公开(公告)号：US09801314B2

公开(公告)日：2017-10-24

申请号：US15276830

申请日：2016-09-27

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Takashi Kuwabara

IPC: H05K7/20 ,  H02M1/14 ,  H05K1/14 ,  H05K1/18 ,  H02M7/00 ,  H02M1/32

CPC classification number: H05K7/20909 ,  H02M1/143 ,  H02M7/003 ,  H02M2001/327 ,  H05K1/0203 ,  H05K1/14 ,  H05K1/181 ,  H05K7/209 ,  H05K2201/04 ,  H05K2201/10015

Abstract: A first printed circuit board on which a heatsink having a discrete semiconductor device attached to it and first capacitors for smoothing an electric current after a conversion from AC to DC are mounted is arranged in the horizontal direction of a bottom portion of a device casing. On the first printed circuit board, various electronic components such as a resistor, a diode, a capacitor, a coil, etc. are mounted in addition to the heatsink and the first capacitors. Further, in an in-device-casing vacant space in an upper portion of the heatsink mounted on the first printed circuit board, a second printed circuit board on which second capacitors for performing smoothing upon a conversion from AC to DC are mounted is arranged orthogonally to the first printed circuit board in the device spacing.

公开(公告)号：US09756726B2

公开(公告)日：2017-09-05

申请号：US14071296

申请日：2013-11-04

Applicant: Infineon Technologies AG

Inventor： Alexander Heinrich ,  Peter Scherl ,  Magdalena Hoier ,  Hans-Joerg Timme

IPC: H05K7/10 ,  H05K7/12 ,  H05K1/11 ,  H05K1/14 ,  H01L23/00 ,  H05K3/36 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K1/11 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45028 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45184 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48092 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48507 ,  H01L2224/48511 ,  H01L2224/85 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36 ,  H05K3/4015 ,  H05K2201/04 ,  H05K2203/0285 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00012 ,  H01L2224/48247 ,  H01L2224/43 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An electronic device may comprise a semiconductor element and a wire bond connecting the semiconductor element to a substrate. Using a woven bonding wire may improve the mechanical and electrical properties of the wire bond. Furthermore, there may be a cost benefit. Woven bonding wires may be used in any electronic device, for example in power devices or integrated logic devices.

公开(公告)号：US09693455B1

公开(公告)日：2017-06-27

申请号：US14227346

申请日：2014-03-27

Applicant: Seong Won Park ,  Hun Teak Lee ,  WoonJae Beak ,  MinJung Kim ,  ChangHwan Kim ,  ByungHyun Kwak ,  GwangTae Kim ,  HeeSoo Lee

Inventor： Seong Won Park ,  Hun Teak Lee ,  WoonJae Beak ,  MinJung Kim ,  ChangHwan Kim ,  ByungHyun Kwak ,  GwangTae Kim ,  HeeSoo Lee

IPC: H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H05K1/09 ,  H05K1/18 ,  H05K1/14 ,  H05K3/32 ,  H05K3/46

CPC classification number: H05K1/112 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K1/09 ,  H05K1/113 ,  H05K1/14 ,  H05K1/18 ,  H05K1/186 ,  H05K3/32 ,  H05K3/36 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/46 ,  H05K3/4614 ,  H05K3/4623 ,  H05K2201/04 ,  H05K2203/061 ,  H05K2203/0733

Abstract: A system and method of manufacture of an integrated circuit packaging system includes: a copper film; a first metal layer directly on the copper film; an insulation layer directly on and over the first metal layer, the insulation layer having a via hole through the insulation layer; a conductive via within the via hole and directly on the first metal layer; a second metal layer directly on the conductive via and the insulation layer; a copper post directly on the copper film; a solder pad over the copper post; and an interposer coupled to the copper post and the solder pad.

公开(公告)号：US09681539B2

公开(公告)日：2017-06-13

申请号：US14617365

申请日：2015-02-09

Applicant: Richard A. Cobley ,  Joseph G. Murray

Inventor： Richard A. Cobley ,  Joseph G. Murray

IPC: H05K5/00 ,  H05K1/02 ,  G21D3/00 ,  H05K1/14

CPC classification number: H05K1/0293 ,  G05B2219/21109 ,  G21D3/00 ,  H05K1/141 ,  H05K2201/04 ,  Y02E30/39

Abstract: A system and apparatus for monitoring and control of the operation of various types of industrial plants, including power plants, nuclear power plants and plants including various types of mechanical, electrical and chemical machinery. The invention employs modular non-microprocessor based, non-software based digital hardware that enables communication between sensors and control logic and between the control logic and actuators that control a functional aspect of each plant.

公开(公告)号：US20170150616A1

公开(公告)日：2017-05-25

申请号：US15030589

申请日：2015-12-10

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhao Li ,  Dawei Wang

IPC: H05K5/00 ,  G09F9/30 ,  H05K7/14 ,  H05K5/02 ,  H05K1/14

CPC classification number: H05K5/0017 ,  G04B37/1486 ,  G04G17/045 ,  G06F1/163 ,  G06F1/1652 ,  G09F9/301 ,  H04M1/0268 ,  H05K1/14 ,  H05K5/0086 ,  H05K5/0217 ,  H05K7/1427 ,  H05K2201/04

Abstract: The present application discloses a mount for mounting a flexible display panel, comprising a flexible frame comprising a first end, a second end, and a mounting surface for receiving the flexible display panel, a first flexible arm attached to the first end of the flexible frame. The first flexible arm is movable between a first position such that the first flexible arm is substantially retracted into the flexible frame and a second position such that the first flexible arm is substantially extended from the flexible frame. When the first flexible arm is substantially extended from the flexible frame, the first flexible arm is capable of connecting to the second end of the flexible frame directly or indirectly and forming a ring comprising the first flexible arm and the flexible frame.

公开(公告)号：US20170094790A1

公开(公告)日：2017-03-30

申请号：US15310530

申请日：2015-03-05

Applicant: Auto-Kabel Management GmbH

Inventor： Wacim Tazarine ,  Simon Betscher ,  Frank Gronwald ,  Sohejl Rafati

IPC: H05K1/14 ,  F02N11/08 ,  H05K1/09 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/14 ,  F02N11/0862 ,  F02N11/087 ,  F02N2011/0874 ,  F02N2250/02 ,  H05K1/0204 ,  H05K1/0263 ,  H05K1/0287 ,  H05K1/056 ,  H05K1/09 ,  H05K1/111 ,  H05K1/142 ,  H05K1/145 ,  H05K2201/04 ,  H05K2201/06 ,  H05K2201/07 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10272

Abstract: Circuit arrangement for vehicles with at least one semiconductor element 30 and at least one first metal carrier plate 2a and a metal circuit board 2b. A multifaceted scope of application is provided if the carrier plate 2a is electrically insulated from the circuit board 2b and the carrier plate 2a is electrically linked with at least one of the circuit boards 2b by means of at least one semiconductor device 30 so that the carrier plate 2a and the circuit board 2b form an electrical three-pole.

公开(公告)号：US11999001B2

公开(公告)日：2024-06-04

申请号：US17545322

申请日：2021-12-08

Applicant: Adeia Semiconductor Technologies LLC

Inventor： Cyprian Emeka Uzoh

IPC: H05K1/11 ,  B23K20/00 ,  B23K20/02 ,  H01L21/50 ,  H01L23/00 ,  H01L23/10 ,  H01L23/48 ,  H01L23/49 ,  H01L23/498 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K13/04 ,  H01L21/48 ,  H01L21/768

CPC classification number: B23K20/023 ,  B23K20/002 ,  H01L21/50 ,  H01L23/10 ,  H01L23/481 ,  H01L23/49 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/98 ,  H05K1/11 ,  H05K1/14 ,  H05K1/144 ,  H05K1/18 ,  H05K3/0094 ,  H05K3/34 ,  H05K13/046 ,  H05K13/0465 ,  H01L21/4853 ,  H01L21/76898 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/27 ,  H01L2224/02372 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05025 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/05138 ,  H01L2224/05155 ,  H01L2224/05157 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/0518 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05187 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/13009 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13138 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/1319 ,  H01L2224/14131 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/16501 ,  H01L2224/16503 ,  H01L2224/16505 ,  H01L2224/2745 ,  H01L2224/27452 ,  H01L2224/27462 ,  H01L2224/27464 ,  H01L2224/29011 ,  H01L2224/29023 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29138 ,  H01L2224/29147 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32501 ,  H01L2224/32505 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/81075 ,  H01L2224/8112 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81825 ,  H01L2224/83075 ,  H01L2224/8312 ,  H01L2224/83193 ,  H01L2224/83825 ,  H01L2924/00014 ,  H01L2924/381 ,  H05K1/111 ,  H05K2201/04 ,  H05K2203/04 ,  H01L2224/8112 ,  H01L2924/00014 ,  H01L2224/1147 ,  H01L2924/00014 ,  H01L2224/05187 ,  H01L2924/04953 ,  H01L2224/0518 ,  H01L2924/01071 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05181 ,  H01L2924/00014 ,  H01L2224/05171 ,  H01L2924/01042 ,  H01L2224/05138 ,  H01L2924/01015 ,  H01L2924/00014 ,  H01L2224/05184 ,  H01L2924/00014 ,  H01L2224/05164 ,  H01L2924/00014 ,  H01L2224/05187 ,  H01L2924/04941 ,  H01L2224/05155 ,  H01L2924/01015 ,  H01L2224/05157 ,  H01L2924/01015 ,  H01L2224/05166 ,  H01L2924/01074 ,  H01L2224/05155 ,  H01L2924/01074 ,  H01L2224/13105 ,  H01L2924/01047 ,  H01L2224/13109 ,  H01L2924/01031 ,  H01L2924/01047 ,  H01L2224/13138 ,  H01L2924/01034 ,  H01L2224/11462 ,  H01L2924/00014 ,  H01L2224/11464 ,  H01L2924/00014 ,  H01L2224/1145 ,  H01L2924/00014 ,  H01L2224/11452 ,  H01L2924/00014 ,  H01L2224/16501 ,  H01L2924/00012 ,  H01L2224/16505 ,  H01L2924/00012 ,  H01L2224/14131 ,  H01L2924/00014 ,  H01L2224/05026 ,  H01L2924/00012 ,  H01L2224/05571 ,  H01L2924/00012 ,  H01L2224/13155 ,  H01L2924/00014 ,  H01L2224/13184 ,  H01L2924/00014 ,  H01L2224/73103 ,  H01L2924/00012 ,  H01L2224/73203 ,  H01L2924/00012 ,  H01L2224/27462 ,  H01L2924/00014 ,  H01L2224/27464 ,  H01L2924/00014 ,  H01L2224/2745 ,  H01L2924/00014 ,  H01L2224/27452 ,  H01L2924/00014 ,  H01L2224/29105 ,  H01L2924/01047 ,  H01L2224/29109 ,  H01L2924/01031 ,  H01L2924/01047 ,  H01L2224/29138 ,  H01L2924/01034 ,  H01L2224/32501 ,  H01L2924/00012 ,  H01L2224/32505 ,  H01L2924/00012 ,  H01L2224/8312 ,  H01L2924/00014 ,  H01L2224/1319 ,  H01L2924/07025 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2224/13018 ,  H01L2924/00012

Abstract: A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further includes an electrically conductive alloy mass joined to the first and second conductive elements. First and second materials of the alloy mass each have a melting point lower than a melting point of the alloy. A concentration of the first material varies in concentration from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element.

公开(公告)号：US09819131B2

公开(公告)日：2017-11-14

申请号：US15333228

申请日：2016-10-25

Applicant: CommScope, Inc. of North Carolina

Inventor： Richard A. Schumacher ,  Scott Lynn Michaelis

IPC: H01R24/00 ,  H01R24/64 ,  H01R12/53 ,  H01R13/6466 ,  H01R13/6469 ,  H01R13/66 ,  H01R24/28 ,  H05K1/11 ,  H05K1/02 ,  H01R107/00

CPC classification number: H01R24/64 ,  H01R12/53 ,  H01R13/6466 ,  H01R13/6469 ,  H01R13/665 ,  H01R13/6658 ,  H01R23/005 ,  H01R24/28 ,  H01R2107/00 ,  H01R2201/04 ,  H05K1/0245 ,  H05K1/115 ,  H05K1/117 ,  H05K2201/04 ,  H05K2201/0949 ,  H05K2201/09845 ,  H05K2201/1034 ,  H05K2201/10356 ,  Y10T29/49124

Abstract: Communications plugs are provided which include a printed circuit board having a plurality of elongated conductive traces and a plurality of plug blades. Each plug blade has a first section that extends along a top surface of the printed circuit board and a second section that extends along a front edge of the printed circuit board. Additionally, each plug blade may have a thickness that is at least twice the thickness of the elongated conductive traces. The plug blades may be low profile plug blades that are manufactured separately from the printed circuit board.

公开(公告)号：US09801277B1

公开(公告)日：2017-10-24

申请号：US14455772

申请日：2014-08-08

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Zhen Feng ,  Anwar Mohammed ,  David Geiger ,  Murad Kurwa

IPC: H05K1/14 ,  H05K3/24 ,  H05K1/02 ,  H01R12/52 ,  H05K3/30 ,  H05K3/00

CPC classification number: H05K1/14 ,  H01R12/52 ,  H05K1/0271 ,  H05K3/0085 ,  H05K3/241 ,  H05K3/303 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/4015 ,  H05K2201/04 ,  H05K2201/068 ,  H05K2201/10734 ,  H05K2201/10946 ,  H05K2201/10984 ,  H05K2201/2045 ,  H05K2203/0338 ,  H05K2203/0723

Abstract: A compliant interconnect with a cylindrical bellows structure is configured to reduce a stress between a substrate and a PCB board. The stress can be caused by a CTE (coefficient of thermal expansion) mismatch, a physical movement, or a combination thereof. The compliant interconnect can be solder to and/or immobilized on one or more coupling structure. Alternatively, the compliant interconnect can include an instant swapping structure (such as a socket) that makes the upgrade of the electronic components easier.

公开(公告)号：US20170171976A1

公开(公告)日：2017-06-15

申请号：US15348044

申请日：2016-11-10

Applicant: LG Display Co., Ltd.

Inventor： Jaeseung LEE

IPC: H05K1/14

CPC classification number: H05K1/14 ,  H05K1/0215 ,  H05K1/0298 ,  H05K1/181 ,  H05K2201/04 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2201/10257 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/20 ,  H05K2201/2036 ,  Y02P70/611

Abstract: A printed circuit board and a display device are provided. The printed circuit board includes a plurality of insulation layers; at least one metal layer between the plurality of insulation layers; and a fixing member fixed to a surface of one of the at least one metal layer and passing through an outermost one of insulation layers to protrude to the outside.