公开(公告)号：US20180206360A1

公开(公告)日：2018-07-19

申请号：US15743882

申请日：2016-07-07

Applicant: Stego-Holding GmbH

Inventor： Robert DENT

IPC: H05K7/20 ,  H05K7/14 ,  H05K1/02

CPC classification number: H05K7/2039 ,  H05K1/0201 ,  H05K7/1427 ,  H05K7/20127 ,  H05K7/20436 ,  H05K2201/066

Abstract: A housing for an electrical device wherein at least a first part of a lower outer wall of the housing is recessed in relation to a second part of the lower outer wall of the housing to form a cooling channel on the lower side of the housing, and wherein a heat sink of the electrical device can be arranged in the housing adjoining the cooling channel such that heat emitted by the heat sink can be dissipated by the cooling channel.

公开(公告)号：US20180205392A1

公开(公告)日：2018-07-19

申请号：US15854261

申请日：2017-12-26

Applicant: Intel Corporation

Inventor： Vinodh Gopal ,  James D. Guilford ,  Kirk S. Yap

IPC: H03M7/40

CPC classification number: H03M7/3084 ,  B25J15/0014 ,  B65G1/0492 ,  G02B6/3882 ,  G02B6/3893 ,  G02B6/3897 ,  G02B6/4292 ,  G02B6/4452 ,  G05D23/1921 ,  G05D23/2039 ,  G06F1/183 ,  G06F3/061 ,  G06F3/0611 ,  G06F3/0616 ,  G06F3/0619 ,  G06F3/0625 ,  G06F3/0631 ,  G06F3/0638 ,  G06F3/064 ,  G06F3/0647 ,  G06F3/0653 ,  G06F3/0658 ,  G06F3/0659 ,  G06F3/0664 ,  G06F3/0665 ,  G06F3/067 ,  G06F3/0673 ,  G06F3/0679 ,  G06F3/0683 ,  G06F3/0688 ,  G06F3/0689 ,  G06F8/65 ,  G06F9/4401 ,  G06F9/5016 ,  G06F9/5044 ,  G06F9/505 ,  G06F9/5072 ,  G06F9/5077 ,  G06F11/141 ,  G06F11/3414 ,  G06F12/0862 ,  G06F12/0893 ,  G06F12/10 ,  G06F12/109 ,  G06F12/1408 ,  G06F13/161 ,  G06F13/1668 ,  G06F13/1694 ,  G06F13/4022 ,  G06F13/4068 ,  G06F13/409 ,  G06F13/42 ,  G06F13/4282 ,  G06F15/8061 ,  G06F17/30949 ,  G06F2209/5019 ,  G06F2209/5022 ,  G06F2212/1008 ,  G06F2212/1024 ,  G06F2212/1041 ,  G06F2212/1044 ,  G06F2212/152 ,  G06F2212/202 ,  G06F2212/401 ,  G06F2212/402 ,  G06F2212/7207 ,  G06Q10/06 ,  G06Q10/06314 ,  G06Q10/087 ,  G06Q10/20 ,  G06Q50/04 ,  G07C5/008 ,  G08C17/02 ,  G08C2200/00 ,  G11C5/02 ,  G11C5/06 ,  G11C7/1072 ,  G11C11/56 ,  G11C14/0009 ,  H03M7/30 ,  H03M7/3086 ,  H03M7/40 ,  H03M7/4031 ,  H03M7/4056 ,  H03M7/4081 ,  H03M7/6005 ,  H03M7/6023 ,  H04B10/25 ,  H04B10/2504 ,  H04L9/0643 ,  H04L9/14 ,  H04L9/3247 ,  H04L9/3263 ,  H04L12/2809 ,  H04L29/12009 ,  H04L41/024 ,  H04L41/046 ,  H04L41/0813 ,  H04L41/082 ,  H04L41/0896 ,  H04L41/12 ,  H04L41/145 ,  H04L41/147 ,  H04L41/5019 ,  H04L43/065 ,  H04L43/08 ,  H04L43/0817 ,  H04L43/0876 ,  H04L43/0894 ,  H04L43/16 ,  H04L45/02 ,  H04L45/52 ,  H04L47/24 ,  H04L47/38 ,  H04L47/765 ,  H04L47/782 ,  H04L47/805 ,  H04L47/82 ,  H04L47/823 ,  H04L49/15 ,  H04L49/25 ,  H04L49/357 ,  H04L49/45 ,  H04L49/555 ,  H04L67/02 ,  H04L67/10 ,  H04L67/1004 ,  H04L67/1008 ,  H04L67/1012 ,  H04L67/1014 ,  H04L67/1029 ,  H04L67/1034 ,  H04L67/1097 ,  H04L67/12 ,  H04L67/16 ,  H04L67/306 ,  H04L67/34 ,  H04L69/04 ,  H04L69/329 ,  H04Q1/04 ,  H04Q11/00 ,  H04Q11/0003 ,  H04Q11/0005 ,  H04Q11/0062 ,  H04Q11/0071 ,  H04Q2011/0037 ,  H04Q2011/0041 ,  H04Q2011/0052 ,  H04Q2011/0073 ,  H04Q2011/0079 ,  H04Q2011/0086 ,  H04Q2213/13523 ,  H04Q2213/13527 ,  H04W4/023 ,  H04W4/80 ,  H05K1/0203 ,  H05K1/181 ,  H05K5/0204 ,  H05K7/1418 ,  H05K7/1421 ,  H05K7/1422 ,  H05K7/1447 ,  H05K7/1461 ,  H05K7/1485 ,  H05K7/1487 ,  H05K7/1489 ,  H05K7/1491 ,  H05K7/1492 ,  H05K7/1498 ,  H05K7/2039 ,  H05K7/20709 ,  H05K7/20727 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20836 ,  H05K13/0486 ,  H05K2201/066 ,  H05K2201/10121 ,  H05K2201/10159 ,  H05K2201/10189 ,  Y02D10/14 ,  Y02D10/151 ,  Y02P90/30 ,  Y10S901/01

Abstract: Technologies for performing speculative decompression include a managed node to decode a variable size code at a present position in compressed data with a deterministic decoder and concurrently perform speculative decodes over a range of subsequent positions in the compressed data, determine the position of the next code, determine whether the position of the next code is within the range, and output, in response to a determination that the position of the next code is within the range, a symbol associated with the deterministically decoded code and another symbol associated with a speculatively decoded code at the position of the next code.

公开(公告)号：US20180203490A1

公开(公告)日：2018-07-19

申请号：US15410667

申请日：2017-01-19

Applicant: Intel Corporation

Inventor： HYOUNG IL KIM

IPC: G06F1/20 ,  H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K1/09 ,  H01L23/40 ,  G06F1/18 ,  H05K3/36 ,  H01R12/73 ,  H01R12/72 ,  H01R12/70

CPC classification number: G06F1/20 ,  G06F1/184 ,  H01L23/4006 ,  H01L2023/4031 ,  H01L2023/405 ,  H01L2023/4087 ,  H01R12/7005 ,  H01R12/7076 ,  H01R12/721 ,  H01R12/73 ,  H05K1/0204 ,  H05K1/092 ,  H05K1/111 ,  H05K1/117 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/066 ,  H05K2201/10159 ,  H05K2201/10325 ,  H05K2201/10409

Abstract: Microelectronic device assembly including a component attached to substrate by at least a screw. The screw applies compressive force against a pad of a thermally and electrically conductive material having sufficiently low modulus to mitigate stress in addition to providing a thermal and electrical path between the component and the substrate. In some embodiments, the screw affixes a printed circuit board hosting one or more integrated circuit components to a motherboard, or passive heat sink. The pad may be deformed to assuage stress applied through the screw during assembly of the device and/or as the device experiences thermal cycling, for example associated with intermittent operation.

公开(公告)号：US20180177038A1

公开(公告)日：2018-06-21

申请号：US15577866

申请日：2016-12-08

Applicant: LG Chem, Ltd.

Inventor： Seung Kyu YOON ,  Jun Young BANG

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0203 ,  H02J7/0068 ,  H02J7/02 ,  H02J7/04 ,  H05K1/0209 ,  H05K1/0265 ,  H05K1/11 ,  H05K1/181 ,  H05K3/24 ,  H05K7/20 ,  H05K2201/066 ,  H05K2201/10166

Abstract: The present invention presents a printed circuit board heat dissipation system using a highly conductive heat dissipation pad, the heat dissipation system comprising: one or more electronic components mounted on a printed circuit board; the printed circuit board having formed thereon a conductive pattern providing current paths between the mounted one or more electronic components; and a highly conductive heat dissipation pad discharging heat generated due to the current flowing in the conductive pattern of the printed circuit board.

公开(公告)号：US09992912B1

公开(公告)日：2018-06-05

申请号：US15414564

申请日：2017-01-24

Applicant: Chun-Chieh Wang

Inventor： Chun-Chieh Wang

IPC: H01L23/40 ,  H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20409 ,  H01L23/367 ,  H01L23/4093 ,  H01L2023/4068 ,  H05K1/0203 ,  H05K2201/066 ,  H05K2201/10393

Abstract: The present invention provides a heat dissipating device combined structure, which consists of a heat sink and a clasp member. At least one expanded portion extends from the heat sink, and a side extends from each of the two sides of a base of the clasp member to form a conduit. The heat sink and a circuit board are disposed inside the conduit, and at least one ledge portion is formed on the sides. Moreover, a slanting portion extends from and is provided on air foils configured on the sides, and the ends of the slanting portions respectively clasp the expanded portions. Accordingly, the circuit board is mounted on the ledge portions, and electronic components on the circuit board are attached to the bottom portion of the aforementioned heat sink.

公开(公告)号：US20180151094A1

公开(公告)日：2018-05-31

申请号：US15880295

申请日：2018-01-25

Applicant: Ultravision Technologies, LLC

Inventor： William Y. Hall

IPC: G09F13/22 ,  H05K5/00 ,  G06F3/14 ,  F21V31/00 ,  H05K5/02 ,  G06F1/16 ,  G06F1/18 ,  G06F1/20 ,  G06F1/26 ,  H05K1/18 ,  F21K9/20 ,  H01B11/02 ,  H01B9/00 ,  H01B7/282 ,  H05K7/20 ,  G09G5/14 ,  H05K7/14 ,  H05K5/03 ,  G09F9/302 ,  G06F3/147 ,  F21V23/02 ,  F21Y115/10 ,  F21Y101/00 ,  G09G3/32 ,  H04N7/00

CPC classification number: G09F13/22 ,  F21K9/20 ,  F21K9/90 ,  F21V23/023 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2115/10 ,  G06F1/1601 ,  G06F1/182 ,  G06F1/183 ,  G06F1/188 ,  G06F1/189 ,  G06F1/20 ,  G06F1/26 ,  G06F3/1446 ,  G06F3/147 ,  G09F9/3023 ,  G09F2013/222 ,  G09G3/006 ,  G09G3/32 ,  G09G5/14 ,  G09G2300/026 ,  G09G2320/029 ,  G09G2330/02 ,  G09G2330/045 ,  G09G2330/10 ,  G09G2360/04 ,  H01B7/2825 ,  H01B9/003 ,  H01B11/02 ,  H04N7/00 ,  H05K1/181 ,  H05K3/32 ,  H05K5/0017 ,  H05K5/0247 ,  H05K5/0256 ,  H05K5/03 ,  H05K5/06 ,  H05K7/1422 ,  H05K7/1427 ,  H05K7/20 ,  H05K7/20127 ,  H05K7/20136 ,  H05K7/2039 ,  H05K7/20954 ,  H05K7/20963 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10128 ,  Y02P70/611

Abstract: Embodiments of the present invention relate to integrated modular display panels. In one embodiment, modular display panel includes a a shell with a first thermally conductive material, a printed circuit board disposed in the shell, and a plurality of LEDs attached to a first side of the printed circuit board. A driver circuit is disposed in the shell and coupled to the plurality of LEDs from a second side of the printed circuit board. The panel further includes a power supply unit for powering the LEDs. The printed circuit board are disposed between the power supply unit and the plurality of LEDs. A second thermally conductive material is disposed between the power supply unit and an outer back side of the panel. A protective structure is disposed over the first side of the printed circuit board, where a display side of the panel, opposite the outer back side, is waterproof.

公开(公告)号：US20180130388A1

公开(公告)日：2018-05-10

申请号：US15866294

申请日：2018-01-09

Applicant: Ultravision Technologies, LLC

Inventor： William Y. Hall

IPC: G09F13/22 ,  H05K5/00 ,  G06F3/14 ,  F21V31/00 ,  H05K5/02 ,  G06F1/16 ,  G06F1/18 ,  G06F1/20 ,  G06F1/26 ,  H05K1/18 ,  H01B11/02 ,  H01B9/00 ,  H01B7/282 ,  H05K7/20 ,  G09G5/14 ,  H05K7/14 ,  H05K5/03 ,  G09F9/302 ,  G06F3/147 ,  F21V23/02 ,  F21Y101/00 ,  G09G3/32 ,  H04N7/00

CPC classification number: G09F13/22 ,  F21K9/20 ,  F21K9/90 ,  F21V23/023 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2115/10 ,  G06F1/1601 ,  G06F1/182 ,  G06F1/183 ,  G06F1/188 ,  G06F1/189 ,  G06F1/20 ,  G06F1/26 ,  G06F3/1446 ,  G06F3/147 ,  G09F9/3023 ,  G09F2013/222 ,  G09G3/006 ,  G09G3/32 ,  G09G5/14 ,  G09G2300/026 ,  G09G2320/029 ,  G09G2330/02 ,  G09G2330/045 ,  G09G2330/10 ,  G09G2360/04 ,  H01B7/2825 ,  H01B9/003 ,  H01B11/02 ,  H04N7/00 ,  H05K1/181 ,  H05K3/32 ,  H05K5/0017 ,  H05K5/0247 ,  H05K5/0256 ,  H05K5/03 ,  H05K5/06 ,  H05K7/1422 ,  H05K7/1427 ,  H05K7/20 ,  H05K7/20127 ,  H05K7/20136 ,  H05K7/2039 ,  H05K7/20954 ,  H05K7/20963 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10128 ,  Y02P70/611

Abstract: Embodiments of the present invention relate to integrated modular display panels. In one embodiment, modular display panel includes a a shell with a first thermally conductive material, a printed circuit board disposed in the shell, and a plurality of LEDs attached to a first side of the printed circuit board. A driver circuit is disposed in the shell and coupled to the plurality of LEDs from a second side of the printed circuit board. The panel further includes a power supply unit for powering the LEDs. The printed circuit board are disposed between the power supply unit and the plurality of LEDs. A second thermally conductive material is disposed between the power supply unit and an outer back side of the panel. A protective structure is disposed over the first side of the printed circuit board, where a display side of the panel, opposite the outer back side, is waterproof.

公开(公告)号：US20180103536A1

公开(公告)日：2018-04-12

申请号：US15289426

申请日：2016-10-10

Applicant: Nidec Motor Corporation

Inventor： William Pickering ,  Bruce A. Nielsen

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/498 ,  H05K1/18 ,  H05K5/00 ,  H01L25/07 ,  H05K1/03 ,  H01M10/42

CPC classification number: H05K1/0206 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/4006 ,  H01L23/49827 ,  H01L23/49844 ,  H01L25/072 ,  H01M10/425 ,  H05K1/0209 ,  H05K1/0263 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/181 ,  H05K5/0008 ,  H05K5/0026 ,  H05K7/1432 ,  H05K7/20963 ,  H05K2201/0162 ,  H05K2201/066 ,  H05K2201/09036 ,  H05K2201/10037 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2201/10272 ,  H05K2201/10295

Abstract: An electrical device configuration enables heat to be dissipated from a multi-layer printed circuit board (PCB) while handling electrical currents in excess of 200 amps. The semiconductor devices that convert input DC current to output AC current are mounted to a side of the PCB that is opposite the side of the PCB that receives the input DC current. A base plate that acts as a heat sink includes recessed areas to receive the semiconductor devices and enable the PCB to be positioned close to the base plate. Thermal vias are provided in the PCB to conductive heat from the semiconductor devices to the side of the PCB that receives the input current. Also, the busbars for receiving the input current are positioned to provide short resistive paths to the current to reduce the generation of heat by the current flowing in the PCB.

公开(公告)号：US09942975B2

公开(公告)日：2018-04-10

申请号：US14875222

申请日：2015-10-05

Applicant: Raytheon Company

Inventor： James M. Elliott ,  James S. Wilson ,  David E. Swernofsky

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/14

CPC classification number: H05K1/0204 ,  H05K1/0209 ,  H05K1/142 ,  H05K3/301 ,  H05K2201/066 ,  H05K2201/10242

Abstract: An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.

公开(公告)号：US20180097273A1

公开(公告)日：2018-04-05

申请号：US15566762

申请日：2015-09-17

Applicant: THOMSON Licensing

Inventor： William H BOSE ,  Mickey J HUNT

IPC: H01Q1/12 ,  H01Q1/38 ,  H01Q1/52 ,  H01Q21/28

CPC classification number: H01Q1/1214 ,  H01Q1/007 ,  H01Q1/1207 ,  H01Q1/22 ,  H01Q1/2291 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q1/528 ,  H01Q21/205 ,  H01Q21/28 ,  H05K1/0209 ,  H05K1/141 ,  H05K3/366 ,  H05K5/0247 ,  H05K2201/066

Abstract: A method for manufacturing an electronic device including configuring one or more circuit boards with a plurality of antennas connected to at least one circuit board having wire securing slots. The electronic device having vertical orientation and an outer casing including a case bottom piece, a case top front piece, and a case top back piece. Features include providing staging slots in the case top back piece holding the board at an angle with respect to the interior surface of the case top back piece to permit connections to the circuit board which includes connecting antenna wires to connectors on the circuit board having antenna wires secured in wire securing slots prior to connecting to antenna connectors. The circuit board attached to only one side wall of one of the case front top piece or the case top back piece.