公开(公告)号：US11787689B2

公开(公告)日：2023-10-17

申请号：US16630036

申请日：2018-07-04

Applicant: TDK Corporation

Inventor： Wolfgang Pahl

IPC: B81C1/00 ,  B81B7/00 ,  H04R19/04 ,  H04R31/00 ,  H04R1/04

CPC classification number: B81C1/00309 ,  B81B7/0061 ,  H04R19/04 ,  H04R31/00 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2201/0292 ,  B81B2207/012 ,  B81B2207/99 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2203/0109 ,  B81C2203/032 ,  H04R1/04 ,  H04R2201/003

Abstract: A MEMS sensor with a media access opening in its carrier board. The MEMS sensor has an integrally filter mesh closing the media access opening. The mesh can be applied in unstructured form over the whole surface of the carrier board. Then, a structuring is performed to produce preferably at the same time a perforation forming the filter mesh.

公开(公告)号：US11780726B2

公开(公告)日：2023-10-10

申请号：US17518350

申请日：2021-11-03

Applicant: Knowles Electronics, LLC

Inventor： Michael Kuntzman ,  Michael Pedersen ,  Faisal Zaman ,  Xin Song ,  Vahid Naderyan

IPC: B81B3/00 ,  H04R7/12

CPC classification number: B81B3/0021 ,  H04R7/125 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0361 ,  B81B2203/04 ,  H04R2201/003

Abstract: A MEMS diaphragm assembly comprises a first diaphragm, a second diaphragm, and a stationary electrode assembly spaced between the first and second diaphragms and including a plurality of apertures disposed therethrough. Each of a plurality of pillars is disposed through one of the plurality of apertures and connects the first and second diaphragms. At least one of the first and second diaphragms is connected to the stationary electrode assembly at a geometric center of the assembly.

公开(公告)号：US20230312335A1

公开(公告)日：2023-10-05

申请号：US18200885

申请日：2023-05-23

Applicant: Soundskrit Inc.

Inventor： Stephane Leahy ,  Wan-Thai Hsu ,  Mohsin Nawaz ,  Carly Stalder ,  Sahil Gupta ,  Meysam Daeichin

IPC: B81B3/00 ,  B81B7/02 ,  H04R19/04

CPC classification number: B81B3/0021 ,  B81B7/02 ,  H04R19/04 ,  B81B2201/0257 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0136 ,  B81B2203/0172 ,  B81B2203/056 ,  B81B2203/06 ,  H04R2201/003

Abstract: A microelectromechanical system (MEMS) transducer includes a substrate and a pair of electrodes supported by the substrate. The pair of electrodes are configured as a bias electrode-sense electrode couple. A moveable electrode of the pair of electrodes is configured for vibrational movement in a first direction during excitation of the moveable electrode. The pair of electrodes are spaced apart from one another by a gap in a second direction perpendicular to the first direction. The moveable electrode includes a cantilevered end, the cantilevered end being warped to exhibit a resting deflection along the first direction.

公开(公告)号：US11760624B2

公开(公告)日：2023-09-19

申请号：US17749378

申请日：2022-05-20

Applicant: Sonion Nederland B.V.

Inventor： Raymond Mogelin ,  Dion Ivo de Roo ,  Frederik Cornelis Blom ,  Alwin Fransen ,  Pavlo Mulyar ,  Peter Christiaan Post

IPC: B81B3/00 ,  H04R19/00 ,  H04R19/01 ,  H04R19/04

CPC classification number: B81B3/007 ,  B81B3/0045 ,  H04R19/005 ,  H04R19/01 ,  H04R19/04 ,  B81B2201/0257 ,  B81B2201/0264 ,  H04R2201/003

Abstract: A micro-electromechanical transducer including one or more moveable members, and a viscoelastic substance having a predetermined viscoelasticity, the viscoelastic substance being adapted to influence the response of the transducer in a predetermined manner. The micro-electromechanical transducer of the present invention may include a MEMS transducer, such as a MEMS microphone, a MEMS vibration sensor, a MEMS acceleration sensor, a MEMS receiver.

公开(公告)号：US11750980B2

公开(公告)日：2023-09-05

申请号：US17815249

申请日：2022-07-27

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： Chun-Wen Cheng ,  Chun Yin Tsai ,  Chia-Hua Chu

IPC: H04R17/02 ,  B81B3/00 ,  B81C1/00

CPC classification number: H04R17/02 ,  B81B3/0021 ,  B81C1/00158 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  H04R2201/003

Abstract: A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate; and a membrane over the substrate and configured to generate charges in response to an acoustic wave, the membrane being in a polygonal shape including vertices. The membrane includes a via pattern having first lines that partition the membrane into slices and extend to the vertices of the membrane such that the slices are separated from each other near an anchored region of the membrane and connected to each other around a central region. The via pattern further includes second lines extending from the anchored region of the membrane toward the central region of the membrane. Each of the second lines includes a length less than a length of each of the first lines.

公开(公告)号：US11743666B2

公开(公告)日：2023-08-29

申请号：US17138487

申请日：2020-12-30

Applicant: Knowles Electronics, LLC

Inventor： Vezio Malandruccolo ,  Mark Niederberger ,  Luca Bettini ,  Weiwen Dai

IPC: H04R29/00 ,  H04R3/00 ,  H04R1/04 ,  B81B7/00 ,  H04R19/04

CPC classification number: H04R29/004 ,  B81B7/008 ,  H04R1/04 ,  H04R3/00 ,  H04R19/04 ,  B81B2201/0257 ,  B81B2207/03 ,  H04R2201/003

Abstract: The disclosure relates generally to microphone and vibration sensor assemblies (100) having a transducer (102), like a microelectromechanical systems (MEMS) device, and an electrical circuit (103) disposed in a housing (110) configured for integration with a host device. The electrical circuit includes a transducer bias circuit that applies a bias to the transducer and a bias control circuit (204) that compensates for transducer sensitivity drift caused by variation in an environmental condition of the transducer, and electrical circuits therefor.

公开(公告)号：US20230242394A1

公开(公告)日：2023-08-03

申请号：US18004527

申请日：2021-07-01

Applicant: Hahn-Schickard-Gesellschaft für angewandte Forschung e. V.

Inventor： Achim Bittner ,  Alfons Dehé

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00309 ,  B81B7/0061 ,  B81C2203/0136 ,  B81C2203/0707 ,  B81B2201/0257 ,  B81B2201/047 ,  B81B2201/0214 ,  B81B2201/0271 ,  B81B2207/012 ,  B81B2207/015 ,  B81B2203/0127 ,  B81B2207/07

Abstract: Preferably, the invention relates to a MEMS package having at least one layer for protecting a MEMS element, wherein the MEMS element has at least one MEMS interaction region on a substrate and a surface conformal coating of the MEMS element is applied with a dielectric layer. Particularly preferably, the invention relates to a MEMS transducer package in which a MEMS element, for example with a MEMS membrane and processor, preferably an integrated circuit, are present on a substrate. For protection, a surface conformal coating of a dielectric is preferably first applied to the MEMS element, for example by spray coating, mist coating, and/or vapor coating. Then, preferably, an electrically conductive layer is applied. Depending on the configuration, the layers may be removed in some regions above a MEMS interaction region of the MEMS element, for example for a sound port of a MEMS membrane.

公开(公告)号：US20230239641A1

公开(公告)日：2023-07-27

申请号：US18156155

申请日：2023-01-18

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Guofeng Chen ,  Yu Hui

IPC: H04R31/00 ,  B81B3/00 ,  B81C1/00 ,  H04R7/04 ,  H04R7/18 ,  H04R17/02 ,  H04R19/04

CPC classification number: H04R31/006 ,  B81B3/0072 ,  B81C1/00666 ,  H04R7/04 ,  H04R7/18 ,  H04R17/02 ,  H04R19/04 ,  H04R31/003 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0307 ,  B81C2201/0105 ,  B81C2201/0132 ,  B81C2203/0118 ,  H04R2201/003

Abstract: A method for manufacturing a microelectromechanical systems (MEMS) microphone comprises depositing a membrane on a first sacrificial layer, wherein the first sacrificial layer is deposited on a substrate, etching the substrate to define a cavity, releasing the membrane by removing at least the first sacrificial layer, and forming at least one anchor at the edge of the membrane.

公开(公告)号：US20230217191A1

公开(公告)日：2023-07-06

申请号：US17827813

申请日：2022-05-30

Applicant: AAC Kaitai Technologies (Wuhan) CO., LTD

Inventor： Bei Tong ,  Rui Zhang

IPC: H04R19/02 ,  H04R7/04 ,  H04R7/18 ,  B81B3/00

CPC classification number: H04R19/02 ,  H04R7/04 ,  H04R7/18 ,  B81B3/0037 ,  H04R2201/003 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0163 ,  B81B2203/019

Abstract: The present invention provides a MEMS microphone, including a substrate and a capacitive structure. The capacitive structure includes a back plate and a vibration diaphragm. The vibration diaphragm includes a main body and a plurality of supporting structures for supporting the main body. Each supporting structure includes a supporting beam and two spring structures. Each spring structure includes at least two beam arms extending along the extension direction of the peripheral edge of the main body, and the beam arm closest to the main body is spaced apart from the main body. The sensitivity of the MEMS microphone in the present invention is higher.

公开(公告)号：US20230199408A1

公开(公告)日：2023-06-22

申请号：US17739202

申请日：2022-05-09

Applicant: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.

Inventor： Zhengyu Shi ,  Linlin Wang ,  Rui Zhang

IPC: H04R19/04 ,  H04R7/04 ,  H04R7/18 ,  B81B3/00

CPC classification number: H04R19/04 ,  H04R7/04 ,  H04R7/18 ,  B81B3/0045 ,  H04R2201/003 ,  B81B2201/0257

Abstract: The present invention discloses a MEMS chip including a substrate with a back cavity; a capacitance system disposed on the substrate including a back plate, a membrane opposite to the back plate forming an inner cavity; a protruding portion accommodated in the inner cavity, fixed on one of the back plate and the membrane and spaced apart from the other along a vibration direction; a support system configured to support the capacitance system, including a first fixation portion suspending the membrane on the substrate, and a second fixation portion suspending the back plate on the substrate; the protruding portion comprises an annular first protruding portion and an annular second protruding portion surrounding the first protruding portion. The MEMS chip has higher sensitivity, higher resonance frequency and higher low frequency property.