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    REDUCING OR ELIMINATING BOARD-TO-BOARD CONNECTORS
    31.
    发明申请
    REDUCING OR ELIMINATING BOARD-TO-BOARD CONNECTORS 有权
    减少或消除板对板连接器

    公开(公告)号：US20150295332A1

    公开(公告)日：2015-10-15

    申请号：US14250811

    申请日：2014-04-11

    Applicant: Apple Inc.

    Inventor： Anna-Katrina Shedletsky ,  Nathan Guide

    IPC: H01R12/61 ,  H01R12/71

    CPC classification number: H01R12/613 ,  H05K3/284 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/09754 ,  H05K2201/10424 ,  H05K2203/025

    Abstract: Embodiments of the present disclosure provide a method for creating a connection mechanism for a circuit board. The method includes securing a plurality of electrical conductors to a sleeve. Once the electrical conductors have been coupled to the sleeve, the sleeve and the plurality of conductors are coupled to, and molded with, the circuit board. At least one side of the circuit board, such as, for example, the molding over the plurality of electrical conductors, is subsequently reduced to expose at least a portion of at least one of the plurality of electrical conductors. An electrical connector is then coupled to the at least the portion of the one or more of the plurality of electrical conductors that was exposed when the first side of the printed circuit board was reduced.

    Abstract translation: 本公开的实施例提供了一种用于创建电路板的连接机构的方法。 该方法包括将多个电导体固定到套筒上。 一旦电导体已经耦合到套筒，套管和多个导体被耦合到电路板并且与其成型。 电路板的至少一侧，例如多个电导体上的模制件，随后被减少以露出多个电导体中的至少一个电导体的至少一部分。 然后，电连接器被耦合到当印刷电路板的第一面减小时暴露的多个电导体中的一个或多个的至少一部分。

    Method for manufacturing wiring substrate
    32.
    发明授权
    Method for manufacturing wiring substrate 有权
    制造布线基板的方法

    公开(公告)号：US09089053B2

    公开(公告)日：2015-07-21

    申请号：US13147961

    申请日：2010-04-27

    Applicant: Mamoru Sawai

    Inventor： Mamoru Sawai

    IPC: H01K3/10 ,  H05K1/02 ,  H05K3/40 ,  H05K3/44 ,  H05K1/05

    CPC classification number: H05K1/0213 ,  H05K1/056 ,  H05K3/40 ,  H05K3/4092 ,  H05K3/44 ,  H05K2201/09754 ,  H05K2201/10924 ,  Y10T29/49158 ,  Y10T29/49165

    Abstract: A wiring substrate includes a wiring board having a main face and a side face substantially perpendicular to the main face; a circuit pattern which is formed on the main face of the wiring board; a soaking plate which is disposed in an intermediate layer of the wiring board; and a plurality of protruding terminals are disposed in the intermediate layer and are projected outwardly from the side face. The protruding terminals are electrically connected in the intermediate layer to each other.

    Abstract translation: 布线基板包括具有主面和大致垂直于主面的侧面的布线板; 形成在布线基板的主面上的电路图案; 浸渍板，其布置在所述布线板的中间层中; 并且多个突出端子设置在中间层中并且从侧面向外突出。 突出端子在中间层中彼此电连接。

    SYSTEMS AND METHODS FOR INTEGRATING RADIO-FREQUENCY IDENTIFICATION CIRCUITRY INTO FLEXIBLE CIRCUITS
    34.
    发明申请
    SYSTEMS AND METHODS FOR INTEGRATING RADIO-FREQUENCY IDENTIFICATION CIRCUITRY INTO FLEXIBLE CIRCUITS 审中-公开
    将无线电频率识别电路集成到灵活电路的系统和方法

    公开(公告)号：US20140033515A1

    公开(公告)日：2014-02-06

    申请号：US14046799

    申请日：2013-10-04

    Applicant: Apple Inc.

    Inventor： Juan Carlos MAURICIA

    IPC: G06K19/077

    CPC classification number: G06K19/07749 ,  H01L23/4985 ,  H01L23/49855 ,  H01L2924/0002 ,  H01L2924/14 ,  H05K1/189 ,  H05K2201/09754 ,  H05K2201/10098 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49126 ,  H01L2924/00

    Abstract: Systems and methods for integrating radio-frequency identification (RFID) circuitry into flexible circuits are provided. An RFID integrated circuit can be embedded within a dielectric layer of a flexible circuit or between a dielectric layer and a conductive layer of the flexible circuit. Additionally or alternatively, an RFID antenna may be integrated into a conductive layer of the flexible circuit. Alternatively, both the integrated circuit and antenna of RFID circuitry may be provided off of the flexible circuit but an RFID connector coupling the integrated circuit and antenna may be integrated into the flexible circuit.

    Abstract translation: 提供了将射频识别（RFID）电路集成到柔性电路中的系统和方法。 RFID集成电路可以嵌入在柔性电路的介电层内或柔性电路的介电层和导电层之间。 另外或替代地，RFID天线可以集成到柔性电路的导电层中。 或者，RFID电路的集成电路和天线都可以设置在柔性电路之外，但是可以将耦合集成电路和天线的RFID连接器集成到柔性电路中。

    Support module for a solid state light source, a lighting device comprising such a module, and a method for manufacturing such a lighting device
    35.
    发明授权
    Support module for a solid state light source, a lighting device comprising such a module, and a method for manufacturing such a lighting device 失效
    用于固态光源的支撑模块，包括这种模块的照明装置以及这种照明装置的制造方法

    公开(公告)号：US08373194B2

    公开(公告)日：2013-02-12

    申请号：US13000042

    申请日：2009-06-23

    Applicant: Marcus Johannes Gerardus Elzinga

    Inventor： Marcus Johannes Gerardus Elzinga

    IPC: H01L33/36 ,  H01L21/00

    CPC classification number: H01L33/486 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K3/3494 ,  H05K2201/09063 ,  H05K2201/09754 ,  H05K2201/09836 ,  H05K2201/10106 ,  H05K2201/10962 ,  H05K2203/107 ,  H01L2924/00

    Abstract: A support module (1), comprising a conducting layer (2) having a trough hole (5) and a receiving surface adapted to receive a solid state light source (3) with the electrical contact pad (4) being aligned with the through hole (5). The support module (1) further comprises an electrical insulation element (8) and at least one contact pin (9), extending through the electrical insulation element (8), and protruding through the through hole (5). Furthermore, the electrical insulation element (8) comprises a channel (10) allowing access to the end of the contact pin (9) and the electrical contact pad (4) of the solid state light source (3) received by the surface of the conducting layer (2). Such a channel makes it possible to reach the end of the contact pin and the contact pad through the insulation element with a soldering tool. Thus, it is possible to attach the solid state light source on a metal surface by soldering the contact pin to the contact pad. Mounting a solid state lighting device on a metal surface is advantageous in applications requiring good heat dissipation, since the heat dissipation properties of a metal surface is better than of a printed circuit board.

    Abstract translation: 一种支撑模块（1），包括具有槽孔（5）的导电层（2）和适于接收固态光源（3）的接收表面，所述电接触焊盘（4）与所述通孔 （5）。 支撑模块（1）还包括电绝缘元件（8）和延伸穿过电绝缘元件（8）并且穿过通孔（5）突出的至少一个接触销（9）。 此外，电绝缘元件（8）包括通道（10），允许接触到接触销（9）的端部和由固态光源（3）的表面接收的固态光源（3）的电接触焊盘（4） 导电层（2）。 这样的通道使得可以用焊接工具通过绝缘元件到达接触针和接触垫的端部。 因此，可以通过将接触销焊接到接触焊盘来将固态光源附着在金属表面上。 由于金属表面的散热性优于印刷电路板，因此在金属表面上安装固态照明装置在需要良好散热的应用中是有利的。

    ELECTRONIC DISPLAY WITH MOUNT-ACCESSIBLE COMPONENTS
    37.
    发明申请
    ELECTRONIC DISPLAY WITH MOUNT-ACCESSIBLE COMPONENTS 有权
    电子显示屏，带有可访问的组件

    公开(公告)号：US20110013367A1

    公开(公告)日：2011-01-20

    申请号：US12684608

    申请日：2010-01-08

    Applicant: David Williams ,  Ware Bedell ,  William Dunn

    Inventor： David Williams ,  Ware Bedell ,  William Dunn

    IPC: H05K5/00

    CPC classification number: G06F1/1601 ,  G06F1/181 ,  G06F2200/1612 ,  H01L23/3107 ,  H01L23/32 ,  H01R12/7076 ,  H01R12/73 ,  H01R23/70 ,  H01R23/7005 ,  H04N5/63 ,  H04N5/64 ,  H04N5/655 ,  H05K1/117 ,  H05K2201/044 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2201/1034

    Abstract: An electronic display assembly where the components can be removed and serviced or replaced without having to remove the display from its position. A backplane may be in electrical communication with the image producing assembly and may contain a plurality of blind mate connectors. Various electronic assemblies may be connected to the blind mate connectors. An access panel may provide access to the electronic assemblies so that they can be removed from the housing. N+1 power supplies may be used so that if one fails the unit would continue to operate until the failed power supply could be replaced. The electronic assemblies may be removed from the left side, right side, top, or bottom surfaces of the display housing. Any flat panel electronic display may be used.

    Abstract translation: 一种电子显示器组件，其中组件可以被移除和维修或更换，而不必从其位置移除显示器。 背板可以与图像产生组件电连通，并且可以包含多个盲配对连接器。 各种电子组件可以连接到盲配接头。 访问面板可以提供对电子组件的访问，使得它们可以从壳体移除。 可以使用N + 1个电源，以便如果发生故障，设备将继续运行，直到发生故障的电源被更换为止。 电子组件可以从显示器壳体的左侧，右侧，顶部或底部表面移除。 可以使用任何平板电子显示器。

    Metal-core substrate and apparatus utilizing the same
    38.
    发明授权
    Metal-core substrate and apparatus utilizing the same 有权
    金属芯基板及利用其的装置

    公开(公告)号：US07754974B2

    公开(公告)日：2010-07-13

    申请号：US11372104

    申请日：2006-03-10

    Applicant: Masataka Suzuki ,  Kenji Hayakawa

    Inventor： Masataka Suzuki ,  Kenji Hayakawa

    IPC: H05K1/00

    CPC classification number: H05K3/4092 ,  H05K1/056 ,  H05K3/403 ,  H05K3/429 ,  H05K2201/0919 ,  H05K2201/09754 ,  H05K2201/10924

    Abstract: The present invention is to provide a metal-core substrate without mounting large size terminals and connectors. Hence, the metal-core substrate can be smaller and thinner. A metal-core substrate includes a metal plate, an insulating layer formed on a surface of the metal plate and a circuit pattern formed on a surface of the insulating layer, wherein a part of said metal plate is exposed to outside of the insulating layer and is utilized as connector terminals. The metal plate has a heat sink plate to heat sink a heat-generating device mounted on the metal-core substrate and connector terminal plates disposed separately from the heat sink plate and utilized for the connector terminals. The heat-generating device and a driving part thereof each are disposed on a different surface of the metal-core substrate.

    Abstract translation: 本发明提供一种不安装大尺寸端子和连接器的金属芯基板。 因此，金属芯基板可以更小更薄。 金属芯基板包括金属板，形成在金属板的表面上的绝缘层和形成在绝缘层的表面上的电路图案，其中所述金属板的一部分暴露于绝缘层的外部， 被用作连接器端子。 金属板具有散热板，用于将安装在金属芯基板上的发热装置和与散热板分开设置的连接器端子板散热，用于连接器端子。 发热元件及其驱动部分分别设置在金属芯基板的不同表面上。

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