公开(公告)号：US06670701B2

公开(公告)日：2003-12-30

申请号：US10000031

申请日：2001-12-04

Applicant: Tetsuya Matsuura ,  Yasushi Kasatani ,  Kazunari Michii ,  Hajime Maeda

Inventor： Tetsuya Matsuura ,  Yasushi Kasatani ,  Kazunari Michii ,  Hajime Maeda

IPC: H01L2302

CPC classification number: H05K1/141 ,  H01L25/105 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/15311 ,  H05K1/144 ,  H05K1/145 ,  H05K1/182 ,  H05K1/183 ,  H05K3/3436 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/09036 ,  H05K2201/10303 ,  H05K2201/10378 ,  H05K2201/10386 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2203/1572

Abstract: A semiconductor module achieving higher density of the semiconductor module itself as well as of being disposed in an area-efficient manner relative to another electronic component, such as a mother board and the like. The semiconductor module includes a mounting substrate having, on an underside, a solder ball for connecting to an interconnection of a mother board and semiconductor packages mounted in multiple layers on the top side of the mounting substrate and connected to electrodes on the mounting substrate.

Abstract translation: 实现半导体模块本身的更高密度以及相对于诸如母板等的其他电子部件以区域有效的方式设置的半导体模块。 该半导体模块包括安装基板，其在下侧具有用于连接到母板和安装在安装基板的顶侧上的多层的半导体封装的互连的焊球，并连接到安装基板上的电极。

公开(公告)号：US06320247B2

公开(公告)日：2001-11-20

申请号：US08818994

申请日：1997-03-17

Applicant: Akira Sakamoto

Inventor： Akira Sakamoto

IPC: H01L2348

CPC classification number: H05K3/4092 ,  H01R12/58 ,  H01R12/721 ,  H01R43/205 ,  H05K3/3405 ,  H05K3/4623 ,  H05K2201/09163 ,  H05K2201/0919 ,  H05K2201/09536 ,  H05K2201/1034 ,  H05K2201/10386 ,  H05K2201/10924

Abstract: There is provided a technique of connecting easily the lead terminal to the board of the module. A plurality of clip lead terminals each has at one end thereof clip portions which are connected electrically to connecting terminals by sandwiching an end portion of a board of a module and the connecting terminals formed thereon between clip members of said clip portions and has a lead portion at the other end thereof. The clip lead terminals are arranged so as to be spaced from one another in parallel with one another with the leading edges of the respective clip portions aligned on a straight line. The clip lead terminals are connected to one another through a tie bar and a guide as a connecting portion, respectively, whereby the connecting clip lead terminal 18 is formed as one-body. The lead portions are bent on every other one, leading end portions of the bent lead portions and leading end portions of the non-bent lead portions are in parallel with each other viewing from a side of the board.

Abstract translation: 提供了将引线端子容易地连接到模块的板的技术。 多个夹子引线端子的一端具有通过夹持模块的板的端部而电连接到连接端子的夹持部分，并且形成在其上的连接端子在所述夹持部分的夹子部件之间并具有引线部分 在另一端。 夹子引线端子被布置成彼此平行地彼此分开，各个夹子部分的前缘在直线上对准。 夹子引线端子分别通过连接杆和引导件彼此连接，由此将连接夹引线端子18形成为一体。 引线部分彼此弯曲，弯曲引线部分的前端部分和非弯曲引线部分的前端部分彼此平行，从板的侧面观察。

公开(公告)号：US06301120B1

公开(公告)日：2001-10-09

申请号：US09493325

申请日：2000-01-28

Applicant: Shiaw-Jong Steve Chen ,  Roger J. Hooey ,  Thang D. Truong

Inventor： Shiaw-Jong Steve Chen ,  Roger J. Hooey ,  Thang D. Truong

IPC: H05K702

CPC classification number: H05K3/445 ,  H05K3/403 ,  H05K3/4608 ,  H05K2201/10386

Abstract: An improved circuit board apparatus configured for mounting electronic components in a circuit arrangement. The apparatus comprises a metal substrate having a first side and a second side, a first-side laminar structure and a second-side laminar structure. The first-side laminar structure includes at least one first-side conductive stratum alternated with at least one first-side dielectric stratum affixed at the first side The second-side laminar structure includes at least one second-side conductive stratum alternated with at least one second-side dielectric stratum affixed at the second side of the metal substrate. The apparatus further comprises a plurality of electrically conductive interside courses intermediate selected first-side strata of the at least one first-side conductive stratum and selected second-side strata of the at least one second-side conductive stratum.

Abstract translation: 一种改进的电路板装置，被配置为将电子部件安装在电路装置中。 该装置包括具有第一侧和第二侧的金属基底，第一侧层状结构和第二侧层状结构。 第一侧层状结构包括至少一个第一侧导电层，该第一侧导电层与固定在第一侧的至少一个第一侧电介质层交替。第二侧层流结构包括至少一个第二侧导电层，其与至少一个 第二侧介电层固定在金属基板的第二面。 所述装置还包括在所述至少一个第一侧导电层的所选择的第一侧层和所述至少一个第二侧导电层的所选择的第二侧层之间的多个导电的中间横列的中间。

公开(公告)号：US06177632B1

公开(公告)日：2001-01-23

申请号：US09183612

申请日：1998-10-30

Applicant: Glynn Russell Ashdown

Inventor： Glynn Russell Ashdown

IPC: H02G308

CPC classification number: H05K9/0022 ,  H05K1/141 ,  H05K3/301 ,  H05K3/3426 ,  H05K3/3447 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/09954 ,  H05K2201/10386

Abstract: A case for an auxiliary circuit board to be mounted on a main circuit board includes a copper sheet formed into a U-shape in which the auxiliary circuit board is mounted. Mounting pins extend from two edges of the case for positioning the auxiliary circuit board perpendicularly to or parallel to the main circuit board. Mounting pins for through hole mounting and support tabs for surface mounting are provided, the unneeded features being removed prior to use of the case.

Abstract translation: 安装在主电路板上的辅助电路板的壳体包括形成为辅助电路板的U形的铜片。 安装销从壳体的两个边缘延伸，以将辅助电路板垂直于或平行于主电路板。 提供了用于通孔安装的安装销和用于表面安装的支撑卡舌，在使用外壳之前，不需要的特征被移除。

公开(公告)号：US5847985A

公开(公告)日：1998-12-08

申请号：US923520

申请日：1997-09-04

Applicant: Hidenori Mitani ,  Masanori Nagahama

Inventor： Hidenori Mitani ,  Masanori Nagahama

IPC: G11C5/00 ,  G11C8/12 ,  H01L25/00 ,  H05K1/14 ,  G11C11/34

CPC classification number: G11C5/06 ,  G11C5/02 ,  G11C5/04 ,  G11C8/12 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10303 ,  H05K2201/10325 ,  H05K2201/1034 ,  H05K2201/10386

Abstract: A memory module comprising a plurality of identical wiring boards stacked in a multi-stage fashion provides with only one decoder mounted on one of the plurality of identical wiring boards and a plurality of inter-pattern connection means arranged on the wiring boards each for selectively connecting a first wiring pattern connected to said output of said decoder and a second wiring pattern connected to said at least one IC memory chip on each wiring board.

Abstract translation: 包括以多级方式堆叠的多个相同的线路板的存储器模块仅提供安装在多个相同的线路板中的一个上的一个解码器，以及布置在每个布线板上的多个图案间连接装置，用于选择性地连接 连接到所述解码器的所述输出的第一布线图案和连接到每个布线板上的所述至少一个IC存储芯片的第二布线图案。

公开(公告)号：US5647121A

公开(公告)日：1997-07-15

申请号：US487821

申请日：1995-06-07

Applicant: Neil McLellan ,  Mike Strittmatter ,  Joseph Patrick Hundt ,  Christopher M. Sells ,  Francis A. Scherpenberg

Inventor： Neil McLellan ,  Mike Strittmatter ,  Joseph Patrick Hundt ,  Christopher M. Sells ,  Francis A. Scherpenberg

IPC: G04G17/02 ,  G11C5/00 ,  H01R33/74 ,  H05K1/14 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K7/10

CPC classification number: H05K7/1046 ,  G04G17/02 ,  H01R12/714 ,  H01R12/721 ,  H05K1/141 ,  H05K2201/10037 ,  H05K2201/10075 ,  H05K2201/10325 ,  H05K2201/10386 ,  H05K2201/10689 ,  H05K3/301 ,  H05K3/3426 ,  H05K3/368 ,  Y10T29/49121 ,  Y10T29/49144

Abstract: A socket system that comprises a printed circuit board; an electrical module; and a socket having a hollow core. The socket holds the electrical module and is capable of electrically coupling the electrical module to the printed circuit board. The electrical module has at least one electrical lead. The socket has at least one electrical lead capable of electrically coupling with the electrical lead(s) of the electrical module. The electrical module comprises a second printed circuit board having a first and second surface; a lithium battery positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, a crystal positioned on the first surface of said second printed circuit board and electrically coupled with the second printed circuit board, and an integrated circuit positioned on the second surface of the second printed circuit board.

Abstract translation: 一种插座系统，包括印刷电路板; 电气模块; 以及具有中空芯的插座。 插座保持电气模块，并且能够将电气模块电连接到印刷电路板。 电气模块具有至少一个电引线。 插座具有能够与电气模块的电引线电耦合的至少一个电引线。 电气模块包括具有第一和第二表面的第二印刷电路板; 位于第二印刷电路板的第一表面上并与第二印刷电路板电耦合的锂电池，位于所述第二印刷电路板的第一表面上并与第二印刷电路板电连接的晶体，以及集成 电路定位在第二印刷电路板的第二表面上。

公开(公告)号：US5579206A

公开(公告)日：1996-11-26

申请号：US304065

申请日：1994-09-12

Applicant: Neil McLellan ,  Mike Strittmatter ,  Joseph P. Hundt ,  Christopher M. Sells ,  Francis A. Scherpenberg

Inventor： Neil McLellan ,  Mike Strittmatter ,  Joseph P. Hundt ,  Christopher M. Sells ,  Francis A. Scherpenberg

IPC: G04G17/02 ,  G11C5/00 ,  H01R33/74 ,  H05K1/14 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K7/10 ,  H05K1/11 ,  H05K1/16

CPC classification number: G04G17/02 ,  H01R12/714 ,  H01R12/721 ,  H05K1/141 ,  H05K7/1046 ,  H05K2201/10037 ,  H05K2201/10075 ,  H05K2201/10325 ,  H05K2201/10386 ,  H05K2201/10689 ,  H05K3/301 ,  H05K3/3426 ,  H05K3/368

Abstract: A socket system that comprises a printed circuit board; an electrical module; and a socket having a hollow core. The socket holds the electrical module and is capable of electrically coupling the electrical module to the printed circuit board. The electrical module has at least one electrical lead. The socket has at least one electrical lead capable of electrically coupling with the electrical lead(s) of the electrical module. The electrical module comprises a second printed circuit board having a first and second surface; a lithium battery positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, a crystal positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, and an integrated circuit positioned on the second surface of the second printed circuit board. A cap extends around and encloses and seals electrical elements of the electrical module. The cap may also have a baffle extending from the cap to surround and secure selected electrical components housed by the cap of the electrical module. The process of providing a printed circuit board, mounting a socket on the printed circuit board, placing the printed circuit board with the socket mounted on it in surface mount reflow oven and heating the printed circuit board and the socket to bond the socket to the printed circuit board, placing a cap over and around an electrical module and bending extended edges of the cap over and around the electrical module to seal electrical components inside the electrical module; and inserting an electrical module with the cap in the socket. If baffles are used, they will need to be aligned with selected electrical component of the electrical module.

Abstract translation: 一种插座系统，包括印刷电路板; 电气模块; 以及具有中空芯的插座。 插座保持电气模块，并且能够将电气模块电连接到印刷电路板。 电气模块具有至少一个电引线。 插座具有能够与电气模块的电引线电耦合的至少一个电引线。 电气模块包括具有第一和第二表面的第二印刷电路板; 位于第二印刷电路板的第一表面上并与第二印刷电路板电耦合的锂电池，位于第二印刷电路板的第一表面上并与第二印刷电路板电连接的晶体，以及集成 电路定位在第二印刷电路板的第二表面上。 盖子围绕并围绕并密封电气模块的电气元件。 盖还可以具有从盖延伸以围绕并固定由电模块的盖容纳的所选电气部件的挡板。 提供印刷电路板的过程，将插座安装在印刷电路板上，将印刷电路板与其上安装的插座放置在表面安装回流炉中，并加热印刷电路板和插座以将插座连接到印刷电路板 将盖子放置在电气模块上并围绕电气模块，并且将盖子的延伸边缘弯曲到电气模块上方和周围，以密封电气模块内部的电气部件; 并将带有盖子的电气模块插入插座。 如果使用挡板，它们将需要与电气模块的选定电气部件对齐。

公开(公告)号：US5569056A

公开(公告)日：1996-10-29

申请号：US503260

申请日：1995-07-17

Applicant: Gerard Raimond

Inventor： Gerard Raimond

IPC: H01L23/498 ,  H01R4/02 ,  H01R12/57 ,  H05K3/34

CPC classification number: H01R12/57 ,  H01L23/49811 ,  H05K3/3405 ,  H01L2924/0002 ,  H05K2201/10386 ,  H05K2201/10984 ,  H05K3/3457

Abstract: An electrical connection device of the type comprising a folded configuration of resilient material adapted to ensure elastic retention and a coating of malleable material to be soldered or brazed adapted to be melted to ensure electrical connection. The coating of malleable material (3) is substantially recessed within said resilient material (1), by being disposed in a groove (3) provided within said resilient material (1). The groove (2) has an inner surface and two flared edges (2b,2c). At least one of the edges (2b2c) of the groove (2) is outside the resilient bearing plane (P), such that the malleable material (3) will be separated from the bearing plane (P) by a predetermined distance (d). The folded configuration of resilient material and the malleable material (3) are cut out to form clips, the resilient material (1) is not to extend laterally beyond the cut-out clips (12). The non-clip portions of the device are in the form of a strip having a laddered configuration with guide positioning holes (8, 9) for an automatic insertion of electrical contacts along one side of a hybrid circuit or of a printed circuit or the like. When the malleable material (3) is melted, it flows by capillarity and solidifies to form electrical contacts (17, 19) that do not extend substantially beyond the clips (12).

Abstract translation: 一种电连接装置，其类型包括弹性材料的折叠构造，其适于确保弹性保持性，以及适于被熔化或钎焊的可延展材料的涂层以适于熔化以确保电连接。 可延展材料（3）的涂层通过设置在设置在所述弹性材料（1）内的凹槽（3）中而基本上凹入所述弹性材料（1）内。 槽（2）具有内表面和两个扩口边缘（2b，2c）。 凹槽（2）的边缘（2b2c）中的至少一个位于弹性支承平面（P）的外部，使得可延展材料（3）将从支承平面（P）离开预定距离（d） 。 弹性材料和可延展材料（3）的折叠构型被切出以形成夹子，弹性材料（1）不能横向延伸越过切口夹子（12）。 装置的非夹持部分是带状的形式，具有带有引导定位孔（8,9）的引导定位孔（8,9），用于沿着混合电路或印刷电路等的一侧自动插入电触头 。 当可延展材料（3）熔化时，其通过毛细作用流动并且固化以形成基本上不超过夹子（12）延伸的电触点（17,19）。

公开(公告)号：US5460319A

公开(公告)日：1995-10-24

申请号：US80622

申请日：1993-06-22

Applicant: Hazime Kato

Inventor： Hazime Kato

IPC: H01L23/50 ,  H01R4/02 ,  H01R43/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01R4/028 ,  H05K3/308 ,  H05K3/3447 ,  H05K1/141 ,  H05K1/142 ,  H05K2201/0373 ,  H05K2201/09709 ,  H05K2201/10386 ,  H05K2201/10757 ,  H05K2201/10871 ,  H05K3/368

Abstract: A lead for achieving solder joining with great vibration strength includes an upper lead portion having a clip and a lower lead portion having a thin tip for insertion into an electrode in a lower substrate and an oblong through hole in the body of the lower lead portion for inducing capillarity of soldering flux.

Abstract translation: 用于实现具有强烈振动强度的焊料接合的引线包括具有夹子的上引线部分和具有用于插入下基板中的电极的薄端部的下引线部分和下引线部分的主体中的长方形通孔， 引起助焊剂的毛细作用。

公开(公告)号：US5449110A

公开(公告)日：1995-09-12

申请号：US252697

申请日：1994-06-02

Applicant: Hirokazu Tsuji ,  Shigeo Yamashita ,  Yasuaki Ohno

Inventor： Hirokazu Tsuji ,  Shigeo Yamashita ,  Yasuaki Ohno

IPC: H01R43/02 ,  H05K3/34 ,  H01R9/16

CPC classification number: H01R12/57 ,  H05K3/3405 ,  H05K2201/10386 ,  H05K2203/0455 ,  H05K3/3468

Abstract: A method of preparing a substrate (1) having terminal electrodes (2, 3) which are provided on its both surfaces and a through hole (4), having a conductive film (5) formed on its inner peripheral surface, provided between the terminal electrodes (2, 3), mounting a lead terminal (9) having a pair of branch portions (9a, 9b) for elastically holding said terminal electrodes (2, 3) therebetween to the substrate (1), dipping the substrate (1) in molten solder from its lower surface (1b), drawing out the substrate (1) and solidifying the molten solder, thereby soldering the lead terminal (9) to the terminal electrodes (2, 3).

Abstract translation: 一种制备具有设置在其两个表面上的端子电极（2,3）和具有在其内周面上形成有导电膜（5）的通孔（4）的基板（1）的方法，该端子电极设置在端子 电极（2,3），安装具有一对分支部分（9a，9b）的引线端子（9），用于将所述端子电极（2,3）弹性地保持在基板（1）之间，浸渍基板（1） 在其下表面（1b）的熔融焊料中，拉出基板（1）并固化熔融焊料，从而将引线端子（9）焊接到端子电极（2,3）。