公开(公告)号：US20090321125A1

公开(公告)日：2009-12-31

申请号：US12146757

申请日：2008-06-26

Applicant: William Louis Brodsky ,  Mark Kenneth Hoffmeyer

Inventor： William Louis Brodsky ,  Mark Kenneth Hoffmeyer

IPC: H01R43/02 ,  H05K1/11

CPC classification number: H05K3/4015 ,  H01R12/7082 ,  H05K3/20 ,  H05K3/341 ,  H05K2201/0347 ,  H05K2201/1025 ,  H05K2201/10424 ,  H05K2203/0156 ,  H05K2203/167 ,  Y10T29/49124 ,  Y10T29/49222

Abstract: An enhanced contact metallurgy construction for plastic land grid array (PLGA) modules and printed wiring boards (PWBs). The PWB may, for example, have subcomposite laminate construction and/or a double-sided LGA site. A plurality of preform contacts are each respectively soldered to one of a plurality of metal pads on a PLGA module carrier and/or a PWB. Each of the preform contacts comprises a metal preform base (e.g., copper, nickel) soldered to one of the plurality of metal pads and an electrolytic noble metal plating (e.g., gold) over the metal preform base. An electrolytic non-noble metal underplating (e.g., nickel) may be interposed between the metal preform base and the electrolytic noble metal plating. In one embodiment, the electrolytic non-noble metal underplating is 80-400 microinches thick to provide an enhanced diffusion barrier, and the electrolytic noble metal plating is 30-60 microinches thick and incorporates one or more hardening agents to provide enhanced wear and corrosion resistance.

Abstract translation: 用于塑料焊盘网格阵列（PLGA）模块和印刷电路板（PWB）的增强型接触式冶金结构。 PWB可以例如具有亚复合层压结构和/或双面LGA位点。 多个预成型件触点分别焊接到PLGA模块载体和/或PWB上的多个金属焊盘之一。 每个预成型件触点包括焊接到多个金属焊盘中的一个的金属预制棒基座（例如铜，镍）和在金属预制棒基部上的电解贵金属电镀（例如金）。 可以在金属预制棒基体和电解贵金属电镀之间插入底层电镀非贵金属（例如镍）。 在一个实施方案中，底镀电解非贵金属为80-400微英寸，以提供增强的扩散阻挡层，并且电解贵金属镀层为30-60微英寸，并且包含一种或多种硬化剂以提供增强的耐磨性和耐腐蚀性 。

公开(公告)号：US20080061434A1

公开(公告)日：2008-03-13

申请号：US11852179

申请日：2007-09-07

Applicant: Ky-Hyun JUNG ,  Wha-Su SIN ,  Heui-Seog KIM ,  Sang-Jun KIM ,  Jun-Young KO

Inventor： Ky-Hyun JUNG ,  Wha-Su SIN ,  Heui-Seog KIM ,  Sang-Jun KIM ,  Jun-Young KO

IPC: H01L23/488 ,  H01K3/22

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01079 ,  H05K3/285 ,  H05K3/3452 ,  H05K3/4092 ,  H05K2201/0215 ,  H05K2201/0245 ,  H05K2201/0397 ,  H05K2201/1025 ,  Y02P70/613 ,  Y10T29/49158 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A substrate for a semiconductor package and a method of manufacturing the same are provided. More particularly, the substrate for the semiconductor package and the method for manufacturing the same include metal pieces, with some of the metal pieces having one end embedded within an insulating layer for insulating an external connection electrode of the substrate and the other end embedded within a solder. The substrate for the semiconductor package has the effects of preventing or retarding a connection failure in a solder connection portion by blocking or retarding the propagation of a crack, and allowing a solder to be easily permeated under the metal pieces and formed at a desired position.

Abstract translation: 提供一种半导体封装用基板及其制造方法。 更具体地，用于半导体封装的衬底及其制造方法包括金属片，其中一些金属片的一端嵌入绝缘层内，用于绝缘衬底的外部连接电极，另一端嵌入 焊接。 用于半导体封装的衬底具有通过阻止或延迟裂纹的传播来防止或延迟焊料连接部分中的连接故障的效果，并且允许焊料容易地渗透在金属片下方并形成在期望的位置。

公开(公告)号：US20080023852A1

公开(公告)日：2008-01-31

申请号：US11495678

申请日：2006-07-31

Applicant: Yu-Cheng Huang ,  Tzu-Chih Lin

Inventor： Yu-Cheng Huang ,  Tzu-Chih Lin

IPC: H01L23/48

CPC classification number: H05K3/244 ,  H05K3/4015 ,  H05K2201/1025 ,  H05K2203/0338

Abstract: A metal pad of mode dial and a manufacturing method thereof, wherein the metal pad is disposed on a substrate and the metal pad comprises at least one metal base pad and at least one conductive foil layer. The conductive foil layer is fixed on the metal base pad in an attached way instead of plating with gold on the metal base pad to reduce production costs so as to prevent oxidization of the metal base pad.

Abstract translation: 一种模式拨盘的金属焊盘及其制造方法，其中金属焊盘设置在基板上，金属焊盘包括至少一个金属基焊盘和至少一个导电箔层。 导电箔层以连接的方式固定在金属基垫上，而不是在金属基底垫上镀金，以降低生产成本，从而防止金属基垫的氧化。

公开(公告)号：US20060043608A1

公开(公告)日：2006-03-02

申请号：US10711185

申请日：2004-08-31

Applicant: William Bernier ,  Marie Cole ,  Mukta Farooq ,  John Knickerbocker ,  Tasha Lopez ,  Roger Quon ,  David Welsh

Inventor： William Bernier ,  Marie Cole ,  Mukta Farooq ,  John Knickerbocker ,  Tasha Lopez ,  Roger Quon ,  David Welsh

IPC: H01L23/48

CPC classification number: H05K3/321 ,  H01L24/05 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/13464 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/1025 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.

Abstract translation: 公开了用于将集成电路器件连接到器件载体的层压（或非层叠）导电互连，其中导电互连包括交替的金属层和聚合物层。 此外，聚合物可以包括枝晶，来自载体或器件的金属突起，和/或聚合物外部的胶束刷。 聚合物层包括金属颗粒，并且交替的金属层和聚合物层形成立方体结构或圆柱形结构。

公开(公告)号：US20050239347A1

公开(公告)日：2005-10-27

申请号：US11167662

申请日：2005-06-27

Applicant: Bruce Chamberlin ,  Mark Hoffmeyer ,  Wai Ma ,  Arch Nuttall ,  James Stack

Inventor： Bruce Chamberlin ,  Mark Hoffmeyer ,  Wai Ma ,  Arch Nuttall ,  James Stack

IPC: H01R12/00 ,  H05K1/11 ,  H05K3/22 ,  H05K3/40 ,  H05K3/42

CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。

公开(公告)号：US20040216919A1

公开(公告)日：2004-11-04

申请号：US10860427

申请日：2004-06-03

Applicant: International Business Machines Corporation

Inventor： Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

IPC: H05K007/06

CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

公开(公告)号：US06784377B2

公开(公告)日：2004-08-31

申请号：US10205102

申请日：2002-07-25

Applicant: Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

Inventor： Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

IPC: H01R1204

CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。

公开(公告)号：US20020179324A1

公开(公告)日：2002-12-05

申请号：US10205102

申请日：2002-07-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

IPC: H05K001/03

CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。

公开(公告)号：US20020025599A1

公开(公告)日：2002-02-28

申请号：US09941384

申请日：2001-08-28

Applicant: Aptos Corporation

Inventor： Chung W. Ho ,  Tsing-Chow Wang

IPC: H01L021/48

CPC classification number: H01L24/12 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13583 ,  H01L2224/136 ,  H01L2224/13647 ,  H01L2224/13671 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01054 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/1025 ,  H05K2201/2081 ,  H05K2203/0315 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00

Abstract: Within a method for forming a solder interconnection structure for use within a microelectronic fabrication, there is first provided a substrate having formed thereover a bond pad. There is then formed upon the bond pad a first solder interconnection layer. There is then formed over the first solder interconnection layer an annular solder non-wettable copper oxide layer which does not cover an upper dome portion of the first solder interconnection layer. There is then formed over the upper dome portion of the first solder interconnection layer and not upon the annular solder non-wettable copper oxide layer a second solder interconnection layer.

Abstract translation: 在用于形成在微电子制造中使用的焊料互连结构的方法中，首先提供了在接合焊盘之上形成的衬底。 然后在接合焊盘上形成第一焊料互连层。 然后在第一焊料互连层上形成不覆盖第一焊料互连层的上部圆顶部分的环形焊料不可湿性氧化铜层。 然后形成在第一焊料互连层的上部圆顶部分上方，而不是在环形焊料不可湿性氧化铜层上形成第二焊料互连层。

公开(公告)号：US5829124A

公开(公告)日：1998-11-03

申请号：US580678

申请日：1995-12-29

Applicant: John Steven Kresge ,  David Noel Light

Inventor： John Steven Kresge ,  David Noel Light

IPC: H05K3/34 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4015 ,  H05K1/113 ,  H05K2201/0376 ,  H05K2201/096 ,  H05K2201/1025 ,  H05K2203/0278 ,  H05K2203/1394 ,  H05K3/0094 ,  H05K3/4007 ,  H05K3/4614 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A method for attaching pads to a high density printed circuit board (PCB) having a plurality of through-holes opening on the top surface. The method includes forming a plurality of pads on a carrier sheet so that each of said pads have a copper layer proximate to said carrier sheet and a joining metal layer formed on top of said copper layer, positioning the plurality of pads on the carrier sheet so that they are aligned with the through-hole pattern on the top surface of the PCB, laminating the pads to the through-holes on the top surface using the joining metal, and separating the carrier sheet from the plurality of pads that are joined to the through-holes so that the copper layer is exposed. The pads may comprise a variety of shapes such as disk-shaped, elongated, or rectangular, and can cover one or multiple through-holes. An electrical component may be soldered to the pad. The method advantageously prevents wicking of the solderball volume into the through-hole, thereby increasing yield and part reliability. In one embodiment, the pad and through-hole may be compressed so that the top surface of the pad is even (flush) with the top surface of the external dielectric surface.

Abstract translation: 一种用于将焊盘附接到具有在顶表面上开口的多个通孔的高密度印刷电路板（PCB）的方法。 该方法包括在载体片上形成多个焊盘，使得每个焊盘具有靠近所述载体片的铜层和形成在所述铜层顶部的接合金属层，将多个焊盘定位在载体片上 它们与PCB的顶表面上的通孔图案对准，使用接合金属将焊盘层压到顶表面上的通孔，并将载体片从与多个焊盘接合的多个焊盘分离 通孔使铜层露出。 垫可以包括各种形状，例如盘形，细长或矩形，并且可以覆盖一个或多个通孔。 电气部件可以焊接到焊盘。 该方法有利地防止了焊球体积进入通孔，从而提高了产量和部件的可靠性。 在一个实施例中，垫和通孔可以被压缩，使得垫的顶表面与外部电介质表面的顶表面均匀（齐平）。