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    PCB WITH HEAT DISSIPATION STRUCTURE AND PROCESSING METHODS THEREOF
    31.
    发明申请
    PCB WITH HEAT DISSIPATION STRUCTURE AND PROCESSING METHODS THEREOF 审中-公开
    PCB散热结构及其处理方法

    公开(公告)号：US20120222888A1

    公开(公告)日：2012-09-06

    申请号：US13141394

    申请日：2011-05-09

    Applicant: Tian Zhang

    Inventor： Tian Zhang

    IPC: H05K7/20 ,  C04B35/64

    CPC classification number: H05K1/0203 ,  C04B37/025 ,  C04B2237/062 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/36 ,  C04B2237/365 ,  C04B2237/40 ,  H05K1/0306 ,  H05K2201/0116 ,  H05K2201/10106

    Abstract: The invention relates to a printed circuit board (PCB) with a heat dissipating structure. The PCB comprises a conducting layer and a PCB carrier layer, wherein the PCB carrier layer is a porous heat conducting layer; heat conducting liquid or a solid-liquid phase change heat conducting material is injected into holes of the porous heat conducting layer; the conducting layer is arranged on a first surface of the porous heat conducting layer; and a second surface of the porous heat conducting layer is a contact interface with external media. In the invention, the carrier layer of the PCB is a porous heat conducting layer which is made of a porous material with high thermal conductivity, heat conducting liquid such as heat conducting ink or the solid-liquid phase change heat conducting material permeates into the holes of the porous heat conducting layer; when the PCB is heated, the heat conducting ink is separated out of the porous material because the expansion coefficient of the porous material is inconsistent with that of the heat conducting ink, and the separated heat conducting ink fills air gaps between the contact interface and the external medium in the contact interface of the PCB via capillary phenomenon, so that heat resistance between a light-emitting diode (LED) and the contact interface is reduced greatly and the thermal conductivity of the PCB is enhanced; moreover, the PCB has low cost, simple structure and easy installation.

    Abstract translation: 本发明涉及一种具有散热结构的印刷电路板（PCB）。 PCB包括导电层和PCB载体层，其中PCB载体层是多孔导热层; 将导热液体或固液相变导热材料注入多孔导热层的孔中; 所述导电层设置在所述多孔导热层的第一表面上; 并且所述多孔导热层的第二表面是与外部介质的接触界面。 在本发明中，PCB的载体层是由具有高导热性的多孔材料制成的多孔导热层，诸如导热油墨的导热液体或固 - 液相变导热材料渗入孔中 的多孔导热层; 当PCB被加热时，由于多孔材料的膨胀系数与导热油墨的膨胀系数不一致，导热油墨从多孔材料中分离出来，并且分离的导热油墨填充接触界面和 外部介质通过毛细管现象在PCB的接触界面中，使得发光二极管（LED）和接触界面之间的耐热性大大降低，并且PCB的导热性增强; 而且PCB成本低，结构简单，安装方便。

    CIRCUIT LAMINATES, AND METHOD OF MANUFACTURE THEREOF
    34.
    发明申请
    CIRCUIT LAMINATES, AND METHOD OF MANUFACTURE THEREOF 有权
    电路层压板及其制造方法

    公开(公告)号：US20110229709A1

    公开(公告)日：2011-09-22

    申请号：US13053417

    申请日：2011-03-22

    Applicant: Michael S. Kuszaj

    Inventor： Michael S. Kuszaj

    IPC: H05K1/03 ,  H05K3/00 ,  H05K3/07 ,  H05K3/42 ,  B32B5/18 ,  B32B7/12

    CPC classification number: H05K1/0313 ,  H05K2201/0116 ,  H05K2201/2018 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/249953 ,  Y10T428/249982

    Abstract: A method of making a supported foam circuit laminate comprises fitting a dielectric foam substrate having a shape defined by edges to a support frame having a thickness, an inner rim and an outer rim, wherein the edges of the dielectric foam substrate are flush with the inner rim of the support frame, and the dielectric foam substrate has a thickness that is greater than the thickness of the support frame; disposing an electrically conductive layer onto a side of the dielectric foam substrate and the support frame, wherein the edges of the electrically conductive layer overlap the inner rim of the support frame; and co-laminating the electrically conductive layer to the dielectric foam substrate and the overlapped support frame under heat and pressure to provide a supported foam circuit laminate.

    Abstract translation: 制造支撑泡沫电路层压体的方法包括将具有由边缘限定的形状的电介质泡沫基材装配到具有厚度，内缘和外缘的支撑框架，其中电介质泡沫基底的边缘与内部 支撑框架的边缘，并且电介质泡沫基板具有大于支撑框架的厚度的厚度; 将导电层设置在电介质泡沫衬底和支撑框架的侧面上，其中导电层的边缘与支撑框架的内边缘重叠; 并且在热和压力下将导电层共同层叠到电介质泡沫衬底和重叠的支撑框架，以提供支撑的泡沫电路层压体。

    ANTENNA CIRCUIT CONSTITUENT BODY FOR IC CARD/TAG AND IC CARD
    37.
    发明申请
    ANTENNA CIRCUIT CONSTITUENT BODY FOR IC CARD/TAG AND IC CARD 有权
    IC卡/标签和IC卡的天线电路体系

    公开(公告)号：US20110036914A1

    公开(公告)日：2011-02-17

    申请号：US12988210

    申请日：2009-04-28

    Applicant: Akira Shingu ,  Kiyoji Egashira

    Inventor： Akira Shingu ,  Kiyoji Egashira

    IPC: G06K19/077 ,  H01Q7/00

    CPC classification number: H01Q7/00 ,  G06K19/07749 ,  H01Q1/38 ,  H05K1/162 ,  H05K1/165 ,  H05K3/4685 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2201/0382

    Abstract: Provided are an antenna circuit constituent body for an IC card/tag, which is capable of enhancing a Q value by reducing a permittivity of a resin film of which a base material is made; and an IC card. The antenna circuit constituent body (10) for an IC card/tag comprises: the base material (11) made of the resin film; and circuit pattern layers (131 and 132) each formed on each of both sides of the base material (11) and made of aluminum foil. The circuit pattern layer (131) includes a coiled pattern layer. Parts of the circuit pattern layers (131 and 132), which mutually face each other; and a part of the base material (11), which is interposed between the parts of the circuit pattern layers (131 and 132), constitute a capacitor. The circuit pattern layers (131 and 132) are electrically connected by means of crimping parts (13a and 13b). The base material (11) includes a plurality of void-state-air layers. A relative density of the base material (11) with respect to a density of a resin is less than or equal to 0.9. An average volume of the void-state-air layers is greater than or equal to 2 μm3 and less than or equal to 90 μm3.

    Abstract translation: 提供一种用于IC卡/标签的天线电路构成体，其能够通过降低制成基材的树脂膜的介电常数来提高Q值; 和IC卡。 用于IC卡/标签的天线电路构成体（10）包括：由树脂膜制成的基材（11）; 以及各自形成在基材（11）的两侧的每一侧上且由铝箔制成的电路图案层（131和132）。 电路图案层（131）包括线圈图案层。 电路图案层（131和132）的相互面对的部分; 并且介于电路图案层（131和132）的部分之间的基底材料（11）的一部分构成电容器。 电路图案层（131和132）通过压接部件（13a和13b）电连接。 基材（11）包括多个空隙状态空气层。 基材（11）相对于树脂的密度的相对密度小于或等于0.9。 空隙状态空气层的平均体积大于或等于2μm3且小于或等于90μm3。

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