公开(公告)号：US20150028911A1

公开(公告)日：2015-01-29

申请号：US14338797

申请日：2014-07-23

Applicant: MPI Corporation

Inventor： Chia-Tai CHANG ,  Hui-Pin YANG

IPC: G01R1/067 ,  G01R1/073

CPC classification number: G01R1/06772 ,  G01R1/07307 ,  G01R1/07342

Abstract: A high frequency probe card for probing a photoelectric device includes a substrate having a first opening and at least one first through hole, an interposing plate disposed on the substrate and having a second opening and at least one second through hole, a circuit board disposed on the interposing plate and having a third opening and at least one third through hole, and a probe module mounted to the substrate and having at least one ground probe and at least one high-frequency impedance matching probe having a signal transmitting structure and a grounding structure passing through the at least one first, second and third through holes and being electrically connected with a signal pad and a ground pad of the circuit board, respectively. The first, second and third openings are communicated with each other for light transmission.

Abstract translation: 用于探测光电装置的高频探针卡包括具有第一开口和至少一个第一通孔的基板，设置在基板上的中间板，具有第二开口和至少一个第二通孔，电路板设置在 所述插入板具有第三开口和至少一个第三通孔，以及安装在所述基板上并具有至少一个接地探针和至少一个具有信号传输结构和接地结构的高频阻抗匹配探头的探针模块 穿过所述至少一个第一，第二和第三通孔并分别与所述电路板的信号焊盘和接地焊盘电连接。 第一，第二和第三开口彼此连通用于透光。

公开(公告)号：US20150022227A1

公开(公告)日：2015-01-22

申请号：US14506146

申请日：2014-10-03

Applicant: MPI CORPORATION

Inventor： Chun-Chi WANG ,  Chia-Tai CHANG ,  Ya-Yun CHENG ,  Wei-Cheng KU ,  Chao-Ping HSIEH

IPC: G01R1/067 ,  G01R31/28 ,  G01R31/02

CPC classification number: G01R1/067 ,  G01R1/06772 ,  G01R31/02 ,  G01R31/2851 ,  G01R31/2889 ,  Y10T29/49218

Abstract: An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.

Abstract translation: 提供集成的高速探头系统。 集成高速探针系统包括用于将来自测试仪器的低频测试信号通过探针组件的第一探头传送到DUT的电路基板，以及用于将来自测试仪的高频测试信号传输到高速基板的高速基板 被测件。 高速基板从测试区域中的电路基板的上表面延伸到探针区域中的电路基板的下表面，用于邻近探针组件并电连接第二探针。 以这种方式，测试仪可以通过集成的高速探头系统传输不同频率的测试信号。

公开(公告)号：US20140197860A1

公开(公告)日：2014-07-17

申请号：US14152755

申请日：2014-01-10

Applicant: MPI CORPORATION

Inventor： Hsien-Ta HSU ,  Horng-Kuang FAN

IPC: G01R1/073

CPC classification number: G01R1/36 ,  G01R1/067 ,  G01R1/06711 ,  G01R1/07357

Abstract: A current-diverting guide plate for use in a probe module is disclosed to include a plate body having a first surface, a second surface opposite to the first surface, and a plurality of through holes penetrating through the first and second surfaces. A conducting layer is provided at a periphery wall of each through hole of the plate body and electrically coupled to a probe slidably inserted through the through holes. A current-diverting circuit trace is disposed on the first surface of the plate body and electrically connected with the conducting layers for diverting the electric current flowing through probes. Thus, the current-diverting guide plate can be used to prevent the probes from possible damage due to an excessive instantaneous current.

Abstract translation: 公开了一种用于探针模块的电流转向导板，包括具有第一表面，与第一表面相对的第二表面和穿过第一表面和第二表面的多个通孔的板体。 导电层设置在板体的每个通孔的周壁处，并电耦合到可滑动地插入穿过通孔的探针。 电流转向电路迹线设置在板体的第一表面上并与导电层电连接，用于转移流过探针的电流。 因此，电流转向引导板可用于防止探针由于过大的瞬时电流而导致的可能损坏。

公开(公告)号：US20140015561A1

公开(公告)日：2014-01-16

申请号：US13941210

申请日：2013-07-12

Applicant: MPI CORPORATION

Inventor： Chia-Tai CHANG ,  Chin-Yi TSAI ,  Chiu-Kuei CHEN ,  Chen-Chih YU ,  Chien-Chang LAI ,  Chin-Tien YANG ,  Hui-Pin YANG ,  Keng-Shieng CHANG ,  Yun-Ru HUANG

IPC: G01R1/073

CPC classification number: G01R1/07342 ,  G01R1/06772

Abstract: A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and having a third opening corresponding to the at least one first and second openings, and at least one probe module including at least one N-type ground probe and at least one high frequency signal probe passing through the corresponding substrate, the interposing plate and the third opening and being electrically connected with the circuit board. Each high frequency signal probe includes an N-type signal probe and a first conductor corresponding to the N-type signal probe and being electrically connected with the N-type ground probe. An insulation layer is disposed between the first conductor and the N-type signal probe.

Abstract translation: 高频探针卡包括具有至少一个第一开口的至少一个基板，设置在所述至少一个基板上的插入板，并且具有至少一个对应于所述至少一个第一开口的第二开口，布置在插入件上的电路板 并且具有对应于所述至少一个第一和第二开口的第三开口，以及至少一个探针模块，其包括至少一个N型接地探针和至少一个穿过相应基板的高频信号探针，所述插入板和 第三开口并与电路板电连接。 每个高频信号探头包括N型信号探头和对应于N型信号探针的第一导体，并与N型接地探针电连接。 绝缘层设置在第一导体和N型信号探头之间。

公开(公告)号：US20250147073A1

公开(公告)日：2025-05-08

申请号：US18934482

申请日：2024-11-01

Applicant: MPI Corporation

Inventor： CHIEN-MING LO ,  Hsuan-Ti Yeh ,  Chih-Hao Ho ,  Horng-Chuan Sun ,  Chien-Ming Huang ,  Chia-Hung Liu

IPC: G01R1/073 ,  G01R3/00

Abstract: The present invention provides a probe card. The probe card comprises a circuit board, a cantilever-type space transformer electrically connected to the circuit board, and a vertical probe head electrically connected to the cantilever-type space transformer. The vertical probe head comprises a probe base and a plurality of vertical probes. The cantilever-type space transformer comprises a mounting base and a plurality of cantilever converting probes, wherein each cantilever converting probe has a fixed segment and an exposed segment. The fixed segment is secured to the mounting base, and the exposed segment is located outside the mounting base. The fixing segment enters from the side of the mounting base and forms a contact at the bottom of the mounting base.

公开(公告)号：US20250044349A1

公开(公告)日：2025-02-06

申请号：US18762919

申请日：2024-07-03

Applicant: MPI CORPORATION

Inventor： ANDREJ RUMIANTSEV ,  Ching-Ling PAI ,  LIN-LIN CHIH

IPC: G01R31/28 ,  G01R1/073 ,  G01R35/00

Abstract: To determine whether the current temperature of a probe assembly is stable for the calibration at the auxiliary site, a wafer probe station verifies a measured air standard dataset with a predetermined signal range or verifying an estimated measurement time range with a predetermined time window. To determine whether adjusting the current temperature of a probe assembly at the wafer site is necessary, a wafer probe station verifies a measured air standard dataset with a predetermined signal range or verifying an estimated measurement time range with a predetermined time window. To determine whether the current temperature of a probe assembly is ready for testing a semiconductor device, a wafer probe station verifies a measured air standard dataset with a predetermined signal range.

公开(公告)号：US12196779B2

公开(公告)日：2025-01-14

申请号：US17888500

申请日：2022-08-16

Applicant: MPI CORPORATION

Inventor： Stojan Kanev ,  Mei-Ting Lu ,  Sebastian Giessmann

IPC: G01R1/067 ,  G01B11/26 ,  G01R1/18 ,  G01R31/28 ,  G06T7/33 ,  G06T11/00 ,  H04N5/272

Abstract: A probe system and a machine apparatus thereof are provided. The machine apparatus can be configured for optionally carrying at least one probe assembly. The machine apparatus includes a temperature control carrier module, a machine frame structure and a temperature shielding structure. The temperature control carrier module can be configured for carrying at least one predetermined object. The machine frame structure can be configured for partially covering the temperature control carrier module, and the machine frame structure has a frame opening for exposing the temperature control carrier module. The temperature shielding structure can be disposed on the machine frame structure for partially covering the frame opening, and the temperature shielding structure has a detection opening for exposing the at least one predetermined object. The temperature shielding structure has a gas guiding channel formed thereinside for allowing a predetermined gas in the gas guiding channel.

公开(公告)号：US12099078B2

公开(公告)日：2024-09-24

申请号：US17856678

申请日：2022-07-01

Applicant: MPI Corporation

Inventor： Yi-Chien Tsai ,  Huo-Kang Hsu ,  Yu-Wen Chou ,  Yu-Shan Hu

IPC: G01R1/073

CPC classification number: G01R1/07378 ,  G01R1/07342

Abstract: A probe card and a wafer testing assembly thereof are provided. The wafer testing assembly includes a printed circuit board, a space transformer, a plurality of copper pillars and a plurality of strengthening structure units. The printed circuit board includes a bottom surface and a plurality of first contacts arranged on the bottom surface. The space transformer includes a top surface and a plurality of second contacts. The second contacts are arranged on the top surface and corresponding to the first contacts. The copper pillars are respectively arranged between the first contacts and the second contacts. Two ends of each of the copper pillars are respectively electrically connected to the first contacts and the second contacts. The strengthening structure units are arranged on the bottom surface of the printed circuit board and respectively surrounding the copper pillars.

公开(公告)号：US12092658B2

公开(公告)日：2024-09-17

申请号：US17871978

申请日：2022-07-24

Applicant: MPI CORPORATION

Inventor： Sebastian Giessmann ,  Po-Yi Ting

IPC: G01B11/30 ,  G01B11/26 ,  G01R1/067 ,  G01R1/18 ,  G01R31/28 ,  G06T7/33 ,  G06T11/00 ,  H04N5/272

CPC classification number: G01R1/06772 ,  G01B11/26 ,  G01R1/18 ,  G01R31/2891 ,  G06T7/33 ,  G06T11/00 ,  H04N5/272 ,  G06T2210/62

Abstract: An optical detection system and an alignment method for a predetermined target object are provided. The optical detection system includes a chuck stage, an optical detection module, a vision inspection module and a control module. The chuck stage includes a chuck configured for carrying a plurality of predetermined objects to be tested. The optical detection module includes an optical probe device, and the optical probe device is configured to be disposed above the chuck for optically detecting the predetermined object. The vision inspection module includes an image capturing device and an image display device. The image capturing device is configured for capturing a real-time image of the predetermined object in real time, and the image display device is configured for displaying the real-time image of the predetermined object in real time. The control module is configured to execute the alignment method for the predetermined target object.

公开(公告)号：USD1031738S1

公开(公告)日：2024-06-18

申请号：US29796877

申请日：2021-06-28

Applicant: MPI CORPORATION

Designer： Chin-Yi Lin ,  Keng-Min Su ,  Che-Wei Lin ,  Hsin-Cheng Hung

Abstract: FIG. 1 is a perspective view of a die plate assembly for probe head, showing the upper die plate and lower die plate in an assembled position according to our design;
FIG. 2 is a front view thereof, showing the upper die plate and lower die plate in an assembled position, the rear side, the left side and the right side being an identical image;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is an enlarged sectional view taken along line 5-5 of FIG. 3, showing the upper die plate and lower die plate of the die plate assembly for probe head in an assembled position;
FIG. 6 is an enlarged sectional view taken along line 6-6 of FIG. 3, showing the upper die plate and lower die plate of the die plate assembly for probe head in an assembled position;
FIG. 7 is a top perspective view of the upper die plate of the die plate assembly for probe head;
FIG. 8 is a front view of the upper die plate of the die plate assembly for probe head, the rear side being an identical image;
FIG. 9 is a left side elevational view of the upper die plate of the die plate assembly for probe head, the right side being an identical image;
FIG. 10 is a top plan view of the upper die plate of the die plate assembly for probe head;
FIG. 11 is a bottom plan view of the upper die plate of the die plate assembly for probe head;
FIG. 12 is a bottom perspective view of the upper die plate of the die plate assembly for probe head;
FIG. 13 is a top perspective view of the lower die plate of the die plate assembly for probe head;
FIG. 14 is a front view of the lower die plate of the die plate assembly for probe head, the rear side, the left side and the right side being an identical image;
FIG. 15 is a top plan view of the lower die plate of the die plate assembly for probe head;
FIG. 16 is a bottom plan view of the lower die plate of the die plate assembly for probe head; and,
FIG. 17 is a bottom perspective view of the lower die plate of the die plate assembly for probe head.
The broken lines depict portions of the die assembly and form no part of the claimed design.