Abstract:
An oscillator that can suppress a solder crack caused by a temperature change by a simple structure at low cost and improve heat cycle resistance performance is provided. The oscillator includes an epoxy resin board and an electronic component mounted on the board. Two-terminal electrode patterns are formed on the board, and connected to terminal electrodes of the electronic component by solder. A projection is formed on each of the electrode patterns at a part connected to a corresponding terminal electrode to create a space between the terminal electrode and the electrode pattern, and the solder forms a fillet in the space. This contributes to enhanced adhesion strength of the solder.
Abstract:
An object of the invention is to provide an oscillator with a pedestal that facilitates soldering operations and offers a high level of productivity. A surface mount crystal oscillator with a pedestal comprises a crystal oscillator with lead wires led out from a bottom surface of a metallic base thereof; and a pedestal having a substantially rectangular outer shape in plan view, has insertion holes through which the lead wires pass, and is attached to a bottom surface of the crystal oscillator, and has mount terminals to be electrically connected to the lead wires formed on a bottom surface thereof. The configuration is such that the insertion holes are provided in four corner sections of the pedestal, in the four corner sections of the bottom surface of the pedestal where the insertion holes are formed there is provided a recess with an open outer periphery, and the lead wire is connected to a terminal electrode formed inside the recess, using solder.
Abstract:
A wiring board module includes a multilayer wiring board. A crystal oscillator and an IC component, for example, are mounted on the mounting surface of the multilayer wiring board. Mounting lands for the IC component, mounting lands for the crystal oscillator, and mounting lands for other surface mount components are provided on the mounting surface. Each mounting land for the crystal oscillator is not a conventional single large-area land but is defined by four adjacent land pieces. The four land pieces are electrically connected via an external terminal of the crystal oscillator, thereby functioning as a mounting land for the external terminal. In other words, each of the plurality of mounting lands provided at locations corresponding to external terminals of the crystal oscillator is divided into four land pieces.
Abstract:
A constant-temperature type crystal oscillator includes: a crystal unit that is installed on one principal surface of a circuit substrate, and chip resistors, which function as heating elements, and which are installed on the other principal surface of the circuit substrate so as to face a principal surface of the crystal unit, the chip resistors heating up the crystal unit to keep an operational temperature of the crystal unit constant. A heating metal film facing the principal surface of the crystal unit is provided on the one principal surface of the circuit substrate. A heat conducting material is interposed between the principal surface of the crystal unit and the heating metal film to perform thermal coupling therebetween. The heating metal film is thermally coupled to electrode terminals of the chip resistors via a plurality of electrode through holes.
Abstract:
A printed circuit board with a quartz crystal oscillator includes a mounting area for receiving the quartz crystal oscillator, two first vias, and two second vias. A copper foil is arranged on the mounting area. Pins of the quartz crystal oscillator are inserted into the first vias. The second vias are connected to a ground layer of the PCB and communicate with the copper foil, for transmitting noise of the quartz crystal oscillator to the ground layer of the PCB.
Abstract:
A printed circuit board Assembly (PCBA), including at least one crystal oscillator and a printed circuit board (PCB), is provided. The crystal oscillator includes a body and a shell. The shell covers the body. The PCB includes at least one inserting area and at least one plated hole. The inserting area is used for receiving the body. The plated hole is disposed on the inserting area. When the PCBA is under wave soldering process, the solder is drawn from one side of the PCBA to another side via the plated hole for enabling the shell to be electrically connected to the bare copper of the inserting area via the solder. Consequently, the shell has an even better shielding effect, and the EMI effect is reduced.
Abstract:
A temperature compensated crystal oscillator, which is manufactured by placing a ring-shaped board on a main board to accommodate compensating components on the main board, and placing a crystal package on the ring-shaped board, is disclosed. A component mounting area on the main board is reduced, thereby reducing a product size. At least one conductive pad may be attached to the ring-shaped board to connect the crystal package to a certain circuit on the main board. The conductive pad may be provided at each of four corners of the ring-shaped board in the case of a rectangular ring-shaped board. The present invention also provides a method of manufacturing the temperature compensated crystal oscillator.
Abstract:
A clock generation system generates and distributes sinusoidal signals. Also, the clock lines are configured and shielded in a novel manner so as to provide the same overall propagation characteristics for the clock signals in all the lines, and to minimize the effects of cross-talk and electromagnetic interference.
Abstract:
A socket system that comprises a printed circuit board; an electrical module; and a socket having a hollow core. The socket holds the electrical module and is capable of electrically coupling the electrical module to the printed circuit board. The electrical module has at least one electrical lead. The socket has at least one electrical lead capable of electrically coupling with the electrical lead(s) of the electrical module. The electrical module comprises a second printed circuit board having a first and second surface; a lithium battery positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, a crystal positioned on the first surface of said second printed circuit board and electrically coupled with the second printed circuit board, and an integrated circuit positioned on the second surface of the second printed circuit board.
Abstract:
A socket system that comprises a printed circuit board; an electrical module; and a socket having a hollow core. The socket holds the electrical module and is capable of electrically coupling the electrical module to the printed circuit board. The electrical module has at least one electrical lead. The socket has at least one electrical lead capable of electrically coupling with the electrical lead(s) of the electrical module. The electrical module comprises a second printed circuit board having a first and second surface; a lithium battery positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, a crystal positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, and an integrated circuit positioned on the second surface of the second printed circuit board. A cap extends around and encloses and seals electrical elements of the electrical module. The cap may also have a baffle extending from the cap to surround and secure selected electrical components housed by the cap of the electrical module. The process of providing a printed circuit board, mounting a socket on the printed circuit board, placing the printed circuit board with the socket mounted on it in surface mount reflow oven and heating the printed circuit board and the socket to bond the socket to the printed circuit board, placing a cap over and around an electrical module and bending extended edges of the cap over and around the electrical module to seal electrical components inside the electrical module; and inserting an electrical module with the cap in the socket. If baffles are used, they will need to be aligned with selected electrical component of the electrical module.