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31.发明申请公开(公告)号：US20170174507A1
公开(公告)日：2017-06-22
申请号：US14973319
申请日：2015-12-17
Applicant: Globalfoundries Singapore Pte. Ltd.
Inventor： Siddharth Chakravarty , Rakesh Kumar , Pradeep Yelehanka
CPC classification number: B81C1/00293 , B81B7/0074 , B81B2203/0315 , B81C2201/0105 , B81C2201/0132 , B81C2201/0133 , B81C2203/0136
Abstract: Semiconductor devices with enclosed cavities and methods for fabricating semiconductor devices with enclosed cavities are provided. In an embodiment, a method for fabricating a semiconductor device with a cavity includes forming a sacrificial structure in and/or over a substrate. The method includes depositing a permeable layer over the sacrificial structure and the substrate. Further, the method includes etching the sacrificial structure through the permeable layer to form the cavity bounded by the substrate and the permeable layer.
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32.发明授权公开(公告)号：US09637371B2
公开(公告)日：2017-05-02
申请号：US14532675
申请日：2014-11-04
Inventor： Emmanuel P Quevy , Jeremy R. Hui , Carrie Wing-Zin Low
CPC classification number: B81C1/00246 , B81B3/0021 , B81B7/007 , B81B7/0077 , B81B7/008 , B81B2201/0214 , B81B2201/0235 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81C1/00158 , B81C1/00269 , B81C1/00285 , B81C1/00333 , B81C1/0038 , B81C2201/0105 , B81C2201/056 , B81C2203/0118 , B81C2203/0136 , B81C2203/0172 , B81C2203/019 , B81C2203/0735 , G01N27/223 , G01N27/227
Abstract: Membrane transducer structures and thin-film encapsulation methods for manufacturing the same are provided. In one example, the thin film encapsulation methods may be implemented to co-integrate processes for thin-film encapsulation and formation of microelectronic devices and microelectromechanical systems (MEMS) that include the membrane transducers.
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33.发明授权Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulation 有权捕获的牺牲结构和使用薄膜封装制造相同的方法公开(公告)号：US09422149B2
公开(公告)日：2016-08-23
申请号：US14532723
申请日：2014-11-04
Inventor： Emmanuel P. Quevy , Louis Nervegna , Jeremy R. Hui
CPC classification number: B81C1/00246 , B81B3/0021 , B81B7/007 , B81B7/0077 , B81B7/008 , B81B2201/0214 , B81B2201/0235 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81C1/00158 , B81C1/00269 , B81C1/00285 , B81C1/00333 , B81C1/0038 , B81C2201/0105 , B81C2201/056 , B81C2203/0118 , B81C2203/0136 , B81C2203/0172 , B81C2203/019 , B81C2203/0735 , G01N27/223 , G01N27/227
Abstract: Trapped sacrificial structures and thin-film encapsulation methods that may be implemented to manufacture trapped sacrificial structures such as relative humidity sensor structures, and spacer structures that protect adjacent semiconductor structures extending above a semiconductor die substrate from being contacted by a molding tool or other semiconductor processing tool in an area of a die substrate adjacent the spacer structures.
Abstract translation: 捕获的牺牲结构和薄膜封装方法可用于制造捕获的牺牲结构，例如相对湿度传感器结构，以及保护在半导体管芯基板之上延伸的相邻半导体结构不被模具或其它半导体加工件接触的间隔结构 工具在与衬垫结构相邻的管芯衬底的区域中。
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公开(公告)号：US09364807B2
公开(公告)日：2016-06-14
申请号：US13635972
申请日：2011-03-10
Applicant: Christian Schoen , Michael Wagner
Inventor： Christian Schoen , Michael Wagner
CPC classification number: B01J4/001 , B01L3/502707 , B01L3/502738 , B01L3/502746 , B01L2200/0621 , B01L2200/10 , B01L2300/0636 , B01L2300/0681 , B01L2300/0816 , B01L2300/0822 , B01L2300/0864 , B01L2300/0887 , B01L2300/161 , B01L2400/0406 , B01L2400/0688 , B01L2400/088 , B81C1/00047 , B81C1/00063 , B81C2201/0105 , B81C2201/0143 , B81C2201/0156 , Y10T137/85938
Abstract: The invention relates to a component (4) of a biosensor, comprising at least one first device (6) for receiving a sample liquid, wherein the device (6) is connected via a distributor channel (7) to further receiving devices (8 to 11), into each of which a feed channel (71, 72, 73, 74) branching off from the distributor channel (7) opens, and the feed channels (71, 72, 73, 74) are arranged in succession in flow direction (S) of the sample liquid passed on through the distributor channel (7). In accordance with the invention, it is envisaged that, in the distributor channel (7), in each case between two immediately successive feed channels (71, 72; 72, 73; 73, 74) in flow direction (S), at least one region (K) for at least temporary slowing or stoppage of the capillary flow of the sample liquid has been inserted. It is thus possible to control the capillary flow of the sample liquid such that always only one receiving device (8, 9, 10, 11) is filled with the volume flow of sample liquid available before the next is filled, and effectively simultaneous filling of the receiving devices (8, 9, 10, 11) is prevented. This leads to rapid and complete filling of the respective receiving device (8, 9, 10, 11). Additionally presented is a process with which the regions (K) can be inserted into the distributor channel (7) in a simple manner.
Abstract translation: 本发明涉及生物传感器的组件（4），其包括用于接收样品液体的至少一个第一装置（6），其中所述装置（6）经由分配器通道（7）连接到另外的接收装置（8至 其中，从分配器通道（7）分支出的进料通道（71,72,73,74）打开，并且进料通道（71,72,73,74）在流动方向上连续地排列 （S）通过分配器通道（7）通过的样品液体。 根据本发明，设想在分配器通道（7）中，在每种情况下，在流动方向（S）处的两个紧邻的供给通道（71,72; 72,73; 73,74）之间至少 已经插入了用于至少暂时放慢或停止样品液体的毛细管流动的区域（K）。 因此，可以控制样品液体的毛细管流动，使得总是只有一个接收装置（8,9,10,11）填充下一个填充之前可用的样品液体的体积流量，并且有效地同时填充 接收装置（8,9,10,11）被防止。 这导致相应的接收装置（8,9,10,11）的快速和完全的填充。 另外提出了一种可以简单地将区域（K）插入到分配器通道（7）中的过程。
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公开(公告)号：US20240343557A1
公开(公告)日：2024-10-17
申请号：US18614036
申请日：2024-03-22
Applicant: Robert Bosch GmbH
Inventor： Jochen Reinmuth , Christoph Schelling , Thomas Buck
CPC classification number: B81B3/007 , B81C1/00158 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81B2203/0163 , B81B2203/0315 , B81B2203/0361 , B81B2203/04 , B81C2201/0105 , B81C2201/056
Abstract: A micromechanical diaphragm system including a first diaphragm and a second diaphragm and spacer elements which are arranged between the first diaphragm and the second diaphragm. At least one spacer element has a first supporting element and a second supporting element. The first supporting element faces the first diaphragm. The second supporting element faces the second diaphragm. The first supporting element and the second supporting element are connected via a spring element.
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Patent Agency Ranking
公开(公告)号：US20240336474A1
公开(公告)日：2024-10-10
申请号：US18298311
申请日：2023-04-10
Applicant: AAC Technologies Pte. Ltd.
Inventor： Houming Chong , Veronica Tan , Zaixiang Pua , Kahkeen Lai , Zhan Zhan
IPC: B81B3/00 , B81C1/00 , G01C19/5733 , G01C19/5769
CPC classification number: B81B3/0037 , B81C1/00166 , G01C19/5733 , G01C19/5769 , B81B2201/0242 , B81B2203/0136 , B81B2203/04 , B81C2201/0105 , B81C2201/0132 , B81C2203/0109
Abstract: A MEMS device and a method for manufacturing the MEMS device are provided. The MEMS device includes a cap sheet and a device sheet. The device sheet includes a silicon substrate, at least two device structure layers, and at least one conductive structure layer, and each two adjacent device structure layers are coupled via a corresponding conductive structure layer. The device sheet defines a functional cavity having a first region, a second region, and a third region. The at least two device structure layers and the at least one conductive structure layer each are across the first region, the second region, and the third region, and the at least two device structure layers and the at least one conductive structure layer cooperatively form a first movable structure in the first region, define an anchor point in the second region, and form a second movable structure in the third region.
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公开(公告)号：US12077429B2
公开(公告)日：2024-09-03
申请号：US17421330
申请日：2020-02-27
Applicant: Robert Bosch GmbH
Inventor： Lars Tebje , Jochen Reinmuth , Johannes Classen
IPC: B81B7/02 , B81C1/00 , G01C19/5783 , G01L7/08 , G01L19/00 , G01P15/08 , G01P15/125
CPC classification number: B81B7/02 , B81C1/00341 , G01C19/5783 , G01L7/082 , G01L19/0092 , G01P15/0802 , G01P15/125 , B81B2201/0235 , B81B2201/0242 , B81B2201/0264 , B81B2203/0127 , B81B2203/04 , B81C2201/0105 , B81C2201/014
Abstract: A micromechanical sensor device and a corresponding production method. The micromechanical sensor device has a substrate which has a front side and a rear side. Formed on the front side, at a lateral distance, are an inertial sensor region having an inertial structure for acquiring external accelerations and/or rotations, and a pressure sensor region having a diaphragm region for acquiring an external pressure. A micromechanical function layer by which the diaphragm region is formed in the pressure sensor region. A micromechanical function layer is applied on the micromechanical function layer, the inertial structure being formed out of the second and third micromechanical function layer. A cap device encloses a first predefined reference pressure in a first cavity in the inertial sensor region, and a second cavity is formed underneath the diaphragm region.
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公开(公告)号：US12022270B2
公开(公告)日：2024-06-25
申请号：US17761669
申请日：2020-05-26
Applicant: CSMC TECHNOLOGIES FAB2 CO., LTD.
Inventor： Jiale Su , Guoping Zhou , Xinwei Zhang , Changfeng Xia
CPC classification number: H04R31/003 , B81C1/00158 , H04R19/04 , B81C2201/0105 , B81C2201/0116 , B81C2201/0133 , H04R2201/003
Abstract: A preparation method for a micro-electromechanical systems (MEMS) microphone includes the steps of: providing a silicon substrate having a silicon surface; forming an enclosed cavity in the silicon substrate; forming a plurality of spaced apart acoustic holes in the silicon substrate, each acoustic hole having two openings, one of which communicating with the cavity and the other one located on the silicon surface; forming a sacrificial layer on the silicon substrate, which includes a first filling portion, a second filling portion and a shielding portion; forming a polysilicon layer on the shielding portion; forming a recess in the silicon substrate on the side away from the silicon surface; and removing the first filling portion, the second filling portion and part of the shielding portion so that the recess is brought into communication with the cavity to form a back chamber, and that the polysilicon layer, the remainder of the shielding portion and the silicon substrate together delimit a hollow chamber, the hollow chamber communicating with the opening of the plurality of acoustic holes away from the cavity, completing the MEMS microphone.
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公开(公告)号：US12006209B2
公开(公告)日：2024-06-11
申请号：US16980792
申请日：2019-03-14
Applicant: Obsidian Sensors, Inc.
Inventor： John Hong , Tallis Chang , Edward Chan , Bing Wen , Yaoling Pan , Sean Andrews
CPC classification number: B81C1/00595 , B81B3/0081 , B81C1/0069 , G01J5/20 , B81B2201/0207 , B81B2203/019 , B81C2201/0105 , B81C2201/014
Abstract: A method of manufacturing an electromechanical systems structure includes manufacturing sub-micron structural features. In some embodiments, the structural features are less than the lithographic limit of a lithography process.
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40.发明公开公开(公告)号：US20240154599A1
公开(公告)日：2024-05-09
申请号：US18505574
申请日：2023-11-09
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Federico VERCESI , Lorenzo CORSO , Giorgio ALLEGATO , Gabriele GATTERE
CPC classification number: H03H9/1021 , B81B7/0038 , B81C1/00285 , H03H3/02 , H03H9/17 , B81B2201/0271 , B81B2203/0118 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C2201/0105 , B81C2203/0118 , H03H2003/022 , H03H2003/027 , H03H2009/155
Abstract: A microelectromechanical resonator device has: a main body, with a first surface and a second surface, opposite to one another along a vertical axis, and made of a first layer and a second layer, arranged on the first layer; a cap, having a respective first surface and a respective second surface, opposite to one another along the vertical axis, and coupled to the main body by bonding elements; and a piezoelectric resonator structure formed by: a mobile element, constituted by a resonator portion of the first layer, suspended in cantilever fashion with respect to an internal cavity provided in the second layer and moreover, on the opposite side, with respect to a housing cavity provided in the cap; a region of piezoelectric material, arranged on the mobile element on the first surface of the main body; and a top electrode, arranged on the region of piezoelectric material, the mobile element constituting a bottom electrode of the piezoelectric resonator structure.
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