公开(公告)号：US09739612B2

公开(公告)日：2017-08-22

申请号：US15037832

申请日：2014-11-20

Applicant: Safran Electronics & Defense

Inventor： Alain Jeanroy ,  Philippe Onfroy

IPC: G01C19/00 ,  G01P3/44 ,  G01P9/00 ,  G01P15/08 ,  G01C19/574 ,  B81B3/00 ,  B81C1/00 ,  G01P15/097

CPC classification number: G01C19/574 ,  B81B3/0021 ,  B81B3/007 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81B2203/0109 ,  B81B2203/04 ,  B81C1/00658 ,  G01P15/097 ,  G01P2015/084

Abstract: A MEMS type inertial sensor comprising a support structure having at least a first seismic body and a second seismic body connected thereto by resilient means in order to be movable in a suspension plane, transducers for maintaining the seismic bodies in vibration and for determining movements of the seismic bodies in the suspension plane, and a control unit connected to the transducers by electrical conductor means. The transducers comprise at least one electrode secured to the first seismic body and at least one electrode secured to the second seismic body, the two electrodes being arranged to enable relative movements of the seismic bodies relative to each other in the suspension plane to be measured directly.

公开(公告)号：US20170232474A1

公开(公告)日：2017-08-17

申请号：US15225118

申请日：2016-08-01

Applicant: North Carolina State University

Inventor： Omer Oralkan ,  Feysel Yalcin Yamaner ,  Xiao Zhang

IPC: B06B1/02 ,  B81C1/00

CPC classification number: B06B1/0292 ,  B06B1/0215 ,  B06B2201/51 ,  B81B2201/0271 ,  B81B2201/0292 ,  B81B2201/047 ,  B81B2207/053 ,  B81C3/001 ,  B81C2203/031

Abstract: A capacitive micromachined ultrasonic transducer (CMUT) and methods of forming the same are disclosed herein. In one implementation, the CMUT comprises a glass substrate having a cavity; a patterned metal bottom electrode situated within the cavity of the glass substrate; and a vibrating plate comprising at least a conducting layer, wherein the vibrating plate is anodically bonded to the glass substrate to form an air-tight seal between the vibrating plate and the substrate and wherein a pressure inside the cavity is less than atmospheric pressure (i.e., a vacuum). In another implementation, the CMUT comprises a glass substrate with Through-Glass-Via (TGV) interconnects, wherein a metal electrode is electrically connected to a TGV and wherein said metal electrode can be in the bottom of a cavity of the glass substrate or on the vibrating plate.

公开(公告)号：US20170170802A1

公开(公告)日：2017-06-15

申请号：US15152866

申请日：2016-05-12

Applicant: Hyundai Motor Company

Inventor： Ilseon Yoo

IPC: H03H9/02 ,  B81B3/00

CPC classification number: H03H9/02244 ,  B81B3/0021 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81B2203/0136 ,  B81B2207/015 ,  G01C19/5719 ,  G01P15/097 ,  H03H9/02275 ,  H03H9/02393 ,  H03H9/02409 ,  H03H9/2447 ,  H03H2009/02165 ,  H03H2009/02291

Abstract: A MEMS resonator includes a main substrate forming a receiving part at a center of the main substrate; a mass body having one end part and a center part elastically supported by both sides of the main substrate; a driving unit configured at one side of the receiving part on the main substrate and producing a driving torque by a voltage applied to both sides of the one end part of the mass body to move a position of the mass body with respect to the main substrate; and a tuning part including a pair of tuning units provided symmetrically with respect to the second elastic member, and having a beam member changing a length of the second elastic member by an actuating operation of each tuning unit to control a frequency.

公开(公告)号：US20170064457A1

公开(公告)日：2017-03-02

申请号：US15244058

申请日：2016-08-23

Applicant: DSP GROUP LTD.

Inventor： Haim Kupershmidt ,  Lior Blanka

IPC: H04R19/02 ,  B81B3/00

CPC classification number: H04R19/02 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2201/0271 ,  H04R17/00 ,  H04R2201/003 ,  H04R2217/03

Abstract: A MEMS speaker that includes a control unit and multiple MEMS elements that include a membrane positioned in a first plane, a blind that is positioned in a second plane and a shutter that is positioned in a third plane. The control unit is configured to control the multiple MEMS elements to operate in an audio output mode or an ultrasonic output mode. The MEMS speaker is configured, when operating in the ultrasonic output mode, to oscillate at least one of the membrane, blind and shutter thereby generating an ultrasonic signal without audio-modulating the ultrasonic signal. The MEMS speaker is configured, when operating in the audio output mode, to oscillate the membrane thereby generating the ultrasonic signal and oscillate at least one of the shutter and the blind thereby modulating the ultrasonic acoustic signal to generate an audio signal.

Abstract translation: 一种MEMS扬声器，其包括控制单元和多个MEMS元件，其包括位于第一平面中的膜，位于第二平面中的盲板和位于第三平面中的快门。 控制单元被配置为控制多个MEMS元件在音频输出模式或超声波输出模式下操作。 MEMS扬声器被配置为当以超声波输出模式操作时，振荡膜，盲和快门中的至少一个，从而产生超声波信号而不对超声信号进行音频调制。 当在音频输出模式下工作时，MEMS扬声器配置为振荡膜，从而产生超声波信号并振荡快门和盲人中的至少一个，从而调制超声波声信号以产生音频信号。

公开(公告)号：US09546090B1

公开(公告)日：2017-01-17

申请号：US14826449

申请日：2015-08-14

Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.

Inventor： Jia Jie Xia ,  Nagarajan Ranganathan ,  Rakesh Kumar ,  Aveek Nath Chatterjee

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B2201/016 ,  B81B2201/0271 ,  B81B2207/015 ,  B81B2207/07 ,  B81C1/00246 ,  B81C1/00253 ,  B81C2201/013 ,  B81C2201/019 ,  B81C2201/053 ,  B81C2203/0735 ,  B81C2203/0771 ,  B81C2203/0792

Abstract: Integrated MEMS-CMOS devices and methods for fabricating MEMS devices and CMOS devices are provided. An exemplary method for fabricating a MEMS device and a CMOS device includes forming the CMOS device in and/or over a first side of a semiconductor substrate. Further, the method includes forming the MEMS device in and/or under a second side of the semiconductor substrate. The second side of the semiconductor substrate is opposite the first side of the semiconductor substrate.

Abstract translation: 提供了用于制造MEMS器件和CMOS器件的集成MEMS-CMOS器件和方法。 用于制造MEMS器件和CMOS器件的示例性方法包括在半导体衬底的第一侧中和/或之上形成CMOS器件。 此外，该方法包括在半导体衬底的第二面内和/或下方形成MEMS器件。 半导体衬底的第二面与半导体衬底的第一侧相对。

公开(公告)号：US20160347605A1

公开(公告)日：2016-12-01

申请号：US14723927

申请日：2015-05-28

Applicant: InvenSense, Inc.

Inventor： Matthew Thompson ,  Joseph Seeger

IPC: B81B3/00

CPC classification number: B81B3/0086 ,  B81B7/02 ,  B81B2201/014 ,  B81B2201/0214 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81B2201/0292 ,  B81B2201/036 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2203/04 ,  B81B2207/012 ,  B81C2203/0792 ,  H01H1/0036

Abstract: A system and/or method for utilizing MEMS switching technology to operate MEMS sensors. As a non-limiting example, a MEMS switch may be utilized to control DC and/or AC bias applied to MEMS sensor structures. Also for example, one or more MEMS switches may be utilized to provide drive signals to MEMS sensors (e.g., to provide a drive signal to a MEMS gyroscope).

Abstract translation: 一种利用MEMS开关技术来操作MEMS传感器的系统和/或方法。 作为非限制性示例，可以使用MEMS开关来控制施加到MEMS传感器结构的DC偏压和/或AC偏压。 也可以使用一个或多个MEMS开关来向MEMS传感器提供驱动信号（例如，向MEMS陀螺仪提供驱动信号）。

公开(公告)号：US09496806B2

公开(公告)日：2016-11-15

申请号：US13953092

申请日：2013-07-29

Applicant: Seiko Epson Corporation

Inventor： Yusuke Matsuzawa

IPC: H02N1/00 ,  B81B7/00 ,  B81C1/00 ,  B81B3/00

CPC classification number: H02N1/006 ,  B81B3/0086 ,  B81B7/0006 ,  B81B7/0032 ,  B81B2201/0271 ,  B81B2203/04 ,  B81C1/00 ,  Y10T29/49117

Abstract: A MEMS device is a MEMS device having a MEMS vibrator which includes a plurality of MEMS constituent elements laminated and formed above a first foundation portion which is laminated above a main surface of a wafer substrate, and the MEMS constituent elements are laminated above a first oxide film and a nitride film so as to cover an opening which is formed in the nitride film and exposes a second foundation portion above which the nitride film is laminated.

Abstract translation: MEMS器件是具有MEMS振动器的MEMS器件，MEMS振子包括层叠并形成在层叠在晶片衬底的主表面上的第一基底部分之上的多个MEMS构成元件，并且MEMS构成元件层叠在第一氧化物 膜和氮化物膜，以覆盖形成在氮化物膜中的开口，并暴露第二基底部分，在该第二基底部分上层叠氮化物膜。

公开(公告)号：US20160289063A1

公开(公告)日：2016-10-06

申请号：US14778514

申请日：2014-04-17

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH

Inventor： Ilker E. Ocak ,  Julius Ming Lin Tsai ,  Navab Singh

IPC: B81B7/00 ,  G01P15/125 ,  G01R33/028 ,  B81C1/00

CPC classification number: B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81B2201/0292 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00285 ,  B81C2203/0118 ,  B81C2203/0172 ,  G01C19/56 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  G01P2015/0828 ,  G01R33/00 ,  G01R33/0052 ,  G01R33/0286 ,  H01L25/00 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electromechanical device and method of fabrication thereof comprising: providing a first wafer with a circuit arrangement on a first surface thereof and a first electrode on a second surface thereof; forming first and second via structures from the first surface to the second surface of the first wafer, said first via electrically connecting the first electrode with the circuit arrangement; providing a second wafer with a suspended structure on a first surface thereof; forming a second electrode on the suspended structure; forming an interconnect structure on the first surface of the second wafer that electrically connects with the second electrode; bonding the first wafer to the second wafer with the second surface of the first wafer facing the first surface of the second wafer, with the second via structure electrically connecting the circuit arrangement to the interconnect structure, and the first and second electrodes forming a capacitive structure.

Abstract translation: 一种机电装置及其制造方法，包括：在其第一表面上提供具有电路装置的第一晶片和在其第二表面上的第一电极; 从所述第一晶片的第一表面到所述第二表面形成第一和第二通孔结构，所述第一通孔将所述第一电极与所述电路装置电连接; 在其第一表面上提供具有悬挂结构的第二晶片; 在所述悬挂结构上形成第二电极; 在与第二电极电连接的第二晶片的第一表面上形成互连结构; 将第一晶片接合到第二晶片，其中第一晶片的第二表面面向第二晶片的第一表面，其中第二通孔结构将电路装置电连接到互连结构，并且第一和第二电极形成电容结构 。

公开(公告)号：US20160273916A1

公开(公告)日：2016-09-22

申请号：US15037532

申请日：2014-10-21

Applicant: SAGEM DEFENSE SECURITE

Inventor： Alain JEANROY ,  Philippe ONFROY

IPC: G01C19/574 ,  G01C19/5769

CPC classification number: G01C19/574 ,  B81B3/0021 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81B2203/0109 ,  B81C1/00547 ,  B81C2201/013 ,  G01C19/5733 ,  G01C19/5769

Abstract: An inertial sensor comprising a frame to which at least two seismic bodies are connected by resilient means so as to be movable in a suspension plane, and transducers to keep the seismic bodies vibrating and to determine a relative movement of the seismic bodies relative to one another, characterized in that the seismic bodies have a single shape and a single mass, and in that the seismic bodies comprise interlocking parts such that the seismic bodies are nested inside one another while being movable in the suspension plane relative to the other of the seismic bodies, with the seismic bodies having centres of gravity that coincide with one another. A method for manufacturing such a sensor.

Abstract translation: 一种惯性传感器，包括框架，至少两个地震体通过弹性装置连接到该框架上，以便能够在悬挂平面中移动，以及换能器，以保持地震体的振动并确定地震体相对于彼此的相对运动 其特征在于，地震体具有单一形状和单一质量，并且地震体包括互锁部分，使得地震体彼此嵌套，同时相对于另一个地震体在悬架平面中可移动 地震体的重心相互重合。 一种用于制造这种传感器的方法。

公开(公告)号：US09434608B2

公开(公告)日：2016-09-06

申请号：US14524986

申请日：2014-10-27

Applicant: SiTime Corporation

Inventor： Aaron Partridge ,  Markus Lutz ,  Pavan Gupta

IPC: H01L23/051 ,  B81C1/00 ,  H01L41/113 ,  B81B7/00

CPC classification number: B81C1/00277 ,  B81B7/0035 ,  B81B7/0058 ,  B81B7/007 ,  B81B2201/0271 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00269 ,  B81C1/00301 ,  B81C2201/0171 ,  B81C2203/031 ,  B81C2203/036 ,  B81C2203/037 ,  B81C2203/038 ,  H01L23/051 ,  H01L41/1136 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A cavity is formed within a first substrate together with trenches that separate first and second portions of the first substrate from each other and from the remainder of the first substrate. The first portion of the first substrate is disposed within the cavity and constitutes a microelectromechanical structure, while the second portion of the substrate is disposed at least partly within the cavity and constitutes a first portion of an electrical contact. A second substrate is secured to the first substrate over the cavity to define a chamber containing the microelectromechanical structure. The second substrate has a first portion that constitutes a second portion of the electrical contact and is disposed in electrical contact with the second portion of the first substrate such that the electrical contact extends from within the chamber to an exterior of the chamber.

Abstract translation: 与第一衬底的第一和第二部分彼此分开并与第一衬底的其余部分分开的沟槽在第一衬底内形成空腔。 第一衬底的第一部分设置在空腔内并构成微机电结构，而衬底的第二部分至少部分地设置在空腔内并且构成电接触的第一部分。 第二衬底在空腔上固定到第一衬底以限定包含微机电结构的腔室。 第二基板具有构成电触点的第二部分的第一部分，并且设置成与第一基板的第二部分电接触，使得电触头从腔室内延伸到腔室的外部。