公开(公告)号：US20040266252A1

公开(公告)日：2004-12-30

申请号：US10835776

申请日：2004-04-30

Inventor： Bunya Sato

IPC: H01R013/00

CPC classification number: H01R43/0242 ,  H01R4/02 ,  H05K3/328 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/062

Abstract: A composite board is fixed by solder to an electrode land formed on a circuit board having an electric wiring. The composite board and another metal plate are bonded by using an electric welding method or the like. By bonding a metal plate of a low resistance or a non-metal plate to the composite board, heat of high temperature or a large current which is generated upon electric wiring can be made difficult to be transferred to a lower portion of the composite board. A structure of a terminal member in which it is possible to prevent the solder under the composite board from being diffused, the solder is not scattered to the periphery, and a short-circuit is not caused is obtained. The terminal member to form the circuit board which is more mechanically and electrically stable is provided.

Abstract translation: 复合板通过焊料固定到形成在具有电布线的电路板上的电极焊盘。 复合板和另一金属板通过电焊方法等粘合。 通过将低电阻金属板或非金属板的金属板接合到复合板，可以使得难以将高温或在电线上产生的大电流传递到复合板的下部。 可以防止复合板下方的焊料扩散的端子构件的结构，焊料不会散射到周围，并且不产生短路。 提供了更机械和电气稳定的形成电路板的端子构件。

公开(公告)号：US06777105B2

公开(公告)日：2004-08-17

申请号：US09995591

申请日：2001-11-29

Applicant: Kazuto Kadokawa

Inventor： Kazuto Kadokawa

IPC: B32B104

CPC classification number: H05K3/3447 ,  H01L23/3675 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K2201/062 ,  H05K2201/066 ,  H05K2201/10166 ,  Y10T428/12354 ,  Y10T428/12361 ,  Y10T428/1241 ,  Y10T428/12528 ,  H01L2924/00

Abstract: A part has a body unit; and one or more leg formed on the body unit. One or more slit is formed on the body unit adjacent to the leg. The legs are inserted to insert holes of a printed wiring board or the like and soldered thereto. Since the slit is formed adjacent to the leg, the heat applied to the leg for the soldering is not radiated by the body unit by virtue of the slit. Therefore, the part can be reliably attached to the printed wiring board or the like.

Abstract translation: 一部分有一个身体单位; 以及形成在身体单元上的一个或多个腿。 在与腿部相邻的主体单元上形成一个或多个狭缝。 插入腿以插入印刷线路板等的孔并焊接到其上。 由于狭缝与腿部相邻地形成，所以施加到用于焊接的腿部的热量由于狭缝而不被身体单元辐射。 因此，该部件可以可靠地附接到印刷线路板等。

公开(公告)号：US20040134975A1

公开(公告)日：2004-07-15

申请号：US10340058

申请日：2003-01-10

Applicant: Visteon Global Technologies, Inc.

Inventor： Lakhi N. Goenka ,  Brenda J. Nation ,  Peter J. Sinkunas ,  Mark Tor

IPC: B23K031/00

CPC classification number: H05K3/3494 ,  B23K1/0016 ,  B23K2101/40 ,  H05K2201/062 ,  H05K2203/081 ,  H05K2203/111 ,  H05K2203/1121 ,  H05K2203/1581

Abstract: The present invention involves a composite pallet for a substrate of a printed circuit board for a vector transient reflow process. The composite pallet includes a heat conductive layer for heat sinking means from the substrate and a heat insulative layer adjacent the conductive layer to shield the substrate from heat and to absorb heat from the heat conductive layer. The heat conductive layer has first and second opposite surfaces. The first surface is configured to receive the substrate disposed thereon to diffuse heat from the substrate during the vector transient reflow process. The heat insulative layer is disposed adjacent the second surface.

Abstract translation: 本发明涉及用于矢量瞬态回流工艺的印刷电路板的基板的复合托盘。 复合托盘包括用于来自基板的散热装置的导热层和邻近导电层的隔热层，以屏蔽基板免受热量并吸收来自导热层的热量。 导热层具有第一和第二相对表面。 第一表面被配置为接收设置在其上的衬底，以在矢量瞬态回流过程期间从衬底扩散热量。 绝热层设置在第二表面附近。

公开(公告)号：US20040025333A1

公开(公告)日：2004-02-12

申请号：US10356464

申请日：2003-02-03

Applicant: IBIDEN Co., Ltd.

Inventor： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H05K003/36 ,  H05K003/20

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 nullm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US20040020972A1

公开(公告)日：2004-02-05

申请号：US10627710

申请日：2003-07-28

Inventor： Yoshiyuki Miyajima

IPC: B23K031/00

CPC classification number: H05K1/116 ,  B23K1/0016 ,  B23K2101/42 ,  H05K1/0201 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/062 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/0989

Abstract: Disclosed is an improved printed circuit board having circuit patterns printed thereon. It has a plurality of composite lands each including a first land having a terminal hole made at its center for inserting the terminal of a selected electric or electronic part or device, and a plurality of second lands each being contiguous to and extending outwards from the first land. The areas contiguous to the contours of the first and second lands have no conductive foils such as copper foils to expose the substrate surface of the printed circuit board. The exposed areas are effective to confine the thermal energy in the limited areas for soldering. And the composite land shape defines a ridged cone like solder lump, which can fixedly grip the terminal of the part or device.

Abstract translation: 公开了一种改进的印刷电路板，其上印有电路图案。 它具有多个复合凸台，每个复合凸台包括具有在其中心形成的端子孔的第一凸台，用于插入所选择的电气或电子部件或装置的端子，以及多个第二凸台，每个第二凸台与第一凸台相邻并向外延伸 土地。 与第一和第二焊盘的轮廓相邻的区域没有导电箔，例如铜箔，以露出印刷电路板的基板表面。 暴露的区域有效地将热能限制在有限的焊接区域。 并且复合地面形状限定了一个像脊状的圆锥状的焊料块，它可以固定地夹住零件或装置的端子。

公开(公告)号：US20030128522A1

公开(公告)日：2003-07-10

申请号：US10302813

申请日：2002-11-25

Inventor： Eriko Takeda ,  Atsushi Isobe ,  Satoshi Tanaka ,  Hiroshi Okabe

IPC: H05K007/20

CPC classification number: H01L23/345 ,  H01L23/3677 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15153 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/19105 ,  H05K1/0201 ,  H05K1/0206 ,  H05K1/0298 ,  H05K1/0306 ,  H05K2201/062 ,  H01L2924/00012

Abstract: The module comprises at least: a first chip forming a heater element; a second chip forming a device whose operating characteristics vary with temperature change or whose maximum operating temperature is lower than the maximum operating temperature of the first chip; and a multilayer substrate which is comprised of a plurality of dielectric layers and a plurality of conductor layers and mechanically supports the first chip and the second chip with some of the conductor layers electrically connected with these chips. The module has at least one of the following means: means for conducting the heat generated by the first chip throughout the module; means for guiding the heat generated by the first chip from the module's top face side to its bottom face side; and means for interrupting heat conduction from the first conductor pattern on which the first chip is placed to the second conductor pattern on which the second chip is placed. Thereby, there is provided a compact radio frequency module with high integration in function.

Abstract translation: 该模块至少包括：形成加热元件的第一芯片; 第二芯片，其形成其工作特性随温度变化而变化或其最大工作温度低于第一芯片的最大工作温度的器件; 以及由多个介电层和多个导体层组成的多层基板，并且机械地支撑第一芯片和第二芯片，其中一些导体层与这些芯片电连接。 模块具有以下装置中的至少一个：用于在整个模块中传导由第一芯片产生的热量的装置; 用于将由第一芯片产生的热量从模块的顶面侧引导到其底面侧的装置; 以及用于中断从其上放置第一芯片的第一导体图案到放置第二芯片的第二导体图案的热传导的装置。 由此，提供了具有高功能集成度的紧凑型射频模块。

公开(公告)号：US20030112710A1

公开(公告)日：2003-06-19

申请号：US10026059

申请日：2001-12-18

Inventor： John C. Eidson ,  Stanley P. Woods ,  Hans Sitte

IPC: G06F001/04 ,  G04F005/00

CPC classification number: G04F5/063 ,  G06F1/20 ,  H05K1/0201 ,  H05K2201/062 ,  H05K2201/093 ,  H05K2201/0969 ,  H05K2201/10371 ,  H05K2201/2036 ,  H05K2203/165 ,  H05K2203/304

Abstract: A variety of techniques for low cost reduction of thermal drift in electronic components. These techniques include structures for increasing the thermal mass of an electronic component and for insulating an electronic component from thermal drift caused by air flow as well as structures for thermally isolating an electronic component from heat flow on a circuit board.

Abstract translation: 各种低成本降低电子部件热漂移的技术。 这些技术包括用于增加电子部件的热质量并使电子部件与由空气流引起的热漂移绝缘的结构以及用于将电子部件与电路板上的热流隔离的结构。

公开(公告)号：US06570484B2

公开(公告)日：2003-05-27

申请号：US10242980

申请日：2002-09-13

Applicant: Michio Miyazaki ,  Haruyuki Takeuchi ,  Tadao Bekku

Inventor： Michio Miyazaki ,  Haruyuki Takeuchi ,  Tadao Bekku

IPC: H01C710

CPC classification number: H01C1/01 ,  H01C1/014 ,  H01C1/1406 ,  H05K1/0201 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/062 ,  H05K2201/10378 ,  H05K2201/10643 ,  H05K2201/10659 ,  H05K2201/2036 ,  Y02P70/611

Abstract: A thermistor with positive resistance-to-temperature characteristic used in a overcurrent protection circuit has electrodes on mutually opposite main surfaces and is mounted to a substrate having electrically conductive members such that deterioration of its voltage resistance due to heat emission can be controlled. A spacer with smaller thermal conductivity than the substrate and penetrated by a conductor piece with a small cross-sectional area is inserted between solder materials connecting to one of the thermistor electrodes. The other electrode is contacted by an elongated connecting member through its sectional surface transverse to its longitudinal direction such that the cross-sectional area of electrical conduction is reduced.

公开(公告)号：US20020166690A1

公开(公告)日：2002-11-14

申请号：US10132261

申请日：2002-04-26

Inventor： Akihiko Chiriku ,  Norio Ito ,  Hiroyuki Sasaki ,  Yoshiyuki Takahara

IPC: H02G003/18

CPC classification number: H02G3/08 ,  H05K1/0201 ,  H05K2201/062 ,  H05K2201/09972

Abstract: A connection box includes a wiring board. The box includes a control board connected to the wiring board. The control board including a control device and another device separated thereinto. Another device has generation heat greater than the control device.

Abstract translation: 接线盒包括接线板。 盒子包括连接到接线板的控制板。 控制板包括控制装置和分离的另一装置。 另一种装置的发电量大于控制装置。

公开(公告)号：US20020080852A1

公开(公告)日：2002-06-27

申请号：US09745829

申请日：2000-12-21

Inventor： Russell N. Mirov

IPC: G01K001/00 ,  G01R031/02

CPC classification number: H05K1/0201 ,  G01K1/20 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/10151

Abstract: A method and apparatus for thermally isolating a temperature sensor mounted on a printed circuit board from a heat generating component mounted on the printed circuit board is provided. Generally, a thermal isolation region, which may be comprised of a plurality of openings in the printed circuit board, is disposed about the temperature sensor to interrupt conductive transfer of heat from the heat generating component to the temperature sensor. The openings extend sufficiently far into the printed circuit board to remove at least a portion of a conductive layer, such as a power plane from the region surrounding the temperature sensor. Electrical power and signals may be provided to the temperature sensor through regions intermediate the openings.

Abstract translation: 提供了一种用于将安装在印刷电路板上的温度传感器与安装在印刷电路板上的发热部件进行热隔离的方法和装置。 通常，可以在印刷电路板中由多个开口组成的热隔离区域设置在温度传感器周围，以中断热量从发热部件到温度传感器的传导传递。 这些开口足够远地延伸到印刷电路板中以从包围温度传感器的区域移除至少一部分导电层，例如电源平面。 可以通过开口之间的区域向温度传感器提供电力和信号。