公开(公告)号：US20060220636A1

公开(公告)日：2006-10-05

申请号：US11389076

申请日：2006-03-27

Applicant: Tomio Satoh

Inventor： Tomio Satoh

IPC: G01R31/28

CPC classification number: H05K1/141 ,  H03B5/32 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10166 ,  H05K2201/10515

Abstract: A highly stable piezoelectric oscillator includes a heat-generating component mounted on a base printed circuit board; an erected printed circuit board placed upright on the base printed circuit board by fitting a fitting end part in a fitting slit that is formed to penetrate the base printed circuit board; a piezoelectric resonator which is disposed horizontally and directly on the heat-generating component on the base printed circuit board and whose lead electrode part is connected and fixed on the erected printed circuit board; and an oscillation circuit component to obtain an oscillation output using the piezoelectric resonator as a frequency source. Further, connection pads are arranged opposite from each other on surfaces of the base printed circuit board along both opposing end edges of the fitting slit; arc-shaped side through holes are provided on the inner walls of the fitting slit that correspond to each of the connection pads; and lead pads are arranged so as to have positional relations to their respective connection pads on both surfaces of the fitting end part of the erected printed circuit board; and each connection pad having the side through hole is soldered to each lead pad of the fitting end part.

Abstract translation: 高度稳定的压电振荡器包括安装在基板印刷电路板上的发热元件; 通过将配合端部嵌合在形成为穿过基底印刷电路板的配合狭缝中而竖立在基板印刷电路板上的竖立印刷电路板; 压电谐振器，其水平地并且直接设置在基板印刷电路板上的发热部件上，其引线电极部分连接固定在竖立的印刷电路板上; 以及使用压电谐振器作为频率源获得振荡输出的振荡电路部件。 此外，连接焊盘沿着配合狭缝的两个相对的端部边缘彼此相对布置在基板印刷电路板的表面上; 弧形侧通孔设置在与每个连接垫对应的装配狭缝的内壁上; 并且引线焊盘被布置成与竖立的印刷电路板的装配端部的两个表面上的各自的连接焊盘具有位置关系; 并且具有侧通孔的每个连接垫焊接到配合端部的每个引线焊盘。

公开(公告)号：US20060180910A1

公开(公告)日：2006-08-17

申请号：US11335254

申请日：2006-01-18

Applicant: Satoshi Miyazawa

Inventor： Satoshi Miyazawa

IPC: H01L23/02

CPC classification number: H01L23/49833 ,  H01L23/13 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0052 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/048 ,  H05K2201/09145 ,  H05K2201/10446 ,  H01L2924/00 ,  H01L2224/81

Abstract: A three-dimensional circuit module has a three-dimensional structure in which a second board is bonded to a first board at a predetermined angle. The first board has a first notched concave part formed at an edge to be a bonding surface S1 and a second notched concave part formed at an edge of the first notched concave part in the depth direction thereof. The second board has an electronic component mounted on a surface thereof opposite to the bonding surface of the first board and is engaged with the first notched concave part in a state in which the electronic component is disposed in the second notched concave part.

Abstract translation: 三维电路模块具有三维结构，其中第二板以预定角度结合到第一板。 第一板具有形成在作为接合面S1的边缘处的第一切口凹部和形成在第一切口凹部的深度方向的边缘处的第二切口凹部。 第二板具有安装在与第一板的接合表面相对的表面上的电子部件，并且在电子部件设置在第二缺口凹部中的状态下与第一切口凹部卡合。

公开(公告)号：US20060070768A1

公开(公告)日：2006-04-06

申请号：US11222098

申请日：2005-09-09

Applicant: Seung-eon Lee

Inventor： Seung-eon Lee

IPC: H05K7/06

CPC classification number: H05K3/366 ,  H05K2201/048 ,  H05K2201/09645 ,  H05K2201/09854 ,  H05K2203/0455

Abstract: A PCB assembly includes a main PCB having an accommodating slit part penetratingly formed therethrough and at least one main terminal part disposed at sides of the accommodating slit part, and a sub PCB having an inserting part which is insertable into the accommodating slit part, the sub PCB including a sub terminal part disposed to correspond to the main terminal part, and a through slot formed in the inserting part along an inserting direction of the sub PCB. Accordingly, the PCB assembly stably combines the sub PCB and the main PCB.

Abstract translation: PCB组件包括具有穿透其形成的容纳狭缝部分和设置在容纳狭缝部分的侧面的至少一个主端子部分的主PCB，以及具有可插入容纳狭缝部分中的插入部分的子PCB， PCB包括设置成对应于主端子部分的子端子部分，以及沿着子PCB的插入方向形成在插入部分中的通孔。 因此，PCB组件稳定地组合子PCB和主PCB。

公开(公告)号：US20060049777A1

公开(公告)日：2006-03-09

申请号：US10532822

申请日：2003-09-26

Applicant: Jun Kumagai ,  Akihiro Kishimoto ,  Hirofumi Konishi

Inventor： Jun Kumagai ,  Akihiro Kishimoto ,  Hirofumi Konishi

IPC: H05B37/02

CPC classification number: H02M1/4208 ,  H02M7/53871 ,  H05B41/2883 ,  H05B41/2888 ,  H05K1/0254 ,  H05K3/301 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09645 ,  H05K2201/09972 ,  H05K2201/10196 ,  H05K2201/10204 ,  Y02B20/202 ,  Y02B20/204 ,  Y02B70/126

Abstract: A full bridge circuit including four switching elements (Q1 to Q4) is alternated with a high switching frequency and a series-connected resonance circuit (5) including an inductor (L2) and a capacitor (C2) is made to resonate at a switching frequency of the full bridge circuit multiplied by an integer (for example, frequency multiplied by three), thereby generating a high voltage pulse for start up. After a high-pressure discharge lamp (DL) is started up, the full bridge circuit is alternated with a low switching frequency so as to operate as a step-down chopper for inverting the output polarity, thereby stably supplying rectangular wave voltage of low frequency to the high-pressure discharge lamp (DL) via a filter circuit including an inductor (L1) and a capacitor (C1).

公开(公告)号：US06995043B2

公开(公告)日：2006-02-07

申请号：US10299504

申请日：2002-11-18

Applicant: David J. Corisis ,  Jerry M. Brooks ,  Matt E. Schwab ,  Tracy V. Reynolds

Inventor： David J. Corisis ,  Jerry M. Brooks ,  Matt E. Schwab ,  Tracy V. Reynolds

IPC: H01L21/48 ,  H01L23/53 ,  H05K3/00

CPC classification number: H05K1/141 ,  H01L23/5385 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/19041 ,  H05K1/147 ,  H05K3/305 ,  H05K3/4084 ,  H05K2201/048 ,  H05K2203/049 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49204 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A routing element for use with a multichip module that includes a substrate that carries conductive traces that provide either additional electrical paths or shorter electrical paths than those provided by a multichip module substrate. The conductive traces may be carried upon a single surface of the routing element substrate, be carried internally by the routing element substrate, or include externally and internally carried portions. The routing element also includes a contact pad positioned at each end of each conductive trace thereof to facilitate electrical connection of each conductive trace to a corresponding terminal of the substrate or to a corresponding bond pad of a semiconductor device of the multichip module. Multichip modules are also disclosed, as are methods for designing the routing element and methods in which the routing element is used.

Abstract translation: 一种用于多芯片模块的布线元件，其包括承载提供比由多芯片模块基板提供的导电路径或更短电路径的导电迹线的基板。 导电迹线可以承载在路由元件衬底的单个表面上，由路由元件衬底在内部承载，或包括外部和内部承载的部分。 路由元件还包括位于其每个导电迹线的每一端处的接触焊盘，以便于将每个导电迹线电连接到衬底的对应端子或多芯片模块的半导体器件的对应接合焊盘。 还公开了多芯片模块，以及用于设计路由元件的方法和使用路由元件的方法。

公开(公告)号：US20050259994A1

公开(公告)日：2005-11-24

申请号：US10850216

申请日：2004-05-20

Applicant: Chao Zhang ,  Yuanjun Huang ,  Qing Huang ,  Zhiyong Jiang ,  Qiuming Wei

Inventor： Chao Zhang ,  Yuanjun Huang ,  Qing Huang ,  Zhiyong Jiang ,  Qiuming Wei

IPC: G02B6/42 ,  H04B10/00 ,  H05K1/14 ,  H05K3/36 ,  H05K9/00

CPC classification number: G02B6/4201 ,  G02B6/4246 ,  G02B6/4261 ,  G02B6/4277 ,  G02B6/428 ,  G02B6/4281 ,  G02B6/4284 ,  H05K1/14 ,  H05K3/366 ,  H05K9/0058 ,  H05K2201/048 ,  H05K2201/10598

Abstract: An optical transceiver module includes a first Printed Circuit Board having a first function circuit connected with the electrical interface and a second Printed Circuit Board having a second function circuit that is electrically connected with the first function circuit. The second Printed Circuit Board is disposed substantially perpendicular to the first Printed Circuit Board.

Abstract translation: 光收发器模块包括具有与电接口连接的第一功能电路的第一印刷电路板和具有与第一功能电路电连接的第二功能电路的第二印刷电路板。 第二印刷电路板被布置成基本上垂直于第一印刷电路板。

公开(公告)号：US20050185951A1

公开(公告)日：2005-08-25

申请号：US11110155

申请日：2005-04-20

Applicant: Hiroshi Terada ,  Naohiro Tsuchida ,  Yutaka Maeda ,  Kazuyuki Iwara ,  Tatsuo Takanashi

Inventor： Hiroshi Terada ,  Naohiro Tsuchida ,  Yutaka Maeda ,  Kazuyuki Iwara ,  Tatsuo Takanashi

IPC: G03B17/00 ,  H05K1/14 ,  H05K3/36 ,  G03B17/02

CPC classification number: G03B17/00 ,  H05K1/148 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10598

Abstract: In a camera according to the present invention, an edge portion of a lens barrel unit is projected and arranged from a front cover. The lens barrel unit is covered with a front cover cylindrical member connected to the front cover, and a front exposed portion of the front cover cylindrical member is covered with an exterior cylindrical member as a detachable (before-attaching) metal cylindrical member. The exterior cylindrical member is positioned and is fixed by an stop claw on the front-cover side. A C-shaped stop portion cover having flexibility is made flexible and is attached around the stop claw portion, and is fixed by a screw. The restriction on design is reduced on the appearance for covering the lens barrel unit of the camera, and a camera exterior portion can be made of metal.

公开(公告)号：US20050156295A1

公开(公告)日：2005-07-21

申请号：US11076740

申请日：2005-03-10

Applicant: David Corisis ,  Jerry Brooks ,  Matt Schwab ,  Tracy Reynolds

Inventor： David Corisis ,  Jerry Brooks ,  Matt Schwab ,  Tracy Reynolds

IPC: H01L23/538 ,  H05K1/14 ,  H05K3/30 ,  H05K3/40 ,  H01L23/053

CPC classification number: H05K1/141 ,  H01L23/5385 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/19041 ,  H05K1/147 ,  H05K3/305 ,  H05K3/4084 ,  H05K2201/048 ,  H05K2203/049 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49204 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A routing element for use in a semiconductor device assembly includes a substrate that carries conductive traces that provide either additional electrical paths or shorter electrical paths than those provided by a carrier substrate of the semiconductor device assembly. The conductive traces may be carried upon a single surface of the routing element substrate, be carried internally by the routing element substrate, or include externally and internally carried portions. The routing element may also include a contact pad positioned at each end of each conductive trace thereof to facilitate electrical connection of each conductive trace to a corresponding terminal of the substrate or to a corresponding bond pad of a semiconductor device of the multichip module. Multichip modules are also disclosed, as are methods for designing the routing element and methods in which the routing element is used.

Abstract translation: 用于半导体器件组件的布线元件包括承载导电迹线的衬底，该衬底提供比由半导体器件组件的载体衬底提供的电路更短的电路径或更短的电路径。 导电迹线可以承载在路由元件衬底的单个表面上，由路由元件衬底在内部承载，或包括外部和内部承载的部分。 布线元件还可以包括位于其每个导电迹线的每一端处的接触垫，以便于将每个导电迹线电连接到衬底的对应端子或多芯片模块的半导体器件的相应接合焊盘。 还公开了多芯片模块，以及用于设计路由元件的方法和使用路由元件的方法。

公开(公告)号：US06851837B2

公开(公告)日：2005-02-08

申请号：US10309966

申请日：2002-12-04

Applicant: Thomas Tessnow ,  Kim M. Albright

Inventor： Thomas Tessnow ,  Kim M. Albright

IPC: F21S2/00 ,  F21S4/00 ,  F21V19/00 ,  F21V21/35 ,  H05K1/00 ,  H05K1/14 ,  H05K1/18 ,  B60Q3/04 ,  F21V15/00

CPC classification number: H05K1/147 ,  F21S2/005 ,  F21S4/28 ,  F21V21/35 ,  F21Y2115/10 ,  H05K1/0284 ,  H05K1/189 ,  H05K2201/048 ,  H05K2201/10106 ,  Y10S362/80

Abstract: A solid-state lighting system (10) has a carrier (12 or 12a) having at least two electrically conductive traces (14, 16) thereon; and at least one module (18) carrying at least one solid-state light source (20) mounted with the carrier. The module (18) has electrical conductors (22, 24) in contact with the electrically conductive traces (14, 16) on the carrier. The carrier (12 or 12a) is elongated and the at least one module (18) has a horizontal aperture (26) therethrough with the electrical conductors (22, 24) extending at least into the aperture. The module (18) is slidably mounted upon the carrier (12 or 12a) with the carrier penetrating the horizontal aperture (26) and the electrical conductors (22, 24) in engagement with the electrical traces (14, 16).

Abstract translation: 固态照明系统（10）具有在其上具有至少两个导电迹线（14,16）的载体（12或12a） 以及携带安装有载体的至少一个固态光源（20）的至少一个模块（18）。 模块（18）具有与载体上的导电迹线（14,16）接触的电导体（22,24）。 载体（12或12a）是细长的，并且所述至少一个模块（18）具有穿过其中的至少延伸到所述孔中的电导体（22,24）的水平孔（26）。 模块（18）可滑动地安装在载体（12或12a）上，载具穿过水平孔（26）和电导体（22,24）与电迹线（14,16）接合。

公开(公告)号：US20040184184A1

公开(公告)日：2004-09-23

申请号：US10767890

申请日：2004-01-28

Applicant: Mitsumi Electric Co., Ltd.

Inventor： Hisateru Komatsu ,  Noriyuki Kobayashi ,  Makoto Konno

IPC: G11B017/00

CPC classification number: G11B33/123 ,  G11B25/043 ,  G11B33/02 ,  H05K3/363 ,  H05K3/366 ,  H05K2201/0397 ,  H05K2201/048

Abstract: In the state where a terminal forming portion of a flexible circuit board is inserted through a first insertion hole formed in a main frame and a second insertion hole formed in a main printed circuit board, the terminal forming portion is bent so as to confront a back surface of the main printed circuit board. A terminal portion of the terminal forming portion is connected, by soldering, to a circuit pattern formed on the back surface of the main printed circuit board.

Abstract translation: 在柔性电路板的端子形成部分通过形成在主框架中的第一插入孔和形成在主印刷电路板中的第二插入孔插入的状态下，端子形成部分被弯曲以面对背面 主印刷电路板表面。 端子形成部分的端子部分通过焊接连接到形成在主印刷电路板的背面上的电路图案。