Abstract:
An insulation structure of high voltage electrodes includes an insulator having an exposed surface and a conductor portion, which includes a joint region in contact with the insulator, and a heat-resistant portion provided, along at least part of an edge of the joint region, in such a manner as to be adjacent to the exposed surface of the insulator. The heat-resistant portion is formed of an electrically conductive material whose melting point is higher than that of the conductor portion. The heat-resistant portion may be so provided as to have a gap between the insulator and the exposed surface.
Abstract:
X-ray CT apparatus is provided in which the photon energy distribution of X-rays to be radiated is flattened. X-ray CT apparatus includes an X-ray tube, a detector, a data acquisition system, a tube voltage generator, and a grid controller. The X-ray tube radiates X-rays onto a subject. The detector includes multiple detection elements for detecting photons forming the X-rays. The data acquisition system counts the number of the detected photons to acquire projection data based on the counted photons. The tube voltage generator applies the tube voltage to the X-ray tube while changing the tube voltage of the X-ray tube in a predetermined cycle. A tube current controller decreases the tube current upon an increase in the tube voltage, and increases the tube current upon a decrease in the tube voltage. Thus, the photon energy distribution of the X-rays radiated from the X-ray tube is flattened.
Abstract:
Methods of reducing glitch rates within an ion implanter are described. In one embodiment, a plasma-assisted conditioning is performed, wherein the bias voltage to the extraction electrodes is modified so as to inhibit the formation of an ion beam. The power supplied to the plasma generator in the ion source is increased, thereby creating a high density plasma, which is not extracted by the extraction electrodes. This plasma extends from the ion source chamber through the extraction aperture. Energetic ions then condition the extraction electrodes. In another embodiment, a plasma-assisted cleaning is performed. In this mode, the extraction electrodes are moved further from the ion source chamber, and a different source gas is used to create the plasma. In some embodiments, a combination of these modes is used to reduce glitches in the ion implanter.
Abstract:
An ion implantation system and method are disclosed in which glitches in voltage are minimized by modifications to the power system of the implanter. These power supply modifications include faster response time, output filtering, improved glitch detection and removal of voltage blanking. By minimizing glitches, it is possible to produce solar cells with acceptable dose uniformity without having to pause the scan each time a voltage glitch is detected. For example, by shortening the duration of a voltage to about 20-40 milliseconds, dose uniformity within about 3% can be maintained.
Abstract:
Ion accelerating devices including connection mechanisms with integrated shielding electrode and related methods are disclosed. According to an embodiment, an ion accelerating device of an ion implantation system comprises: a first element; a first connection system within the first element, the first connection system including a first connector and a first encapsulated shielding electrode around the first connector; and a second connection system within a second element other than the first element, the second connection system being coupled to the first connector; wherein the first encapsulated shielding electrode includes a first shielding portion adjacent to a first interface surface of the first element where the second connection system interfaces with the first element, in a cross-sectional view, the first shielding portion being substantially U-shaped.
Abstract:
An electron beam system (such as a scanning electron microscope or an electron probe microanalyzer) capable of displaying backscattered electron (BSE) images at the same brightness and same contrast at all times if the atomic number differences are the same when illumination conditions including accelerating voltage and emission current are varied or when the specimens are imaged with different instruments.
Abstract:
The present invention is directed to a beam control circuit and method used to minimize particle contamination in an ion implantation system by reducing the duty factor of the ion beam. In one embodiment the beam control circuit comprises a,high voltage switch connected in series with a power supply and an ion source portion of the ion implantation system, wherein the switch is operable to interrupt or reestablish a connection between the power supply and an electrode of the ion source including electrodes for plasma production. The beam control circuit also comprises a switch controller operable to control the duty factor of the ion beam by controlling the switch to close before a start of ion implantation and to open after a completion of implantation or at other times when the beam is not needed, thereby minimizing beam duty and particle contamination. The beam control technique may be applied to wafer doping implantation and duty factor reduction. Protection circuits for the high voltage switch absorb energy from reactive components and clamp any overvoltages.
Abstract:
A voltage-isolating passageway for providing high voltage isolation between a component maintained at high DC voltage and a component maintained at a substantially lower voltage is described. The voltage-isolating passageway incorporates a transverse magnetic field across its passageway, which reduces the potential energy of charged particles (e.g., electrons) passing through the passageway. The reduction in electron potential energy reduces the energy of collisions between electrons and molecules and therefore reducing the likelihood of avalanche ionization. The voltage-isolating passageway includes a passageway and at least two magnets. The passageway has two openings and the two magnets are positioned along opposite and exterior surfaces of the passageway wherein the first and second magnets impose a magnetic field in a transverse direction with respect to a lengthwise axis of the passageway. In addition, a semi-conductive coating can be applied to the interior passageway surface to help remove potential energy from the gas that comes in direct contact with the coating.
Abstract:
A semiconductor processing system, such as an ion implantation machine, includes a pair of controllers respectively disposed in high and low voltage areas of the machine, and interconnected by a fiber optic communication link. The controller located in the high voltage area employs a pair of computer processor units for respectively collecting the status of process parameters and control elements in the high voltage area, and for delivering control signals to controllable elements such as flow control valves. The controller in the low voltage area likewise employs a pair of computer processor units for generating control signals that are delivered via the fiber optic link to the first controller, and for receiving status signal information from the first controller. The fiber optic link provides high voltage isolation between the two controllers and reduces noise affecting signal accuracy.
Abstract:
An arc suppressor is provided for an electron gun of the type used e.g. in semiconductor lithography equipment. The arc suppressor prevents damaging emission properties of the electron gun either due to variation of the cathode work function or any damage to the emitter apex. The arc suppressor includes a resistance and an inductor in series with each electrode lead providing voltage or current to the various electrodes of the electron gun. The inductance is provided by a ferrite toroid which contains a plurality of holes in addition to the main central hole. The leads for each electrode are wrapped around the toroid through the various holes, with one hole being provided for each lead. Thus advantageously each lead is isolated magnetically from the others, reducing the transformer and capacitive effects that couple one lead to another.