公开(公告)号：US20110164005A1

公开(公告)日：2011-07-07

申请号：US13063153

申请日：2009-07-06

Applicant: Hideki Miyata

Inventor： Hideki Miyata

IPC: G09G5/00

CPC classification number: H05K1/0215 ,  G02F1/13452 ,  H05K1/147 ,  H05K2201/09145 ,  H05K2201/10409

Abstract: Provided is a liquid crystal display device (1) including a liquid crystal panel (display unit) (2) having a plurality of pixels (P) for displaying information on the liquid crystal panel (2). The liquid crystal display device (1) includes: a bezel (14) for housing the liquid crystal panel (2); a plurality of source drivers (23-1 to 23-9) for driving the plurality of pixels (P); a plurality of printed circuit boards (10) arranged inside the bezel (14) and respectively connected to at least one of the source drivers (23-1 to 23-9); and a flexible printed circuit board (28) pulled out of the bezel (14) and connected between two adjacent printed circuit boards (10).

Abstract translation: 本发明提供一种液晶显示装置（1），包括具有用于在液晶面板（2）上显示信息的多个像素（P）的液晶面板（显示单元）（2）。 液晶显示装置（1）包括：用于容纳液晶面板（2）的边框（14）; 用于驱动所述多个像素（P）的多个源极驱动器（23-1至23-9）; 多个印刷电路板（10），布置在所述边框（14）内部并分别连接到所述源极驱动器（23-1至23-9）中的至少一个; 以及从所述边框（14）拉出并连接在两个相邻的印刷电路板（10）之间的柔性印刷电路板（28）。

公开(公告)号：US07940365B2

公开(公告)日：2011-05-10

申请号：US11650133

申请日：2007-01-05

Applicant: Shawn Robert Gettemy ,  Wei Yao ,  Barry Corlett

Inventor： Shawn Robert Gettemy ,  Wei Yao ,  Barry Corlett

IPC: G02F1/1345

CPC classification number: H05K1/147 ,  G02F1/1345 ,  H05K1/181 ,  H05K2201/09145 ,  H05K2201/09227 ,  H05K2201/10674 ,  Y10T29/4913

Abstract: Compact sub-assemblies of flexible circuits and drivers are provided. The sub-assemblies can occupy less space in an electronic device than conventional sub-assemblies. In one or more embodiments of the present invention, the flexible circuits can be attached to or wires can be disposed on portions of the substrate that previously were unoccupied in conventional sub-assemblies. In one or more embodiments, the sub-assemblies of the present invention also can have wires disposed underneath the driver or vary the width of the wires. In one or more embodiments, the sub-assemblies of the present invention also can have composite wires that occupy less space than wires of conventional sub-assemblies, while still maintaining similar energy flux.

Abstract translation: 提供了柔性电路和驱动器的紧凑型子组件。 子组件在电子设备中的占用空间比传统子组件少。 在本发明的一个或多个实施例中，柔性电路可以附接到或可以将线布置在先前在常规子组件中未被占用的衬底的部分上。 在一个或多个实施例中，本发明的子组件还可以具有布置在驱动器下方的线或者改变线的宽度。 在一个或多个实施例中，本发明的子组件还可以具有与传统子组件的线相比占据更少空间的复合线，同时仍保持相似的能量通量。

公开(公告)号：US07874861B2

公开(公告)日：2011-01-25

申请号：US12495725

申请日：2009-06-30

Applicant: Yi-Kuo Wang

Inventor： Yi-Kuo Wang

IPC: H01R13/62

CPC classification number: H05K3/0097 ,  H05K2201/09145 ,  H05K2201/10598 ,  H05K2203/0169 ,  H05K2203/167

Abstract: For connecting multiple PC boards to form a PCB pane, a PCB connector is disclosed include a bearing strip, which has locating grooves spaced along the length, upright pins disposed in the locating grooves and inserted through respective through holes on connection portions of the PC boards to be connected and studs spaced along the length and disposed beyond the locating grooves, and a holding down strip, which has locating grooves corresponding to the locating grooves of the bearing strip for receiving the connection strips of the PC boards, pin holes respectively press-fitted onto the upright pins and sockets respectively fastened to the studs of the bearing strip.

Abstract translation: 为了连接多个PC板以形成PCB板，公开了一种PCB连接器，其包括具有沿着长度间隔开的定位槽的轴承条，设置在定位槽中的直立销插入通过PC板的连接部分上的相应通孔 被连接并且沿着长度间隔开并且设置在定位槽之外的螺柱，以及具有对应于用于接收PC板的连接条的轴承条的定位槽的定位槽的压紧带， 安装在分别固定在轴承条的螺柱上的直立销和插座上。

公开(公告)号：US20100328919A1

公开(公告)日：2010-12-30

申请号：US12882122

申请日：2010-09-14

Applicant: William O. Alger ,  Gary B. Long ,  Gary A. Brist ,  Bryce D. Horine

Inventor： William O. Alger ,  Gary B. Long ,  Gary A. Brist ,  Bryce D. Horine

IPC: H05K7/00 ,  H01B19/00 ,  H05K3/10

CPC classification number: H05K1/0366 ,  H05K1/024 ,  H05K3/0052 ,  H05K2201/029 ,  H05K2201/09145 ,  H05K2201/09236 ,  Y10T29/49155 ,  Y10T29/49227 ,  Y10T156/1052 ,  Y10T428/249924 ,  Y10T428/249939 ,  Y10T428/24994

Abstract: A method of making a printed circuit board panel, a printed circuit board panel made according to the method, and a system incorporating a printed circuit board provided onto the panel. The printed circuit board panel has a panel top edge, a panel bottom edge parallel to the panel top edge, and two parallel panel side edges, and further includes a first set of fiber bundles extending at the predetermined angle with respect to the panel side edges, and a second set of fiber bundles extending at the predetermined angle with respect to the panel top edge.

Abstract translation: 制造印刷电路板面板的方法，根据该方法制造的印刷电路板面板以及设置在面板上的印刷电路板的系统。 印刷电路板面板具有面板顶部边缘，平行于面板顶部边缘的面板底部边缘和两个平行面板侧边缘，并且还包括第一组纤维束，其相对于面板侧边缘以预定角度延伸 以及相对于面板顶部边缘以预定角度延伸的第二组纤维束。

公开(公告)号：US07770048B2

公开(公告)日：2010-08-03

申请号：US11750046

申请日：2007-05-17

Applicant: Slavek P. Aksamit ,  David D. Chudy ,  Cristian Medina

Inventor： Slavek P. Aksamit ,  David D. Chudy ,  Cristian Medina

IPC: G06F1/04

CPC classification number: G07C3/10 ,  H05K3/366 ,  H05K2201/09145 ,  H05K2201/10189 ,  H05K2203/163

Abstract: An apparatus is disclosed. The apparatus comprises a device and a counter system coupled thereto. The counter system provides an indication of a number of times the device is inserted into a slot. Through the use of the device disclosed above, a history and a number of insertions of a particular device within a system can be known and therefore it can be determined if the integrity of the device is threatened.

Abstract translation: 公开了一种装置。 该装置包括与其耦合的装置和计数器系统。 计数器系统提供设备插入插槽的次数的指示。 通过使用上述公开的装置，系统内的特定装置的历史和许多插入是已知的，因此可以确定装置的完整性是否受到威胁。

公开(公告)号：US20100033262A1

公开(公告)日：2010-02-11

申请号：US11558126

申请日：2006-11-09

Applicant: Angelo M. Puzella ,  Joseph M. Crowder ,  Patricia S. Dupuis ,  Michael C. Fallica ,  John B. Francis ,  Joseph A. Licciardello

Inventor： Angelo M. Puzella ,  Joseph M. Crowder ,  Patricia S. Dupuis ,  Michael C. Fallica ,  John B. Francis ,  Joseph A. Licciardello

IPC: H03H7/38

CPC classification number: H01Q21/0087 ,  H03H7/38 ,  H05K1/0251 ,  H05K1/116 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/09145 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/09718 ,  H05K2201/09727 ,  H05K2201/209 ,  H05K2203/061 ,  Y10T29/49165

Abstract: A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.

Abstract translation: 多层电路板组件包括构成电路板组件的不同电路板上的不同电路层之间的一个或多个射频（RF）互连。 RF互连可以包括一个或多个RF匹配焊盘，其提供用于匹配RF短截线的阻抗特性的机制，以在期望的RF工作频带上提供具有期望的插入损耗和阻抗特性的RF互连。 RF匹配焊盘允许制造具有RF互连的电路板，而不需要执行任何后钻和反向填充操作以去除多层电路板组件中的RF互连的短截线部分。

公开(公告)号：US20090283299A1

公开(公告)日：2009-11-19

申请号：US12427605

申请日：2009-04-21

Applicant: Daigo SUZUKI

Inventor： Daigo SUZUKI

IPC: H05K1/09 ,  H05K3/10

CPC classification number: H05K1/186 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01046 ,  H01L2924/01078 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0209 ,  H05K3/0061 ,  H05K3/403 ,  H05K3/4069 ,  H05K3/429 ,  H05K2201/09145 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2201/10204 ,  Y10T29/49124

Abstract: According to one embodiment, a component-embedded printed circuit board is provided with a built-in component mounted on a component mounting surface of a substrate and enclosed by an insulating layer, an interior pattern layer for heat radiation which is provided on the opposite side of the built-in component from the substrate and radiates heat generated from the built-in component, and an exterior pattern layer for heat radiation connected to the interior pattern layer for heat radiation.

Abstract translation: 根据一个实施例，组件嵌入式印刷电路板设置有安装在基板的部件安装表面上并由绝缘层包围的内置部件，用于散热的内部图案层，其设置在相对侧 并且辐射从内置部件产生的热量，以及用于散热的外部图案层，其连接到用于散热的内部图案层。

公开(公告)号：US20090161324A1

公开(公告)日：2009-06-25

申请号：US12210931

申请日：2008-09-15

Applicant: Noriaki Sakamoto ,  Masahiro Kobayashi

Inventor： Noriaki Sakamoto ,  Masahiro Kobayashi

IPC: H05K9/00 ,  H05K7/00

CPC classification number: H05K9/006 ,  H05K3/308 ,  H05K3/3405 ,  H05K3/3447 ,  H05K2201/09145 ,  H05K2201/09854 ,  H05K2201/10371

Abstract: A shielding case for accommodating a wiring board includes a board mounting member with a fitting member formed at an outer frame thereof so that the wiring board is fixed and held to the board mounting member through fitting of the fitting member into a through hole formed at the wiring board.

Abstract translation: 一种用于容纳布线板的屏蔽壳体，包括：板安装部件，其具有形成在其外框架上的嵌合部件，使得所述布线板通过将所述嵌合部件嵌入到形成在所述导线板上的通孔中而固定并固定在所述板安装部件上 接线板

公开(公告)号：US20090160580A1

公开(公告)日：2009-06-25

申请号：US12170071

申请日：2008-07-09

Applicant: Yu-Chen HSIEH ,  Chih-Tse Chen ,  Yi-Bin Lee

Inventor： Yu-Chen HSIEH ,  Chih-Tse Chen ,  Yi-Bin Lee

IPC: H03H7/00 ,  H01F27/02 ,  H01F27/06

CPC classification number: H01F41/10 ,  H01F17/062 ,  H01F27/027 ,  H01F27/29 ,  H03H2001/0092 ,  H05K1/18 ,  H05K3/403 ,  H05K2201/09145 ,  H05K2201/09181 ,  H05K2201/1003 ,  H05K2201/10287 ,  H05K2201/10446

Abstract: A filter includes a coil leading structure and at least one coil. The coil leading structure includes a board and at least one pin. The pin is disposed at a side of the board and formed integrally with the board as a monolithic piece. The core is disposed on the board and has at least one end to be coupled with the pin.

Abstract translation: 滤波器包括线圈引导结构和至少一个线圈。 线圈引导结构包括板和至少一个引脚。 销设置在板的一侧，并与板一体地形成为一块整体。 芯部设置在板上，并且至少一端与销连接。

公开(公告)号：US07494382B2

公开(公告)日：2009-02-24

申请号：US11564966

申请日：2006-11-30

Applicant: Chin Wei Ho

Inventor： Chin Wei Ho

IPC: H01R24/00

CPC classification number: H05K3/0052 ,  H05K3/225 ,  H05K2201/09145 ,  H05K2203/0169 ,  H05K2203/167

Abstract: An alignment structure of individual printed circuit board and method thereof are disclosed. The alignment structure of individual printed circuit board includes a panel body and an assembling part. An aligned part having a geometric feature is disposed on an inner side of the panel body. The assembling part coupled with an individual printed circuit board is similar to the geometric feature of the aligned part so that the individual printed circuit board is combined with the panel body.

Abstract translation: 公开了各个印刷电路板的对准结构及其方法。 单个印刷电路板的对准结构包括面板本体和组装部件。 具有几何特征的对准部分设置在面板主体的内侧。 与单独的印刷电路板耦合的组装部分类似于对准部分的几何特征，使得单独的印刷电路板与面板主体组合。