OSCILLATOR
    31.
    发明申请
    OSCILLATOR 有权
    振荡器

    公开(公告)号:US20120200366A1

    公开(公告)日:2012-08-09

    申请号:US13358818

    申请日:2012-01-26

    Abstract: An oscillator that can suppress a solder crack caused by a temperature change by a simple structure at low cost and improve heat cycle resistance performance is provided. The oscillator includes an epoxy resin board and an electronic component mounted on the board. Two-terminal electrode patterns are formed on the board, and connected to terminal electrodes of the electronic component by solder. A projection is formed on each of the electrode patterns at a part connected to a corresponding terminal electrode to create a space between the terminal electrode and the electrode pattern, and the solder forms a fillet in the space. This contributes to enhanced adhesion strength of the solder.

    Abstract translation: 提供了一种可以通过简单的结构以低成本抑制由温度变化引起的焊料裂纹并提高耐热循环性能的振荡器。 振荡器包括环氧树脂板和安装在板上的电子部件。 在电路板上形成两端电极图形,并通过焊料与电子部件的端子电极连接。 在与相应的端子电极连接的部分上的每个电极图案上形成突起,以在端子电极和电极图案之间形成空间,并且焊料在该空间中形成圆角。 这有助于提高焊料的粘附强度。

    Crystal oscillator with pedestal
    32.
    发明授权
    Crystal oscillator with pedestal 失效
    水晶振荡器与基座

    公开(公告)号:US08072279B2

    公开(公告)日:2011-12-06

    申请号:US12657907

    申请日:2010-01-29

    Applicant: Kenji Kasahara

    Inventor: Kenji Kasahara

    Abstract: An object of the invention is to provide an oscillator with a pedestal that facilitates soldering operations and offers a high level of productivity. A surface mount crystal oscillator with a pedestal comprises a crystal oscillator with lead wires led out from a bottom surface of a metallic base thereof; and a pedestal having a substantially rectangular outer shape in plan view, has insertion holes through which the lead wires pass, and is attached to a bottom surface of the crystal oscillator, and has mount terminals to be electrically connected to the lead wires formed on a bottom surface thereof. The configuration is such that the insertion holes are provided in four corner sections of the pedestal, in the four corner sections of the bottom surface of the pedestal where the insertion holes are formed there is provided a recess with an open outer periphery, and the lead wire is connected to a terminal electrode formed inside the recess, using solder.

    Abstract translation: 本发明的目的是提供一种具有便于焊接操作的基座的振荡器,并提供高水平的生产率。 具有基座的表面贴装晶体振荡器包括:晶体振荡器,其引线从其金属基底的底面引出; 并且在平面图中具有大致矩形的外形的基座具有引线通过的插入孔,并且附接到晶体振子的底面,并且具有安装端子,电连接到形成在 其底面。 其结构是,在基座的四个角部设置插入孔,在形成有插入孔的基座的底面的四个角部,设置有开口外周的凹部, 使用焊料将导线连接到形成在凹部内部的端子电极。

    Wiring board and wiring board module
    33.
    发明授权
    Wiring board and wiring board module 有权
    接线板和接线板模块

    公开(公告)号:US07679929B2

    公开(公告)日:2010-03-16

    申请号:US11687319

    申请日:2007-03-16

    Abstract: A wiring board module includes a multilayer wiring board. A crystal oscillator and an IC component, for example, are mounted on the mounting surface of the multilayer wiring board. Mounting lands for the IC component, mounting lands for the crystal oscillator, and mounting lands for other surface mount components are provided on the mounting surface. Each mounting land for the crystal oscillator is not a conventional single large-area land but is defined by four adjacent land pieces. The four land pieces are electrically connected via an external terminal of the crystal oscillator, thereby functioning as a mounting land for the external terminal. In other words, each of the plurality of mounting lands provided at locations corresponding to external terminals of the crystal oscillator is divided into four land pieces.

    Abstract translation: 布线板模块包括多层布线板。 例如,在多层布线基板的安装面上安装有晶体振荡器和IC部件。 在安装面上设有用于IC部件的安装平台,晶体振荡器的安装平台和其他表面安装部件的安装台面。 用于晶体振荡器的每个安装平台不是常规的单个大面积的土地,而是由四个相邻的陆块限定。 四块焊盘通过晶体振荡器的外部端子电连接,从而用作外部端子的安装焊盘。 换句话说,设置在与晶体振荡器的外部端子对应的位置处的多个安装焊盘中的每一个被分成四个焊盘。

    Constant-temperature type crystal oscillator
    34.
    发明申请
    Constant-temperature type crystal oscillator 有权
    恒温型晶体振荡器

    公开(公告)号:US20100052802A1

    公开(公告)日:2010-03-04

    申请号:US12584192

    申请日:2009-09-01

    Applicant: Junichi Arai

    Inventor: Junichi Arai

    Abstract: A constant-temperature type crystal oscillator includes: a crystal unit that is installed on one principal surface of a circuit substrate, and chip resistors, which function as heating elements, and which are installed on the other principal surface of the circuit substrate so as to face a principal surface of the crystal unit, the chip resistors heating up the crystal unit to keep an operational temperature of the crystal unit constant. A heating metal film facing the principal surface of the crystal unit is provided on the one principal surface of the circuit substrate. A heat conducting material is interposed between the principal surface of the crystal unit and the heating metal film to perform thermal coupling therebetween. The heating metal film is thermally coupled to electrode terminals of the chip resistors via a plurality of electrode through holes.

    Abstract translation: 恒温型晶体振荡器包括:安装在电路基板的一个主表面上的晶体单元和用作加热元件的片式电阻器,并且安装在电路基板的另一个主表面上,以便 面对晶体单元的主表面,芯片电阻加热晶体单元以保持晶体单元的工作温度恒定。 在电路基板的一个主表面上设置面对晶体单元的主表面的加热金属膜。 导热材料插入在晶体单元的主表面和加热金属膜之间,以在它们之间进行热耦合。 加热金属膜通过多个电极通孔热耦合到芯片电阻器的电极端子。

    Printed circuit board with quartz crystal oscillator
    35.
    发明授权
    Printed circuit board with quartz crystal oscillator 失效
    带石英晶体振荡器的印刷电路板

    公开(公告)号:US07525192B2

    公开(公告)日:2009-04-28

    申请号:US11309215

    申请日:2006-07-13

    Applicant: Ling-Ling Shen

    Inventor: Ling-Ling Shen

    Abstract: A printed circuit board with a quartz crystal oscillator includes a mounting area for receiving the quartz crystal oscillator, two first vias, and two second vias. A copper foil is arranged on the mounting area. Pins of the quartz crystal oscillator are inserted into the first vias. The second vias are connected to a ground layer of the PCB and communicate with the copper foil, for transmitting noise of the quartz crystal oscillator to the ground layer of the PCB.

    Abstract translation: 具有石英晶体振荡器的印刷电路板包括用于接收石英晶体振荡器的安装区域,两个第一通孔和两个第二通孔。 铜箔布置在安装区域上。 将石英晶体振荡器的引脚插入第一通孔中。 第二通孔连接到PCB的接地层,并与铜箔连通,将石英晶体振荡器的噪声传递到PCB的接地层。

    Printed circuit board assembly and method for preventing EMI of crystal oscillator thereof
    36.
    发明申请
    Printed circuit board assembly and method for preventing EMI of crystal oscillator thereof 审中-公开
    印刷电路板组件及其晶体振荡器的EMI防止方法

    公开(公告)号:US20070000690A1

    公开(公告)日:2007-01-04

    申请号:US11473051

    申请日:2006-06-23

    Applicant: Qing-Li Chai

    Inventor: Qing-Li Chai

    Abstract: A printed circuit board Assembly (PCBA), including at least one crystal oscillator and a printed circuit board (PCB), is provided. The crystal oscillator includes a body and a shell. The shell covers the body. The PCB includes at least one inserting area and at least one plated hole. The inserting area is used for receiving the body. The plated hole is disposed on the inserting area. When the PCBA is under wave soldering process, the solder is drawn from one side of the PCBA to another side via the plated hole for enabling the shell to be electrically connected to the bare copper of the inserting area via the solder. Consequently, the shell has an even better shielding effect, and the EMI effect is reduced.

    Abstract translation: 提供了包括至少一个晶体振荡器和印刷电路板(PCB)的印刷电路板组件(PCBA)。 晶体振荡器包括主体和外壳。 壳覆盖身体。 PCB包括至少一个插入区域和至少一个电镀孔。 插入区域用于接收身体。 电镀孔设置在插入区域上。 当PCBA处于波峰焊接工艺时,焊料通过电镀孔从PCBA的一侧拉到另一侧,以使壳体能够通过焊料与插入区域的裸铜电连接。 因此,壳体具有更好的屏蔽效果,并且EMI效应降低。

    Temperature compensated crystal oscillator and method of manufacturing the same
    37.
    发明申请
    Temperature compensated crystal oscillator and method of manufacturing the same 失效
    温度补偿晶体振荡器及其制造方法

    公开(公告)号:US20030122452A1

    公开(公告)日:2003-07-03

    申请号:US10137327

    申请日:2002-05-03

    Inventor: Hyung Kon Kim

    Abstract: A temperature compensated crystal oscillator, which is manufactured by placing a ring-shaped board on a main board to accommodate compensating components on the main board, and placing a crystal package on the ring-shaped board, is disclosed. A component mounting area on the main board is reduced, thereby reducing a product size. At least one conductive pad may be attached to the ring-shaped board to connect the crystal package to a certain circuit on the main board. The conductive pad may be provided at each of four corners of the ring-shaped board in the case of a rectangular ring-shaped board. The present invention also provides a method of manufacturing the temperature compensated crystal oscillator.

    Abstract translation: 公开了一种温度补偿晶体振荡器,其通过将主板上的环形板放置在主板上的补偿部件并将晶体封装放置在环形板上而制造。 主板上的部件安装区域减少,从而减小产品尺寸。 至少一个导电垫可以附接到环形板以将晶体封装连接到主板上的某个电路。 在矩形环形板的情况下,导电垫可以设置在环形板的四个角的每一个处。 本发明还提供一种制造温度补偿晶体振荡器的方法。

    Enhanced low profile sockets and module systems
    40.
    发明授权
    Enhanced low profile sockets and module systems 失效
    增强的低调插座和模块系统

    公开(公告)号:US5579206A

    公开(公告)日:1996-11-26

    申请号:US304065

    申请日:1994-09-12

    Abstract: A socket system that comprises a printed circuit board; an electrical module; and a socket having a hollow core. The socket holds the electrical module and is capable of electrically coupling the electrical module to the printed circuit board. The electrical module has at least one electrical lead. The socket has at least one electrical lead capable of electrically coupling with the electrical lead(s) of the electrical module. The electrical module comprises a second printed circuit board having a first and second surface; a lithium battery positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, a crystal positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, and an integrated circuit positioned on the second surface of the second printed circuit board. A cap extends around and encloses and seals electrical elements of the electrical module. The cap may also have a baffle extending from the cap to surround and secure selected electrical components housed by the cap of the electrical module. The process of providing a printed circuit board, mounting a socket on the printed circuit board, placing the printed circuit board with the socket mounted on it in surface mount reflow oven and heating the printed circuit board and the socket to bond the socket to the printed circuit board, placing a cap over and around an electrical module and bending extended edges of the cap over and around the electrical module to seal electrical components inside the electrical module; and inserting an electrical module with the cap in the socket. If baffles are used, they will need to be aligned with selected electrical component of the electrical module.

    Abstract translation: 一种插座系统,包括印刷电路板; 电气模块; 以及具有中空芯的插座。 插座保持电气模块,并且能够将电气模块电连接到印刷电路板。 电气模块具有至少一个电引线。 插座具有能够与电气模块的电引线电耦合的至少一个电引线。 电气模块包括具有第一和第二表面的第二印刷电路板; 位于第二印刷电路板的第一表面上并与第二印刷电路板电耦合的锂电池,位于第二印刷电路板的第一表面上并与第二印刷电路板电连接的晶体,以及集成 电路定位在第二印刷电路板的第二表面上。 盖子围绕并围绕并密封电气模块的电气元件。 盖还可以具有从盖延伸以围绕并固定由电模块的盖容纳的所选电气部件的挡板。 提供印刷电路板的过程,将插座安装在印刷电路板上,将印刷电路板与其上安装的插座放置在表面安装回流炉中,并加热印刷电路板和插座以将插座连接到印刷电路板 将盖子放置在电气模块上并围绕电气模块,并且将盖子的延伸边缘弯曲到电气模块上方和周围,以密封电气模块内部的电气部件; 并将带有盖子的电气模块插入插座。 如果使用挡板,它们将需要与电气模块的选定电气部件对齐。

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