公开(公告)号：US20120026337A1

公开(公告)日：2012-02-02

申请号：US12844124

申请日：2010-07-27

Applicant: Pierre Boulanger ,  Marcel Tremblay ,  Jim Goodland ,  Barbara Sharp ,  Farhad Mirbod ,  Theodore R. Hoelter

Inventor： Pierre Boulanger ,  Marcel Tremblay ,  Jim Goodland ,  Barbara Sharp ,  Farhad Mirbod ,  Theodore R. Hoelter

IPC: H04N5/33 ,  B23P11/00

CPC classification number: G01J5/20 ,  G01J1/0204 ,  G01J1/44 ,  G01J5/02 ,  G01J5/0215 ,  G01J5/023 ,  G01J5/046 ,  G01J5/10 ,  G01J2005/0077 ,  G01J2005/204 ,  H01L22/14 ,  H01L22/32 ,  H01L27/146 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14669 ,  H01L27/14687 ,  H01L27/14698 ,  H01L37/02 ,  H04N5/2251 ,  H04N5/33 ,  Y10T29/49826

Abstract: An infrared camera architecture includes, for an embodiment, an infrared detector, a substrate, a plurality of electrical components coupled to the substrate, and a pedestal made of a thermally conductive material and having a leg coupled to the substrate. The infrared detector is supported by and thermally coupled to the pedestal, with the pedestal thermally isolating the infrared detector from the plurality of electrical components.

Abstract translation: 对于一个实施例，红外线照相机结构包括红外检测器，衬底，耦合到衬底的多个电气部件，以及由导热材料制成并具有连接到衬底的腿部的基座。 红外检测器由支架支撑并热耦合到基座，基座将红外检测器与多个电气部件热隔离。

公开(公告)号：US08077304B2

公开(公告)日：2011-12-13

申请号：US12591974

申请日：2009-12-07

Applicant: Tadashi Chiba

Inventor： Tadashi Chiba

IPC: G01J1/42 ,  H01L31/075

CPC classification number: G01J1/44 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/0219 ,  G01J1/0228 ,  G01J1/0233 ,  G01J1/0247 ,  G01J1/0271 ,  G01J1/4204 ,  G01J2001/4266 ,  H04M1/22

Abstract: A light amount measuring apparatus including a light amount measuring circuit and a power supply for supplying power to the light amount measuring circuit; wherein the light amount measuring circuit includes a light receiving device for receiving light and outputting an electric signal corresponding to light amount of the received light; a first switch for switching between electrical connection and disconnection between the light receiving device and the power supply; and a drive controller for controlling the first switch so that the first switch electrically connects the light receiving device to the power supply when the light receiving device is set to an activated state and electrically disconnects the light receiving device from the power supply when the light receiving device is set to a deactivated state.

Abstract translation: 一种光量测量装置，包括光量测量电路和用于向光量测量电路供电的电源; 光量测量电路包括：光接收装置，用于接收光并输出与​​所接收的光的光量对应的电信号; 用于在光接收装置和电源之间的电连接和断开之间切换的第一开关; 以及驱动控制器，用于控制第一开关，使得当光接收装置被设置为激活状态时，第一开关将光接收装置电连接到电源，并且当光接收时电光断开光接收装置与电源 设备设置为禁用状态。

公开(公告)号：US20110266443A1

公开(公告)日：2011-11-03

申请号：US12799626

申请日：2010-04-28

Applicant: Thomas R. Schimert ,  Thomas P. Fagan, III ,  Athanasios J. Syllaios

Inventor： Thomas R. Schimert ,  Thomas P. Fagan, III ,  Athanasios J. Syllaios

IPC: H01L31/09 ,  H01L31/18 ,  H01L31/0232 ,  H01L27/144 ,  G01J5/28 ,  G01J5/08

CPC classification number: G01J5/20 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/04 ,  G01J1/0411 ,  G01J1/0429 ,  G01J1/0488 ,  G01J4/04 ,  G01J5/02 ,  G01J5/0215 ,  G01J5/023 ,  G01J5/024 ,  G01J5/08 ,  G01J5/0806 ,  G01J5/0825 ,  G01J5/0862

Abstract: Pixel-level monolithic optical element configurations for uncooled infrared detectors and focal plane arrays in which a monolithically integrated or fabricated optical element may be suspended over a microbolometer pixel membrane structure of an uncooled infrared detector element A monolithic optical element may be, for example, a polarizing or spectral filter element, an optically active filter element, or a microlens element that is structurally attached by an insulating interconnect to the existing metal interconnects such that the installation of the optical element substantially does not impact the thermal mass or thermal time constant of the microbolometer pixel structure, and such that it requires little if any additional device real estate area beyond the area originally consumed by the microbolometer pixel structure interconnects.

Abstract translation: 用于非制冷红外探测器和焦平面阵列的像素级单片光学元件配置，其中单片集成或制造的光学元件可以悬挂在非制冷红外探测器元件的微测辐射热计像素膜结构上。单片光学元件可以是例如 偏振或光谱滤光器元件，光学有源滤光器元件或微透镜元件，其通过绝缘互连结构地附接到现有金属互连，使得光学元件的安装基本上不影响光学元件的热质量或热时间常数 微照度计像素结构，并且使得其需要很少的额外的设备房地产区域超出由微测热计像素结构原始消耗的区域互连。

公开(公告)号：US07767947B2

公开(公告)日：2010-08-03

申请号：US11229709

申请日：2005-09-20

Applicant: John P. Downing, Jr.

Inventor： John P. Downing, Jr.

IPC: G01J1/32 ,  H01S3/13

CPC classification number: G01J1/32 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/0414 ,  G01J1/08 ,  G01J1/4257

Abstract: A semiconductor light source with optical feedback includes a vertical member extending upward from an upper horizontal surface of a header parallel to a vertical beam projected from a semiconductor light-emitting element mounted on the horizontal surface of the header wherein the vertical member supports a light-sensing element for receiving light reflected transversely from the vertical beam by a beam splitter supported by the vertical member. The vertical beam passing through the beam splitter passes through a window or filter in a cap mounted on the header and covering the light-emitting element, the light-sensing element, the beam splitter, and the vertical member. Substantially all of the transversely reflected light impinges on the light-sensing element and can be used to control the power to the light-emitting element. A simple lens can by used to collimate the beam. Interior portions of the unit are formed from light absorbing materials such as black ceramic, black plastic, anodized aluminum, etc. The combined effect of the non-reflective interior of the assembly, the orientation of the photo-diode to have an acceptance cone perpendicular to the beam axis, the small entrance pupil, and the optical filter reduces ambient radiation in the unit by as much as −75 dB of the level outside the device. This reduces noise and drift in the automatic power control loop to produce constant intensity in the output light beam.

Abstract translation: 具有光学反馈的半导体光源包括垂直构件，其从头部的上水平面向上延伸，平行于从安装在头部的水平表面上的半导体发光元件投影的垂直光束，其中垂直构件支撑发光二极管， 感测元件，用于接收由垂直构件支撑的分束器从垂直梁横向反射的光。 穿过分束器的垂直光束穿过安装在头部上的盖子中的窗口或滤光器，并覆盖发光元件，光感测元件，分束器和垂直构件。 基本上所有的横向反射光都照射在感光元件上，并且可以用于控制发光元件的功率。 一个简单的镜头可以用来准直光束。 单元的内部部分由诸如黑色陶瓷，黑色塑料，阳极氧化铝等的光吸收材料形成。组件的非反射内部的组合效应，光电二极管的取向具有接受锥垂直 到光束轴，小入射光瞳和光学滤光器将该单元中的环境辐射减少高达设备外部的-75dB的水平。 这降低了自动功率控制回路中的噪声和漂移，从而在输出光束中产生恒定的强度。

公开(公告)号：US20100103962A1

公开(公告)日：2010-04-29

申请号：US12527618

申请日：2008-02-21

Applicant: Taro Ando ,  Yoshiyuki Ohtake ,  Naoya Matsumoto ,  Takashi Inoue ,  Haruyoshi Toyoda ,  Norihiro Fukuchi

Inventor： Taro Ando ,  Yoshiyuki Ohtake ,  Naoya Matsumoto ,  Takashi Inoue ,  Haruyoshi Toyoda ,  Norihiro Fukuchi

IPC: H01S3/10 ,  H01S5/183 ,  H01S5/026

CPC classification number: G01J1/08 ,  B23K26/03 ,  B23K26/066 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/04 ,  G01J1/0414 ,  G01N21/8806 ,  G02B27/58 ,  G11B7/1367 ,  G11B7/1387

Abstract: A light source device 1 includes a laser light source 10 and an optical phase modulator 15 or the like. The optical phase modulator 15 inputs coherent light output from the laser light source 10 and transmitted through a beam splitter 14, phase-modulates the light according to the position on a beam cross section of the light, and outputs the phase-modulated light to the beam splitter 14. When (p+1) areas sectioned by p circumferences centered on a predetermined position are set on a beam cross section of light input to the optical phase modulator 15, the more outside each of the (p+1) areas is, the wider the radial width of the area, the amount of phase modulation is constant in each of the (p+1) areas, and the amounts of phase modulation differ by π between two adjacent areas out of the (p+1) areas.

Abstract translation: 光源装置1包括激光光源10和光相位调制器15等。 光相位调制器15输入从激光光源10输出的相干光，并透过分束器14，根据光束横截面上的位置对光进行相位调制，并将相位调制光输出到 当在输入到光相位调制器15的光束的横截面上设定以预定位置为中心的以p周为中心的（p + 1）区域时，每个（p + 1）区域越多 ，区域的径向宽度越宽，每个（p + 1）区域的相位调制量是恒定的，并且相位调制量的差异为＆pgr; （p + 1）区域之间的两个相邻区域之间。

公开(公告)号：US07663083B2

公开(公告)日：2010-02-16

申请号：US12185910

申请日：2008-08-05

Applicant: Jong-oh Kwon ,  Yoon-chul Son ,  Kyu-dong Jung ,  Woon-bae Kim

Inventor： Jong-oh Kwon ,  Yoon-chul Son ,  Kyu-dong Jung ,  Woon-bae Kim

IPC: H01L23/52

CPC classification number: G01J1/02 ,  G01J1/0204 ,  G01J1/0219 ,  G01J1/0271 ,  G01J1/04 ,  G01J1/0411 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00

Abstract: An image sensor module capable of facilitating an electrical and mechanical connection of an electric component and a fabrication thereof are disclosed. The image sensor module includes a sensor chip; at least one lens disposed above the sensor chip; at least one electric component disposed with respect to the at least one lens to adjust optical characteristics of the at least one lens; a housing accommodating and closing up the sensor chip, the at least one lens and the at least one electric component, and having an opening to expose the at least one lens to an outside thereof; and a wiring part longitudinally disposed on an inner surface of the housing, and including at least one conducting wire having a first connecting terminal exposed to the outside of the housing to allow the at least one conducting wire to electrically connect a terminal pad of the at least one electric component with an external electronic device and a second connecting terminal connected to the terminal pad of the at least one electric component.

Abstract translation: 公开了能够促进电气部件的电气和机械连接及其制造的图像传感器模块。 图像传感器模块包括传感器芯片; 设置在所述传感器芯片上方的至少一个透镜; 相对于所述至少一个透镜布置的至少一个电气部件，以调节所述至少一个透镜的光学特性; 容纳和封闭传感器芯片的壳体，所述至少一个透镜和所述至少一个电气部件，并且具有用于将所述至少一个透镜暴露于其外部的开口; 以及纵向设置在所述壳体的内表面上的布线部分，并且包括至少一个导线，其具有暴露于所述壳体的外部的第一连接端子，以允许所述至少一根导线电连接所述壳体的端子垫 至少一个具有外部电子设备的电气部件和连接到所述至少一个电气部件的端子焊盘的第二连接端子。

公开(公告)号：US20100001653A1

公开(公告)日：2010-01-07

申请号：US12375797

申请日：2007-08-15

Applicant: Achim Hilgers

Inventor： Achim Hilgers

IPC: H05B37/02 ,  F21V1/00 ,  G02B6/00

CPC classification number: G01J1/04 ,  F21V23/0457 ,  F21V23/0464 ,  F21Y2115/10 ,  G01J1/0204 ,  G01J1/0295 ,  G01J1/0407 ,  G01J1/0414 ,  G01J1/0474 ,  G01J1/0488 ,  G01J1/4204 ,  G01J2001/4247 ,  H05B33/0803 ,  H05B33/0869

Abstract: The present invention relates to a optical lighting device comprising several solid state light sources (2) and at least one optical sensor (4) arranged between the solid state light sources (2) in approximately the same plane. An optical deflection unit (5, 13) is mounted in front of the sensor (4) and designed to deflect light laterally emitted by the solid state light sources (2) to the optical sensor (4). The deflection unit (5, 13) is designed to inhibit the transmission of ambient light to the optical sensor (4).

Abstract translation: 本发明涉及包括几个固态光源（2）和布置在大致相同平面内的固态光源（2）之间的至少一个光学传感器（4）的光学照明装置。 光学偏转单元（5,13）安装在传感器（4）的前面，并被设计成将由固态光源（2）横向发射的光偏转到光学传感器（4）。 偏转单元（5,13）被设计成阻止环境光传递到光学传感器（4）。

公开(公告)号：US20090245324A1

公开(公告)日：2009-10-01

申请号：US12310389

申请日：2008-03-13

Applicant: Hideki Sunaga ,  Hirokazu Inoue ,  Yutaka Nakamura ,  Katsuyuki Urayama ,  Shuji Hojo

Inventor： Hideki Sunaga ,  Hirokazu Inoue ,  Yutaka Nakamura ,  Katsuyuki Urayama ,  Shuji Hojo

IPC: G01K13/00 ,  G01N7/00 ,  G01N33/497 ,  G01J5/00 ,  G01J1/44

CPC classification number: G01K1/14 ,  B60H1/00792 ,  G01J1/02 ,  G01J1/0204 ,  G01J1/0271 ,  G01J1/4228 ,  G01J5/0022 ,  G01J5/0025 ,  G01J5/0846 ,  G01J2001/4266 ,  G01K1/08 ,  G01K2201/02

Abstract: A compound sensor which can improve the space for installing sensors and an operation for installing sensors by organizing various types of sensors, are provided. A compound sensor according to the present invention includes a light-shielding plate (3A) having one face onto which sunlight is irradiated and the other face located on a side opposite to the one face, which shields the sunlight from the one face side toward the other face side, a solar sensor (8A-8C) provided in the one face of the light-shielding plate (3A), and a temperature sensor provided in the other face side of the light-shielding plate (3A).

Abstract translation: 提供了一种复合传感器，其可以改善用于安装传感器的空间和通过组织各种类型的传感器来安装传感器的操作。 根据本发明的复合传感器包括一个遮光板（3A），该遮光板（3A）具有一个被照射的阳光的面，另一个面位于与一个面相反的一侧，该遮光板将阳光从一个面侧遮挡 设置在遮光板（3A）的一个面上的太阳能传感器（8A-8C）和设在遮光板（3A）的另一面侧的温度传感器。

公开(公告)号：US07564033B2

公开(公告)日：2009-07-21

申请号：US10563993

申请日：2005-01-14

Applicant: Frank Reichenbach ,  Holger Hoefer

Inventor： Frank Reichenbach ,  Holger Hoefer

IPC: G01N21/00 ,  G01J5/04 ,  G01P15/00

CPC classification number: G01N21/3504 ,  G01J1/0204 ,  G01J1/04 ,  G01J5/12 ,  G01N2021/3177 ,  G01P1/023 ,  G01P15/18 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  Y10T29/49002 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The invention relates to a microstructured sensor, having at least one measurement chip in which there is formed a first measurement area having a first measurement structure and a second measurement area having a second measurement structure, the measurement areas being offset to one another in a lateral direction, one cap chip that is fastened in vacuum-tight fashion to the measurement chip in a connecting area, one intermediate space, formed between the measurement chip and the cap chip, that is sealed outwardly by the connecting area and in which the measurement areas are situated, and at least one contact area, formed on the measurement chip, and left exposed by the cap chip, for the contacting of the measurement chip. The sensor can be in particular a gas sensor for measuring a gas concentration, or an acceleration sensor.

Abstract translation: 本发明涉及一种微结构传感器，其具有至少一个测量芯片，其中形成具有第一测量结构的第一测量区域和具有第二测量结构的第二测量区域，测量区域在侧向相互偏移 方向，一个在与测量芯片和盖芯片之间形成的连接区域中的测量芯片以真空密封方式固定的一个盖芯片，其由连接区域向外密封，并且测量区域 并且至少一个接触区域形成在测量芯片上，并且被盖芯片暴露以使测量芯片接触。 传感器可以特别地用于测量气体浓度的气体传感器或加速度传感器。

公开(公告)号：US07491920B2

公开(公告)日：2009-02-17

申请号：US11347536

申请日：2006-02-02

Applicant: Donald L. Lee ,  William E. Tennant

Inventor： Donald L. Lee ,  William E. Tennant

IPC: H01L27/00 ,  H04N9/64

CPC classification number: G01J1/4228 ,  G01J1/0204 ,  G01J1/04 ,  G01J1/0411 ,  H01L27/14625 ,  H01L27/14627 ,  H04N5/367

Abstract: A cost-effective FPA includes a plurality of detectors per pixel, wherein radiation is directed by a microlens array into respective focal regions that are covered by the union of the detectors' collections regions within each pixel and any defective detectors are de-selected in the ROIC. The operability of each pixel is evaluated, and a map generated specifying detector de-selection for each pixel. This map is read into memory in the ROIC to de-select bad detectors. Bad detectors are preferably allowed to float to a photovoltage and re-emit some of their accumulated photo charge to neighboring detectors to improve collection efficiency. The radiation levels are preferably read out on a pixel-by-pixel basis. Accordingly, the signals from the selected detectors are combined within each pixel.

Abstract translation: 成本有效的FPA包括每个像素的多个检测器，其中辐射由微透镜阵列引导到由每个像素内的检测器集合区域的并集覆盖的各个聚焦区域中，并且任何缺陷检测器在 ROIC。 对每个像素的可操作性进行评估，并且生成针对每个像素指定检测器去选择的映射。 该地图被读入ROIC中的内存以取消选择不良检测器。 优选地，允许错误的检测器漂浮到光电压并将其累积的光电荷的一些重新发射到相邻检测器以提高收集效率。 辐射水平优选以逐个像素为基础读出。 因此，来自所选择的检测器的信号在每个像素内组合。