mating connector. As a result, a better shielding effect on the signal terminals can be provided. Besides, it is easy to guide insertion of the shielding shell into the mating connector.