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    Feedthrough via connection on solder resistant layer
    31.
    发明授权
    Feedthrough via connection on solder resistant layer 失效
    通过连接在耐焊层上

    公开(公告)号：US06172307B2

    公开(公告)日：2001-01-09

    申请号：US08410616

    申请日：1995-03-24

    Applicant: Fred E. Ostrem ,  Alfred G. Ocken

    Inventor： Fred E. Ostrem ,  Alfred G. Ocken

    IPC: H01R909

    CPC classification number: H05K3/44 ,  H05K1/0206 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/111 ,  H05K3/0061 ,  H05K3/305 ,  H05K3/3452 ,  H05K3/363 ,  H05K3/4038 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/09554 ,  H05K2201/10666 ,  H05K2201/10977

    Abstract: A method for constructing a feedthrough via connection and a corresponding apparatus includes a metallic plate (101), or rigidizer, preferably composed of an aluminum material. A solderable contact area (103), is located on the plate (101). This contact area (103) is preferable comprised of a copper material selectively disposed by a plasma spraying process. Next, an electrically insulating adhesive layer (105) is disposed onto the plate (101). This adhesive layer (105) has a feedthrough via (106) disposed therethrough aligned with the contact area (103). Then, a substrate (109), preferably composed of a flexible composite polyimide material, is disposed onto the adhesive layer (105). This flexible substrate (109) has a via (110) disposed therethrough with a solderable area (111) disposed thereon. Then, a quantity of solder (113) is disposed onto the solderable area (111), and the assembly (100) is heated so that the solder (113) flows into the vias (106) and (110), thereby providing an electrical connection including the solderable area (111) of the via (110), the solder (113), and the contact area (103). During this reflow step, the structure of the adhesive layer (105) acts as a soldermask preventing the solder (113) from flowing outside of an area defined by the via (106).

    Abstract translation: 通过连接构造馈通方法和相应的装置包括优选由铝材料组成的金属板（101）或刚性机构。 可焊接接触区域（103）位于板（101）上。 该接触区域（103）优选由通过等离子体喷涂工艺选择性地设置的铜材料构成。 接下来，将电绝缘性粘合剂层（105）设置在板（101）上。 该粘合剂层（105）具有穿过通孔（106），其穿过与接触区域（103）对齐。 然后，将优选由柔性复合聚酰亚胺材料构成的基板（109）设置在粘合剂层（105）上。 该柔性基板（109）具有穿过其中设置有可焊接区域（111）的通孔（110）。 然后，将一定量的焊料（113）设置在可焊接区域（111）上，并且组装（100）被加热，使得焊料（113）流入通孔（106）和（110），从而提供电气 包括通孔（110）的可焊接区域（111），焊料（113）和接触区域（103）的连接。 在该回流步骤期间，粘合剂层（105）的结构用作焊接掩模，防止焊料（113）流过由通孔（106）限定的区域的外部。

    Printed circuit assembly having locally enhanced wiring density
    32.
    发明授权
    Printed circuit assembly having locally enhanced wiring density 失效
    具有局部增强的布线密度的印刷电路组件

    公开(公告)号：US6147870A

    公开(公告)日：2000-11-14

    申请号：US195913

    申请日：1998-11-19

    Applicant: Richard J. Pommer

    Inventor： Richard J. Pommer

    IPC: H05K3/34 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11

    CPC classification number: H05K3/462 ,  H05K1/141 ,  H01L2224/83138 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/09701 ,  H05K2201/0195 ,  H05K2201/10378 ,  H05K2201/10666 ,  H05K2201/10977 ,  H05K2201/2036 ,  H05K2203/063 ,  H05K2203/1189 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/368 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4647 ,  Y10T428/24562

    Abstract: A printed circuit assembly and method of making the same facilitates the attachment of high density modules onto a printed circuit board. In one embodiment, the high density modules are attached to the printed circuit board using an adhesive having a conductive material disposed within at least one via. In an alternate embodiment, an adhesive layer including a plurality of non-conductive "gauge particles" disposed within a non-conductive adhesive is used to attach the module to the printed circuit board. When the adhesive layer is disposed between a module and a printed circuit, individual gauge particles are interposed or sandwiched at various points between the layers such that the diameters of the particles control the layer separation throughout overlapping areas of thereof, thereby permitting careful control over layer separation. A printed circuit assembly and method of making the same utilize in another embodiment an interlayer interconnecting technology incorporating conductive posts that are deposited on one of a pair of contact pads formed on a module that opposes a printed circuit board and is thereafter bonded to the other in the pair of contact pads during lamination. Fusible material may be utilized in the conductive posts to facilitate mechanical bonding to a contact pad, and the posts project through a dielectric layer disposed between the printed circuit boards, thereby forming the electrical connections between the boards at discrete locations. The conductive posts may also comprise a conductive ink.

    Abstract translation: 印刷电路组件及其制造方法有助于将高密度模块附接到印刷电路板上。 在一个实施例中，使用具有布置在至少一个通孔内的导电材料的粘合剂将高密度模块附接到印刷电路板。 在替代实施例中，使用包括设置在非导电粘合剂内的多个非导电“规格颗粒”的粘合剂层将模块附接到印刷电路板。 当粘合剂层设置在模块和印刷电路之间时，各个测量颗粒被插入或夹在层之间的各个点处，使得颗粒的直径控制其重叠区域中的层分离，从而允许对层的仔细控制 分离 一种印刷电路组件及其在另一实施例中的应用方法，其中包括导电柱的层间互连技术，所述导电柱沉积在形成在与印刷电路板相对的模块上的一对接触焊盘中的一个上，然后在另一个接合 层压过程中的一对接触垫。 在导电柱中可以使用可熔材料，以便于与接触垫的机械接合，并且柱突出穿过布置在印刷电路板之间的电介质层，从而在离散位置处形成电路板之间的电连接。 导电柱也可以包括导电油墨。

    Device for using in an electronic controller
    35.
    发明授权
    Device for using in an electronic controller 失效
    在电子控制器中使用的装置

    公开(公告)号：US5880935A

    公开(公告)日：1999-03-09

    申请号：US800950

    申请日：1997-02-14

    Applicant: Thomas Wiesa ,  Ralph Schimitzek ,  Dieter Karr

    Inventor： Thomas Wiesa ,  Ralph Schimitzek ,  Dieter Karr

    IPC: H05K1/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36

    CPC classification number: H05K1/147 ,  H05K1/141 ,  H05K3/363 ,  H05K1/0298 ,  H05K1/181 ,  H05K2201/10666 ,  H05K3/284 ,  H05K3/341 ,  H05K3/4691 ,  Y10T29/49128

    Abstract: A device, in particular for use in an electronic controller, includes a card rack and a subassembly. The device is manufactured by soldering over a large area the unpopulated back side of the subassembly to this card rack. The soldering can be performed using a reflow soldering process and can be automated, and thus suitable for mass production. The electrical connections of the subassembly are led spatially and electrically separately from the mechanical attachment of the subassembly to the card rack. The subassembly can be an additional component mounted on the card rack with a new additional function, so that the controller can be flexibly adapted to a given requirement profile in a simple manner by combining, in a flexible manner, a plurality of subassemblies with different layouts and modes of operation on the card rack.

    Abstract translation: 特别是用于电子控制器的装置包括卡架和子组件。 该装置是通过将大部分未组装的子组件的背面焊接到该卡架上来制造的。 焊接可以使用回流焊接工艺进行，并且可以自动化，因此适合于批量生产。 子组件的电气连接在空间上和电气上分开地从子组件的机械附件引导到卡架上。 子组件可以是安装在卡架上的附加部件，具有新的附加功能，使得通过以灵活的方式组合具有不同布局的多个子组件，控制器可以以简单的方式灵活地适应给定的需求简档 和卡架上的操作模式。

    Method of manufacturing a printed circuit assembly
    37.
    发明授权
    Method of manufacturing a printed circuit assembly 失效
    制造印刷电路组件的方法

    公开(公告)号：US5839188A

    公开(公告)日：1998-11-24

    申请号：US583645

    申请日：1996-01-05

    Applicant: Richard J. Pommer

    Inventor： Richard J. Pommer

    IPC: H05K1/14 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46

    CPC classification number: H05K3/462 ,  H05K1/141 ,  H01L2224/83138 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/09701 ,  H05K2201/0195 ,  H05K2201/10378 ,  H05K2201/10666 ,  H05K2201/10977 ,  H05K2203/063 ,  H05K2203/1189 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/368 ,  H05K3/4069 ,  H05K3/4623 ,  H05K3/4647 ,  Y10T29/49117 ,  Y10T29/49126

    Abstract: A printed circuit assembly and method of making the same utilize in one embodiment an adhesive layer including a plurality of non-conductive "gauge particles" disposed within a non-conductive adhesive. When the adhesive layer is disposed between opposing printed circuit layers (be they insulating substrates, conductive layers, or other layers), individual gauge particles are interposed or sandwiched at various points between the layers such that the diameters of the particles control the layer separation throughout overlapping areas of thereof, thereby permitting careful control over layer separation. A printed circuit assembly and method of making the same utilize in another embodiment an interlayer interconnecting technology incorporating conductive posts that are deposited on one of a pair of contact pads formed on opposing printed circuit boards and thereafter bonded to the other in the pair of contact pads during lamination. Fusible material may be utilized in the conductive posts to facilitate mechanical bonding to a contact pad, and the posts project through a dielectric layer disposed between the printed circuit boards, thereby forming the electrical connections between the boards at discrete locations.

    Abstract translation: 印刷电路组件及其制造方法在一个实施例中用于设置在非导电粘合剂内的多个非导电“规格颗粒”的粘合剂层。 当粘合剂层设置在相对的印刷电路层（绝缘基板，导电层或其他层）之间时，各个规格颗粒被插入或夹在层之间的各个点处，使得颗粒的直径控制层间分离 其重叠区域，从而允许对层分离的仔细控制。 一种印刷电路组件及其在另一实施例中的应用方法，其中包括导电柱的层间互连技术，所述导电柱沉积在形成在相对的印刷电路板上的一对接触焊盘中的一个上，然后在所述一对接触焊盘 在层压期间。 在导电柱中可以使用可熔材料，以便于与接触垫的机械接合，并且柱突出穿过布置在印刷电路板之间的电介质层，从而在离散位置处形成电路板之间的电连接。

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