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    Thermally matched electronic components
    34.
    发明授权
    Thermally matched electronic components 失效
    热电偶配件

    公开(公告)号：US5506754A

    公开(公告)日：1996-04-09

    申请号：US267535

    申请日：1994-06-29

    Applicant: Mark Brooks ,  Gary Seibel

    Inventor： Mark Brooks ,  Gary Seibel

    IPC: H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H05K7/20

    CPC classification number: H05K3/368 ,  H05K1/141 ,  H05K3/3442 ,  H05K1/023 ,  H05K2201/068 ,  H05K2201/09181 ,  H05K2201/09572 ,  H05K2201/10022 ,  H05K2201/10045 ,  H05K2201/10636 ,  H05K2201/10984 ,  H05K2201/10992 ,  H05K3/28 ,  Y02P70/611 ,  Y02P70/613

    Abstract: Discrete circuit devices constructed on a component substrate thermally matched to the supporting substrate of a higher level circuit assembly. Upon securing each component to the supporting substrate of a higher level circuit assembly, a connection subject to reduced thermal stress is obtained. In the construction of an exemplary surface mount, hybrid component containing resistors and capacitors, a component substrate of a polyimide impregnated material is populated with a repeating matrix of chip capacitors and chip resistors, which are adhesively bound and soldered to selected termination pads containing high temperature solder filled through vias. The substrate is epoxy encapsulated and then diced at selected ones of the through vias into multiple components. Each thermally matched component is resoldered at the separated vias to obtain surface mount terminations. Portions of the vias may be exposed through the component sidewall to permit circuit test. Other, exemplary thermally matched components, constructed of multi-layer resin or ceramic substrates are also disclosed and wherein external termination pads are concentrated to the center of the component. Alternative, thermally matched transmission lines and resistor network circuits are also disclosed.

    Abstract translation: 构造在与上层电路组件的支撑衬底热匹配的部件衬底上的分立电路器件。 在将每个部件固定到较高级别的电路组件的支撑基板上时，获得了受热应力降低的连接。 在示例性表面安装的构造中，包含电阻器和电容器的混合元件，聚酰亚胺浸渍材料的部件衬底填充有片状电容器和片状电阻器的重复矩阵，其被粘合地结合并焊接到包含高温的选定的端接焊盘 焊料填充通孔。 衬底被环氧树脂封装，然后在选择的通孔中切成多个成分。 每个热匹配组件在分离的通孔处被转化，以获得表面贴装终端。 通孔的一部分可以通过部件侧壁暴露以允许电路测试。 还公开了由多层树脂或陶瓷基板构成的其它示例性热匹配部件，并且其中外部端接焊盘被集中到部件的中心。 还公开了替代的热匹配传输线路和电阻器网络电路。

    Method for filling plated through holes
    35.
    发明授权
    Method for filling plated through holes 失效
    填充电镀通孔的方法

    公开(公告)号：US5435480A

    公开(公告)日：1995-07-25

    申请号：US172064

    申请日：1993-12-23

    Applicant: Paul J. Hart ,  Kishor V. Desai ,  Edward Vytlacil ,  Ajit K. Trivedi

    Inventor： Paul J. Hart ,  Kishor V. Desai ,  Edward Vytlacil ,  Ajit K. Trivedi

    IPC: H05K3/34 ,  H05K3/40

    CPC classification number: H05K3/3484 ,  H05K3/3478 ,  H05K2201/09572 ,  H05K2203/0191 ,  H05K2203/041 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/0568 ,  Y10T29/49126

    Abstract: Plated thru holes in a printed circuit card or board are filled with solder to provide as void free as possible solder fill. According to one method, an adhesive film is provided on the bottom side of a circuit card or board containing plated thru holes. A plurality of solder balls are then provided within at least one thru hole of the card or board. The total volume of the solder balls is greater than the volume of the plated thru hole. The solder balls are reflowed to thereby fill the plated thru hole with solder and provide solder on top of the thru hole.According to another method, a solder ball is provided above and in contact with a plated thru hole. The volume of the solder ball is greater than the volume of the plated thru hole. The solder ball is reflowed to thereby fill the plated thru hole with solder, and to provide solder both above and below the plated thru hole.

    Abstract translation: 印刷电路板或电路板上的通孔穿过焊料，以提供尽可能无铅的焊料填充。 根据一种方法，在包含电镀通孔的电路卡或板的底侧上设置粘合膜。 然后在卡或板的至少一个通孔内提供多个焊球。 焊球的总体积大于电镀通孔的体积。 焊球回流，由此用焊料填充电镀通孔，并在通孔的顶部提供焊料。 根据另一种方法，在电镀通孔上方并与电镀通孔相接触地设置焊球。 焊球的体积大于电镀通孔的体积。 将焊球回流，由此用焊料填充电镀通孔，并在电镀通孔上方和下方提供焊料。

    Printed circuit board/chassis grounding apparatus and methods
    36.
    发明授权
    Printed circuit board/chassis grounding apparatus and methods 失效
    印刷电路板/底盘接地装置及方法

    公开(公告)号：US5420378A

    公开(公告)日：1995-05-30

    申请号：US274872

    申请日：1994-07-14

    Applicant: H. Scott Estes ,  Michael Ohlinger ,  N. Deepak Swamy

    Inventor： H. Scott Estes ,  Michael Ohlinger ,  N. Deepak Swamy

    IPC: H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/42 ,  H05K9/00 ,  H05K1/18 ,  H05K7/04

    CPC classification number: H05K9/0039 ,  H05K1/0215 ,  H05K1/115 ,  H05K3/3452 ,  H05K2201/09572 ,  H05K2201/0979 ,  H05K2201/099 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K3/325 ,  H05K3/429

    Abstract: To facilitate a grounding connection between a circuit board and a chassis upon which it is to be mounted, a spaced series of unlined mounting holes are formed through the substrate portion of the circuit board between its top and bottom sides, and spaced series of grounding vias are formed through the substrate and positioned in a circular arrays around each of the mounting holes. Annular layers of a metallic plating material are formed on the opposite sides of the circuit board substrate, around the top and bottom ends of the unlined mounting holes, with the plating material being extended along the interior side surfaces of the vias between associated top and bottom annular plating material layers. Using solder masks placed on the opposite sides of the circuit board substrate, circular arrays of solder pads are formed on the outer side surfaces of the annular plating layers, with each solder pad array being interdigitated with the vias in one of the circular arrays thereof, and being horizontally offset from the vias. The bottom side of the circuit board is secured against a side of the chassis by extending metal mounting screws through the unlined mounting holes of the circuit board and threading the screws into corresponding holes in the chassis to press the bottom side solder pads of the circuit board against the chassis.

    Abstract translation: 为了便于电路板与要安装在其上的底盘之间的接地连接，在其顶侧和底侧之间通过电路板的基板部分形成间隔的一系列无内衬的安装孔，并且间隔开的一系列接地通孔 通过基板形成并围绕每个安装孔定位成圆形阵列。 在电路板基板的相对侧上，围绕无衬里的安装孔的顶端和底端形成金属电镀材料的环形层，电镀材料沿相连的顶部和底部之间的通孔的内侧表面延伸 环形电镀层。 使用放置在电路板基板的相对侧上的焊接掩模，在环形镀层的外侧表面上形成圆形阵列的焊盘，每个焊盘阵列与其中一个圆形阵列中的通孔相互交错， 并且与通孔水平地偏移。 通过将金属安装螺钉穿过电路板的无衬里安装孔，将电路板的底部固定在机箱的一侧，并将螺丝拧入机箱中相应的孔，以将电路板的底面焊盘 对着底盘。

    Electronic package
    37.
    发明授权
    Electronic package 失效
    电子包装

    公开(公告)号：US5337219A

    公开(公告)日：1994-08-09

    申请号：US719425

    申请日：1991-06-24

    Applicant: Dennis C. Carr ,  Edward P. McLeskey ,  Frank H. Sarnacki

    Inventor： Dennis C. Carr ,  Edward P. McLeskey ,  Frank H. Sarnacki

    IPC: H01L23/538 ,  H05K3/00 ,  H05K3/22 ,  H05K3/42 ,  H05K1/11

    CPC classification number: H01L23/5385 ,  H05K3/225 ,  H01L2224/16225 ,  H01L2924/10253 ,  H01L2924/15312 ,  H01L2924/19107 ,  H05K2201/09572 ,  H05K2201/10287 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2203/0455 ,  H05K2203/175 ,  H05K3/0047 ,  H05K3/42

    Abstract: A method for altering an electrical connection in an electronic package including one or more semiconductor chips overlying, i.e., mounted directly onto, or mounted onto one or more modules which are mounted onto, a substrate such as a printed circuit card or printed circuit board, as well as the resulting electronic package, is disclosed. In accordance with a preferred embodiment of the inventive method, at least one plated, solder-filled hole in the substrate is drilled out to eliminate an unwanted electrical connection. A solder region, e.g., a solder ball, is inserted into the drilled out hole into contact with an electrically conductive member, e.g., an electrically conductive pin, extending from, for example, a module into the hole. A cylinder, including a central core of electrically conductive material, encircled by an annulus of electrically insulating material, is inserted into the hole. The solder region is then reflowed to form an electrical and metallurgical bond between the module member and the central core. A new electrical connection is completed by extending a wire bond from the bottom of the central core to the bottom of the central core in another such hole or to the bottom of a solder-filled hole.

    Abstract translation: 一种用于改变包括一个或多个半导体芯片的电子连接的方法，所述半导体芯片重叠，即直接安装在或安装在安装到诸如印刷电路板或印刷电路板的基板上的一个或多个模块上， 以及所得到的电子封装。 根据本发明方法的优选实施例，钻出衬底中的至少一个电镀的焊料填充孔以消除不期望的电连接。 焊料区域例如焊球被插入到钻孔中，与例如导电销（例如，模块）延伸到孔中的导电构件接触。 包括导电材料的中心芯的圆筒，被电绝缘材料的环形区域包围，插入孔中。 焊料区域然后回流以在模块构件和中心芯之间形成电和冶金结合。 通过将引线接合从中心芯的底部延伸到另一个这样的孔中的中心芯的底部或焊料填充的孔的底部来完成新的电连接。

    End terminated high power chip resistor assembly
    40.
    发明授权
    End terminated high power chip resistor assembly 失效
    端接大功率片式电阻器组件

    公开(公告)号：US5179366A

    公开(公告)日：1993-01-12

    申请号：US720034

    申请日：1991-06-24

    Applicant: Robert Wagner

    Inventor： Robert Wagner

    IPC: H01C1/084 ,  H01C17/00 ,  H05K1/02 ,  H05K3/34 ,  H05K3/42

    CPC classification number: H01C17/006 ,  H01C1/084 ,  H05K1/0206 ,  H05K3/341 ,  H05K2201/09572 ,  H05K2201/10022 ,  H05K2201/10636 ,  H05K2201/10969 ,  H05K3/0061 ,  H05K3/3442 ,  H05K3/42 ,  Y02P70/611 ,  Y02P70/613

    Abstract: An end terminated high power chip resistor-printed circuit board assembly (9) suitable for use in applications requiring miniature surface mount resistors capable of high power dissipation. An end terminated high power chip resistor (8) is constructed by coating a portion of the bottom of an end terminated chip resistor with a conductive plate (12). The end terminated high power chip resistor (8) is mounted to a printed circuit board having at least one via (23) lined with metal (20) wherein the conductive plate (12) is positioned above the via (23) lined with metal (20). A heat sink (16) is mounted to the printed circuit board opposite to the side to which the end terminated high power chip resistor (8) is mounted and is in contact with the metal (20) lining via (23).

    Abstract translation: 一种端接的大功率芯片电阻器印刷电路板组件（9），适用于需要具有高功耗的微型表面贴装电阻器的应用。 端接的大功率芯片电阻器（8）通过用导电板（12）涂覆端部端接的芯片电阻器的底部的一部分而构成。 端接的大功率芯片电阻器（8）安装到具有至少一个衬有金属（20）的通孔（23）的印刷电路板，其中导电板（12）位于衬有金属的通孔（23）上方 20）。 散热器（16）安装到印刷电路板的与端接的大功率芯片电阻器（8）所安装的一侧相对并且与金属（20）衬套通过（23）接触。

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