公开(公告)号：US20180132362A1

公开(公告)日：2018-05-10

申请号：US15866547

申请日：2018-01-10

Applicant: KANEKA CORPORATION

Inventor： Takashi Kikuchi ,  Yasutaka Kondo

IPC: H05K3/38 ,  C09J7/25 ,  H05K3/14 ,  H05K3/06

CPC classification number: H05K3/386 ,  B32B7/12 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B32B27/08 ,  B32B27/20 ,  B32B27/281 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2307/306 ,  B32B2307/546 ,  B32B2307/704 ,  B32B2307/7265 ,  B32B2457/08 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C09J7/25 ,  C09J179/08 ,  C09J2201/622 ,  C09J2479/08 ,  C09J2479/086 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/0393 ,  H05K3/06 ,  H05K3/146 ,  H05K3/18 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0355 ,  Y10T428/2896

Abstract: A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.

公开(公告)号：US09955580B2

公开(公告)日：2018-04-24

申请号：US15228304

申请日：2016-08-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yang Je Lee ,  Jae Ho Shin ,  Dek Gin Yang

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/46 ,  H05K3/02 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K1/0278 ,  H05K1/0298 ,  H05K1/118 ,  H05K3/0026 ,  H05K3/0058 ,  H05K3/02 ,  H05K3/027 ,  H05K3/285 ,  H05K3/4644 ,  H05K3/4691 ,  H05K2201/0154 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T156/1082

Abstract: A method of manufacturing a rigid-flexible printed circuit board, which including: providing a first flexible film having a first metal layer on one or both surfaces; forming a circuit pattern by patterning the first metal layer; forming a second flexible film, which has a second metal layer on one surface, on one or both surfaces of the first flexible film; forming a circuit pattern by patterning the second metal layer in a rigid domain R; providing an anti-oxidation protective layer on the second metal layer in a flexible domain F; laminating at least one circuit layer on the second flexible film; and removing the circuit layer in the flexible domain F.

公开(公告)号：US09955574B2

公开(公告)日：2018-04-24

申请号：US14369909

申请日：2012-01-13

Applicant: Koichiro Tanaka ,  Kazuki Kammuri

Inventor： Koichiro Tanaka ,  Kazuki Kammuri

IPC: B32B15/00 ,  H05K1/03 ,  B32B15/08 ,  H05K1/09 ,  H05K3/02 ,  B32B7/02 ,  B32B15/20 ,  H05K1/05

CPC classification number: H05K1/0393 ,  B32B7/02 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/712 ,  B32B2457/08 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/05 ,  H05K2201/06 ,  Y10T29/302 ,  Y10T428/12438 ,  Y10T428/273

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f3×t3)/(f2×t2)=>1 wherein t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2: 1

公开(公告)号：US09955572B2

公开(公告)日：2018-04-24

申请号：US15296055

申请日：2016-10-18

Applicant: TAIFLEX Scientific Co., Ltd.

Inventor： Yi-Kai Fang ,  Tsung-Tai Hung ,  Chiao-Pei Chen ,  Chiu-Feng Chen ,  Ching-Hung Huang

IPC: H05K1/03 ,  C08G73/10 ,  C09D179/08 ,  H05K1/02 ,  H05K1/09

CPC classification number: H05K1/0313 ,  C08G73/1028 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1078 ,  C09D179/08 ,  H05K1/028 ,  H05K1/0346 ,  H05K1/09 ,  H05K2201/0154 ,  H05K2201/068

Abstract: A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar′ is A is and 0

公开(公告)号：US09942989B2

公开(公告)日：2018-04-10

申请号：US14312222

申请日：2014-06-23

Applicant: ILLINOIS TOOL WORKS, INC.

Inventor： Hongchuan Liao ,  Chris Benson ,  Yong Liang ,  Tom Carlson

IPC: H05K7/00 ,  H05K1/18 ,  B32B27/08 ,  B32B27/20 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36

CPC classification number: H05K1/185 ,  B32B27/08 ,  B32B27/20 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2250/24 ,  B32B2250/40 ,  B32B2262/106 ,  B32B2264/02 ,  B32B2264/102 ,  B32B2264/105 ,  B32B2264/107 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/212 ,  B32B2307/302 ,  B32B2457/04 ,  H05K2201/0137 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0183 ,  Y10T428/31507 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31728 ,  Y10T428/31736 ,  Y10T428/31757 ,  Y10T428/31786 ,  Y10T428/31797 ,  Y10T428/31913

Abstract: The present invention provides an insulation film and a method for making the insulation film, comprising a film upper layer and a film lower layer, wherein both of the film upper layer and film lower layer are made of a heat conduction plastics material, the heat conduction plastics material contains a heat conduction additive; and a film intermediate layer located between the film upper layer and the film lower layer. The film intermediate layer is made of a heat conduction plastics material, and the heat conduction plastics material contains a conductive additive An upper surface of the film intermediate layer is bound together with a lower surface of the film upper layer, and a lower surface of the film intermediate layer is bound together with an upper surface of the film lower layer.

公开(公告)号：US09924597B2

公开(公告)日：2018-03-20

申请号：US15111305

申请日：2015-02-20

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： Fujio Kuwako ,  Toshifumi Matsushima ,  Toshihiro Hosoi

IPC: H05K1/09 ,  H05K1/16 ,  B32B15/00 ,  B32B15/04 ,  B32B15/20 ,  H05K3/02 ,  H05K3/46 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/162 ,  B32B15/00 ,  B32B15/04 ,  B32B15/20 ,  B32B2307/51 ,  B32B2457/00 ,  B32B2457/08 ,  B32B2457/16 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0047 ,  H05K3/022 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/09763

Abstract: A material for forming of the capacitor layer which generates no crack in drilling on the dielectric layer of the capacitor in manufacturing of a highly multilayered printed wiring board embedded a capacitor circuit. Copper clad laminate for forming of an embedded capacitor layer of a multilayered printed wiring board including an embedded capacitor circuit having a layer structure of copper layer/dielectric layer of the capacitor/copper layer in an inner layer characterized in that the composite elastic modulus Er of the resin film constituting the dielectric layer of the capacitor along the thickness direction is less than 6.1 GPa is employed.

公开(公告)号：US09907163B2

公开(公告)日：2018-02-27

申请号：US15418991

申请日：2017-01-30

Applicant: Japan Display Inc.

Inventor： Yuuki Nishimoto

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0281 ,  H05K1/0271 ,  H05K1/115 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/0154 ,  H05K2201/068 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: A flexible circuit board includes a base material including a first surface and a second surface opposite the first surface, the base material including a conductor layer, a first insulating film covering the first surface of the base material and formed with a first opening, a first insulating member formed inside the first opening and formed with a connection port to expose the conductor layer, the first insulating member having a thermal expansion coefficient smaller than that of the first insulating film, a second insulating film covering the second surface of the base material and formed with a second opening overlapping at least a portion of the first opening in a plan view, and a second insulating member formed inside the second opening and having a thermal expansion coefficient smaller than that of the first insulating film.

公开(公告)号：US09900979B2

公开(公告)日：2018-02-20

申请号：US15240132

申请日：2016-08-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hiesang Sohn ,  Chan Kwak ,  Mi Jeong Kim ,  Hyeon Cheol Park ,  Weonho Shin ,  Youngjin Cho

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  H05K3/14 ,  H05K3/22 ,  C01B31/04

CPC classification number: H05K1/09 ,  C01B31/0484 ,  C01B32/184 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/146 ,  H05K3/22 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2203/0783 ,  Y02E10/50

Abstract: A conductor includes a substrate, a first conductive layer disposed on the substrate and including two or more islands including graphene, and a second conductive layer disposed on the first conductive layer and including a conductive metal nanowire, wherein at least one of an upper surface and a lower surface of the islands including graphene includes a P-type dopant.

公开(公告)号：US09896546B2

公开(公告)日：2018-02-20

申请号：US14373218

申请日：2013-01-18

Applicant: ASAHI KASEI E-MATERIALS CORPORATION

Inventor： Koichiro Shimoda ,  Yasuhito Iizuka ,  Masaki Yamamoto ,  Yoro Sasaki ,  Hiroaki Adachi ,  Shuji Kashiwagi

IPC: C08G73/10 ,  C08K5/353 ,  C08L79/08 ,  B32B27/28 ,  C08G18/58 ,  C08G18/61 ,  C08G18/73 ,  H05K1/03 ,  H05K3/46 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42

CPC classification number: C08G73/1075 ,  B32B27/281 ,  C08G18/58 ,  C08G18/61 ,  C08G18/73 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/106 ,  C08G73/1071 ,  C08K5/353 ,  C08L79/08 ,  H05K1/0201 ,  H05K1/0298 ,  H05K1/0346 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/118 ,  H05K3/0064 ,  H05K3/427 ,  H05K3/4655 ,  H05K2201/0154 ,  H05K2201/051 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate in 3 mass % aqueous sodium hydroxide at 45° C. is 0.95 or more after a heat history of 90° C. for 10 minutes with the solution rate before the heat history assumed to be 1, (b) the solution rate in 3 mass % aqueous sodium hydroxide at 45° C. ranges from 0.001 μm/sec to 0.02 μm/sec after the heat history of 180° C. for 60 minutes, (c) a bleed-out amount is 50 mg/m2 or less in storing at 40° C. for 2 weeks after the heat history of 180° C. for 60 minutes, and (d) a thermogravimetric decrease at 260° C. is 2.0% or less in measuring on a temperature rising condition of 10° C./min from 40° C. by thermogravimetric analysis (TG). When a multilayer flexible wiring board is manufactured using the resin composition, it is possible to obtain the resin layer excellent in alkali processability, embeddability in press, heat resistance, bendability, insulation reliability, and adhesion to the conductive layer.

公开(公告)号：US20180042125A1

公开(公告)日：2018-02-08

申请号：US15365674

申请日：2016-11-30

Applicant: TAIMIDE TECHNOLOGY INCORPORATION

Inventor： Yen-Po Huang ,  Tsung-Hsien Tsai

IPC: H05K3/46 ,  C08L79/08 ,  H05K1/03

CPC classification number: H05K3/007 ,  C03C17/3405 ,  C03C2218/11 ,  C03C2218/32 ,  C08G73/1039 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08L79/08 ,  C08L2203/20 ,  C09D179/08 ,  H01L21/6835 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2221/68345 ,  H01L2221/68386 ,  H05K1/0393 ,  H05K3/4682 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2203/0152 ,  H05K2203/016 ,  H05K2203/0264 ,  C08L27/18 ,  C08K5/544

Abstract: A method of fabricating a flexible printed circuit includes providing a carrying support comprised of a rigid support base and a release layer adhered in contact with each other, forming a flexible substrate on the carrying support, the formed flexible substrate being adhered in contact with the release layer, applying one or more processing step on the flexible substrate while the flexible substrate is supported by the carrying support, and peeling the flexible substrate with an electric circuit formed thereon from the release layer while the release layer remains adhered in contact with the support base.