PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
    32.
    发明申请
    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 有权
    印刷线路板和制造印刷线路板的方法

    公开(公告)号:US20150163901A1

    公开(公告)日:2015-06-11

    申请号:US14564126

    申请日:2014-12-09

    Abstract: A printed wiring board includes resin insulation layers, conductive layers formed on the resin insulation layers respectively such that each of the conductive layers is formed on a surface of each of the resin insulation layers, and via conductors penetrating through the resin insulation layers respectively such that the via conductors are connecting the conductive layers through the resin insulation layers. The conductive layers and the via conductors are formed such that each of the conductive layers and each of the via conductors includes an electroless copper-plated film, an intermediate compound layer having Cu3N+Cu(NH)x and formed on the electroless copper-plated film, and an electrolytic copper-plated film formed on the intermediate compound layer.

    Abstract translation: 印刷布线板包括树脂绝缘层,分别形成在树脂绝缘层上的导电层,使得每个导电层形成在每个树脂绝缘层的表面上,以及通孔导体分别贯穿树脂绝缘层,使得 通孔导体通过树脂绝缘层连接导电层。 导电层和通孔导体形成为使得导电层和每个通路导体中的每一个包括无电镀铜膜,具有Cu 3 N + Cu(NH)x的中间化合物层并形成在无电镀铜 膜和在中间化合物层上形成的电解铜电镀膜。

    SUBSTRATE FOR MOUNTING ELEMENT AND PROCESS FOR ITS PRODUCTION
    36.
    发明申请
    SUBSTRATE FOR MOUNTING ELEMENT AND PROCESS FOR ITS PRODUCTION 有权
    安装元件的基材及其生产工艺

    公开(公告)号:US20140201993A1

    公开(公告)日:2014-07-24

    申请号:US14219583

    申请日:2014-03-19

    Abstract: To provide a substrate for mounting element having sulfurization resistance improved by increasing planarity of the surface of a thick conductor layer.The substrate 10 for mounting element of the present invention has such a structure that on a surface of a LTCC substrate or ceramics substrate as an inorganic insulating substrate 1, a thick conductor layer 2 is formed as an element connection terminal. The thick conductor layer 2 is made of a metal composed mainly of silver (Ag) or copper (Cu) and formed by printing and firing a metal paste. This thick conductor layer has its surface planarized by wet blast treatment to a surface roughness Ra of at most 0.02 μm. A Ni/Au-plated layer 3 is formed on the thick conductor layer 2, so that the surface of the thick conductor layer 2 is completely covered without any space.

    Abstract translation: 为了提供通过增加厚导体层的表面的平坦度而提高耐硫化性的安装元件的基板。 本发明的安装元件用基板10具有如下的结构:在作为无机绝缘基板1的LTCC基板或陶瓷基板的表面上形成作为元件连接端子的厚导体层2。 厚导体层2由主要由银(Ag)或铜(Cu)组成的金属制成,并通过印刷和烧制金属膏形成。 该厚导体层的表面通过湿喷处理而平坦化,表面粗糙度Ra为0.02μm以下。 在厚导体层2上形成Ni / Au镀层3,使得厚导体层2的表面被完全覆盖而没有任何空间。

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