公开(公告)号：US20150338879A1

公开(公告)日：2015-11-26

申请号：US14637133

申请日：2015-03-03

Applicant: Kabushiki Kaisha Toshiba

Inventor： Syuji Hiramoto ,  Hideki Ogawa

IPC: G06F1/16 ,  H05K1/18 ,  H05K1/02

CPC classification number: G06F1/163 ,  G06F1/1637 ,  G06F1/1652 ,  G06F1/1658 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/09081 ,  H05K2201/10037 ,  H05K2201/10083 ,  H05K2201/10128 ,  H05K2201/10734

Abstract: According to one embodiment, a circuit board device includes a flexible printed circuit board configured to be bendable and including a first mounting surface and a second mounting surface opposed to the first mounting surface, at least one electronic component mounted on the first mounting surface of the flexible printed circuit board, and a plurality of bent portions on both sides of the electronic component near the electronic component, the bent portions being formed by folding a part of the flexible printed circuit board.

Abstract translation: 根据一个实施例，一种电路板装置包括：柔性印刷电路板，其被构造为可弯曲的，并且包括第一安装表面和与第一安装表面相对的第二安装表面;至少一个电子部件安装在第一安装表面上 柔性印刷电路板，以及在电子部件附近的电子部件的两侧的多个弯曲部，弯曲部通过折叠柔性印刷电路板的一部分而形成。

公开(公告)号：US09196277B2

公开(公告)日：2015-11-24

申请号：US13856094

申请日：2013-04-03

Applicant: NHK SPRING CO., LTD.

Inventor： Akira Omachi

IPC: G11B5/48 ,  G11B21/16 ,  H01R4/00 ,  G01L9/00 ,  H01R12/55 ,  H05K3/32 ,  H05K3/40 ,  H05K3/30

CPC classification number: G11B5/4833 ,  G01L9/00 ,  G11B5/486 ,  G11B5/4873 ,  H01R4/00 ,  H01R12/55 ,  H05K3/30 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/091 ,  H05K2201/10083 ,  H05K2201/10446

Abstract: A terminal includes a terminal wiring part extending from a flexure and having an insulating layer and a wiring layer formed on the insulating layer, a terminal main part formed at a front end of the terminal wiring part and connected to a piezoelectric element arranged to face the terminal main part, and a terminal bender that is made of a supportive metal layer, is arranged along a part of the terminal wiring part in an extending direction thereof, and is plastically deformed to form a bend in the part of the terminal wiring part so as to bring the terminal main part closer to the piezoelectric element.

Abstract translation: 端子包括从弯曲部延伸并具有形成在绝缘层上的绝缘层和布线层的端子布线部分，形成在端子布线部分的前端并连接到压电元件的端子主体部分，该压电元件布置成面对 端子主体部分和由支撑金属层制成的端子弯曲器沿着端子布线部分的一部分沿其延伸方向布置，并且塑性变形以在端子布线部分的部分中形成弯曲部 使端子主体靠近压电元件。

公开(公告)号：US20150329371A1

公开(公告)日：2015-11-19

申请号：US14661595

申请日：2015-03-18

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Yoichi KUROSAWA ,  Masashi OOTA ,  Shunpei YAMAZAKI

IPC: C01G19/00 ,  C01G15/00 ,  H05K1/18 ,  H01L29/24 ,  H01L29/786

CPC classification number: C01G15/00 ,  C01G15/006 ,  C01G19/006 ,  C01P2002/70 ,  C01P2002/72 ,  C01P2004/04 ,  H01L27/1225 ,  H01L29/24 ,  H01L29/78648 ,  H01L29/7869 ,  H01L29/78696 ,  H05K1/182 ,  H05K2201/10037 ,  H05K2201/10083

Abstract: The oxide includes indium, an element M, and zinc. The oxide includes a first region and a second region. A peak of diffraction intensity derived from a crystal structure is not observed in the first region using X-ray. An electron diffraction pattern including a third region with high luminance in a ring pattern and a spot in the third region is observed by transmission of an electron beam having a probe diameter of 0.3 nm or more and 3 nm or less through the second region. The oxide includes a crystal part when being observed with a transmission electron microscope.

Abstract translation: 氧化物包括铟，元素M和锌。 氧化物包括第一区域和第二区域。 在使用X射线的第一区域中没有观察到从晶体结构得到的衍射强度的峰值。 通过第二区域透射具有0.3nm以上且3nm以下的探针直径的电子束，观察包括环状图案中的高亮度的第3区域和第3区域的点的电子衍射图案。 当用透射电子显微镜观察时，氧化物包括晶体部分。

公开(公告)号：US20150311423A1

公开(公告)日：2015-10-29

申请号：US14439111

申请日：2013-12-17

Applicant: KYOCERA CORPORATION

Inventor： Michiya MURAKAMI

IPC: H01L41/047 ,  H01L41/083

CPC classification number: H01L41/0475 ,  H01L41/083 ,  H04R17/00 ,  H04R2499/11 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/10083 ,  H05K2201/2009

Abstract: There are provided a piezoelectric actuator having reduced noise caused by the vibration of a piezoelectric element is reduced, a piezoelectric vibration apparatus and a portable terminal. A piezoelectric actuator includes a piezoelectric element which includes a stacked body in which internal electrodes and piezoelectric layers are laminated, and a surface electrode disposed on one main surface of the stacked body so as to be electrically connected to the internal electrodes; and a flexible substrate electrically joined to the surface electrode; and a reinforcing plate fixedly attached to a region of the flexible substrate where the flexible substrate overlaps with the piezoelectric element, the reinforcing plate being provided with a bend portion.

Abstract translation: 提供了一种由压电元件的振动引起的噪声减小的压电致动器，压电振动装置和便携式终端。 压电致动器包括压电元件，该压电元件包括​​层叠有内部电极和压电层的层叠体，以及设置在层叠体的一个主表面上以与内部电极电连接的表面电极; 以及电连接到所述表面电极的柔性基板; 以及加强板，其固定地附接到所述柔性基板的与所述压电元件重叠的区域，所述加强板设置有弯曲部。

公开(公告)号：US09148956B2

公开(公告)日：2015-09-29

申请号：US13868471

申请日：2013-04-23

Applicant: Seiko Epson Corporation

Inventor： Naohiro Nakagawa

IPC: H05K1/11 ,  H05K3/10 ,  H05K3/40 ,  H05K3/42 ,  H03H9/05 ,  H03H9/10 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K1/115 ,  H01L2224/16225 ,  H03H9/0514 ,  H03H9/1021 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/0029 ,  H05K3/4038 ,  H05K3/426 ,  H05K2201/017 ,  H05K2201/09563 ,  H05K2201/10083 ,  H05K2203/085 ,  H05K2203/107 ,  H05K2203/1147 ,  Y10T29/49165

Abstract: A base substrate includes an insulator board comprising through holes penetrating between two opposed principal surfaces, penetrating electrodes provided within the through holes, and intermediate layers sandwiched between inner surfaces of the through holes and the penetrating electrodes and having surfaces with smaller concavities and convexities than those of the inner surfaces at the penetrating electrode sides.

Abstract translation: 基底基板包括绝缘体板，该绝缘体板包括穿过两个相对的主表面之间的通孔，设置在通孔内的穿透电极以及夹在通孔和穿透电极的内表面之间的中间层，并且具有比那些 的穿透电极侧的内表面。

公开(公告)号：US20150022978A1

公开(公告)日：2015-01-22

申请号：US13946359

申请日：2013-07-19

Applicant: Motorola Mobility LLC

Inventor： Paul R. Steuer ,  Patrick J. Cauwels

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02

CPC classification number: H05K1/144 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/1688 ,  H04M1/026 ,  H04M1/035 ,  H05K1/0203 ,  H05K1/0278 ,  H05K1/145 ,  H05K3/3494 ,  H05K3/366 ,  H05K9/0035 ,  H05K2201/046 ,  H05K2201/047 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/10053 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2203/1105 ,  H05K2203/1115

Abstract: A circuit assembly (1800) includes a first circuit substrate (1200) defining a first major face (1201) and a second circuit substrate (1500) defining a second major face (1502). A plurality of electrical components (1203,1204,1205) can be disposed on one or more of the first major face or the second major face. One or more substrate bridging members (1301,1302,1303,1304) are disposed between the first circuit substrate and the second circuit substrate. Each substrate bridging member can define a unitary structure having a first end bonded to the first major face and a second end bonded to the second major face to bridge the first circuit substrate and the second circuit substrate.

公开(公告)号：US20150009549A1

公开(公告)日：2015-01-08

申请号：US14382724

申请日：2013-02-11

Applicant: Lemoptix SA

Inventor： Faouzi Khechana ,  Nicolas Abele

IPC: G02B26/08 ,  G02B26/10 ,  G02B7/182

CPC classification number: G02B26/085 ,  B81B7/007 ,  B81B2201/042 ,  B81B2207/098 ,  B81C1/00214 ,  B81C1/00873 ,  B81C3/005 ,  B81C2203/054 ,  B81C2203/057 ,  G02B7/1821 ,  G02B26/0833 ,  G02B26/105 ,  G03B21/008 ,  H01L2224/48091 ,  H01L2924/1461 ,  H05K1/0269 ,  H05K1/0281 ,  H05K1/118 ,  H05K1/189 ,  H05K3/328 ,  H05K3/34 ,  H05K2201/083 ,  H05K2201/10083 ,  H05K2203/049 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A MEMS micro-mirror assembly (250, 300, 270, 400) comprising, a MEMS device (240) which comprises a MEMS die (241) and a magnet (231); a flexible PCB board (205) to which the MEMS device (240) is mechanically, and electrically, connected; wherein the flexible PCB board (205) further comprises a first extension portion (205b) which comprises a least one electrical contact (259a,b) which is useable to electrically connect the MEMS micro-mirro rassembly (250, 300, 270, 400) to another electrical component). There is further provided a projection system comprising such a MEMS micro-mirror assembly (250, 300, 270, 400).

Abstract translation: 包括MEMS器件（240）的MEMS微反射镜组件（250,3300,270,400），其包括MEMS管芯（241）和磁体（231）; MEMS器件（240）机械地并电连接到的柔性PCB板（205）; 其中所述柔性PCB板还包括第一延伸部分（205b），所述第一延伸部分包括至少一个电触点（259a，b），所述至少一个电触头可用于电连接所述MEMS微镜组件（250,300,270,400） 到另一个电气部件）。 还提供了一种包括这种MEMS微镜组件（250,300,270,400）的投影系统。

公开(公告)号：US20140290390A1

公开(公告)日：2014-10-02

申请号：US14243563

申请日：2014-04-02

Applicant: Arizona Board of Regents, a Body Corporate of the State of Arizona, Action for and on Behalf of AZ

Inventor： Oliver Graudejus ,  James Abbas

IPC: G01L1/22 ,  H05K3/28

CPC classification number: H05K3/284 ,  G01L1/2287 ,  H01C10/106 ,  H05K1/0283 ,  H05K1/0293 ,  H05K3/4676 ,  H05K2201/0133 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0317 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/49004 ,  Y10T29/49155

Abstract: Embodiments of a resistive microcracked pressure sensor having a metal stack with a metallic conductor encapsulated within an elastomer substrate and related method of manufacture are disclosed. During manufacture, the metallic conductor forms a plurality of microcracks that increase the overall resistance of the metallic conductor. The microcracks in the metallic conductor allow greater magnitudes of normal and shear forces to be applied to the pressure sensor without fracturing metallic conductor.

Abstract translation: 公开了具有金属叠层的电阻式微裂纹压力传感器的实施例，该金属叠层封装在弹性体基板内的金属导体和相关的制造方法。 在制造过程中，金属导体形成多个微裂纹，增加金属导体的整体电阻。 金属导体中的微裂纹允许更大的正常和剪切力被施加到压力传感器而不会破坏金属导体。

公开(公告)号：US08804363B2

公开(公告)日：2014-08-12

申请号：US13683997

申请日：2012-11-21

Applicant: Apple Inc.

Inventor： Jahan Minoo ,  Anthony P. N. Bidmead ,  Michael Nikkhoo

IPC: H05K1/18 ,  H04R1/02 ,  H04R1/04

CPC classification number: H05K1/183 ,  H04R1/025 ,  H04R1/04 ,  H05K1/02 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/0919 ,  H05K2201/10053 ,  H05K2201/10083 ,  H05K2201/10356 ,  H05K2201/10446

Abstract: Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board substrate may have grooves and buried channels in which wires may be mounted. Recesses may be provided with solder pads to which the wires may be soldered or attached with conductive adhesive. An integrated switch may be provided in an opening within a printed circuit board substrate. The integrated switch may have a dome switch member that is mounted within the opening. A cover member for the switch may be formed from a flexible layer that covers the dome switch member. Terminals for the integrated switch may be formed from conductive structures in an interior printed circuit board layer. Interconnects may be used to electrically connect embedded components such as switches, integrated circuits, solder pads for wires, and other devices.

Abstract translation: 印刷电路板配有嵌入式组件。 嵌入式部件可以安装在印刷电路板基板的表面中的凹部内。 印刷电路板基板可以具有可以安装电线的凹槽和埋入通道。 凹部可以设置有焊料，焊丝可以焊接或者用导电粘合剂附着。 集成开关可以设置在印刷电路板基板的开口内。 集成开关可以具有安装在开口内的圆顶开关构件。 用于开关的盖构件可以由覆盖圆顶开关构件的柔性层形成。 集成开关的端子可以由内部印刷电路板层中的导电结构形成。 互连可用于电连接嵌入式组件，例如开关，集成电路，电线焊盘和其他设备。

公开(公告)号：US20140184019A1

公开(公告)日：2014-07-03

申请号：US14176392

申请日：2014-02-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Syuji YAMATO

IPC: H01L41/053

CPC classification number: H01L41/053 ,  H03H9/0576 ,  H03H9/725 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/10083

Abstract: A circuit module and a composite circuit module, which suppress or prevent damage to a connection to or within a device when heat is applied, includes a SAW filter including a piezoelectric substrate. In a package substrate that is a resin substrate, the SAW filter is mounted. A mounting substrate is a multilayer substrate mounted on a mother substrate, and the package substrate is mounted therein.

Abstract translation: 在施加热量时抑制或防止对器件的连接的损坏的电路模块和复合电路模块包括具有压电基板的SAW滤波器。 在作为树脂基板的封装基板中，安装SAW滤波器。 安装基板是安装在母基板上的多层基板，其中安装有封装基板。