Abstract:
The invention relates to a printed circuit board arrangement, more particularly a multilayer printed circuit board. The printed circuit board arrangement comprises at least two printed circuit boards which are arranged parallel to one another and connected to one another. According to the invention, in the case of the printed circuit board arrangement of the type mentioned initially, at least one surface region of one printed circuit board is connected to another printed circuit board of the printed circuit board arrangement by means of an element embodied in an elastic and/or damping fashion in such a way that an oscillatory system, more particularly a spring-mass system, an oscillatory bending strip or a flexurally oscillatory board is formed by means of the surface region of the printed circuit board and the element.
Abstract:
Systems and methods sense out-of-plane linear accelerations. In an exemplary embodiment, the out-of plane linear accelerometer is accelerated in an out-of-plane direction, wherein the acceleration generates a rotational torque to an unbalanced proof mass. A rebalancing force is applied to at least one plurality of interleaved rotor comb tines and stator comb tines, wherein the rebalancing force opposes the rotational torque, wherein the rotor comb tines are disposed at an end of the unbalanced proof mass, and wherein the stator comb tines are disposed on a stator adjacent to the end of the unbalanced proof mass. An amount of acceleration is then determined based upon the applied rebalancing force.
Abstract:
According to a physical quantity sensor, a first movable electrode group, a second movable electrode group, a third movable electrode group, and a fourth movable electrode group are arranged in this order along a first direction. In a third direction, a thickness of a second movable electrode in the second movable electrode group and a thickness of a third movable electrode in the third movable electrode group are different from a thickness of a first movable electrode in the first movable electrode group and a thickness of a fourth movable electrode in the fourth movable electrode group. When an imaginary line extending in a second direction from a center of a fixed portion is an axis of symmetry, the first movable electrode is disposed line-symmetrically with the fourth movable electrode, and the second movable electrode is disposed line-symmetrically with the third movable electrode.
Abstract:
A semiconductor device production method includes performing trench etching to form a trench in a thickness direction of a semiconductor layer so that both of a first pattern portion and a second pattern portion whose side walls face each other across the trench are formed. In the trench etching, the semiconductor layer is etched and removed while a protective film is formed on a surface of the semiconductor layer, and the trench etching is performed so that the first pattern portion and the second pattern portion are configured to have a same potential or a same temperature during the trench etching.
Abstract:
A vibration sensor having a moveable mass being suspended in a suspension member and being adapted to move in response to vibrations or accelerations. The moveable mass and the suspension member are rigidly connected across one or more gaps formed by respective opposing surfaces of the moveable mass and the suspension member. The vibration sensor includes a damping arrangement having a damping substance. The moveable mass is arranged to interact directly or indirectly with the damping substance in order to reduce a mechanical resonance peak of the vibration sensor.
Abstract:
A capacitance type physical quantity sensor including a movable electrode formed in a weight part, and a fixed electrode facing the movable electrode is provided. A first movable sensing electrode and a first fixed sensing electrode face each other in a first y direction. A second movable sensing electrode and a second fixed sensing electrode face each other in a second y direction. A first movable damping electrode is located in the middle between two first fixed damping electrodes, faces one of the first fixed damping electrodes in the first y direction and faces the other of the first fixed damping electrodes in the second y direction. A plurality of the first movable damping electrodes are located point-symmetrically with respect to the center of the weight part or line-symmetrically with respect to a center line passing the center in the y direction.
Abstract:
A microelectromechanical system (MEMS) accelerometer having separate sense and force-feedback electrodes is disclosed. The use of separate electrodes may in some embodiments increase the dynamic range of such devices. Other possible advantages include, for example, better sensitivity, better noise suppression, and better signal-to-noise ratio. In one embodiment, the accelerometer includes three silicon wafers, fabricated with sensing electrodes forming capacitors in a fully differential capacitive architecture, and with separate force feedback electrodes forming capacitors for force feedback. These electrodes may be isolated on a layer of silicon dioxide. In some embodiments, the accelerometer also includes silicon dioxide layers, piezoelectric structures, getter layers, bonding pads, bonding spacers, and force feedback electrodes, which may apply a restoring force to the proof mass region. MEMS accelerometers with force-feedback electrodes may be used in geophysical surveys, e.g., for seismic sensing or acoustic positioning.
Abstract:
The invention relates to an acceleration sensor (100) having a sensor material (120) which is mounted by means of spring elements (130) so as to be movable along a movement axis (x) over a substrate (110), first trim electrodes (140) which are connected to the sensor material (120), and second trim electrodes (150) which are connected to the substrate (110) and are associated with the first trim electrodes (140). When the sensor material is deflected along the movement axis, a spring force acting on the sensor material (120) is generated by the spring elements (130), and when the sensor material (120) is deflected, au electrostatic three acting on the sensor material (120), which counteracts the spring force, is generated by application of an electrical trim voltage between the first trim electrodes (140) and the second trim elements (150).
Abstract:
A vibration sensor having a moveable mass being suspended in a suspension member and being adapted to move in response to vibrations or accelerations. The moveable mass and the suspension member are rigidly connected across one or more gaps formed by respective opposing surfaces of the moveable mass and the suspension member. The vibration sensor includes a damping arrangement having a damping substance. The moveable mass is arranged to interact directly or indirectly with the damping substance in order to reduce a mechanical resonance peak of the vibration sensor.
Abstract:
Apparatus and methods for interfacing with a micro-electromechanical system (MEMS) sensor are provided. In an example, an apparatus can interface circuit including an integrator circuit, a sample switch circuit, a saturation detector and a controller. The saturation detector can be configured to receive a signal indicative of an integration of charge of the sensor, to compare the signal indicative of the integration of charge to an integrator saturation threshold and to modulate a divide parameter using the comparison of the signal indicative of the integration of charge and the integrator saturation threshold. The controller can be configured to receive a clock signal and to control the sample switch circuit based on a phase of the clock signal and the divide parameter.