公开(公告)号：US07880289B2

公开(公告)日：2011-02-01

申请号：US11752770

申请日：2007-05-23

Applicant: Shin Kim

Inventor： Shin Kim

IPC: H01L23/48 ,  H01L21/30 ,  H01L21/58

CPC classification number: H01L23/3114 ,  H01L21/561 ,  H01L23/13 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/12 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/105 ,  H01L2224/03334 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/16105 ,  H01L2224/16157 ,  H01L2224/274 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83 ,  H01L2225/1005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H05K1/183 ,  H05K1/184 ,  H05K2201/09845 ,  H05K2201/10477 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Provided are a semiconductor package having connection terminals whose side surfaces are exposed and a semiconductor module including such a semiconductor package. Also provided are methods of fabricating the semiconductor package and semiconductor module. According to an embodiment of the present invention, a semiconductor package includes a semiconductor chip including a semiconductor wafer having first and second opposite surfaces and a plurality of conductive pads arranged in a row on the first surface along the edges of the semiconductor wafer such that a side surface of each conductive pad is exposed. An insulating layer is formed on the first surface of the semiconductor wafer and includes openings for exposing parts of the conductive pads. A plurality of connection terminals are respectively arranged on the conductive pads exposed through the openings and a reinforcing member is arranged on the insulating layer to cover a portion of each connection terminal.

Abstract translation: 提供了具有侧表面露出的连接端子和包括这种半导体封装的半导体模块的半导体封装。 还提供了制造半导体封装和半导体模块的方法。 根据本发明的实施例，半导体封装包括半导体芯片，其包括具有第一和第二相对表面的半导体晶片和沿着半导体晶片的边缘在第一表面上排成一行的多个导电焊盘，使得 每个导电焊盘的侧面露出。 绝缘层形成在半导体晶片的第一表面上，并且包括用于暴露导电焊盘部分的开口。 多个连接端子分别布置在通过开口暴露的导电焊盘上，并且在绝缘层上布置加强构件以覆盖每个连接端子的一部分。

公开(公告)号：US20100300735A1

公开(公告)日：2010-12-02

申请号：US12542824

申请日：2009-08-18

Applicant: Chang-Te Liao

Inventor： Chang-Te Liao

IPC: H05K1/09

CPC classification number: H05K3/3452 ,  H05K1/0206 ,  H05K3/0094 ,  H05K3/341 ,  H05K3/3468 ,  H05K3/42 ,  H05K2201/099 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/10969 ,  Y02P70/613

Abstract: A printed circuit board (PCB) includes a substrate, a plurality of copper foils formed on at least one surface of the substrate, a plurality of through holes extending through the substrate arranged in a rectangular array, and a plurality of blocking wall. Inner walls of the plurality of through holes are coated with the plurality of copper foils. The plurality of blocking walls project from the plurality of copper foils and surround the plurality of through holes to prevent solder from overflowing into the plurality of through holes when the PCB goes through a wave soldering procedure.

Abstract translation: 印刷电路板（PCB）包括基板，形成在基板的至少一个表面上的多个铜箔，延伸穿过布置成矩形阵列的基板的多个通孔和多个阻挡壁。 多个通孔的内壁涂覆有多个铜箔。 多个阻挡壁从多个铜箔突出并且围绕多个通孔，以防止当PCB通过波峰焊接过程时焊料溢出到多个通孔中。

公开(公告)号：US20100155966A1

公开(公告)日：2010-06-24

申请号：US12714130

申请日：2010-02-26

Applicant: Walter L. Moden

Inventor： Walter L. Moden

IPC: H01L23/485

CPC classification number: H01L24/81 ,  H01L21/485 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5382 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/85 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K1/141 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10477 ,  H05K2201/10727 ,  H05K2203/0415 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A semiconductor device assembly includes a substrate and a semiconductor die adjacent to a first surface of the substrate. The substrate also includes a second surface opposite from the first surface, an opening extending from the first surface and the second surface, contact pads on the second surface, and substrate pads on the second surface, adjacent to the opening. Bond pads of the semiconductor die are aligned with the opening through the substrate. Intermediate conductive elements, such as bond wires, extend from bond pads of the semiconductor die, through the opening, to substrate pads on the opposite, second surface of the substrate. An encapsulant, which fills the opening and covers the intermediate conductive elements, protrudes beyond a plane in which the second surface of the substrate is located. Discrete conductive elements, such as solder balls, may protrude from the contact pads of the substrate.

Abstract translation: 半导体器件组件包括与衬底的第一表面相邻的衬底和半导体管芯。 衬底还包括与第一表面相对的第二表面，从第一表面和第二表面延伸的开口，第二表面上的接触焊盘以及与开口相邻的第二表面上的衬底焊盘。 半导体管芯的焊盘与通过衬底的开口对准。 诸如接合线的中间导电元件从半导体管芯的接合焊盘延伸通过开口，延伸到衬底的相对的第二表面上的衬底焊盘。 填充开口并覆盖中间导电元件的密封剂突出超过衬底的第二表面所在的平面。 离散导电元件，例如焊球，可能从基板的接触垫突出。

公开(公告)号：US20100110590A1

公开(公告)日：2010-05-06

申请号：US12588797

申请日：2009-10-28

Applicant: Tetsuya Ohsawa ,  Hayato Abe ,  Yoshinari Yoshida ,  Toshiki Naito

Inventor： Tetsuya Ohsawa ,  Hayato Abe ,  Yoshinari Yoshida ,  Toshiki Naito

IPC: G11B5/60

CPC classification number: G11B13/04 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/4853 ,  G11B2005/0021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/06 ,  H05K3/445 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/10537 ,  H05K2201/10545 ,  H05K2201/10727 ,  H05K2203/0323 ,  H05K2203/0361

Abstract: A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.

Abstract translation: 具有电路的悬挂板包括导电图案，包括布置在具有电路的悬挂板的表面侧上的滑块，并安装有磁头，磁头与导电图案电连接; 以及发光装置，其配置在具有电路的电路的背面侧并与导电图形电连接，其中导电图案包括设置在具有电路的悬挂板的表面上的第一端子，并与磁性电连接 头; 以及设置在所述悬挂板的后表面上并具有电路并与所述发光装置电连接的第二端子。

公开(公告)号：US20100001291A1

公开(公告)日：2010-01-07

申请号：US12168254

申请日：2008-07-07

Applicant: Ralf Otremba ,  Josef Hoeglauer

Inventor： Ralf Otremba ,  Josef Hoeglauer

IPC: H01L23/02 ,  H01L21/52 ,  H01L29/16

CPC classification number: H01L23/49551 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/06 ,  H01L24/18 ,  H01L24/19 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/0603 ,  H01L2224/18 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48666 ,  H01L2224/48669 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48766 ,  H01L2224/48769 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/48866 ,  H01L2224/48871 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/82102 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/305 ,  H05K3/3442 ,  H05K3/3468 ,  H05K2201/10727 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2224/82 ,  H01L2924/01026 ,  H01L2924/00 ,  H01L2224/48869 ,  H01L2224/48744 ,  H01L2224/48771 ,  H01L2224/48671 ,  H01L2924/00012

Abstract: An electronic device and manufacturing thereof. One embodiment provides a carrier and multiple contact elements. The carrier defines a first plane. A power semiconductor chip is attached to the carrier. A body is formed of an electrically insulating material covering the power semiconductor chip. The body defines a second plane parallel to the first plane and side faces extends from the first plane to the second plane. At least one of the multiple contact elements has a cross section in a direction orthogonal to the first plane that is longer than 60% of the distance between the first plane and the second plane.

Abstract translation: 电子设备及其制造。 一个实施例提供载体和多个接触元件。 载体定义第一平面。 功率半导体芯片附着在载体上。 主体由覆盖功率半导体芯片的电绝缘材料形成。 主体限定平行于第一平面的第二平面，侧面从第一平面延伸到第二平面。 多个接触元件中的至少一个在与第一平面正交的方向上具有长于第一平面和第二平面之间的距离的60％的横截面。

公开(公告)号：US20090294953A1

公开(公告)日：2009-12-03

申请号：US12471712

申请日：2009-05-26

Applicant: Lu-Chen Hwan ,  Po Ching Chen

Inventor： Lu-Chen Hwan ,  Po Ching Chen

IPC: H01L23/522 ,  H01L21/50

CPC classification number: H01L23/49572 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/16195 ,  H05K3/321 ,  H05K2201/10666 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2924/00014

Abstract: The present invention discloses an integrated circuit module and method of manufacturing the same. The integrated circuit module includes a chip and a carrier supporting the chip. The carrier defines a front side and a back side, and the chip is disposed on the front side. The carrier includes a first insulating layer defining a first opening at the back side, a second insulating layer defining a second opening and a chip accommodation opening at the front side, and a patterned conductive layer sandwiched in between the first insulating layer and the second insulating layer. The patterned conductive layer is formed with an inner contacting portion exposed through the chip accommodation opening and an outer contacting portion exposed through the first opening and the second opening. The inner contacting portion is connected to the chip through the chip accommodation opening. The outer contacting portion is provided for electronically connecting an electronic device to the patterned conductive layer selectively at the front side through the second opening and at the back side through the first opening.

Abstract translation: 本发明公开了一种集成电路模块及其制造方法。 集成电路模块包括芯片和支持芯片的载体。 载体限定前侧和后侧，并且芯片设置在前侧。 载体包括限定在后侧的第一开口的第一绝缘层，限定第二开口的第二绝缘层和在前侧的芯片容纳开口，以及夹在第一绝缘层和第二绝缘层之间的图案化导电层 层。 图案化导电层形成有通过芯片容纳开口暴露的内部接触部分和通过第一开口和第二开口露出的外部接触部分。 内部接触部分通过芯片容纳开口连接到芯片。 外部接触部分被设置用于通过第二开口在电子设备和图案化导电层的前侧选择性地连接电子器件，并且通过第一开口在后侧。

公开(公告)号：US07626827B2

公开(公告)日：2009-12-01

申请号：US12204927

申请日：2008-09-05

Applicant: Henrik K. Nielsen ,  Dan G. Georgesco

Inventor： Henrik K. Nielsen ,  Dan G. Georgesco

IPC: H05K7/02

CPC classification number: H05K1/183 ,  H01L23/04 ,  H01L23/13 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/3011 ,  H05K1/141 ,  H05K2201/10151 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A sensor module having a package substrate, a sensor disposed within and electrically connected to the package substrate, an amplifier disposed within and electrically connected to the package substrate, and electrical traces within the package substrate for routing sensor signals from the sensor to the amplifier, and then from the amplifier to external electrical connectors on the package substrate.

Abstract translation: 传感器模块，其具有封装基板，设置在封装基板内并电连接到封装基板的传感器模块，放置在封装基板内并电连接到封装基板的放大器，以及用于将传感器信号从传感器路由到放大器的封装基板内的电迹线， 然后从放大器到封装衬底上的外部电连接器。

公开(公告)号：US20090278760A1

公开(公告)日：2009-11-12

申请号：US12510338

申请日：2009-07-28

Applicant: Mikiko Kimura ,  Noboru Kato

Inventor： Mikiko Kimura ,  Noboru Kato

IPC: H01Q1/50 ,  H01Q1/38

CPC classification number: G06K19/07749 ,  G06K19/07756 ,  H01Q1/2208 ,  H05K1/0269 ,  H05K3/303 ,  H05K2201/09918 ,  H05K2201/09954 ,  H05K2201/10636 ,  H05K2201/10727 ,  H05K2203/166 ,  Y02P70/611 ,  Y02P70/613

Abstract: A wireless IC device includes a wireless IC chip; a feeder circuit board which has the wireless IC chip located thereon, is magnetically coupled to a radiation plate, supplies electric power to the wireless IC chip, and relays signals between the wireless IC chip and the radiation plate; and a substrate on which the feeder circuit board is placed. On the substrate, there are formed a plurality of positioning markers indicating the boundaries of a plurality of positioning areas in which the feeder circuit board is selectively placed.

Abstract translation: 无线IC器件包括无线IC芯片; 具有位于其上的无线IC芯片的馈电电路板磁耦合到辐射板，向无线IC芯片供电，并在无线IC芯片和辐射板之间中继信号; 以及放置有供电电路基板的基板。 在基板上，形成有多个定位标记，其指示多个定位区域的边界，馈电电路板选择放置在该定位区域中。

公开(公告)号：US20090277675A1

公开(公告)日：2009-11-12

申请号：US11919292

申请日：2006-03-31

Applicant: Toshiki Koyama

Inventor： Toshiki Koyama

IPC: H05K1/16 ,  H05K1/11

CPC classification number: H01L23/49805 ,  H01L23/13 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/16195 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A recess (5a) in the corner direction and recesses (5b) in side directions are formed in each connecting pad (5A) located at a corner of a lower surface-side of an insulating base 2 having groove-shaped recesses (6) in the periphery, and groove-shaped recesses (6a and 6b) in the corner and side directions are formed in each corner portion (2A) of the insulating base 2 corresponding to the connecting pad (5A). Connecting pads (5) of an electronic apparatus in which an electronic component is mounted on the insulating base 2 are mounted on an external electrical circuit board by using a solder. A solder (31) melted during the solder-mounting adheres onto the groove-shaped recesses (6a and 6b) in the corner and side directions of the corner portion (2A) of the insulating base 2 and thus solder fillets are formed in the groove-shaped recesses (6a and 6b). Thus, solder bonding strength in the corners where external force is likely to work can be increased and the connecting pads of the wiring board can be firmly bonded to the lead conductors of the external electrical circuit board by using a hard and brittle lead-free solder.

Abstract translation: 在位于具有槽形凹部（6）的绝缘基体2的下表面侧的角部的每个连接垫（5A）中形成有角部方向的凹部（5a）和侧方的凹部（5b） 在绝缘底座2的对应于连接垫（5A）的每个角部（2A）中形成有角部和侧面的周边和槽形凹部（6a，6b）。 通过使用焊料将外部电路板安装在绝缘基座2上安装电子部件的电子设备的连接垫（5）。 在焊接安装期间熔化的焊料（31）在绝缘基体2的角部（2A）的角部和侧面的方向上粘附到槽形凹部（6a和6b）上，因此在沟槽 （6a和6b）。 因此，通过使用硬脆的无铅焊料，可以提高外力易于工作的角部的焊接强度，并且可以将布线板的连接焊盘牢固地接合到外部电路板的引线导体 。

公开(公告)号：US20090236707A1

公开(公告)日：2009-09-24

申请号：US12473477

申请日：2009-05-28

Applicant: Nan-Cheng Chen ,  Chun-Wei Chang ,  Chao-Wei Tseng

Inventor： Nan-Cheng Chen ,  Chun-Wei Chang ,  Chao-Wei Tseng

IPC: H01L23/34 ,  H01L23/495 ,  H01L23/498 ,  H01L23/48

CPC classification number: H05K7/205 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0206 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/0715 ,  H05K2201/09054 ,  H05K2201/10303 ,  H05K2201/10477 ,  H05K2201/10727

Abstract: An electronic device with enhanced heat spread. A printed circuit board is disposed in a casing and includes a first metal ground layer, a second metal ground layer, and a metal connecting portion. The first metal ground layer is opposite the second metal ground layer. The metal connecting portion is connected between the first and second metal ground layers. The second metal ground layer is connected to the casing. A chip is electrically connected to the printed circuit board and includes a die and a heat-conducting portion connected to the die and soldered with the first metal ground layer. Heat generated by the chip is conducted to the casing through the heat-conducting portion, first metal ground layer, metal connecting portion, and second metal ground layer.

Abstract translation: 具有增强散热性的电子设备。 印刷电路板设置在壳体中，并且包括第一金属接地层，第二金属接地层和金属连接部分。 第一金属接地层与第二金属接地层相对。 金属连接部分连接在第一和第二金属接地层之间。 第二金属接地层连接到外壳。 芯片电连接到印刷电路板，并且包括模具和连接到模具并与第一金属接地层焊接的导热部分。 由芯片产生的热量通过导热部分，第一金属接地层，金属连接部分和第二金属接地层传导到壳体。