公开(公告)号：US10105732B2

公开(公告)日：2018-10-23

申请号：US14988677

申请日：2016-01-05

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Ming-Hsiang Hung ,  Teng-Yi Huang ,  Fu-Jen Tien ,  Li-Jen Wu ,  Cheng-Ming Wu ,  Teng-Hwee Ng ,  Ming-Yang Chuang

IPC: B05C5/02 ,  B05C19/00 ,  B05C11/08 ,  H01L21/00 ,  H01L21/67 ,  B05B14/44

Abstract: A coater includes a chuck, a source of a coating material, a dispensing head, an exhaust system, and a liner. The chuck is configured to support a wafer. The dispensing head is configured to dispense the coating material onto the wafer. The exhaust system is configured to exhaust the excess coating material. The liner is present at least partially on an inner surface of the exhaust system. The liner has a stick resistance to the coating material, and the stick resistance of the liner is greater than a stick resistance of the inner surface of the exhaust system.

公开(公告)号：US20180272374A1

公开(公告)日：2018-09-27

申请号：US15934670

申请日：2018-03-23

Applicant: Robatech AG

Inventor： Roman Kappeler ,  Mathias Heller

IPC: B05C5/02 ,  B05C11/08 ,  B05C11/10

Abstract: A slotted nozzle for discharging a liquid adhesive to a narrow edge of a substrate includes a nozzle body, a nozzle slot formed in the nozzle body, a passage in the nozzle body for supplying the adhesive to the nozzle slot, and a slot-shaped outlet opening of the nozzle slot. The nozzle body is configured in the region of averted ends of the nozzle slot that are based on the longitudinal extent of the nozzle slot in such a manner that an increased outlet of the adhesive through the outlet opening takes place in the region of the averted ends of the nozzle slot.

公开(公告)号：US20180166300A1

公开(公告)日：2018-06-14

申请号：US15377399

申请日：2016-12-13

Applicant: Lam Research AG

Inventor： Philipp Zagorz

IPC: H01L21/67 ,  B01F3/08 ,  B01F15/00 ,  B08B3/04 ,  B08B3/08 ,  B08B11/02 ,  B05C11/08 ,  H01L21/687 ,  H01L21/66 ,  H01L21/02

CPC classification number: H01L21/67051 ,  B01F3/088 ,  B01F15/00136 ,  B01F15/00162 ,  B01F15/00175 ,  B01F15/00344 ,  B01F15/0429 ,  B01F2015/0221 ,  H01L21/67017 ,  H01L21/67248

Abstract: A liquid dispensing system for treating a substrate is provided and includes a flow controller, pressure regulator, mixing node, liquid mixer, temperature sensor, N dispensers, and system controller. The flow controller receives and controls a flow rate of a first liquid. The pressure regulator receives and controls a pressure of a second liquid. The mixing node mixes the first and second liquid output by the flow controller and pressure regulator to provide a first mixture. The liquid mixer mixes the first mixture and a third liquid to provide a second mixture. The temperature sensor measures a temperature of the second mixture. The N dispensers dispense the second mixture at the substrate. The system controller controls the measured temperature to be between the first and second temperatures by adjusting the flow rate based on the measured temperature and independent of a measurement of a flow rate of the second liquid.

公开(公告)号：US20180147599A1

公开(公告)日：2018-05-31

申请号：US15579505

申请日：2016-04-15

Applicant: SCREEN Holdings Co., Ltd.

Inventor： Yuji TANAKA ,  Masaya ASAI ,  Masahiko HARUMOTO ,  Koji KANEYAMA

IPC: B05D1/00 ,  B05C11/10 ,  B05C11/08 ,  B05D3/00 ,  C23F1/00 ,  H01L21/67

CPC classification number: B05D1/005 ,  B05C11/08 ,  B05C11/10 ,  B05C11/1039 ,  B05D3/007 ,  C23F1/00 ,  C23F1/08 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67742 ,  H01L21/68707

Abstract: A coating liquid containing metal as a metal-containing coating liquid is supplied to a surface to be processed of a substrate by a coating processing unit, whereby a metal-containing coating film is formed on the surface to be processed. The substrate on which the metal-containing coating film has been formed is transported to a metal removal unit by a transport mechanism. A removal liquid for dissolving the metal is supplied to a peripheral portion of the substrate by the metal removal unit such that the metal-containing coating film remains in a region except for the peripheral portion of the surface to be processed of the substrate.

公开(公告)号：US20180047592A1

公开(公告)日：2018-02-15

申请号：US15671325

申请日：2017-08-08

Applicant: Tokyo Electron Limited

Inventor： Masahiro Fukuda ,  Hiroshi Ichinomiya ,  Koichi Obata ,  Taro Yamamoto ,  Kouichirou Tanaka

IPC: H01L21/67 ,  B05C11/08 ,  G03F7/16 ,  B05C11/10 ,  B08B3/08 ,  B08B3/10 ,  H01L21/027 ,  B05C5/02

CPC classification number: H01L21/6715 ,  B05C5/0258 ,  B05C11/08 ,  B05C11/1002 ,  B08B3/08 ,  B08B3/10 ,  G03F7/162 ,  G03F7/3021 ,  H01L21/0273 ,  H01L21/67051 ,  H01L21/67178

Abstract: There is provided a guide member 3 in which an inclined surface 32 thereof is inclined downwardly outwards from an edge portion of a rear surface of a horizontally held wafer W; and a cylindrical surrounding member 2 which surrounds the wafer W and in which an upper peripheral portion thereof is inwardly extended obliquely upwards. Further, the surrounding member 2 has, at an inner surface side thereof, two groove portions 23 extended along an entire circumference and located above a height position of the horizontally held wafer W. If an air flow flows along the surrounding member 2, a vortex flow is formed within the groove portions 23 and stays therein. Thus, mist can be captured, so that the flow of the mist to the outside of a cup body 1 can be suppressed. Accordingly, the adhesion of the mist to the wafer W can be suppressed.

公开(公告)号：US09855579B2

公开(公告)日：2018-01-02

申请号：US14179337

申请日：2014-02-12

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Ching-Hai Yang ,  Yao-Hwan Kao ,  Shang-Sheng Li ,  Kuo-Pin Chen ,  Hsiang-Kai Tseng ,  Chuan-Wei Chen

IPC: B05C11/10 ,  B05C11/08 ,  B05B11/00 ,  G03F7/16 ,  G03F7/30 ,  H01L21/67

CPC classification number: B05C11/1039 ,  B05B11/3097 ,  B05C11/08 ,  G03F7/162 ,  G03F7/3021 ,  H01L21/6715

Abstract: A spin dispenser module and methods for using the same is disclosed. The spin dispenser module includes a cup having a basin with sidewalls and an exhaust, a rotatable platform situated inside the cup adapted for holding and rotating a substrate, a liquid dispenser disposed over the rotatable platform for dispensing a liquid coating material on top of the substrate, one or more ejector inlets disposed over the rotatable platform, the one or more ejectors connected to a negative pressure source, and a motor coupled to the rotatable platform to rate the rotatable platform at different rotational speeds. The one or more ejector inlets may be translatable and/or rotatable with optionally adjustable suction pressure. The ejector inlets operate after a liquid coating material is dispensed to avoid deposition of suspended organic compounds after a coating is formed.

公开(公告)号：US20170321337A1

公开(公告)日：2017-11-09

申请号：US15496901

申请日：2017-04-25

Applicant: United Company RUSAL Engineering and Technology Centre LLC

Inventor： Aleksandr Vladimirovich Proshkin ,  Samuil Yakovlevich Levenson ,  Vitaliy Valer'evich Pingin ,  Aleksey Vasil'evich Morozov

IPC: C25C3/08 ,  B05C11/08 ,  B05C11/02

CPC classification number: C25C3/08 ,  B05C11/025 ,  B05C11/08

Abstract: The invention relates to method and apparatus for lining the cathode of the electrolytic cell. The method comprises filling the cell's shell with powder material, leveling it with a rack, covering the fill material with a dust-proof film, and compaction. Compaction is performed in two stages: preliminary static and final dynamic treatment by consequent movement of static and dynamic work tools of compaction along the longitudinal axis of the cathode of the electrolytic cell through a cushion, which is made of at least 2 layers: a lower layer, which prevents pushing powder material forward in the direction of travel, and an upper layer, which provides for a coupling between the cushion and the static work tool. Static treatment unit of the apparatus is designed in the form of a roller with a drive, connected to a dynamic treatment unit with a vibratory exciter by means of elastic elements.

公开(公告)号：US20170213725A1

公开(公告)日：2017-07-27

申请号：US15393698

申请日：2016-12-29

Applicant: SCREEN Holdings Co., Ltd.

Inventor： Hiroaki KITAGAWA ,  Dai UEDA ,  Katsuhiko MIYA

IPC: H01L21/02 ,  B05C13/00 ,  B05D3/04 ,  B05D3/12 ,  F25B21/02 ,  H01L21/67 ,  H01L21/687 ,  B08B7/00 ,  B08B3/10 ,  B05C11/08 ,  B05C9/14

CPC classification number: F25B21/02 ,  B05D3/10 ,  B08B7/0014 ,  H01L21/02052 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/68764

Abstract: A substrate processing apparatus comprises: a first solidifier and a second solidifier. The first solidifier solidifies a liquid to be solidified adhering to a front surface of a substrate by supplying a liquid refrigerant to a back surface of the substrate at a first position. The second solidifier solidifies the liquid to be solidified by at least one of a first cooling mechanism and a second cooling mechanism. The first cooling mechanism cools the liquid to be solidified by supplying a gas refrigerant toward the substrate at a second position more distant from a center of rotation of the substrate in a radial direction than the first position. The second cooling mechanism cools the liquid to be solidified by bringing a processing surface into contact with the liquid to be solidified at the second position.

公开(公告)号：US09687874B2

公开(公告)日：2017-06-27

申请号：US14863375

申请日：2015-09-23

Applicant: Screen Semiconductor Solutions Co., Ltd.

Inventor： Hiroyuki Ogura ,  Tsuyoshi Mitsuhashi ,  Yoshiteru Fukutomi ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

IPC: B05C11/00 ,  B05C13/00 ,  H01L21/306 ,  H01L21/677 ,  H01L21/67 ,  B05C9/12 ,  B05C11/08 ,  G03F7/16 ,  C23C14/56 ,  B05C13/02

CPC classification number: B05C13/00 ,  B05C9/12 ,  B05C11/08 ,  B05C13/02 ,  C23C14/568 ,  G03F7/16 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67276 ,  H01L21/67703 ,  H01L21/67742 ,  H01L21/67745 ,  Y10S414/135

Abstract: A substrate treating apparatus includes a first treating block and a second treating block disposed adjacent to the first treating block. Each of the first treating block and the second treating block include a plurality of stories arranged vertically. Each of the plurality of stories includes treating units for treating substrates and a main transport mechanism for transporting the substrates to and from the treating units. The substrates are transportable between the stories of the first treating block and the stories of the second treating block at same heights as corresponding stories of the first treating block. The substrates are transportable between the stories of the first treating block and the stories of the second treating block at different heights from corresponding stories of the first treating block.

公开(公告)号：US20170117160A1

公开(公告)日：2017-04-27

申请号：US15401892

申请日：2017-01-09

Applicant: SCREEN Holdings Co., Ltd.

Inventor： Akio HASHIZUME ,  Takashi OTA

IPC: H01L21/311 ,  B05C11/10 ,  B05C9/14 ,  B05C11/08 ,  H01L21/67 ,  B08B3/08

CPC classification number: H01L21/31138 ,  B05C9/14 ,  B05C11/08 ,  B05C11/1015 ,  B08B3/08 ,  G03F7/42 ,  H01L21/31133 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/67109

Abstract: In a substrate processing method, a substrate holding unit holds a substrate in a horizontal position, a processing liquid supplying unit supplies first and second processing liquids to the surface of the substrate held by the substrate holding unit, a substrate rotating unit rotates the substrate held by the substrate holding unit, a heater opposes the substrate held by the substrate holding unit, and a moving unit moves at least one of the substrate holding unit and the heater supporting member such that the heater and the substrate are held in two different relative positions.