公开(公告)号：US20120244728A1

公开(公告)日：2012-09-27

申请号：US13418853

申请日：2012-03-13

Applicant: JAMES RATHBURN

Inventor： JAMES RATHBURN

IPC: H01R12/71 ,  H05K3/00 ,  H05K3/34 ,  H01C17/06 ,  H01P11/00 ,  H01R43/16 ,  H01G4/00

CPC classification number: H01R12/523 ,  H01C1/14 ,  H01G4/228 ,  H01R12/7082 ,  H05K1/0231 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/4038 ,  H05K3/4092 ,  H05K7/1069 ,  H05K7/1092 ,  H05K2201/049 ,  Y10T29/43 ,  Y10T29/49016 ,  Y10T29/49099 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49222

Abstract: A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. A socket substrate is provided with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality of electrically conductive contact tabs are attached to the socket substrate so that contact tips on the contact tabs extend into the openings. The contact tips electrically couple with the BGA device when the solder balls are positioned in the openings. Vias electrically couple the contact tabs to contact pads located proximate the second surface of the socket substrate. Solder balls are bonded to the contact pads to electrically and mechanically couple the electrical interconnect to the PCB.

Abstract translation: 适于在BGA器件上的焊球和PCB之间提供界面的表面贴装电互连。 插座衬底设置有第一表面，第二表面和多个开口，其尺寸和构造用于容纳BGA器件上的焊球。 多个导电接触突片附接到插座基底，使得接触片上的接触尖端延伸到开口中。 当焊球定位在开口中时，接触尖端与BGA器件电耦合。 通孔将接触片电耦合到位于插座衬底的第二表面附近的接触垫。 焊球结合到接触焊盘，以电连接和机械耦合电互连到PCB。

公开(公告)号：US08062068B2

公开(公告)日：2011-11-22

申请号：US12663822

申请日：2008-06-10

Applicant: Tamim Peter Sidiki ,  Horst Roehm ,  Hans-Martin Ritter ,  Robert Muir Gemmel Izat ,  Rob P. Weber

Inventor： Tamim Peter Sidiki ,  Horst Roehm ,  Hans-Martin Ritter ,  Robert Muir Gemmel Izat ,  Rob P. Weber

IPC: H01R13/66

CPC classification number: H01R13/6485 ,  H01R13/6666 ,  H05K1/0259 ,  H05K1/141 ,  H05K1/18 ,  H05K2201/049 ,  H05K2201/10189 ,  H05K2201/10515 ,  Y10T29/49208

Abstract: The present invention relates to an electrical connector for a first IC, comprising a second IC (12) carrying ESD protection, the second IC (12) being integrated into the connector (8), which enhances the ESD protection and preserves the RF performance of such connector (8). The present invention further relates to a method for making an electrical connector (8) for a first IC, comprising this step of providing ESD protection to the first IC by integrating a second IC (12) carrying ESD-protection into the connector (8).

Abstract translation: 本发明涉及一种用于第一IC的电连接器，包括承载ESD保护的第二IC（12），第二IC（12）集成到连接器（8）中，这增强了ESD保护并保持了RF性能 这种连接器（8）。 本发明还涉及一种用于制造用于第一IC的电连接器（8）的方法，包括通过将携带ESD保护的第二IC（12）集成到连接器（8）中来向第一IC提供ESD保护的步骤， 。

公开(公告)号：US08059855B2

公开(公告)日：2011-11-15

申请号：US12356628

申请日：2009-01-21

Applicant: Susumu Yamagami

Inventor： Susumu Yamagami

IPC: H04R1/02

CPC classification number: H05K1/141 ,  H04N5/642 ,  H05K1/148 ,  H05K3/0052 ,  H05K3/3447 ,  H05K2201/049 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09954 ,  H05K2201/10083 ,  H05K2201/10287

Abstract: A speaker device includes a speaker and a connecting component. The speaker has a pair of input terminals spaced apart with a first predetermined distance therebetween. The connecting component electrically couples the speaker to a printed circuit board. The connecting component has a relay-use printed circuit board and a pair of lead wires. The relay-use printed circuit includes a pair of sub-board portions and a separation portion. The sub-board portions have a pair of terminal holes. The input terminals of the speaker are disposed through the terminal holes, respectively. The separation portion is disposed between the sub-board portions to couple the sub-board portions with a second predetermined distance between the terminal holes of the sub-board portions, and selectively separate the sub-board portions when the first predetermined distance between the input terminals of the speaker is different from the second predetermined distance between the terminal holes of the sub-board portions.

Abstract translation: 扬声器装置包括扬声器和连接部件。 扬声器具有一对输入端子，其间隔开第一预定距离。 连接部件将扬声器电耦合到印刷电路板。 连接部件具有继电器用印刷电路板和一对引线。 继电器用印刷电路包括一对子板部分和分离部分。 子板部分具有一对端子孔。 扬声器的输入端分别设置在端子孔中。 分离部分设置在子板部分之间，以在子板部分的端子孔之间以第二预定距离耦合子板部分，并且当输入之间的第一预定距离时，选择性地分离子板部分 扬声器的端子与子板部分的端子孔之间的第二预定距离不同。

公开(公告)号：US08049317B2

公开(公告)日：2011-11-01

申请号：US12714130

申请日：2010-02-26

Applicant: Walter L. Moden

Inventor： Walter L. Moden

IPC: H01L23/02

CPC classification number: H01L24/81 ,  H01L21/485 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5382 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/75 ,  H01L24/85 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/75 ,  H01L2224/81801 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K1/141 ,  H05K3/305 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10477 ,  H05K2201/10727 ,  H05K2203/0415 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A semiconductor device assembly includes a substrate and a semiconductor die adjacent to a first surface of the substrate. The substrate also includes a second surface opposite from the first surface, an opening extending from the first surface and the second surface, contact pads on the second surface, and substrate pads on the second surface, adjacent to the opening. Bond pads of the semiconductor die are aligned with the opening through the substrate. Intermediate conductive elements, such as bond wires, extend from bond pads of the semiconductor die, through the opening, to substrate pads on the opposite, second surface of the substrate. An encapsulant, which fills the opening and covers the intermediate conductive elements, protrudes beyond a plane in which the second surface of the substrate is located. Discrete conductive elements, such as solder balls, may protrude from the contact pads of the substrate.

Abstract translation: 半导体器件组件包括与衬底的第一表面相邻的衬底和半导体管芯。 衬底还包括与第一表面相对的第二表面，从第一表面和第二表面延伸的开口，第二表面上的接触焊盘以及与开口相邻的第二表面上的衬底焊盘。 半导体管芯的焊盘与通过衬底的开口对准。 诸如接合线的中间导电元件从半导体管芯的接合焊盘延伸通过开口，延伸到衬底的相对的第二表面上的衬底焊盘。 填充开口并覆盖中间导电元件的密封剂突出超过衬底的第二表面所在的平面。 离散导电元件，例如焊球，可能从基板的接触垫突出。

公开(公告)号：US20110110060A1

公开(公告)日：2011-05-12

申请号：US12941265

申请日：2010-11-08

Applicant: Masaaki TOGASHI ,  Kouji YAMADA

Inventor： Masaaki TOGASHI ,  Kouji YAMADA

IPC: H05K7/02 ,  H05K1/18

CPC classification number: H05K1/0231 ,  H05K1/112 ,  H05K1/141 ,  H05K1/181 ,  H05K1/182 ,  H05K2201/049 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10674 ,  Y02P70/611

Abstract: An electronic component mounting structure which can reduce the ESL while saving the space when mounting electronic components is provided. A first electronic component 7 is electrically connected to surface-mounted electrode parts 11A, 12A at metal terminals 26, 27 such that a first capacitor 24 having a greater capacitance and a mounting surface 4a of a multilayer substrate 4 are separated from each other. A second electronic component 8 is arranged between the first capacitor 24 and the mounting surface 4a and electrically connected to surface-mounted electrode parts 12B, 11B at second terminal electrodes 32, 33. The second electronic component 8 overlaps the first capacitor 24 when seen in the laminating direction. The first electronic component 7 is mounted to the multilayer substrate 4 such that first terminal electrodes 22, 23 oppose each other in a predetermined direction D1. The second electronic component 8 is mounted to the multilayer substrate 4 such that the second terminal electrodes 32, 33 oppose each other in the predetermined direction D1.

Abstract translation: 提供一种电子部件安装结构，其能够在安装电子部件的同时节省空间的同时减小ESL。 第一电子部件7在金属端子26,27处电连接到表面安装电极部分11A，12A，使得具有较大电容的第一电容器24和多层基板4的安装表面4a彼此分离。 第二电子部件8布置在第一电容器24和安装表面4a之间，并且在第二端子电极32,33处与表面安装的电极部分12B，11B电连接。第二电子部件8与第一电容器24重叠， 层压方向。 第一电子部件7安装到多层基板4，使得第一端子电极22,23在预定方向D1上彼此相对。 第二电子部件8安装到多层基板4，使得第二端子电极32,33在预定方向D1上彼此相对。

公开(公告)号：US20110102075A1

公开(公告)日：2011-05-05

申请号：US12985990

申请日：2011-01-06

Applicant: Steve Weir ,  Scott McMorrow

Inventor： Steve Weir ,  Scott McMorrow

IPC: H01L25/00

CPC classification number: H05K1/141 ,  H01L23/66 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/3011 ,  H03H7/01 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/0263 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/049 ,  H05K2201/09254 ,  H05K2201/09309 ,  H05K2201/09781 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: A power distribution system for integrated circuits includes methods to damp resonance between a bypass capacitor network and a power/ground cavity of the printed circuit board that (a) does not require excessive quantities of bypass/damping components or (b) does not require high plane cavity capacitance or in the alternative can insure a Q of less than 1.4 at the transition from the bypass network to the plane cavity impedance cross-over.

Abstract translation: 用于集成电路的配电系统包括阻止旁路电容器网络和印刷电路板的电源/接地腔之间的谐振的方法，（a）不需要过量的旁路/阻尼部件，或（b）不需要高 平面腔电容，或者在旁路网络到平面腔阻抗交叉的过渡中，可以确保小于1.4的Q。

公开(公告)号：US20110068878A1

公开(公告)日：2011-03-24

申请号：US12851393

申请日：2010-08-05

Applicant: Steve Weir ,  Scott McMorrow

Inventor： Steve Weir ,  Scott McMorrow

IPC: H03H7/38 ,  H05K1/16

CPC classification number: H05K1/141 ,  H01L23/66 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/0263 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/049 ,  H05K2201/09254 ,  H05K2201/09309 ,  H05K2201/09781 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T307/492

Abstract: A power distribution system for integrated circuits includes methods to damp resonance between a bypass capacitor network and a power/ground cavity of the printed circuit board that (a) does not require excessive quantities of bypass/damping components or (b) does not require high plane cavity capacitance or in the alternative can insure a Q of less than 1.4 at the transition from the bypass network to the plane cavity impedance cross-over.

公开(公告)号：US07889043B2

公开(公告)日：2011-02-15

申请号：US12536943

申请日：2009-08-06

Applicant: Jui-Yuan Hsu ,  Hong-Jian Gan

Inventor： Jui-Yuan Hsu ,  Hong-Jian Gan

IPC: H01F5/00

CPC classification number: H01F27/06 ,  H01F27/2866 ,  H01F27/2871 ,  H01F27/325 ,  H01F27/40 ,  H01F2027/065 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/049 ,  H05K2201/1003

Abstract: An assembly structure includes a transformer, a system circuit board and an auxiliary circuit board. The transformer includes a primary winding coil, a secondary winding assembly and a magnetic core assembly. The magnetic core assembly is partially embedded within the primary winding coil and the secondary winding assembly. The secondary winding assembly has multiple output ends. The system circuit board is connected to the primary winding coil. The auxiliary circuit board is connected to the system circuit board and has multiple connecting parts. The output ends of the secondary winding assembly of the transformer are connected with corresponding connecting parts of the auxiliary circuit board.

Abstract translation: 组装结构包括变压器，系统电路板和辅助电路板。 变压器包括初级绕组线圈，次级绕组组件和磁芯组件。 磁芯组件部分地嵌入初级绕组线圈和次级绕组组件内。 次级绕组组件具有多个输出端。 系统电路板连接到初级绕组线圈。 辅助电路板连接到系统电路板，并具有多个连接部分。 变压器的次级绕组组件的输出端与辅助电路板的相应连接部分连接。

公开(公告)号：US20110019377A1

公开(公告)日：2011-01-27

申请号：US12847483

申请日：2010-07-30

Applicant: Kenneth J. Kledzik ,  Jason C. Engle

Inventor： Kenneth J. Kledzik ,  Jason C. Engle

IPC: H05K7/12

CPC classification number: H05K1/14 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06572 ,  H01L2924/01078 ,  H01L2924/15331 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/0268 ,  H05K1/0298 ,  H05K1/141 ,  H05K1/144 ,  H05K1/183 ,  H05K3/3436 ,  H05K7/12 ,  H05K2201/049 ,  H05K2201/09036 ,  H05K2201/09954 ,  H05K2201/10515 ,  H05K2201/10734 ,  H05K2203/1572

Abstract: An apparatus and method is disclosed that allows for the arranging in a three dimensional array semiconductor chips on a circuit board. A unique chip carrier is disclosed on which any IC chip can be positioned on above the other on a circuit board. Additionally, the carrier allows for the testing of IC chips on the carrier and underneath it without having to remove the carrier and chips from the system even if they are of the BGA or CSP type. The carrier includes exposed test points to allow an on site test.

Abstract translation: 公开了允许在电路板上布置三维阵列半导体芯片的装置和方法。 公开了一种独特的芯片载体，其中任何IC芯片可以在电路板上定位在另一个上。 此外，载体允许在载体上并在其下测试IC芯片，而不必从系统中移除载体和芯片，即使它们是BGA或CSP型。 运营商包括暴露的测试点，以便现场测试。

公开(公告)号：US07868429B2

公开(公告)日：2011-01-11

申请号：US12060289

申请日：2008-04-01

Applicant: Parn-Far Chen ,  Hsiu-Wu Tung ,  Chao-Yu Chou

Inventor： Parn-Far Chen ,  Hsiu-Wu Tung ,  Chao-Yu Chou

IPC: H01L23/495

CPC classification number: H01L27/14618 ,  H01L27/14636 ,  H01L27/14683 ,  H01L2924/0002 ,  H05K1/147 ,  H05K2201/049 ,  H05K2201/10121 ,  H01L2924/00

Abstract: The micro-sensor for a micro image pick-up device includes a flexible circuit board and a circuit substrate. The flexible circuit board has an opening exposing an end of a plurality of metal wires. An image sensing device that electrically connected to a plurality of printed wires disposed on the circuit substrate. The circuit substrate is disposed at the opening of the flexible circuit board. The plurality of printed wires on the circuit substrate corresponds to and contacts the end of the plurality of metal wires exposed out of the flexible circuit board. With the design of the flexible circuit board, the steps of forming a plurality of wiring ducts on the circuit substrate and electrically connecting the printed wires of the circuit substrate by a plurality of connecting lines for transferring signals can be omitted.

Abstract translation: 用于微图像拾取装置的微传感器包括柔性电路板和电路基板。 柔性电路板具有露出多根金属线的端部的开口。 一种图像感测装置，其电连接到设置在电路基板上的多个印刷线。 电路基板设置在柔性电路板的开口处。 电路基板上的多根印刷线对应于与柔性电路板露出的多根金属线的端部接触。 通过柔性电路板的设计，可以省略在电路基板上形成多个布线导管并通过多个用于传送信号的连接线电连接电路基板的印刷线路的步骤。