Patent search cpc:"H05K2201/066" Page 5

41.

发明申请
HEAT SINK RETENTION SPRING CLIP 有权

公开(公告)号：US20180054914A1

公开(公告)日：2018-02-22

申请号：US15243279

申请日：2016-08-22

Applicant: Verizon Patent and Licensing Inc.

Inventor： Gregory A. James , Steve S. Chen

IPC: H05K7/20 , F16B2/24 , H05K1/02

CPC classification number: H05K7/2039 , F16B2/248 , H01L23/40 , H01L23/4093 , H05K1/0203 , H05K2201/066

Abstract: A retaining clip is provided for use with a heat sink. The heat sink has a flat bottom surface in heat conducting engagement with an electronic device and fins extending from a top surface of the heat sink, the fins defining a channel. The retainer clip includes a middle section and a first end section and a second end section on either side of the middle section. The middle section fits within the channel and engages the heat sink to hold the bottom surface against the electronic device. The middle section further includes a portion extending above the top surface, within the channel, to limit rotation of the heat sink. Each of the first and second end sections include a pivot end adjacent to the middle section, a distal end to engage an anchor, a first leg adjacent to the distal end, a second leg adjacent to a pivot end, and a bend between the first leg and the second leg, the bend located to form a moment arm from the pivot end.

42.

发明申请
System and Method for a Modular Multi-Panel Display 审中-公开

公开(公告)号：US20180054906A1

公开(公告)日：2018-02-22

申请号：US15802241

申请日：2017-11-02

Applicant: Ultravision Technologies, LLC

Inventor： William Y. Hall

IPC: H05K5/02 , G09F9/302 , G09G3/00 , G09G3/32 , H05K3/32 , H05K1/18 , G06F3/14 , H05K7/20 , H05K7/14

CPC classification number: G09F13/22 , F21K9/20 , F21K9/90 , F21V23/023 , F21V31/005 , F21Y2101/00 , F21Y2115/10 , G06F1/1601 , G06F1/182 , G06F1/183 , G06F1/188 , G06F1/189 , G06F1/20 , G06F1/26 , G06F3/1423 , G06F3/1446 , G06F3/147 , G06T1/60 , G09F9/3023 , G09F2013/222 , G09G3/006 , G09G3/32 , G09G5/003 , G09G5/14 , G09G2300/026 , G09G2300/04 , G09G2320/029 , G09G2330/02 , G09G2330/045 , G09G2330/10 , G09G2360/04 , H01B7/2825 , H01B9/003 , H01B11/02 , H04N7/00 , H05K1/181 , H05K3/32 , H05K5/0017 , H05K5/0247 , H05K5/0256 , H05K5/03 , H05K5/06 , H05K7/1422 , H05K7/1427 , H05K7/20 , H05K7/20127 , H05K7/20136 , H05K7/2039 , H05K7/20954 , H05K7/20963 , H05K999/99 , H05K2201/066 , H05K2201/10106 , H05K2201/10128 , H05K2201/1028 , Y02P70/611

Abstract: A LED display panel includes a casing having a recess. The casing has a first side and an opposite second side, where the first side of the casing includes a first surface that is part of a first outer surface of the modular LED display panel, and the second side of the casing includes a second surface that is part of a second outer surface of the modular LED display panel. The casing has attachment points at the second outer surface. A printed circuit board is disposed in the recess. A plurality of LEDs is attached to a first side of the printed circuit board. A processor is coupled to the plurality of LEDs, where the processor is configured to process received media and control operation of the plurality of LEDs. The modular LED display panel is sealed to be waterproof and is configured to be cooled passively.

43.

发明授权
Cooling device 有权

公开(公告)号：US09900973B2

公开(公告)日：2018-02-20

申请号：US14867465

申请日：2015-09-28

Applicant: NEC Corporation

Inventor： Yuki Matsumoto

IPC: H05K7/20 , H01L23/40 , H01L23/36 , H05K1/02

CPC classification number: H05K1/0204 , H01L23/36 , H01L23/40 , H05K7/2039 , H05K2201/066 , H05K2201/10409

Abstract: The object of the present invention is to provide a cooling device capable of more efficiently cooling heating components heated. The cooling device has a first heat sink and a heat conductor. The first heat sink is thermally coupled to a first heating component mounted on a first surface of a circuit board. The heat conductor is thermally coupled to a second heating component mounted on a second surface of the circuit board and is thermally coupled to the first heat sink.

44.

发明申请
POWER CONVERTER 审中-公开

公开(公告)号：US20180042104A1

公开(公告)日：2018-02-08

申请号：US15785563

申请日：2017-10-17

Applicant: OMRON Corporation

Inventor： Shingo NAGAOKA , Hiroyuki ONISHI , Takeo NISHIKAWA , Kentaro HAMANA

IPC: H05K1/02 , H01L23/433 , H05K1/18

CPC classification number: H05K1/0216 , H01L23/36 , H01L23/4332 , H01L23/5222 , H02M1/44 , H02M3/155 , H02M7/48 , H05K1/0209 , H05K1/181 , H05K2201/0311 , H05K2201/066 , H05K2201/0792 , H05K2201/10166 , H05K2201/10265 , H05K2201/10356 , H05K2201/10628 , H05K2201/10757

Abstract: Provided is a power converter which is applied to a power converter equipped with a switching element provided on a line, and a radiator connected to a predetermined potential such as a ground potential. A noise eliminator in which a conductive member is covered with insulator is provided between the switching element (semiconductor switch) and the radiator (heatsink). A flexible connecting line connected to a conductive member of the noise eliminator is connected to an on-board line disposed on a circuit board.

45.

发明申请
PRINTED CIRCUIT BOARD ASSEMBLY 审中-公开

公开(公告)号：US20180042100A1

公开(公告)日：2018-02-08

申请号：US15664369

申请日：2017-07-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seok-hun KANG , In-beom KIM , Bo-ram KIM , Soo-hong KIM

IPC: H05K1/02 , H05K1/18

CPC classification number: H05K1/0206 , H05K1/00 , H05K1/02 , H05K1/0203 , H05K1/18 , H05K1/181 , H05K3/30 , H05K3/3447 , H05K3/429 , H05K7/20 , H05K7/20509 , H05K2201/066 , H05K2201/1056 , Y02P70/611

Abstract: A printed circuit board assembly is provided. A printed circuit board assembly includes a printed circuit board; an electronic component mounted on the printed circuit board; a heat radiating member which contacts the electronic component and is configured to receive and conduct heat generated by the electronic component; and at least one connection part connecting the printed circuit board and the heat radiating member to each other and configured to transfer the heat conducted through the heat radiating member to the printed circuit board.

46.

发明申请
SUBSTRATE UNIT 审中-公开

公开(公告)号：US20180033714A1

公开(公告)日：2018-02-01

申请号：US15549243

申请日：2016-01-29

Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , Sumitomo Electric Indutries, Ltd.

Inventor： Shungo Hiratani , Hideaki Tahara , Kazuyoshi Ohara , Munsoku O , Hideo Morioka , Arinobu Nakamura

IPC: H01L23/367 , H01L23/50 , H01L25/07

CPC classification number: H01L23/3675 , H01L23/36 , H01L23/50 , H01L25/072 , H05K1/0209 , H05K1/183 , H05K7/209 , H05K2201/066 , H05K2201/10166

Abstract: Provided is a substrate unit configured to improve heat dissipation efficiency while preventing workability from degrading at the time of assembly. A substrate unit includes: a substrate that has one surface on having a conductive pattern, and includes an opening; a conductive member that includes a main portion is fixed to the other surface of the substrate, and at least one terminal of an electronic component is electrically connected via the opening; and a heat dissipation member is fixed to a surface of the conductive member opposite a substrate side surface thereof, wherein the conductive member is provided with an extension portion that extends from the main portion of the conductive member and to which an external device is to be electrically connected, the extension portion intersecting a plane that extends along the heat dissipation member.