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    ELECTRONIC DEVICE
    31.
    发明申请
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20180070449A1

    公开(公告)日：2018-03-08

    申请号：US15560264

    申请日：2016-03-08

    Applicant: OMRON Corporation

    Inventor： Seiki Shimoda ,  Masaaki Abe

    IPC: H05K1/18 ,  H01H50/02 ,  H01H50/14

    CPC classification number: H05K1/181 ,  H01H50/023 ,  H01H50/043 ,  H01H50/047 ,  H01H50/14 ,  H01H51/229 ,  H01H2001/5888 ,  H05K2201/10053 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10931

    Abstract: An electronic device where molten solder does not come into contact with a sealant so as not to destroy a sealing function. An electronic device is provided with: an insulating base mounted on a printed circuit board; a common planar terminal provided so as to extend from an outer side surface to a bottom surface edge of the insulating base, and cause electrical continuity between the outer side surface and the bottom surface edge of the insulating base; a cover fitted to the insulating base and covering the common planar terminal; and a sealant sealing a gap between the outer side surface of the insulating base and an inner circumferential surface of the cover. A solder pool is formed in a position surrounded by the printed circuit board and the common planar terminal at the bottom surface edge of the insulating base.

    Electronic device and manufacturing method of the same
    37.
    发明授权
    Electronic device and manufacturing method of the same 有权
    电子器件及其制造方法相同

    公开(公告)号：US07677905B2

    公开(公告)日：2010-03-16

    申请号：US11979968

    申请日：2007-11-13

    Applicant: Takayoshi Honda

    Inventor： Takayoshi Honda

    IPC: H01R12/00

    CPC classification number: H05K1/116 ,  H01R12/707 ,  H01R43/0256 ,  H05K1/023 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394

    Abstract: An electronic device includes a printed circuit board with multiple lands and through holes and an electronic element with multiple terminals on the board. Each terminal is coupled with the land through a solder. The lands include a surface land on the board and an insertion land on a sidewall of the through hole. The terminals include a branch terminal having an insertion member and a surface member. The insertion member is coupled with the insertion land through the solder. The surface member is coupled with the surface land through the solder. The surface member is parallel to the printed circuit board. The insertion member is perpendicular to the printed circuit board. The insertion member extends from a part of the surface member, which faces the surface land and disposed above the through hole.

    Abstract translation: 电子设备包括具有多个焊盘和通孔的印刷电路板以及具有多个端子的电子元件。 每个端子通过焊料与焊盘连接。 焊盘包括板上的表面焊盘和通孔的侧壁上的插入焊盘。 端子包括具有插入部件和表面部件的分支端子。 插入构件通过焊料与插入平台耦合。 表面构件通过焊料与表面焊盘连接。 表面构件平行于印刷电路板。 插入构件垂直于印刷电路板。 所述插入部件从所述表面部件的面向所述表面焊盘并设置在所述通孔的上方的一部分延伸。

    Electronic device
    38.
    发明授权
    Electronic device 有权
    电子设备

    公开(公告)号：US07563112B2

    公开(公告)日：2009-07-21

    申请号：US11979972

    申请日：2007-11-13

    Applicant: Takayoshi Honda

    Inventor： Takayoshi Honda

    IPC: H01R12/00

    CPC classification number: H05K1/116 ,  H01R12/707 ,  H01R43/0256 ,  H05K1/023 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394

    Abstract: An electronic device includes a printed circuit board having lands and an electronic element having a body and terminals. First and second lands provide a zigzag pattern. Each first land is coupled with the first terminal, and each second land is coupled with the second terminal. The second terminal includes a first parallel member, a first connection member, a second parallel member and a first mounting member. The first parallel member is completely embedded in the body, or another part of the first parallel member exposed from the body is shorter than the second parallel member. A second height between the second parallel member and the printed circuit board is smaller than a first height between the first parallel member and the printed circuit board.

    Abstract translation: 电子设备包括具有平台的印刷电路板和具有主体和端子的电子元件。 第一和第二土地提供锯齿形图案。 每个第一焊盘与第一端子耦合，并且每个第二焊盘与第二端子耦合。 第二端子包括第一平行构件，第一连接构件，第二平行构件和第一安装构件。 第一平行构件完全嵌入主体中，或者从主体露出的第一平行构件的另一部分比第二平行构件短。 第二平行构件和印刷电路板之间的第二高度小于第一平行构件和印刷电路板之间的第一高度。

    Electronic component with high density, low cost attachment
    39.
    发明授权
    Electronic component with high density, low cost attachment 有权
    电子元件密度高，附件成本低

    公开(公告)号：US07484971B2

    公开(公告)日：2009-02-03

    申请号：US11604289

    申请日：2006-11-27

    Applicant: Mark W. Gailus ,  Leon M. Khilchenko

    Inventor： Mark W. Gailus ,  Leon M. Khilchenko

    IPC: H01R9/09

    CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/10803 ,  H05K2201/10924 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00

    Abstract: A contact tail for an electronic component compatible with surface mount manufacturing techniques. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. High precision in the contact tails in turn provides more reliable solder joints across an array of contact tails in an electronic component. Further, the contact tail may be shaped to reduce the propensity for solder to wick from the attachment area during a reflow operation. Reducing the propensity of solder to wick reduces the chance that solder will interfere with the operation of the electronic component. Additionally, reducing the propensity for solder to wick allows pads to which the contact tail is attached to be positioned over vias, thereby increasing the density with which contacts may be attached to a substrate. The reliability with which electronic assemblies incorporating components using the contact tail is also increased when the contact tail is used in self-centering arrays.

    Abstract translation: 与表面贴装制造技术兼容的电子元件的接触尾部。 接触尾部被冲压，提供相对低的制造成本和高精度。 接触尾部的高精度依次在电子部件中的接触尾部阵列上提供更可靠的焊点。 此外，接触尾部可以被成形为在回流操作期间降低焊料从连接区域芯吸的倾向。 降低焊料对芯的倾向降低了焊料会干扰电子部件的操作的可能性。 此外，降低焊料对芯的倾向允许接触尾部附着的焊盘定位在通孔上方，从而增加接触可附着于基底的密度。 当接触尾部用于自定心阵列时，使用接触尾部组装部件的电子组件的可靠性也增加。

    CIRCUIT-BOARD CONNECTING TERMINAL
    40.
    发明申请
    CIRCUIT-BOARD CONNECTING TERMINAL 审中-公开
    电路板连接终端

    公开(公告)号：US20020058428A1

    公开(公告)日：2002-05-16

    申请号：US09473705

    申请日：1999-12-29

    Inventor： CHIEKO TORII

    IPC: H05K001/00

    CPC classification number: H05K3/3447 ,  H01R4/028 ,  H01R12/58 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/10803 ,  H05K2201/10871

    Abstract: The circuit-board connecting terminal (1) includes a small-width portion (7) to be inserted into a through hole (22) formed in a circuit board (12), a pair of taper portions (8) respectively to be abutted against an open end (23) of the through hole (22), and a large-width portion (5) formed so as to be continuous with the taper portions (8), while the small-width portion (7) can be connected to the inside of the through hole (22) by soldering. In the circuit-board connecting terminal (1), the taper portions (8) have a steep inclination angle, and are located at the open end (23) of the through hole (22), so as not to advance almost into the through hole (22).

    Abstract translation: 电路板连接端子（1）包括插入到形成在电路板（12）中的通孔（22）中的小宽度部分（7），一对锥形部分（8），分别抵靠 所述通孔（22）的开口端（23）和形成为与所述锥形部分（8）连续的大宽度部分（5），而所述小宽度部分（7）可以连接到 通孔（22）的内部通过焊接。 在电路板连接端子（1）中，锥形部分（8）具有陡峭的倾斜角度，并且位于通孔（22）的开口端（23）处，以便不会前进到通孔 孔（22）。

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