公开(公告)号：US20060158828A1

公开(公告)日：2006-07-20

申请号：US11289884

申请日：2005-11-30

Applicant: Daniel Amey ,  Sounak Banerji ,  William Borland ,  David McGregor ,  Attiganal Sreeram ,  Karl Dietz

Inventor： Daniel Amey ,  Sounak Banerji ,  William Borland ,  David McGregor ,  Attiganal Sreeram ,  Karl Dietz

IPC: H01G4/06

CPC classification number: H05K1/162 ,  H01L2924/0002 ,  H05K3/4641 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09763 ,  H01L2924/00

Abstract: A power core comprising: at least one embedded singulated capacitor layer containing at least one embedded singulated capacitor; and at least one planar capacitor laminate; wherein at least one planar capacitor laminate serves as a low inductance path to supply a charge to at least one embedded singulated capacitor; and wherein said embedded singulated capacitor is connected in parallel to said planar capacitor laminate.

Abstract translation: 一种功率核心，包括：至少一个嵌入的单个电容器层，其包含至少一个嵌入式单电容器; 和至少一个平面电容器层压板; 其中至少一个平面电容器层叠体用作低电感路径，以向至少一个嵌入的单个电容器提供电荷; 并且其中所述嵌入式单电容器与所述平面电容器层压体并联连接。

公开(公告)号：US20060152323A1

公开(公告)日：2006-07-13

申请号：US11375483

申请日：2006-03-14

Applicant: Mark Pavier

Inventor： Mark Pavier

IPC: H01F5/00

CPC classification number: H05K1/165 ,  H01F17/0006 ,  H01F17/043 ,  H01L23/645 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15192 ,  H05K3/429 ,  H05K2201/086 ,  H05K2201/09763 ,  H05K2203/0545

Abstract: An embedded inductor which includes a spiral conductive inductor embedded in a magnetically permeable body composed of particles of pre-sintered magnetically permeable (e.g. ferromagnetic) material and an epoxy binder.

公开(公告)号：US20060141764A1

公开(公告)日：2006-06-29

申请号：US11317403

申请日：2005-12-23

Applicant: Kiyoshi Oi ,  Noriyoshi Shimizu ,  Tomoo Yamasaki

Inventor： Kiyoshi Oi ,  Noriyoshi Shimizu ,  Tomoo Yamasaki

IPC: H01L21/4763

CPC classification number: H05K1/162 ,  H01L23/49822 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/113 ,  H05K3/20 ,  H05K3/4644 ,  H05K2201/096 ,  H05K2201/09763 ,  H05K2201/10674 ,  H05K2203/016 ,  H05K2203/0733 ,  H01L2924/00

Abstract: A method of manufacturing a wiring board is disclosed. The wiring board has: a capacitor, having multiple electrode layers which oppose each other with a dielectric layer in between, that is connected to a semiconductor chip; one or more via wirings which pierce the electrode layers and which are connected to the semiconductor chip, and pattern wirings connected to the via wirings. The method includes: forming the electrode layers, each having one or more through holes which the via wirings pierce, and the dielectric layer, and forming the capacitor; installing the capacitor such that the capacitor opposes the pattern wirings over an insulating layer; forming one or more via holes which reach the pattern wirings from the through holes; and forming the via wiring in the via hole.

Abstract translation: 公开了一种制造布线板的方法。 布线板具有：电容器，具有多个彼此相对的电极层，中间具有介电层，并连接到半导体芯片; 一个或多个穿透电极层并且连接到半导体芯片的通孔布线以及连接到通孔布线的图案布线。 该方法包括：形成各自具有通孔布线穿过的一个或多个通孔的电极层和电介质层，并形成电容器; 安装电容器使得电容器与绝缘层上的图案布线相对; 形成从通孔到达图案布线的一个或多个通孔; 以及在通孔中形成通孔布线。

公开(公告)号：US20060120015A1

公开(公告)日：2006-06-08

申请号：US11002748

申请日：2004-12-02

Applicant: William Borland

Inventor： William Borland

IPC: H01G4/228

CPC classification number: H05K1/162 ,  H01L27/013 ,  H05K1/092 ,  H05K3/1291 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/035 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09763 ,  H05K2203/1126 ,  Y10T29/435 ,  Y10T29/49128 ,  Y10T29/49156

Abstract: A method of embedding thick-film capacitors includes etching foil electrodes outside the boundary of the capacitor dielectric to prevent etching solutions from coming in contact with and damaging the capacitor dielectric layers.

Abstract translation: 嵌入厚膜电容器的方法包括在电容器电介质的边界之外蚀刻箔电极，以防止蚀刻溶液与电容器电介质层接触并损坏电容器电介质层。

公开(公告)号：US20060044734A1

公开(公告)日：2006-03-02

申请号：US10999442

申请日：2004-11-29

Applicant: Jin-Yong Ahn ,  Chang-Sup Ryu ,  Suk-Hyeon Cho ,  Seok-Kyu Lee ,  Jong-Kuk Hong ,  Ho-Sik Jun

Inventor： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Suk-Hyeon Cho ,  Seok-Kyu Lee ,  Jong-Kuk Hong ,  Ho-Sik Jun

IPC: H01G4/20

CPC classification number: H05K1/162 ,  H01G4/1209 ,  H01G4/1218 ,  H01G4/248 ,  H01G4/33 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/09509 ,  H05K2201/09763 ,  H05K2201/09881 ,  H05K2203/0568 ,  H05K2203/1366 ,  Y10T29/42

Abstract: Disclosed is a PCB including embedded capacitors and a method of fabricating the same. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.

Abstract translation: 公开了一种包括嵌入式电容器的PCB及其制造方法。 使用具有高电容的陶瓷材料形成电介质层，从而确保电容器各自具有对应于去耦芯片电容器的电容的高介电常数。

公开(公告)号：US20050207094A1

公开(公告)日：2005-09-22

申请号：US10801257

申请日：2004-03-16

Applicant: William Borland ,  Alton Jones ,  Olga Renovales

Inventor： William Borland ,  Alton Jones ,  Olga Renovales

IPC: C04B35/46 ,  C04B35/468 ,  H01G4/008 ,  H01G4/12 ,  H01G4/33 ,  H01G4/35 ,  H05K1/16

CPC classification number: C04B35/468 ,  C04B2235/445 ,  C04B2235/6562 ,  H01G4/008 ,  H01G4/1227 ,  H01G4/33 ,  H05K1/162 ,  H05K3/1291 ,  H05K2201/017 ,  H05K2201/0355 ,  H05K2201/09763 ,  H05K2203/1126

Abstract: Dielectric powder and thick-film paste compositions are formed having high dielectric constants, low loss tangents, and other desirable electrical and physical properties. Conductive powder and paste compositions are formed having desirable electrical and physical properties. The dielectric powder and thick-film paste compositions can be used in combination with the conductive powder and paste compositions to form capacitors and other fired-on-foil passive circuit components.

Abstract translation: 形成介电粉末和厚膜糊组合物，其具有高介电常数，低损耗切线和其它所需的电学和物理性能。 形成具有所需电学和物理性质的导电粉末和糊剂组合物。 电介质粉末和厚膜糊剂组合物可以与导电粉末和糊剂组合物组合使用，以形成电容器和其它无卤电路元件。

公开(公告)号：US20050176209A1

公开(公告)日：2005-08-11

申请号：US10366924

申请日：2003-02-14

Applicant: Jon Jorgenson ,  Milind Shah ,  Victor Steel

Inventor： Jon Jorgenson ,  Milind Shah ,  Victor Steel

IPC: H05K1/16 ,  H05K3/46 ,  H01L21/20 ,  G06F17/50 ,  H01L29/00

CPC classification number: H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/4652 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0959 ,  H05K2201/09763

Abstract: The present invention embeds passive components within a multilayer substrate used for mounting integrated circuits and other electronic components to form an electronic module or circuit board. During construction of the multilayer substrate, passive components are attached to an inside surface of a metallic foil layer. The inside surface of the metallic foil layer is then laminated to another metallic foil layer, such that the foil layers are parallel to but separated from each other. As such, the passive component is embedded within the multilayer substrate. Contacts are formed for the passive component by etching away portions of the foil layer on which the passive component resides. Electrical connections can be routed in the foil to effectively couple the passive component to a circuit formed on the multilayer substrate as desired. The embedded passive components can take various forms, such as capacitors, inductors, and resistors.

Abstract translation: 本发明将无源部件嵌入用于安装集成电路和其他电子部件的多层基板中，以形成电子模块或电路板。 在多层基板的构造期间，将无源部件附着到金属箔层的内表面。 然后将金属箔层的内表面层压到另一金属箔层上，使得箔层彼此平行但分开。 因此，被动部件嵌入在多层基板内。 通过蚀刻去除被动部件所在的箔层的部分，为无源部件形成触点。 电连接可以在箔中布线以有效地将无源部件耦合到根据需要在多层基板上形成的电路。 嵌入式无源器件可以采取各种形式，如电容器，电感器和电阻器。

公开(公告)号：US20050035845A1

公开(公告)日：2005-02-17

申请号：US10639794

申请日：2003-08-12

Applicant: Jiming Zhou ,  Dwadasi Sarma ,  Carl Berlin ,  John Myers ,  M. Fairchild

Inventor： Jiming Zhou ,  Dwadasi Sarma ,  Carl Berlin ,  John Myers ,  M. Fairchild

IPC: H01C7/00 ,  H01C17/065 ,  H05K1/02 ,  H05K1/09 ,  H05K1/16 ,  H05K3/40 ,  H05K3/46 ,  H01C1/01 ,  H01C17/06

CPC classification number: H05K1/167 ,  H01C7/003 ,  H01C17/065 ,  H05K1/0206 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09763 ,  H05K2201/09781 ,  H05K2203/171 ,  Y10T29/49099 ,  Y10T29/49101

Abstract: A thick-film resistor component may include a thick film component formed between a thick-film resistor and an electrically conductive sheet, wherein a portion of the sheet is selectively removed to form resistor contacts while exposing a portion of the thick-film component. Electrical terminals to a thick-film resistor may be sized to reduce stress and/or be selectively positioned relative to the resistor to define a desired resistor value. A thick-film resistor may include one or more resistor segments configured to be selectively open-circuited to incrementally adjust the value of the resistor.

Abstract translation: 厚膜电阻器部件可以包括形成在厚膜电阻器和导电片之间的厚膜部件，其中，当暴露一部分厚膜部件时，片材的一部分被选择性地去除以形成电阻器触点。 可以将电气端子连接到厚膜电阻器，以减小应力和/或相对于电阻器选择性地定位以限定所需的电阻器值。 厚膜电阻器可以包括被配置为选择性地开路的一个或多个电阻器段，以递增地调节电阻器的值。

公开(公告)号：US20040108134A1

公开(公告)日：2004-06-10

申请号：US10663551

申请日：2003-09-16

Inventor： William J. Borland ,  Saul Ferguson ,  David R. McGregor

IPC: H05K001/16

CPC classification number: H05K1/162 ,  H05K1/092 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4623 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09718 ,  H05K2201/09763

Abstract: A printed wiring board (PWB) has stacked innerlayer panels comprised of passive circuit elements. The passive elements can include capacitors with electrode terminations located within the footprints of the capacitor electrodes. The capacitor terminations are therefore closely spaced, reducing the capacitors' contributions to loop inductance in the innerlayer. Capacitor terminations within the electrode footprints also reduce the PWB board surface area used in forming the capacitors.

Abstract translation: 印刷电路板（PWB）具有由无源电路元件组成的层叠的内层面板。 无源元件可以包括具有位于电容器电极的覆盖区内的电极端子的电容器。 因此，电容器端子紧密地间隔开，减小了电容器对内层中的环路电感的贡献。 电极脚印中的电容终端也可以减少用于形成电容器的PWB板表面积。

公开(公告)号：US20040104451A1

公开(公告)日：2004-06-03

申请号：US10692836

申请日：2003-10-24

Inventor： Kiyoshi Ooi ,  Yasuyoshi Horikawa ,  Tomoo Yamasaki

IPC: H01L029/00

CPC classification number: H01G4/224 ,  H01L21/6835 ,  H01L23/50 ,  H01L23/642 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05172 ,  H01L2224/05184 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K1/162 ,  H05K2201/0162 ,  H05K2201/09763 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2224/05166

Abstract: A capacitor includes a capacitor part formed of a dielectric film sandwiched by a pair of electrodes and a support body formed of a film of an organic polysilane. The support body is provided so as to support the capacitor part thereon.

Abstract translation: 电容器包括由夹在一对电极之间的电介质膜和由有机聚硅烷膜形成的支撑体形成的电容器部分。 支撑体设置成在其上支撑电容器部分。