公开(公告)号：US20150173210A1

公开(公告)日：2015-06-18

申请号：US14634269

申请日：2015-02-27

Applicant: Super Talent Technology, Corp.

Inventor： Jim Chin-Nan Ni ,  Nan Nan ,  Abraham C. Ma

IPC: H05K3/34 ,  H05K3/40

CPC classification number: H05K3/3484 ,  G06F1/1632 ,  H01L23/3121 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01R12/57 ,  H01R12/71 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/326 ,  H05K3/361 ,  H05K3/4007 ,  H05K3/4046 ,  H05K5/0278 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2203/1316 ,  Y10T29/49128 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A dual-personality extended USB (EUSB) system supports both USB and EUSB devices using an extended 9-pin EUSB socket. Each EUSB device includes a PCBA having four standard USB metal contact pads, and several extended purpose contact springs disposed on an upper side of a PCB. A single-shot molding process is used to form a molded housing over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs. The EUSB device is optionally used as a modular insert that is mounted onto a metal or plastic case to provide a EUSB assembly having a plug shell similar to a standard USB male connector.

Abstract translation: 双重个性扩展USB（EUSB）系统使用扩展的9针EUSB插座支持USB和EUSB设备。 每个EUSB设备包括具有四个标准USB金属接触焊盘的PCBA和设置在PCB上侧的多个扩展用途接触弹簧。 单次注射成型工艺用于在被动元件和设置在下PCB表面上的IC管芯之间形成模制外壳。 使用SMT方法安装无源部件，并使用COB方法安装IC管芯。 扩展的9针EUSB插座包括通过标准USB金属触点和接触弹簧与PCBA通信的标准USB触点和扩展使用触点。 EUSB设备可选地用作安装在金属或塑料外壳上的模块化插件，以提供具有类似于标准USB公连接器的插头外壳的EUSB组件。

公开(公告)号：US20150163901A1

公开(公告)日：2015-06-11

申请号：US14564126

申请日：2014-12-09

Applicant: IBIDEN Co., Ltd.

Inventor： Hiroyuki NISHIOKA ,  Shinsuke ISHIKAWA

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/00 ,  H05K1/03

CPC classification number: H05K3/4644 ,  H01L21/4846 ,  H01L23/145 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/12042 ,  H05K2201/09472 ,  H05K2201/09563 ,  H05K2203/095 ,  H01L2924/00

Abstract: A printed wiring board includes resin insulation layers, conductive layers formed on the resin insulation layers respectively such that each of the conductive layers is formed on a surface of each of the resin insulation layers, and via conductors penetrating through the resin insulation layers respectively such that the via conductors are connecting the conductive layers through the resin insulation layers. The conductive layers and the via conductors are formed such that each of the conductive layers and each of the via conductors includes an electroless copper-plated film, an intermediate compound layer having Cu3N+Cu(NH)x and formed on the electroless copper-plated film, and an electrolytic copper-plated film formed on the intermediate compound layer.

Abstract translation: 印刷布线板包括树脂绝缘层，分别形成在树脂绝缘层上的导电层，使得每个导电层形成在每个树脂绝缘层的表面上，以及通孔导体分别贯穿树脂绝缘层，使得 通孔导体通过树脂绝缘层连接导电层。 导电层和通孔导体形成为使得导电层和每个通路导体中的每一个包括无电镀铜膜，具有Cu 3 N + Cu（NH）x的中间化合物层并形成在无电镀铜 膜和在中间化合物层上形成的电解铜电镀膜。

公开(公告)号：US09021690B2

公开(公告)日：2015-05-05

申请号：US13137756

申请日：2011-09-09

Applicant: Myung Sam Kang

Inventor： Myung Sam Kang

IPC: H01R9/00 ,  H05K1/11 ,  H05K3/20 ,  H05K3/34 ,  H05K3/28

CPC classification number: H05K1/111 ,  H01L2924/0002 ,  H05K3/205 ,  H05K3/28 ,  H05K3/3473 ,  H05K2201/0376 ,  H05K2201/09472 ,  H05K2201/09736 ,  Y02P70/611 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00

Abstract: A method of manufacturing a printed circuit board having a buried solder bump, including: preparing a carrier on which a circuit layer, a solder bump, and a circuit pattern formed on the solder bump are formed; pressing the carrier into an insulating layer so that the circuit layer, the solder bump and the circuit pattern are buried in the insulating layer; and removing the carrier.

Abstract translation: 一种制造具有埋置焊料凸块的印刷电路板的方法，包括：制备其上形成有电路层，焊料凸块和形成在焊料凸块上的电路图案的载体; 将载体压入绝缘层，使得电路层，焊料凸块和电路图案埋在绝缘层中; 并移除载体。

公开(公告)号：US20150101852A1

公开(公告)日：2015-04-16

申请号：US14499184

申请日：2014-09-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Tae PARK ,  Ho Shik Kang

IPC: H05K1/11 ,  H05K3/04 ,  H05K1/09

CPC classification number: H05K1/115 ,  H05K3/0097 ,  H05K3/108 ,  H05K3/426 ,  H05K3/428 ,  H05K3/465 ,  H05K2201/0347 ,  H05K2201/09472 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2203/1536 ,  Y10T29/49165

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same.The printed circuit board according to a preferred embodiment of the present invention may include: an insulating layer; a first via depressed from one surface of the insulating layer; a second via depressed from the other surface of the insulating layer; and a circuit pattern formed in the insulating layer and bonded to the first and second vias.

Abstract translation: 这里公开了一种印刷电路板及其制造方法。 根据本发明的优选实施例的印刷电路板可以包括：绝缘层; 从所述绝缘层的一个表面凹陷的第一通孔; 从所述绝缘层的另一表面压下的第二通孔; 以及形成在绝缘层中并结合到第一和第二通孔的电路图案。

公开(公告)号：US20150014027A1

公开(公告)日：2015-01-15

申请号：US14329062

申请日：2014-07-11

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kentaro Kaneko ,  Kazuhiro Kobayashi ,  Toshimitsu Omiya ,  Kotaro Kodani ,  Shunichiro Matsumoto ,  Ruofan Tang

IPC: H05K1/11 ,  H05K1/03

CPC classification number: H05K1/113 ,  H05K3/244 ,  H05K3/3452 ,  H05K3/383 ,  H05K3/4682 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2201/2072 ,  H05K2203/0152 ,  H05K2203/0307 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/1184 ,  H05K2203/308

Abstract: A wiring substrate includes an insulating layer, a pad, and a solder resist layer. The insulating layer has a first surface formed with a first recess portion. The pad is embedded in the first recess portion. The pad includes a second surface and a third surface. The third surface that is located at a lower position than the first surface so as to expose an inner wall surface of the first recess portion. The pad is formed with a second recess portion in a center portion of the third surface. The solder resist layer is provided on the first surface. An adjacent portion of the first surface to a peripheral portion of the first recess portion is smaller in roughness than a region of the first surface peripheral to the adjacent portion of the first surface.

Abstract translation: 布线基板包括绝缘层，焊盘和阻焊层。 绝缘层具有形成有第一凹部的第一表面。 衬垫嵌入第一凹部。 垫包括第二表面和第三表面。 所述第三表面位于比所述第一表面更低的位置处，以暴露所述第一凹部的内壁表面。 垫在第三表面的中心部分形成有第二凹部。 阻焊层设置在第一表面上。 所述第一表面与所述第一凹部的周边部分的相邻部分的粗糙度小于所述第一表面的相邻部分的周边的第一表面的区域。

公开(公告)号：US20140201993A1

公开(公告)日：2014-07-24

申请号：US14219583

申请日：2014-03-19

Applicant: Asahi Glass Company, Limited

Inventor： Katsuyoshi NAKAYAMA

IPC: H05K3/30

CPC classification number: H05K3/30 ,  B24C3/322 ,  B24C7/0007 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49827 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2201/09472 ,  Y10T29/49155 ,  H01L2924/00

Abstract: To provide a substrate for mounting element having sulfurization resistance improved by increasing planarity of the surface of a thick conductor layer.The substrate 10 for mounting element of the present invention has such a structure that on a surface of a LTCC substrate or ceramics substrate as an inorganic insulating substrate 1, a thick conductor layer 2 is formed as an element connection terminal. The thick conductor layer 2 is made of a metal composed mainly of silver (Ag) or copper (Cu) and formed by printing and firing a metal paste. This thick conductor layer has its surface planarized by wet blast treatment to a surface roughness Ra of at most 0.02 μm. A Ni/Au-plated layer 3 is formed on the thick conductor layer 2, so that the surface of the thick conductor layer 2 is completely covered without any space.

Abstract translation: 为了提供通过增加厚导体层的表面的平坦度而提高耐硫化性的安装元件的基板。 本发明的安装元件用基板10具有如下的结构：在作为无机绝缘基板1的LTCC基板或陶瓷基板的表面上形成作为元件连接端子的厚导体层2。 厚导体层2由主要由银（Ag）或铜（Cu）组成的金属制成，并通过印刷和烧制金属膏形成。 该厚导体层的表面通过湿喷处理而平坦化，表面粗糙度Ra为0.02μm以下。 在厚导体层2上形成Ni / Au镀层3，使得厚导体层2的表面被完全覆盖而没有任何空间。

公开(公告)号：US08759148B2

公开(公告)日：2014-06-24

申请号：US13836706

申请日：2013-03-15

Applicant: Panasonic Corporation

Inventor： Shingo Yoshioka ,  Hiroaki Fujiwara

IPC: H01L21/00

CPC classification number: H05K1/11 ,  G11B5/486 ,  H01L21/565 ,  H01L22/12 ,  H01L23/3121 ,  H01L24/03 ,  H01L24/05 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24051 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/25175 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73267 ,  H01L2224/82009 ,  H01L2224/82039 ,  H01L2224/82101 ,  H01L2224/82931 ,  H01L2224/82947 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/92244 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/184 ,  H05K2201/0376 ,  H05K2201/09472 ,  Y02P70/611 ,  Y10T428/1171 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of mounting a semiconductor chip includes: forming a resin coating on a surface of a path connecting a bonding pad on a surface of a semiconductor chip and an electrode pad formed on a surface of an insulating base material; forming, by laser beam machining, a wiring gutter having a depth that is equal to or greater than a thickness of the resin coating along the path for connecting the bonding pad and the electrode pad; depositing a plating catalyst on a surface of the wiring gutter; removing the resin coating; and forming an electroless plating coating only at a site where the plating catalyst remains.

Abstract translation: 安装半导体芯片的方法包括：在连接半导体芯片的表面上的接合焊盘和形成在绝缘基材的表面上的电极焊盘的路径的表面上形成树脂涂层; 通过激光束加工形成具有等于或大于沿着用于连接焊盘和电极焊盘的路径的树脂涂层的厚度的深度的布线槽; 在布线槽的表面上沉积电镀催化剂; 去除树脂涂层; 并且仅在电镀催化剂保留的部位形成化学镀层。

公开(公告)号：US20140124474A1

公开(公告)日：2014-05-08

申请号：US14070291

申请日：2013-11-01

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Kwang Sun You ,  Seung Ryeol Lee ,  Sang Hoon Park ,  Kyung Jin Heo ,  Jae Ho Shin ,  Joong Hyuk Jung

IPC: H05K3/00

CPC classification number: H05K3/007 ,  H05K3/0032 ,  H05K3/4007 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/09472 ,  H05K2203/061 ,  H05K2203/308

Abstract: Disclosed herein is a method for manufacturing a printed circuit board, wherein a protective film for stripping and a metal layer closely adhered to the protective film for stripping are formed on an inner layer pad to protect the inner layer pad at the time of laser processing related to cavity processing and applying an etchant, thereby making it possible to improve reliability of a product.

Abstract translation: 本发明公开了一种制造印刷电路板的方法，其中在内层衬垫上形成用于剥离的保护膜和紧密附着在剥离用保护膜上的金属层，以在激光加工时保护内层衬垫 对腔体加工和施加蚀刻剂，从而可以提高产品的可靠性。

公开(公告)号：US20140097865A1

公开(公告)日：2014-04-10

申请号：US14104315

申请日：2013-12-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Guk Han ,  Seok-Joon Moon

IPC: G01R31/28 ,  H01L21/66 ,  H01L23/00

CPC classification number: H01L25/0657 ,  G01R31/2808 ,  G01R31/2818 ,  G11C5/02 ,  G11C5/025 ,  G11C5/06 ,  G11C29/04 ,  G11C29/12 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602 ,  H01L22/30 ,  H01L22/32 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/538 ,  H01L24/09 ,  H01L24/48 ,  H01L24/49 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0912 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4912 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/181 ,  H05K1/0268 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/002 ,  H05K3/245 ,  H05K3/28 ,  H05K3/288 ,  H05K3/323 ,  H05K2201/0187 ,  H05K2201/035 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/099 ,  H05K2201/10159 ,  H05K2203/162 ,  Y10T29/49117 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

Abstract translation: 提供具有印刷电路板的电子设备。 在一个实施例中，印刷电路板包括要与外部装置耦合的多个外部焊盘和用于测试电路的多个旁路焊盘。 外部焊盘被暴露，并且多个旁路焊盘中的至少一个不暴露于PCB的外表面。 还提供了使用电子设备的系统和测试电子设备的方法。

公开(公告)号：USRE44251E1

公开(公告)日：2013-06-04

申请号：US10839813

申请日：2004-05-06

Applicant: Motoo Asai ,  Yoichiro Kawamura ,  Yoji Mori

Inventor： Motoo Asai ,  Yoichiro Kawamura ,  Yoji Mori

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H01L23/49833 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5384 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01R12/523 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/114 ,  H05K3/184 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/0212 ,  H05K2201/09227 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09727 ,  H05K2201/10674 ,  H05K2201/10734

Abstract: A board for mounting electronic circuit parts includes a first connection terminal group including a plurality of connection terminals densely formed on the top surface of a substrate having through holes formed therein, and a second connection terminal group including a plurality of connection terminals formed at at least the peripheral portion of a back surface of the substrate. The first connection terminal group is connected to the second connection terminal group by way of the through holes. A build-up multilayer interconnection layer having via holes is formed on the top surface of the substrate, so that the first connection terminal group is connected to the second connection terminal group through the build-up multilayer interconnection layer and the through holes. According to another aspect, each signal line on the top surface of the build-up multilayer interconnection layer comprises a plurality of wiring patterns having different widths and a taper-shaped pattern that connects those wiring patterns together and whose width continuously changes. Each signal line has a smaller width at an area having a relatively high wiring density than at an area having a relatively low wiring density.