公开(公告)号：US20060120005A1

公开(公告)日：2006-06-08

申请号：US11272941

申请日：2005-11-14

Applicant: Robert Van Sickle

Inventor： Robert Van Sickle

IPC: H02H9/06

CPC classification number: H05K1/0262 ,  H02H9/044 ,  H05K1/0231 ,  H05K1/18 ,  H05K2201/10022 ,  H05K2201/10174 ,  H05K2201/10181

Abstract: A surge-suppression system utilizing a hybrid design comprised of metal oxide varistors, silicon avalanche diodes, a fuse element, filter capacitor and multiple surge planes and surge paths to dissipate and divert transient over-voltages away from sensitive electronic equipment. These multiple surge conduction paths provide redundant parallel planes which optimize the skin-effect phenomena, which is the flow of electrical current at the conductor surface. This design provides a very low impedance which produces a high performance surge-suppression system.

Abstract translation: 浪涌抑制系统利用由金属氧化物变阻器，硅雪崩二极管，熔丝元件，滤波电容器和多个浪涌平面以及浪涌路径组成的混合设计，以消除和转移远离敏感电子设备的瞬态过电压。 这些多个浪涌传导路径提供冗余的平行平面，其优化皮肤效应现象，即导体表面处的电流的流动。 该设计提供非常低的阻抗，产生高性能浪涌抑制系统。

公开(公告)号：US20050017337A1

公开(公告)日：2005-01-27

申请号：US10622461

申请日：2003-07-21

Applicant: Cherng-Chiao Wu

Inventor： Cherng-Chiao Wu

IPC: H01L25/10 ,  H05K1/14 ,  H05K1/18 ,  H01L23/02

CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/182 ,  H05K2201/049 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/10174 ,  H05K2201/10515 ,  H01L2924/00

Abstract: An apparatus for stacking a plurality of integrated circuit assemblies includes a connection substrate for soldering the integrated circuit assemblies. The substrate has a carved out frame structure or a cavity in the center that has a dimension matching the integrated circuit assemblies. There are solder spots or through holes located on the periphery of the frame structure or cavity. The solder spots may be located on one side or two sides of the substrate. The one side solder spots are electrically connected to other substrate surface through leads or conductive through holes. The integrated circuit assemblies are sunken in the frame structure or cavity. The legs of the assemblies are connected to the solder spots. Thus the assemblies are stacked over one another in a layer fashion to form a final assembly package.

Abstract translation: 用于堆叠多个集成电路组件的装置包括用于焊接集成电路组件的连接基板。 基板具有雕刻出的框架结构或中心具有与集成电路组件匹配的尺寸的空腔。 存在位于框架结构或空腔周边的焊点或通孔。 焊点可以位于衬底的一侧或两侧。 单面焊点通过引线或导电通孔电连接到其它衬底表面。 集成电路组件在框架结构或空腔中凹陷。 组件的腿部连接到焊点。 因此，组件以层的方式彼此堆叠以形成最终的组装包装。

公开(公告)号：US20040159461A1

公开(公告)日：2004-08-19

申请号：US10778114

申请日：2004-02-17

Applicant: DENSO CORPORATION

Inventor： Keiichi Kato ,  Tamotsu Morishima

IPC: H05K001/00

CPC classification number: B60R16/0239 ,  H05K1/141 ,  H05K3/103 ,  H05K3/284 ,  H05K3/3447 ,  H05K2201/09754 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10287 ,  H05K2203/1316

Abstract: In a vehicle electronic control unit, a power device and a circuit component, which structure a circuit in which current flows when the power device is driven, and a printed board are disposed within an aluminum case as a housing. Both the power device and the circuit component are disposed within a resin mold unit in a state where both the power device and the circuit component are wired so that a loop circuit is structured as a current path. Both the power device and the circuit component are mounted on the printed board by using a connection terminal which protrudes from the resin mold unit. According to the vehicle electronic control unit, noise and efficiency of the circuit can be improved because a loop of large current can be reduced.

Abstract translation: 在车载电子控制单元，动力装置和电路部件中，其构成电力装置被驱动时电流流动的电路，印刷电路板设置在作为外壳的铝外壳内。 功率器件和电路部件在电力设备和电路部件都被布线的状态下设置在树脂模具单元内，使得环路电路被构造为电流路径。 通过使用从树脂模具单元突出的连接端子将功率器件和电路部件两者安装在印刷电路板上。 根据车辆电子控制单元，可以提高电路的噪声和效率，因为可以减小大电流回路。

公开(公告)号：US20040001327A1

公开(公告)日：2004-01-01

申请号：US10452455

申请日：2003-06-03

Inventor： Kazuyuki Nagata

IPC: H05K007/02 ,  H05K007/06 ,  H05K007/08 ,  H05K007/10

CPC classification number: H05K1/0266 ,  H05K1/0295 ,  H05K1/18 ,  H05K2201/09936 ,  H05K2201/09954 ,  H05K2201/10015 ,  H05K2201/10174 ,  H05K2201/10204 ,  H05K2201/10522 ,  H05K2203/168

Abstract: Disclosed is a foolproof polarity indication of poled electronics parts or devices to be given to a printed circuit board to assure that poled electronics parts and/or devices be correctly mounted in respect of their polarities to meet occasional requirements dependent on different specifications. Each pair of terminal holes are allotted to a given poled electronics part or device. Two symbols representative of such electronics part or device are arranged side by side on either side of the line drawn from one to the other terminal hole. The poled electronics part or device symbols are of reversed polarities. This dual symbol arrangement is effective to draw workers' attention in mounting electrode components in terms of their polarities. When extra components or dummy ones are combined with such a poled component, they are encircled by a boundary line, thereby showing the correct polarity direction of the poled component in respect of whether it is enclosed or not.

Abstract translation: 公开了一种给予印刷电路板的极化电子部件或装置的绝对极性指示，以确保极化的电子部件和/或设备在其极性方面被正确地安装，以满足取决于不同规格的偶尔要求。 每对端子孔分配给给定的极化电子部件或器件。 代表这种电子部件或装置的两个符号被并排地布置在从一个端子孔到另一个端子孔的线的任一侧上。 极化的电子部件或器件符号具有相反的极性。 这种双重符号排列是有效的吸引工作人员注意安装电极组件的极性方面。 当额外的元件或虚拟元件与这种极化元件组合时，它们被边界线包围，从而显示极限元件的正确极性方向是否被封闭。

公开(公告)号：US06665170B1

公开(公告)日：2003-12-16

申请号：US10177095

申请日：2002-06-21

Applicant: Bryan T. Warner ,  Matthew W. Thomas ,  Michael J. McCarthy

Inventor： Bryan T. Warner ,  Matthew W. Thomas ,  Michael J. McCarthy

IPC: H05B508

CPC classification number: H05K3/0052 ,  H01L25/0753 ,  H01L2924/0002 ,  H05K1/0286 ,  H05K1/18 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09972 ,  H05K2201/10106 ,  H05K2201/10174 ,  H01L2924/00

Abstract: A light emitting diode illumination system comprises a printed circuit board with score lines allowing a user to break the board into segments. The segments are a plurality of printed circuit boards provided with electrical elements. The electrical elements include light emitting diodes, a plurality of resistors and a zener diode. The zener diode has an associated capacitor and a plurality of associated rectifying diodes. The rectifying diodes convert AC to DC. Two pairs of electrical contacts are provided. Either pair is capable of coupling the electrical elements to a source of electrical potential to illuminate the light emitting diodes with minimum current while generating minimum heat.

Abstract translation: 发光二极管照明系统包括具有允许用户将板断裂成分段的刻痕线的印刷电路板。 这些段是设置有电气元件的多个印刷电路板。 电气元件包括发光二极管，多个电阻器和齐纳二极管。 齐纳二极管具有相关联的电容器和多个相关联的整流二极管。 整流二极管将AC转换为DC。 提供两对电触点。 任一对都能够将电气元件耦合到电势源，以最小的电流照射发光二极管，同时产生最小的热量。

公开(公告)号：US20020154492A1

公开(公告)日：2002-10-24

申请号：US09876315

申请日：2001-06-07

Inventor： Kai Hung Huang ,  Yi Hwa Hsieh ,  Kun-Feng Chen

IPC: H05K001/11

CPC classification number: H05K1/148 ,  H05K1/0306 ,  H05K1/056 ,  H05K1/141 ,  H05K3/36 ,  H05K3/368 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10287 ,  H05K2201/10318 ,  H05K2201/10477

Abstract: An assembling structure of electronic devices for an electronic product is provided. The assembling structure includes a first circuit board, a second circuit board having higher thermal conductivity than the first circuit board and at least one high-power electronic device mounted thereon, and a connecting element for electrically coupling the first circuit board with the second circuit board.

Abstract translation: 提供了一种用于电子产品的电子设备的组装结构。 组装结构包括第一电路板，具有比第一电路板更高的导热性的第二电路板和安装在其上的至少一个大功率电子器件，以及用于将第一电路板与第二电路板电耦合的连接元件 。

公开(公告)号：US06185105B2

公开(公告)日：2001-02-06

申请号：US09129998

申请日：1998-08-06

Applicant: Yoshitaka Inoguchi

Inventor： Yoshitaka Inoguchi

IPC: H05K702

CPC classification number: H05K1/0259 ,  H05K1/0254 ,  H05K1/116 ,  H05K1/18 ,  H05K3/3442 ,  H05K3/3447 ,  H05K3/3452 ,  H05K9/0067 ,  H05K2201/0989 ,  H05K2201/10022 ,  H05K2201/10174 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611

Abstract: In a printed circuit board, electronic components such as a component having a pair of leading portions, a chip component having a pair of electrodes, and the like, are connected to circuit patterns; and a resist layer covering a copper foil portion formed as a ground pattern is removed in vicinity of the high-impedance side leading portion of the current leading component and the high-impedance side electrode of the chip component to thereby form removed portions so that discharge paths are formed between the copper foil portion exposed through the removed portions and the leading portion and the electrode.

Abstract translation: 在印刷电路板中，诸如具有一对引导部分的部件，具有一对电极的芯片部件等的电子部件连接到电路图案; 并且在芯片部件的电流引导部件和高阻抗侧电极的高阻抗侧引出部分附近除去覆盖形成为接地图案的铜箔部分的抗蚀剂层，从而形成去除部分，使得放电 在通过去除部分露出的铜箔部分与引导部分和电极之间形成通路。

公开(公告)号：US5706160A

公开(公告)日：1998-01-06

申请号：US577548

申请日：1995-12-22

Applicant: Walter Latuszkin ,  Mohammad Masghati ,  Dorothy E. Kruglick

Inventor： Walter Latuszkin ,  Mohammad Masghati ,  Dorothy E. Kruglick

IPC: H02H9/04 ,  H04M3/18 ,  H05K1/02 ,  H05K1/18 ,  H02H9/06

CPC classification number: H02H9/044 ,  H04M3/18 ,  H05K1/0257 ,  H05K1/0254 ,  H05K1/0259 ,  H05K1/18 ,  H05K2201/09672 ,  H05K2201/10174 ,  H05K2201/10371 ,  Y10T307/786

Abstract: A surge protector module for protecting telecommunications equipment from power and transient surges includes a two-piece interfitting housing, a printed circuit board, a plurality of circuit surge protector devices mounted on the printed circuit board, an input connector connected to a first side of the printed circuit board, and an output connector connected to a second side of the printed circuit board. The printed circuit board includes a unique pattern of conductive traces for use in association with the electrical components of the protector devices so as to meet the TIA's Category 5 specification for connectors. As a result, the bandwidth of the protector module has been extended.

Abstract translation: 用于保护电信设备免受电力和瞬态浪涌的浪涌保护器模块包括两件式对接壳体，印刷电路板，安装在印刷电路板上的多个电路电涌保护器装置，连接到第一侧的输入连接器 印刷电路板和连接到印刷电路板的第二侧的输出连接器。 印刷电路板包括与保护器装置的电气部件相关联使用的导电迹线的独特图案，以便符合TIA针对连接器的5类规格。 结果，保护模块的带宽已经扩展。

公开(公告)号：US4979090A

公开(公告)日：1990-12-18

申请号：US448314

申请日：1989-12-11

Applicant: John Huss ,  Richard J. Hoppe ,  Lawrence E. Crowe ,  Thomas Sutrina ,  Eric D. Lakin

Inventor： John Huss ,  Richard J. Hoppe ,  Lawrence E. Crowe ,  Thomas Sutrina ,  Eric D. Lakin

IPC: H05K1/02 ,  H05K1/16 ,  H05K3/00

CPC classification number: H05K1/0265 ,  H05K1/0203 ,  H05K1/16 ,  H05K1/167 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K3/0061

Abstract: Prior power converters have utilized discrete components mounted on circuit boards of different design. Failure of one or more of the components requires the components to be separately tested to determine which is faulty. The faulty component or the board containing same must then be replaced. This results in significant down time for the inverter and can require stocking of a large number of specialized boards. In order to overcome these problems, an inverter is assembled using a series of circuit boards of standardized type. Each circuit board includes separate layers which interconnect components mounted thereon together with a heat exchanger which cools high power components. When a malfunction of a component occurs, the entire board may be replaced so that inverter down time is minimized. Also, the use of standardized boards reduces stocking requirements and inventory costs.

公开(公告)号：US4975824A

公开(公告)日：1990-12-04

申请号：US448313

申请日：1989-12-11

Applicant: John Huss ,  Richard J. Hoppe ,  Lawrence E. Crowe ,  Thomas Sutrina ,  Eric D. Lakin

Inventor： John Huss ,  Richard J. Hoppe ,  Lawrence E. Crowe ,  Thomas Sutrina ,  Eric D. Lakin

IPC: H01R12/70 ,  H02K11/04 ,  H02M7/00 ,  H05K1/02 ,  H05K1/16

CPC classification number: H05K1/0265 ,  H01R12/7076 ,  H02K11/046 ,  H02M7/003 ,  H05K1/0203 ,  H05K1/167 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10174

Abstract: Prior power converters have utilized discrete components mounted on circuit boards of different design. Failure of one or more of the components requires the components to be separately tested to determine which is faulty. The faulty component or the board containing same must then be replaced. This results in significant down time for the inverter and can require stocking of a large number of specialized boards. In order to overcome these problems, an inverter is assembled using a series of circuit boards of standardized type. Each circuit board includes separate layers which interconnect components mounted thereon together with a heat exchanger which cools high power components. When a malfunction of a component occurs, the entire board may be replaced so that inverter down time is minimized. Also, the use of standardized boards reduces stocking requirements and inventory costs.

Abstract translation: 现有的电源转换器已经使用安装在不同设计的电路板上的分立元件。 一个或多个组件的故障需要单独测试组件以确定哪些组件有故障。 必须更换有故障的部件或包含相同的部件。 这导致逆变器的显着的停机时间，并且可能需要放置大量的专用板。 为了克服这些问题，使用一系列标准化的电路板组装逆变器。 每个电路板包括将安装在其上的组件与冷却高功率组件的热交换器互连的单独的层。 当组件发生故障时，可以更换整个电路板，从而使逆变器停机时间最小化。 此外，使用标准化板材可减少库存需求和库存成本。