中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

65 records (took 0.017 seconds)

    Wafer inversion mechanism
    31.
    发明授权
    Wafer inversion mechanism 有权
    晶圆反转机制

    公开(公告)号：US09431282B2

    公开(公告)日：2016-08-30

    申请号：US13723618

    申请日：2012-12-21

    Applicant: Rudolph Technologies, Inc.

    Inventor： Troy Palm

    IPC: H01L21/68 ,  B25J15/00 ,  H01L21/677 ,  H01L21/687

    CPC classification number: H01L21/68 ,  B25J15/00 ,  H01L21/67775 ,  H01L21/68707

    Abstract: A BOLTS compatible module includes a support mechanism for gripping a wafer. The support mechanism is coupled to a rotary mechanism for rotating the support mechanism with a wafer grip therein. The rotary mechanism is coupled to the module and capable of at least 180° of rotation.

    Abstract translation: BOLTS兼容模块包括用于夹持晶片的支撑机构。 支撑机构联接到用于使支撑机构旋转的旋转机构，其中具有晶片把手。 旋转机构联接到模块并且能够至少180°的旋转。

    ON-AXIS FOCUS SENSOR AND METHOD
    32.
    发明申请
    ON-AXIS FOCUS SENSOR AND METHOD 有权
    轴对焦传感器和方法

    公开(公告)号：US20140368635A1

    公开(公告)日：2014-12-18

    申请号：US14367564

    申请日：2012-12-20

    Applicant: Rudolph Technologies, Inc.

    Inventor： Dennis L. Ohren ,  Christopher J. Voges ,  Andrew E. Rotering

    IPC: G02B7/28 ,  G01N21/84 ,  H04N5/232 ,  G01B11/06

    CPC classification number: G02B7/28 ,  G01B11/00 ,  G01B11/026 ,  G01B11/0608 ,  G01N21/84 ,  G01N21/9501 ,  G01N2201/127 ,  H04N5/23212

    Abstract: A focus height sensor in an optical system for inspection of semiconductor devices includes a sensor beam source that emits a beam of electromagnetic radiation. A reflector receives the beam of electromagnetic radiation from the sensor beam source and directs the beam toward a surface of a semiconductor device positioned within a field of view of the optical system. The reflector is positioned to receive at least a portion of the beam back from the surface of the semiconductor device to direct the returned beam to a sensor. The sensor receives the returned beam and outputs a signal correlating to a position of the surface within the field of view along an optical axis of the optical system.

    Abstract translation: 用于检查半导体器件的光学系统中的焦点高度传感器包括发射电磁辐射束的传感器光束源。 反射器接收来自传感器光束源的电磁辐射束，并将光束引向位于光学系统的视野内的半导体器件的表面。 反射器定位成从半导体器件的表面接收光束的至少一部分，以将返回的光束引导到传感器。 传感器接收返回的光束，并沿着光学系统的光轴输出与视场内的表面的位置相关的信号。

    SUBSTRATE HANDLER
    33.
    发明申请
    SUBSTRATE HANDLER 有权
    基板处理器

    公开(公告)号：US20140314535A1

    公开(公告)日：2014-10-23

    申请号：US14253502

    申请日：2014-04-15

    Applicant: Rudolph Technologies, Inc.

    Inventor： Troy Palm ,  Kevin J. Barr ,  Ralph P. Sowden ,  Matthew M. Laberge ,  Andrey Monjoseph ,  Brian Delsey ,  Emily Nordick ,  Richard Sobotka ,  Chetan Suresh

    IPC: H01L21/68

    CPC classification number: H01L21/68 ,  H01L21/67775

    Abstract: A loadport for handling film frames is disclosed. The loadport is modular and substantially compatible with applicable standards regarding modular equipment. In particular, the load port is substantially interchangeable with loadports not adapted for handling film frames. The loadport has a compact shuttle for moving film frames and flexible alignment mechanisms for aligning film frames and cassettes of different configurations.

    Abstract translation: 公开了一种用于处理胶卷框的装载口。 负载端口是模块化的，并且与模块化设备的适用标准基本兼容。 特别地，负载端口与不适于处理胶片框架的装载端口基本上可互换。 装载端口具有用于移动胶片框架的紧凑型梭子和用于对准不同配置的胶片框架和胶卷盒的柔性对准机构。

    INSPECTION DEVICE WITH VERTICALLY MOVEABLE ASSEMBLY
    34.
    发明申请
    INSPECTION DEVICE WITH VERTICALLY MOVEABLE ASSEMBLY 审中-公开
    具有垂直移动装置的检查装置

    公开(公告)号：US20140253166A1

    公开(公告)日：2014-09-11

    申请号：US14282565

    申请日：2014-05-20

    Applicant: RUDOLPH TECHNOLOGIES, INC.

    Inventor： Gary Mark Gunderson ,  Greg Olmstead

    IPC: G01R1/04

    CPC classification number: G01R1/04 ,  G01R31/2891

    Abstract: The inspection of semiconductors or like substrates by the present mechanism minimizes deflection in the checkplate and probe card. An inspection device including a housing, a toggle assembly within the housing, an objective lens assembly attached within the toggle assembly including an objective coupled within an objective focus, wherein the objective focus is deflectable along an optics axis, and a cam assembly including a rotary cam and a window carrier, wherein the window carrier is moveable along the optics axis with rotation of the rotary cam, wherein the cam assembly is coupled to the toggle assembly with the objective and window are aligned along the optics axis.

    Abstract translation: 通过本机构检查半导体或类似基板可以最大限度地减少检查板和探针卡中的偏转。 一种检查装置，包括壳体，壳体内的肘节组件，附接在肘节组件内的物镜组件，其包括联接在物镜焦点内的物镜，其中物镜焦点可沿光学轴线偏转;以及凸轮组件，包括旋转 凸轮和窗户托架，其中所述窗口托架可随着所述旋转凸轮的旋转沿着所述光学轴线移动，其中所述凸轮组件联接到所述肘节组件，所述物镜和所述窗口沿着所述光学轴线对准。

    Selective overtravel during electrical test of probe cards
    35.
    发明授权
    Selective overtravel during electrical test of probe cards 有权
    探针卡电测试期间的选择性超程

    公开(公告)号：US08659308B1

    公开(公告)日：2014-02-25

    申请号：US13647554

    申请日：2012-10-09

    Applicant: Rudolph Technologies, Inc.

    Inventor： James Charles Andersen

    IPC: G01R31/00

    CPC classification number: G01R35/00

    Abstract: An apparatus and method for conducting electrical testing of probes is disclosed. Probes may also be tested for deflection and loading hysteresis.

    Abstract translation: 公开了一种用于进行探针电气测试的装置和方法。 也可以测试探头的偏转和负载滞后。

    Optically-based method and apparatus for detecting and characterizing surface pits in a metal film during chemical mechanical polish
    36.
    发明申请
    Optically-based method and apparatus for detecting and characterizing surface pits in a metal film during chemical mechanical polish 失效
    用于在化学机械抛光中检测和表征金属膜中的表面凹坑的基于光学的方法和装置

    公开(公告)号：US20020151127A1

    公开(公告)日：2002-10-17

    申请号：US10105829

    申请日：2002-03-25

    Applicant: Rudolph Technologies, Inc.

    Inventor： Hengda Liu ,  Joseph Z. Xie

    IPC: H01L021/8238

    CPC classification number: B24B37/042 ,  B24B49/12 ,  G01B11/303 ,  G01N21/1702

    Abstract: An optically-based system and method are disclosed for detecting surface pits and their average depth in a metal film by an examination of pulse shape in a reflected probe beam pulse. Also disclosed is an optically-based system and method for detecting an occurrence of a failure in a CMP process by detecting surface pits in a metal film by an examination of pulse shape in a reflected probe beam pulse. Also disclosed is an optically-based system and method for providing quality indications to a CMP process for enabling control of the CMP process by detecting surface pits in a metal film by an examination of pulse shape in a reflected probe beam pulse, where the pulse shape has a twin peak shape that is indicative of a presence of a surface pit. Control of the CMP process includes controlling at least one of polish pressure, speed, polish pad life and polish slurry composition and chemistry. Also disclosed is an optically-based system and method to enable semiconductor process improvements using an optical metrology system that is suitably programmed to recognize and detect the presence of an abnormal twin or double peak that is indicative of a surface defect (e.g., pitting) in a film (e.g., a metal (Cu) film).

    Abstract translation: 公开了一种基于光学的系统和方法，用于通过检查反射的探针光束脉冲中的脉冲形状来检测表面凹坑及其在金属膜中的平均深度。 还公开了一种基于光学的系统和方法，用于通过检测反射的探测光束脉冲中的脉冲形状来检测金属膜中的表面凹坑来检测CMP工艺中的故障的发生。 还公开了一种基于光学的系统和方法，用于向CMP处理提供质量指示，以通过检测反射的探测光束脉冲中的脉冲形状来检测金属膜中的表面凹坑来实现CMP工艺的控制，其中脉冲形状 具有表示存在表面凹坑的双峰形状。 CMP工艺的控制包括控制抛光压力，速度，抛光垫寿命和抛光浆料组成和化学中的至少一个。 还公开了一种基于光学的系统和方法，其使用光学测量系统来实现半导体工艺改进，所述光学测量系统被适当地编程以识别和检测指示表面缺陷（例如点蚀）的异常双峰或双峰的存在 膜（例如，金属（Cu）膜））。

    Opto-acoustic metrology of signal attenuating structures
    37.
    发明授权
    Opto-acoustic metrology of signal attenuating structures 有权

    公开(公告)号：US10209300B2

    公开(公告)日：2019-02-19

    申请号：US15346278

    申请日：2016-11-08

    Applicant: Rudolph Technologies, Inc.

    Inventor： Michael Kotelyanskii ,  Roman Basistyy

    IPC: H01L21/66 ,  G01R31/302 ,  G01R31/28 ,  H01L21/768 ,  G01N21/17 ,  G01N21/95

    Abstract: Methods and systems for manufacturing and analyzing interconnect structures in integrated circuit (IC) devices. The methods include forming an interconnect structure, such as a pillar, in an IC device. The pillar is analyzed using an opto-acoustic sensor to quantify physical characteristics used to determine whether the pillar satisfies predetermined quality criterion. The analysis includes capturing an opto-acoustic signal from the pillar and estimating optical parameters for a number of local maxima of the signal. A mode may then be fitted for each of the identified local maxima based on the optical characteristics. The modes and estimated optical parameters may then be iteratively corrected in an order from strongest to weakest local maximum. The corrected values may then be compared to a predicted physical model to identify the physical characteristics of the pillar. If the physical characteristics fall outside of the quality criterion, manufacturing processes may be altered.

Patent Agency Ranking