公开(公告)号：US07674117B2

公开(公告)日：2010-03-09

申请号：US10827593

申请日：2004-04-19

Applicant: Jay C. Sinnett ,  Arthur R. Metcalf

Inventor： Jay C. Sinnett ,  Arthur R. Metcalf

IPC: H01R4/58

CPC classification number: H01R43/0256 ,  B29D2030/0072 ,  B29D2030/0083 ,  B60C23/0452 ,  B60C23/0493 ,  H01R4/02 ,  H01R4/20 ,  H01R13/58 ,  H01R13/5808 ,  H01R13/5845 ,  H01R2201/02 ,  H01R2201/26 ,  H05K3/301 ,  H05K3/305 ,  H05K3/3421 ,  H05K2201/0133 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2203/1194 ,  Y10S439/947

Abstract: A strain-resistant electrical connection and a method of making the same is provided. A wire or other conductive lead is connected to a circuit in a manner that makes the connection more resistant to mechanical stresses such as movement or rotation of the lead relative to the circuit. A material is configured around the lead and near the point of connection to the circuit so as to create a region of decreasing flexibility or graduated stiffness near the point of connection. In certain embodiments, the lead may also be coiled or otherwise shaped to provide additional ability to withstand mechanical stresses.

Abstract translation: 提供耐应变电气连接及其制造方法。 电线或其他导电引线以使得连接更能抵抗机械应力（例如引线相对于电路的移动或旋转）的方式连接到电路。 材料围绕引线构造并且靠近与电路的连接点，以便在连接点附近产生降低的柔性或渐变刚度的区域。 在某些实施例中，引线也可以被卷绕或以其他方式成形，以提供额外的承受机械应力的能力。

公开(公告)号：US20090250154A1

公开(公告)日：2009-10-08

申请号：US12411254

申请日：2009-03-25

Applicant: Shinichi NAGANO ,  Shin YOSHIDA

Inventor： Shinichi NAGANO ,  Shin YOSHIDA

IPC: B29C65/06 ,  B32B37/06

CPC classification number: H01R43/0214 ,  H01L23/49811 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/81201 ,  H01L2224/81206 ,  H01L2224/81222 ,  H01L2224/81234 ,  H01L2224/81385 ,  H01L2224/81464 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19042 ,  H01R13/2421 ,  H05K3/326 ,  H05K3/4015 ,  H05K3/42 ,  H05K2201/0311 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/10265 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T156/10 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2224/83851 ,  H01L2924/00

Abstract: A connection electrode that is formed of solder on an electronic component side and a tip portion of an elastic contact contact each other at a contact portion. Regarding the elastic contact, a resistive layer is formed in the tip portion, and the tip portion is placed in a clearance of an induction coil. When a predetermined high-frequency current is passed through the induction coil, electromagnetic induction causes the resistive layer to generate heat. Solder that forms the connection electrode is melt, and flows onto the tip portion of the elastic contact. Thus, the tip portion of the elastic contact and the connection electrode can be strongly bonded together at the contact portion that is a single point therebetween.

Abstract translation: 由电子部件侧的焊料形成的连接电极和弹性接触的前端部在接触部分处相互接触。 关于弹性接触，在前端部形成电阻层，将前端部配置在感应线圈的间隙内。 当预定的高频电流通过感应线圈时，电磁感应使电阻层产生热量。 形成连接电极的焊料熔化，并流到弹性接触件的前端部。 因此，弹性接触件的顶端部分和连接电极可以在它们之间的单点的接触部分处牢固地结合在一起。

公开(公告)号：US20090205191A1

公开(公告)日：2009-08-20

申请号：US12032748

申请日：2008-02-18

Applicant: Ting-Jui Wang ,  Ming-De Wu

Inventor： Ting-Jui Wang ,  Ming-De Wu

IPC: B23P11/00

CPC classification number: H05K1/182 ,  H05K3/3447 ,  H05K2201/10265 ,  H05K2201/10409 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49947

Abstract: A packaging method for assembling a screw to a printed circuit board (PCB) includes the steps of: providing a screw having a head, a threaded shank, and a ferrule enclosing the threaded shank; mounting a stop ring on the threaded shank to maintain a predetermined height from top of the head to bottom of the ferrule; using a tool to fetch the screw and align the threaded shank with one through hole provided on the PCB; releasing the screw from the tool for a flange of the ferrule to extend into the through hole on the PCB; heating to melt a solder layer atop of the PCB, so that the ferrule is fixedly held to the PCB when the molten solder layer is cooled and hardened again; and removing the stop ring so that the threaded shank is retracted into the ferrule.

Abstract translation: 用于将螺钉组装到印刷电路板（PCB）的包装方法包括以下步骤：提供具有头部，螺纹柄和包围螺纹柄的套圈的螺钉; 在所述螺纹柄上安装止动环以保持从头部的顶部到所述套圈的底部的预定高度; 使用工具取出螺丝，并将螺纹柄与PCB上提供的一个通孔对准; 从工具上释放螺丝以使套圈的凸缘延伸到PCB上的通孔中; 加热以在PCB的顶部熔化焊料层，使得当熔融焊料层再次冷却和硬化时，套圈固定地保持在PCB上; 并且移除止动环，使得螺纹杆缩回到套圈中。

公开(公告)号：US07518275B2

公开(公告)日：2009-04-14

申请号：US10547672

申请日：2004-03-02

Applicant: Toshio Suzuki ,  Minoru Ueda ,  Tsuyoshi Takano

Inventor： Toshio Suzuki ,  Minoru Ueda ,  Tsuyoshi Takano

IPC: B06B1/04 ,  B06B1/16 ,  H02K7/065 ,  H02K5/22

CPC classification number: H02K5/225 ,  B06B1/045 ,  H02K5/00 ,  H02K7/061 ,  H02K2211/03 ,  H05K3/325 ,  H05K2201/10083 ,  H05K2201/10265

Abstract: In order to improve the reliability of an electrical connection between a power supply terminal of a vibrator and an electrode of a circuit board and to improve the efficiency of mounting the vibrator on the circuit board, the power supply terminal is made from a torsion coil spring and a contact portion of the power supply terminal in contact with the electrode of the circuit board is formed by winding. In addition, a torsion coil spring portion is wound around a spindle pin and a housing is provided with a step portion as a space for accommodating the contact portion without interference and a plane portion to which the contact portion faces. Moreover, a partition plate is provided between a pair of power supply terminals or a space where the contact portion can be elastically deformed is surrounded by a box member, a pair of power supply terminals having positive and negative polarities are extended in a bilaterally symmetric direction from torsion coil spring portions to the contact portions, and the power supply terminals are constructed so as to be elastically deformed to allow each contact portion to reach the outside of each torsion coil spring portion.

Abstract translation: 为了提高振动器的电源端子和电路板的电极之间的电连接的可靠性，并且提高将振动器安装在电路板上的效率，电源端子由扭转螺旋弹簧 并且通过绕组形成与电路板的电极接触的电源端子的接触部分。 此外，扭转螺旋弹簧部分缠绕在心轴销上，并且壳体设置有台阶部分作为用于容纳接触部分而没有干涉的空间和接触部分面向的平面部分。 此外，在一对电源端子之间设置有隔板，或者可以使弹性变形的空间被盒构件包围，具有正极性和负极性的一对电源端子以双向对称的方向延伸 从扭转螺旋弹簧部分到接触部分，并且电源端子被构造成弹性变形，以允许每个接触部分到达每个扭转螺旋弹簧部分的外部。

公开(公告)号：US20090053911A1

公开(公告)日：2009-02-26

申请号：US12254608

申请日：2008-10-20

Applicant: Takashi KARIYA ,  Toshiki Furutani ,  Takeshi Kawanishi

Inventor： Takashi KARIYA ,  Toshiki Furutani ,  Takeshi Kawanishi

IPC: H01R12/02

CPC classification number: H05K3/4015 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/72 ,  H01L24/78 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/838 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/326 ,  H05K3/341 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T29/49135 ,  Y10T29/49142 ,  Y10T29/49149 ,  Y10T29/49153 ,  H01L2224/13099 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2224/48 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).

公开(公告)号：US20090047843A1

公开(公告)日：2009-02-19

申请号：US11909400

申请日：2006-03-17

Applicant: Taiji Okamoto ,  Akira Watanabe

Inventor： Taiji Okamoto ,  Akira Watanabe

IPC: H01R13/24

CPC classification number: H05K3/4092 ,  G01R1/06716 ,  H01L24/72 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01R12/57 ,  H01R12/714 ,  H01R13/2421 ,  H05K3/326 ,  H05K3/42 ,  H05K2201/0397 ,  H05K2201/10265

Abstract: [Object] To provide a spiral contactor that has a spiral-shaped elastic arm having a stable elastic function and less unevenness, and is easy to manufacture.[Solving Means] An elastic arm 3 composed of an electrically conductive material such as copper or the like is formed in a spiral shape from a base end 4 substantially up to spiral end normal Oθ and the portion forward thereof is sharply bent so that a tip 5 is located substantially in the center. The elastic arm 3 can elastically deform in a long range and exert a stable elastic force. Additionally, this spiral contactor is easily manufactured by an etching process or the like, as a wide space is formed between elastic arm portions of a spiral shape.

Abstract translation: 本发明提供一种螺旋接触器，其具有具有稳定的弹性功能和较小的不均匀性的螺旋形弹性臂，并且易于制造。 [解决方案]由诸如铜等的导电材料构成的弹性臂3从大致直到螺旋端正常Othta的基端4形成为螺旋状，并且其前方部分被急剧弯曲，使得尖端 5基本位于中心。 弹性臂3能够在长范围内弹性变形，发挥稳定的弹力。 此外，由于在螺旋形状的弹性臂部之间形成宽的空间，因此通过蚀刻工艺等容易地制造该螺旋接触器。

公开(公告)号：US20080264899A1

公开(公告)日：2008-10-30

申请号：US12170272

申请日：2008-07-09

Applicant: Yung-Yu HSU ,  Shyi-Ching Liau ,  Ra-Min Tain ,  Jr-Yuan Jeng

Inventor： Yung-Yu HSU ,  Shyi-Ching Liau ,  Ra-Min Tain ,  Jr-Yuan Jeng

IPC: H01B13/00

CPC classification number: H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/742 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05571 ,  H01L2224/111 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/368 ,  H05K2201/10242 ,  H05K2201/10265 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: An interconnect structure with stress buffering ability is disclosed, which comprises: a first surface, connected to a device selected form the group consisting of a substrate and an electronic device; a second surface, connected to a device selected form the group consisting of the substrate and the electronic device; a supporting part, sandwiched between and interconnecting the first and the second surfaces while enabling the areas of the two ends of the supporting part to be small than those of the first and the second surfaces in respective; and a buffer, arranged surrounding the supporting part for absorbing and buffering stresses.

Abstract translation: 公开了具有应力缓冲能力的互连结构，其包括：第一表面，连接到由基板和电子器件组成的组中选择的器件; 第二表面，连接到从由所述基板和所述电子装置组成的组中选择的装置; 支撑部分，夹持在第一和第二表面之间并互相连接，同时使得支撑部分的两个端部的区域相对于第一和第二表面的面积小; 以及缓冲器，其布置成围绕所述支撑部分以吸收和缓冲应力。

公开(公告)号：US20080105963A1

公开(公告)日：2008-05-08

申请号：US11881743

申请日：2007-07-27

Applicant: William Carlson ,  Michael Warner ,  Salvador Tostado ,  John Riley ,  Ronald Green ,  Ilyas Mohammed ,  Michael Nystrom ,  Rolfe Gustus ,  David Baker

Inventor： William Carlson ,  Michael Warner ,  Salvador Tostado ,  John Riley ,  Ronald Green ,  Ilyas Mohammed ,  Michael Nystrom ,  Rolfe Gustus ,  David Baker

IPC: H01L23/02

CPC classification number: H05K1/144 ,  H01L23/49811 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/162 ,  H01L2224/16 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/284 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/10265 ,  H05K2201/2036

Abstract: A stackable chip assembly is disclosed, as are many different embodiments relating to same. The chip assembly preferably includes at least two substrates with components mounted on each. The substrates are preferably situated with respect to one another such that components on one substrate extend towards the other substrate and vice versa. The components of each substrate preferably extend between each other. In addition various connections between the substrates are disclosed, as well as methods of constructing such chip assemblies.

Abstract translation: 公开了可堆叠的芯片组件，与其相关的许多不同的实施例也是公开的。 芯片组件优选地包括至少两个具有安装在其上的部件的基板。 衬底优选地相对于彼此定位，使得一个衬底上的部件朝向另一个衬底延伸，反之亦然。 每个基板的部件优选彼此延伸。 此外，公开了基板之间的各种连接以及构造这种芯片组件的方法。

公开(公告)号：US20070278669A1

公开(公告)日：2007-12-06

申请号：US11756072

申请日：2007-05-31

Applicant: Martin Hierholzer ,  Patrick Baginski ,  Michael Hornkamp ,  Uwe Jansen

Inventor： Martin Hierholzer ,  Patrick Baginski ,  Michael Hornkamp ,  Uwe Jansen

IPC: H01L23/34

CPC classification number: H05K3/325 ,  H01L23/051 ,  H01L23/4006 ,  H01L24/72 ,  H01L25/072 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K2201/10265 ,  H05K2201/10409 ,  H01L2924/00

Abstract: A semiconductor circuit arrangement is disclosed. In one embodiment, a semiconductor module is attached to a board using a screw, with a mechanical and electrical contact being made between module contacts on the semiconductor module and associated board contacts on the board at the same time by attachment using the screw.

Abstract translation: 公开了一种半导体电路装置。 在一个实施例中，使用螺钉将半导体模块附接到板上，通过使用螺钉的附接，在半导体模块上的模块触点和板上的相关板触点之间同时进行机械和电接触。

公开(公告)号：US20070264879A1

公开(公告)日：2007-11-15

申请号：US11433571

申请日：2006-05-15

Applicant: Olof Simonsson ,  Omid Kazemifar ,  Mikael Hall ,  Maiko Karlsson ,  Hakan Petersson

Inventor： Olof Simonsson ,  Omid Kazemifar ,  Mikael Hall ,  Maiko Karlsson ,  Hakan Petersson

IPC: H01R4/48

CPC classification number: H01R12/79 ,  H01R4/4809 ,  H01R4/4881 ,  H01R12/714 ,  H01R43/027 ,  H05K1/118 ,  H05K3/365 ,  H05K2201/056 ,  H05K2201/10265 ,  H05K2201/10386 ,  H05K2201/2027

Abstract: A system includes a rigid electrical device including a first contact, and a flexible electrical device including a second contact. The system further includes a spring clip connecting the first contact to the second contact to electrically interconnect the rigid electrical device to the flexible electrical device.

Abstract translation: 一种系统包括包括第一接触件的刚性电气设备和包括第二接触件的柔性电气设备。 该系统还包括将第一接触件连接到第二接触件的弹簧夹，以将刚性电气设备电连接到柔性电气设备。