公开(公告)号：US20170141697A1

公开(公告)日：2017-05-18

申请号：US15322961

申请日：2015-07-08

Applicant: AISIN AW CO., LTD.

Inventor： Shinsuke TSUBAMOTO ,  Keita MUTSUURA

IPC: H02M7/44 ,  H05K1/02 ,  H02M1/14

CPC classification number: H02M7/44 ,  H02M1/14 ,  H02M7/003 ,  H05K1/0204 ,  H05K1/0262 ,  H05K2201/06 ,  H05K2201/09972 ,  H05K2201/10022

Abstract: A control board for a power conversion device, the control board including a board body that is a multilayer board; a first circuit mounted on a first surface of the board body and including a heat generator; a second circuit mounted on the first surface of the board body, the second circuit using a voltage different from a voltage of the first circuit; an insulation region formed on the first surface of the board body, the insulation region performing insulation between the first circuit and the second circuit; and a pattern of a thermal conductive material formed on an internal layer of the board body, extending in a region overlapping with the insulation region as seen from a direction orthogonal to the first surface of the board body, and thermally connected to the heat generator.

公开(公告)号：US20170135215A1

公开(公告)日：2017-05-11

申请号：US15346847

申请日：2016-11-09

Applicant: The University of Memphis Research Foundation

Inventor： Bashir I. Morshed

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H05K1/03 ,  H05K3/12 ,  H05K1/09 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K1/181 ,  H05K1/028 ,  H05K1/0353 ,  H05K1/0393 ,  H05K1/097 ,  H05K1/113 ,  H05K1/118 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/125 ,  H05K3/303 ,  H05K3/4007 ,  H05K3/4053 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10143 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/0759 ,  H05K2203/1131

Abstract: A multilayer printed circuit as well as printed passive and active electronic components using additive printing technology is provided. The fabrication process includes a substrate and a first conductive layer that is printed with conductive ink on the substrate. An insulation layer that has uniform thickness is printed on the first conductive layer and the substrate, less via cavities, test point cavities, and a surface mount component contact point and mounting cavities. The insulation layer is replaceable with resistive layer or semi-conductive layer to fabricate electronic components. The vias are printed with conductive ink inside of the via cavities. Additionally, a second conductive layer is printed on the vias and over the insulation layer. The insulation, resistive, or semi-conducting layer, the vias, and the conductive layers are repeatedly printed in sequence to thus form the multilayer printed circuit.

公开(公告)号：US20170071067A1

公开(公告)日：2017-03-09

申请号：US15256537

申请日：2016-09-03

Applicant: SMR Patents S.à.r.l.

Inventor： Artem Rudi ,  Romeo Wieczorek ,  Andreas Herrmann ,  Nitesh Shah

IPC: H05K5/00 ,  H05K1/18

CPC classification number: H05K5/0026 ,  B60Q1/2665 ,  B60R1/00 ,  B60R1/12 ,  H05K1/141 ,  H05K1/144 ,  H05K1/18 ,  H05K5/0017 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10189

Abstract: An electronic circuit board unit for an electronic module installed in a vehicle rear view device. The electronic circuit board unit has a base plate, at least one printed circuit board, and at least one plug connection for an electronic and physical connection between the printed circuit board and the base plate. The electronic circuit board has at least one first receiver for mounting an electronic consumer unit of the electronic module and being attachable or attached to the base plate or to one of the at least one printed circuit board. There is at least one second connector attachable or attached to the base plate or to the at least one printed circuit board for connecting at least one further electronic consumer unit of the electronic module to the driver circuit of the base plate. This configuration provides either n printed circuit boards and n+1 of electronic consumer units, with n being an integer number of 1 and above, or a plurality of printed circuit boards is provided, with each circuit board comprising at least one first receiver and at least one second connector.

Abstract translation: 一种用于安装在车辆后视装置中的电子模块的电子电路板单元。 电子电路板单元具有底板，至少一个印刷电路板和用于印刷电路板和基板之间的电子和物理连接的至少一个插头连接。 电子电路板具有用于安装电子模块的电子消费单元的至少一个第一接收器，并且可附接或附接到基板或至少一个印刷电路板中的一个。 至少一个第二连接器可附接或附接到基板或至少一个印刷电路板，用于将电子模块的至少一个另外的电子消费单元连接到基板的驱动电路。 该配置提供n个印刷电路板和n + 1个电子消费单元，其中n为1以上的整数，或者提供多个印刷电路板，每个电路板包括至少一个第一接收器和 至少一秒钟的连接器。

公开(公告)号：US20170064834A1

公开(公告)日：2017-03-02

申请号：US15239943

申请日：2016-08-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO ,  Shinichiro KUROIWA

IPC: H05K1/18 ,  H01G4/12 ,  H05K1/02 ,  H01C7/00 ,  H01C1/01 ,  H01G4/30 ,  H01G4/248

CPC classification number: H05K1/181 ,  H01C1/01 ,  H01C1/014 ,  H01C1/142 ,  H01C1/148 ,  H01C7/008 ,  H01C7/18 ,  H01G2/065 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H05K1/0296 ,  H05K2201/0909 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003

Abstract: A collective substrate for resistor devices includes a base, a first conductive pattern in a to-be-product region and a to-be-cut-away region of the base, and a resistive element in the to-be-product region of the base. The to-be-cut-away region includes a first region adjacent to the to-be-product region in a first direction, and a second region adjacent to the to-be-product region in a second direction. The first conductive pattern includes a first terminal portion connected to the resistive element and disposed in the to-be-product region, a first electrode portion disposed in the first region and larger in area than the first terminal portion, and a first interconnect portion extended from the first terminal portion toward the second region to be connected to the first electrode portion.

Abstract translation: 用于电阻器件的集合衬底包括基底，待产品区域中的第一导电图案和基底的待切割区域，以及在待产品区域中的电阻元件 基础。 待切割区域包括与第一方向上的待产品区域相邻的第一区域和与第二方向上的待产品区域相邻的第二区域。 第一导电图案包括连接到电阻元件并设置在产品区域中的第一端子部分，设置在第一区域中的第一电极部分和比第一端子部分大的区域，以及第一互连部分延伸 从第一端子部分朝向与第一电极部分连接的第二区域。

公开(公告)号：US09583463B2

公开(公告)日：2017-02-28

申请号：US14727885

申请日：2015-06-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seon-Sik Kim ,  Changwoo Koo ,  Wooseop Kim ,  Jungjoon Lee ,  Dongmin Jang

IPC: H05K7/10 ,  H05K7/12 ,  H01L25/065 ,  H05K1/11 ,  H05K3/34

CPC classification number: H01L25/0655 ,  H01L25/16 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/10022 ,  H05K2201/10159 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor module includes: a module board, a plurality of chips mounted on the module board, and a plurality of array resistors mounted on the module board, the plurality of array resistors including at least a first array resistor. The first array resistor may include a substrate comprising a top surface, a bottom surface opposite the top surface, and first to fourth side surfaces connecting the top surface to the bottom surface, the first and third side surfaces being opposite each other, and the second and fourth side surfaces being opposite each other; a plurality of first electrodes disposed on the first side surface of the substrate, each first electrode including at least a first portion on the first side surface of the substrate and a second portion on the bottom surface of the substrate; a plurality of second electrodes disposed on the third side surface of the substrate, each second electrode opposite a respective first electrode and including at least a first portion on the third side surface of the substrate and a second portion on the bottom surface of the substrate; for each pair of respective first and second electrodes opposite each other, a resistor disposed on the substrate between the respective first and second electrodes; and at least one third electrode disposed on the second side surface of the substrate, the third electrode including at least a first portion on the second side surface of the substrate and a second portion on the bottom surface of the substrate. Each of the first electrodes, the second electrodes, and the third electrode may be bonded to the module board.

Abstract translation: 半导体模块包括：模块板，安装在模块板上的多个芯片，以及安装在模块板上的多个阵列电阻器，所述多个阵列电阻器至少包括第一阵列电阻器。 第一阵列电阻器可以包括基板，其包括顶表面，与顶表面相对的底表面，以及将顶表面连接到底表面的第一至第四侧表面，第一和第三侧表面彼此相对，第二 和第四侧面彼此相对; 多个第一电极，设置在所述基板的第一侧表面上，每个第一电极至少包括在所述基板的第一侧表面上的第一部分和所述基板的底表面上的第二部分; 多个第二电极，设置在所述基板的第三侧表面上，每个第二电极与相应的第一电极相对，并且至少包括在所述基板的第三侧表面上的第一部分和所述基板的底表面上的第二部分; 对于彼此相对的每对相应的第一和第二电极，设置在相应的第一和第二电极之间的基板上的电阻器; 以及设置在所述基板的所述第二侧表面上的至少一个第三电极，所述第三电极至少包括所述基板的第二侧表面上的第一部分和所述基板的底表面上的第二部分。 第一电极，第二电极和第三电极中的每一个可以结合到模块板。

公开(公告)号：US20170048983A1

公开(公告)日：2017-02-16

申请号：US15340634

申请日：2016-11-01

Applicant: ROHM CO., LTD.

Inventor： Masaki YONEDA

IPC: H05K1/18 ,  H01C1/012 ,  H01C17/28 ,  H01C1/142 ,  H01C17/00 ,  H05K1/11 ,  H01C7/00

CPC classification number: H05K1/185 ,  H01C1/012 ,  H01C1/142 ,  H01C7/003 ,  H01C17/006 ,  H01C17/02 ,  H01C17/281 ,  H05K1/113 ,  H05K2201/10022

Abstract: [Object] To provide a chip resistor with which laser irradiation requires no extremely high positional accuracy, and a plating layer provided on a base and adjacent to a resistor element can be connected to an external conductive layer. [Solution] A chip resistor includes a base 1, a first principal surface electrode 21, a second principal surface electrode spaced apart from the first principal surface electrode 21 in a first direction X1, a resistor element 4 in contact with the first principal surface electrode 21 and the second principal surface electrode 31, an overcoat 6 covering the resistor element 4, the first principal surface electrode 21 and the second principal surface electrode, a first auxiliary electrode 25 covering the first principal surface electrode 21 and the overcoat 6, and a first plating electrode 27 covering the first auxiliary electrode 25. The first auxiliary electrode 25 includes a portion 259 offset from the first principal surface electrode 21 in the first direction X1.

Abstract translation: 为了提供激光照射不需要极高位置精度的片式电阻器，并且设置在基座上并且与电阻元件相邻的镀层可以连接到外部导电层。 [解决方案]芯片电阻器包括基底1，第一主面电极21，与第一主面电极21沿第一方向X1隔开的第二主面电极，与第一主面电极接触的电阻体4 21和第二主表面电极31，覆盖电阻元件4，第一主表面电极21和第二主表面电极的外涂层6，覆盖第一主表面电极21和外涂层6的第一辅助电极25和 覆盖第一辅助电极25的第一电镀电极27.第一辅助电极25包括从第一主表面电极21沿第一方向X1偏移的部分259。

公开(公告)号：US20160378065A1

公开(公告)日：2016-12-29

申请号：US15116773

申请日：2014-02-06

Applicant: Orolia Switzerland SA

Inventor： Pascal ROCHAT ,  Bernard LEUENBERGER

IPC: G04F5/14 ,  H05K3/32 ,  H01P3/127 ,  H05K1/02 ,  H05K1/18

CPC classification number: G04F5/14 ,  G04F5/145 ,  H01P3/127 ,  H03B5/1882 ,  H03L7/08 ,  H03L7/26 ,  H05K1/0212 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/10022 ,  H05K2201/10151 ,  H05K2201/10166

Abstract: The present invention concerns a device (1) for an atomic clock, the device comprising:—a printed circuit board (20), said printed circuit board (20) comprising a conductive piece(10) for both interrogating and heating a gas in a cell of an atomic clock, the piece (10) comprising a gap (11), and being arranged for containing the cell (2), and so as to directly touch the cell (2) in at least one point,—a heating source (40, 60) for generating heat, and connected to the piece (10),—microwave conductive means (12) and arranged to be connected to the piece (10) so as to send to the piece (10) a microwave signal for interrogating the atoms of the gas in the cell (2). This device performs more than one function (e.g. heating and interrogating) and simplify the manufacturing of the atomic clock.

Abstract translation: 本发明涉及一种用于原子钟的装置（1），该装置包括： - 印刷电路板（20），所述印刷电路板（20）包括导电片（10），用于在 原子钟的单元，所述片（10）包括间隙（11），并且被布置用于容纳所述单元（2），并且至少在一个点上直接接触所述单元（2）， - 加热源 （40,60），用于产生热量，并连接到所述件（10）上;微波导电装置（12），被布置成连接到所述件（10），以便向所述件（10）发送微波信号， 询问电池（2）中气体的原子。 该装置执行多个功能（例如加热和询问）并简化原子钟的制造。

公开(公告)号：US09530761B2

公开(公告)日：2016-12-27

申请号：US13597973

申请日：2012-08-29

Applicant: Alan Roth ,  Eric Soenen ,  Chaohao Wang

Inventor： Alan Roth ,  Eric Soenen ,  Chaohao Wang

IPC: H05K7/00 ,  H01L25/16 ,  H05K1/18 ,  H01L23/00

CPC classification number: H02M3/158 ,  H01L23/5226 ,  H01L24/05 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L25/16 ,  H01L28/10 ,  H01L28/40 ,  H01L2224/05025 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05157 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/29025 ,  H01L2224/2919 ,  H01L2224/32265 ,  H01L2224/4502 ,  H01L2224/45111 ,  H01L2224/45116 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48265 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/0479 ,  H01L2924/048 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/10331 ,  H01L2924/10332 ,  H01L2924/10333 ,  H01L2924/10335 ,  H01L2924/10337 ,  H01L2924/10339 ,  H01L2924/10342 ,  H01L2924/10351 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/14252 ,  H01L2924/1427 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H05K1/111 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10166 ,  Y02P70/611 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A package system includes at least one active circuitry disposed over a substrate. A passivation structure is disposed over the at least one active circuitry. The passivation structure has at least one opening that is configured to expose at least one first electrical pad. At least one passive electrical component is disposed over the passivation structure. The at least one passive electrical component is electrically coupled with the at least one first electrical pad.

Abstract translation: 封装系统包括设置在衬底上的至少一个有源电路。 钝化结构设置在至少一个有源电路上。 钝化结构具有至少一个开口，其被配置为暴露至少一个第一电垫。 在钝化结构上方设置至少一个无源电组件。 所述至少一个无源电部件与所述至少一个第一电焊盘电耦合。

公开(公告)号：US20160374201A1

公开(公告)日：2016-12-22

申请号：US14901751

申请日：2014-05-23

Applicant: ILLINOIS TOOL WORKS INC.

Inventor： XianBo WANG ,  Mark R. HECKENKAMP ,  Jerald J. SMITH ,  Maxwell J. KIRBY ,  William E. BARGHOLTZ ,  Michael S. OSVATIC

IPC: H05K1/11 ,  H05K1/09 ,  H01R12/75 ,  H05K3/00 ,  H01R12/72 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/119 ,  H01R12/728 ,  H01R12/75 ,  H05K1/09 ,  H05K1/117 ,  H05K1/181 ,  H05K3/007 ,  H05K3/325 ,  H05K3/3405 ,  H05K2201/09063 ,  H05K2201/09181 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10053 ,  H05K2201/10287 ,  H05K2201/1034 ,  H05K2201/10356 ,  H05K2201/10386 ,  H05K2203/0195 ,  H05K2203/167

Abstract: A printed circuit board provides lateral notches for receiving wire conductors in a lateral direction to be joined with printed circuit board traces by solder or an insulation displacement connector eliminating the need for laborious sequential insertion of conductors through printed circuit board holes.

Abstract translation: 印刷电路板提供横向凹口以在横向方向上接收线导体，以通过焊料或绝缘位移连接器与印刷电路板迹线接合，从而消除了通过印刷电路板孔难以连续插入导体的需要。

公开(公告)号：US09519018B2

公开(公告)日：2016-12-13

申请号：US14284451

申请日：2014-05-22

Applicant: Dell Products L.P.

Inventor： James Lewis Petivan ,  Alan R. Dellinger

IPC: G01R31/04 ,  H05K3/42 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34

CPC classification number: G01R31/041 ,  G01R31/04 ,  G01R31/2813 ,  G01R31/2818 ,  H05K1/0268 ,  H05K1/0275 ,  H05K1/113 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/10022 ,  H05K2201/10151 ,  H05K2201/10651 ,  H05K2201/10939 ,  Y10T29/49156 ,  Y10T29/49167

Abstract: In accordance with embodiments of the present disclosure, a circuit board may include a connector configured to electrically couple a device to the circuit board. The connector may include a conductive element configured to be electrically coupled to a first voltage and a detection pad configured to be electrically coupled to a second voltage via a resistor, such that when a device pin of a device is electrically coupled to the conductive element, the detection pad is electrically coupled to the conductive element via the device pin.

Abstract translation: 根据本公开的实施例，电路板可以包括被配置为将设备电耦合到电路板的连接器。 连接器可以包括被配置为电耦合到第一电压的导电元件和被配置为经由电阻器电耦合到第二电压的检测焊盘，使得当器件的器件引脚电耦合到导电元件时， 检测焊盘通过器件引脚电耦合到导电元件。