公开(公告)号：US20160262259A1

公开(公告)日：2016-09-08

申请号：US15029182

申请日：2014-09-15

Applicant: DENSO CORPORATION

Inventor： Kengo UEYAMA ,  Takaomi HASEGAWA ,  Makoto YOSHIDA

IPC: H05K1/02 ,  H05K5/02

CPC classification number: H05K1/0216 ,  G06F1/182 ,  G06F1/184 ,  H05K1/0215 ,  H05K1/0231 ,  H05K1/144 ,  H05K3/28 ,  H05K5/0247 ,  H05K7/142 ,  H05K9/0039 ,  H05K2201/042 ,  H05K2201/10409 ,  H05K2201/2036

Abstract: An electronic device includes: a printed circuit board; a conductive casing; and a connecting part. The printed circuit board is mounted with an electronic component to configure a predetermined electronic circuit. The conductive casing stores the printed circuit board. The connecting part is arranged between the conductive casing and the printed circuit board, and is configured to be capacitively coupled with a conductor pattern of the printed circuit board so as to guide radiation noise from the printed circuit board to the conductive casing.

Abstract translation: 电子设备包括：印刷电路板; 导电套管; 和连接部。 印刷电路板安装有电子部件以配置预定的电子电路。 导电套管存储印刷电路板。 连接部分布置在导电壳体和印刷电路板之间，并且被配置为与印刷电路板的导体图形电容耦合，以将辐射噪声从印刷电路板引导到导电壳体。

公开(公告)号：US20160192473A1

公开(公告)日：2016-06-30

申请号：US14980395

申请日：2015-12-28

Applicant: Masato Kasashima ,  Tomoyoshi Kobayashi ,  Satoru Sasaki ,  Yoshihiro Ikushima

Inventor： Masato Kasashima ,  Tomoyoshi Kobayashi ,  Satoru Sasaki ,  Yoshihiro Ikushima

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0204 ,  H05K3/0061 ,  H05K3/4697 ,  H05K2201/10409 ,  H05K2201/10416

Abstract: A circuit board includes a first insulating layer having an upper surface on which mounting regions of electronic components and wiring patterns are provided, a metal core provided on the lower surface of the first insulating layer, in such a way as to vertically overlap with the mounting regions, and a second insulating layer provided on the lower surface of the first insulating layer, around the metal core. The lower surface of the metal core is exposed from the second insulating layer, the thermal conductivities of the first insulating layer and the metal core are higher than the thermal conductivity of the second insulating layer, and the hardness of the first insulating layer is higher than the hardness of the second insulating layer. Through holes that penetrate the insulating layers and that connect wiring patterns of the insulating layers are provided.

Abstract translation: 电路板包括具有上表面的第一绝缘层，电子部件和布线图案的安装区域设置在其上，设置在第一绝缘层的下表面上的金属芯，以与安装件垂直重叠的方式 以及设置在第一绝缘层的下表面上的金属芯周围的第二绝缘层。 金属芯的下表面从第二绝缘层露出，第一绝缘层和金属芯的热导率高于第二绝缘层的导热率，第一绝缘层的硬度高于 第二绝缘层的硬度。 提供穿透绝缘层并连接绝缘层的布线图案的通孔。

公开(公告)号：US20160157350A1

公开(公告)日：2016-06-02

申请号：US14837856

申请日：2015-08-27

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Nobuhiro YAMAMOTO ,  Keiko KAJI ,  Kota TOKUDA ,  Takahisa FUNAYAMA

IPC: H05K1/18 ,  H05K1/02 ,  G11B5/48 ,  H05K1/11

CPC classification number: H05K1/181 ,  G11B5/4826 ,  G11B5/4846 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/11 ,  H05K2201/10409

Abstract: An electronic device module includes a wiring board having a first surface including first and second electrodes formed thereon and a second surface opposite to the first surface, a supporting member attached to the second surface of the wiring board, a first electronic unit mounted on the first surface of the wiring board and electrically connected to the first electrode, and a second electronic unit mounted on the first surface of the wiring board and electrically connected to the second electrode. The wiring board includes a wiring extending from the first electronic unit to a position closer to the second electronic unit, and a reinforcement layer disposed between the first and second electronic units and apart from the wiring in a thickness direction of the wiring board.

Abstract translation: 一种电子设备模块，包括具有第一表面的布线板，第一表面包括形成在其上的第一和第二电极以及与第一表面相对的第二表面，安装在布线板的第二表面上的支撑构件，安装在第一表面上的第一电子单元 电连接到第一电极的第二电子单元和安装在布线板的第一表面上并电连接到第二电极的第二电子单元。 布线板包括从第一电子单元延伸到靠近第二电子单元的位置的布线，以及设置在第一和第二电子单元之间并且在布线板的厚度方向上与布线分开的加强层。

公开(公告)号：US20160070316A1

公开(公告)日：2016-03-10

申请号：US14942787

申请日：2015-11-16

Applicant: SMART Modular Technologies, Inc.

Inventor： Victor Mahran ,  Robert S. Pauley, JR.

IPC: G06F1/18 ,  G06F1/20 ,  G11C5/02

CPC classification number: G06F1/185 ,  G06F1/20 ,  G11C5/025 ,  H05K1/0209 ,  H05K1/144 ,  H05K1/145 ,  H05K7/1431 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10303 ,  H05K2201/10378 ,  H05K2201/10409 ,  Y10T29/4913

Abstract: A method of manufacture of an enhanced capacity memory system includes: providing a dual in-line memory module carrier having a memory module and an integrated memory buffer coupled to the memory module; coupling a memory expansion board, having a supplementary memory module, to the dual in-line memory module carrier including attaching a bridge transposer; and providing a system interface connector coupled to the integrated memory buffer and the bridge transposer for controlling the memory module, the supplementary memory module, or a combination thereof.

Abstract translation: 一种制造增强容量存储器系统的方法包括：提供具有存储器模块和耦合到存储器模块的集成存储器缓冲器的双列直插存储器模块载体; 将具有辅助存储器模块的存储器扩展板耦合到双列直插式存储器模块载体，包括附接桥式变压器; 并且提供耦合到集成存储器缓冲器的系统接口连接器和用于控制存储器模块，辅助存储器模块或其组合的桥接转换器。

公开(公告)号：US20160050743A1

公开(公告)日：2016-02-18

申请号：US14804748

申请日：2015-07-21

Applicant: FUJITSU LIMITED

Inventor： Jun TAGUCHI

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H05K1/0206 ,  H05K1/144 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09754 ,  H05K2201/1028 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: A circuit board includes a plate member capable of holding a printed circuit board, the printed circuit board including an electronic component, and a cooling member provided on the electronic component, the printed circuit board and the electronic component being positioned between the plate member and the cooling member; and a circuit provided to the plate member and allowed to be electrically connected with the printed circuit board.

Abstract translation: 电路板包括能够保持印刷电路板的板构件，包括电子部件的印刷电路板和设置在电子部件上的冷却部件，印刷电路板和电子部件位于板部件和 冷却构件; 以及设置到板构件并允许与印刷电路板电连接的电路。

公开(公告)号：US20160037627A1

公开(公告)日：2016-02-04

申请号：US14776389

申请日：2014-03-06

Applicant: ENPLAS CORPORATION

Inventor： Yuki UEYAMA

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K1/0271 ,  G01R31/2863 ,  H01R12/716 ,  H05K1/0313 ,  H05K1/115 ,  H05K3/0061 ,  H05K3/3447 ,  H05K2201/10325 ,  H05K2201/10409 ,  H05K2201/2009

Abstract: A substrate reinforcing structure for preventing and suppressing deformation or the like of a substrate with a fixed electric component socket.A first reinforcing plate in, for example, a frame shape is attached to a back surface of a wiring board. Further, a second reinforcing plate in, for example, a flat shape is provided on a back side of the first reinforcing plate. In a preferred embodiment of the present invention, a first insulating sheet is further provided between the wiring board and the first reinforcing plate, and a spacer is provided on the second reinforcing plate and abutted to a part of the wiring board where contact pins do not protrude. A second insulating sheet is further provided on the second reinforcing plate.

Abstract translation: 一种用于防止和抑制具有固定电气部件插座的基板的变形等的基板加强结构。 例如，将框状的第一加强板安装在布线基板的背面。 此外，在第一加强板的背面设置有例如平坦形状的第二加强板。 在本发明的优选实施例中，第一绝缘片还设置在布线板和第一加强板之间，并且间隔件设置在第二加强板上，并且与接线脚不相邻的布线板的一部分 突出 第二绝缘片还设置在第二加强板上。

公开(公告)号：US20150382455A1

公开(公告)日：2015-12-31

申请号：US14649848

申请日：2013-12-06

Applicant: CRYPTERA A/S

Inventor： Mathias Tannebæk Enevoldsen ,  Thomas Trabolt West ,  Erling Wesselhoff ,  Jan Rasmussen ,  Dennis Bruun Mikkelsen

IPC: H05K1/02 ,  H05K7/14 ,  G01R27/02

CPC classification number: H05K1/0275 ,  G01R27/02 ,  G06F21/87 ,  G09C1/00 ,  H04L9/004 ,  H05K1/02 ,  H05K1/0268 ,  H05K1/141 ,  H05K7/1422 ,  H05K2201/09263 ,  H05K2201/10409 ,  H05K2201/2018

Abstract: There is provided a security module for protecting circuit components from unauthorized access. The security module comprises a base printed circuit board, base PCB, for supporting circuit components to be protected, a frame printed circuit board, frame PCB, where the frame PCB is secured on top of the base PCB and defining a protective space for circuit components supported by the base PCB, and a lid printed circuit board, lid PCB, which is secured on top of the frame PCB, thereby providing a top closure to the protective space. First and third meshes are provided in the frame PCB, and a second mesh is provided in the lid PCB. The first, second and third meshes have a number of electrically conductive tracks, and one or more tamper detection paths are formed comprising a serial connection of one track from each of the first, second and third meshes. The security module may further comprise security circuitry arranged on the base PCB within the protective space, and for each tamper detection path the security circuitry has a pair of electrical signal input/outputs being electrically connected to the tamper detection path.

Abstract translation: 提供了用于保护电路组件免于未授权访问的安全模块。 该安全模块包括用于支持要保护的电路元件的基本印刷电路板，基底PCB，框架印刷电路板，框架PCB，其中框架PCB固定在基座PCB的顶部上并且为电路部件定义保护空间 由基板PCB支撑，以及盖印刷电路板，盖PCB，其固定在框架PCB的顶部上，从而向保护空间提供顶部封闭。 第一和第三网格设置在框架PCB中，并且第二网格设置在盖PCB中。 第一，第二和第三网格具有多个导电轨道，并且形成一个或多个篡改检测路径，其包括从第一，第二和第三网格中的每一个的一个轨道的串行连接。 安全模块还可以包括布置在保护空间内的基本PCB上的安全电路，并且对于每个篡改检测路径，安全电路具有电连接到篡改检测路径的一对电信号输入/输出。

公开(公告)号：US09165856B2

公开(公告)日：2015-10-20

申请号：US14018932

申请日：2013-09-05

Applicant: LSIS CO., LTD.

Inventor： Bohyun Youn ,  Min Heo

IPC: H01L23/40 ,  H01L23/00 ,  H05K3/30 ,  H05K7/20 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L23/40 ,  H01L24/37 ,  H01L24/40 ,  H01L24/72 ,  H01L24/73 ,  H01L24/91 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2224/371 ,  H01L2224/40106 ,  H01L2224/40227 ,  H01L2224/732 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/014 ,  H05K1/0203 ,  H05K1/0215 ,  H05K3/301 ,  H05K3/3421 ,  H05K7/2049 ,  H05K2201/10409 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2224/84

Abstract: Provided is a coupling assembly of a power semiconductor device and a printed circuit board (PCB). The coupling assembly of the power semiconductor device and the printed circuit board (PCB) includes a PCB, a power semiconductor device comprising a plurality of legs electrically connected to a circuit pattern disposed on the PCB, a connection member disposed above the power semiconductor device, the connection member being formed of an electrically conductive material, a main fixing unit fixing the power semiconductor device to the PCB, and a housing disposed outside the PCB. Thus, a coupling force between the power semiconductor device and the PCB and electric efficiency may be improved to a heat generation amount. In addition, heat may be more quickly dissipated through the connection member to improve a cooling effect.

Abstract translation: 提供了功率半导体器件和印刷电路板（PCB）的耦合组件。 功率半导体器件和印刷电路板（PCB）的耦合组件包括PCB，功率半导体器件，包括电连接到布置在PCB上的电路图案的多个支脚，设置在功率半导体器件上方的连接元件， 所述连接构件由导电材料形成，主固定单元将所述功率半导体器件固定到所述PCB，以及壳体，设置在所述PCB外部。 因此，功率半导体器件与PCB之间的耦合力和电效率可以提高到发热量。 此外，可以通过连接构件更快地散发热量以改善冷却效果。

公开(公告)号：US20150264802A1

公开(公告)日：2015-09-17

申请号：US14426876

申请日：2013-07-29

Applicant: VALEO SYSTEMES DE CONTROLE MOTEUR

Inventor： Hubert Lescot ,  Yoann Legendre

IPC: H05K1/02 ,  H05K5/04

CPC classification number: H05K1/0215 ,  H05K1/0231 ,  H05K1/053 ,  H05K5/04 ,  H05K7/1432 ,  H05K2201/10015 ,  H05K2201/1028 ,  H05K2201/10409

Abstract: An electrical device and electrical compressor. The electrical device (102) comprises an electrical circuit (104) comprising a metal substrate (202), a layer of dielectric material (206) extending over the metal substrate (202), and a metal strip (208) extending over the layer of dielectric material (206). It further comprises a linking conductive part (218) intended to be connected to an electrical ground (106) and having a first contact end (220) intended to be pressed against the metal strip (208), and a pushing device (224) intended to take a first position, called the closed position, in which the pushing device (224) presses against a support portion (226) of the linking conductive part (218) so as to press the first contact end (220) against the metal strip (208), the support portion (226) being located away from the first contact end (220), and a second position, called the open position, in which the pushing device (224) allows the first contact end (220) to be separated from the metal strip (208).

Abstract translation: 电气设备和电动压缩机。 电气设备（102）包括电路（104），该电路包括金属基底（202），在金属基底（202）上延伸的介电材料层（206） 电介质材料（206）。 其还包括用于连接到电接地（106）并且具有旨在被压靠在金属条（208）上的第一接触端（220）的连接导电部分（218），以及推动装置（224） 以将第一位置称为关闭位置，其中推动装置（224）压靠连接导电部分（218）的支撑部分（226），以将第一接触端（220）压靠在金属带 （208），所述支撑部分（226）远离所述第一接触端（220）定位，以及称为所述打开位置的第二位置，所述推动装置（224）允许所述第一接触端（220）为 与金属条（208）分离。

公开(公告)号：US09089043B2

公开(公告)日：2015-07-21

申请号：US13948308

申请日：2013-07-23

Applicant: International Business Machines Corporation

Inventor： Edward C. Gillard ,  Don A. Gilliland

IPC: H05K5/00 ,  H05K9/00

CPC classification number: H05K9/0007 ,  H01G4/35 ,  H05K1/0215 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0234 ,  H05K1/0246 ,  H05K2201/086 ,  H05K2201/10409 ,  H05K2201/2036

Abstract: A first substantially annular conductive material has a first central opening, the first central opening is sufficient to substantially surround a fastener and maintain an electrical connection between the printed circuit board and the chassis. A second substantially annular conductive material is concentric with the first conductive material and the second conductive material hays a second central opening which is sufficient to substantially surround the fastener and maintain the electric connection between the printed circuit board and the chassis. A substantially annular impedance material is between and adjacent to the first conductive material and the second conductive material, the impedance material is sufficient to attenuate the electromagnetic interference from the system.

Abstract translation: 第一基本上环形的导电材料具有第一中心开口，第一中心开口足以基本上围绕紧固件并维持印刷电路板与底座之间的电连接。 第二基本上环形的导电材料与第一导电材料同心，第二导电材料干燥第二中心开口，该第二中心开口足以基本上包围紧固件并保持印刷电路板与底盘之间的电连接。 基本上环形的阻抗材料在第一导电材料和第二导电材料之间并且与第二导电材料相邻，阻抗材料足以衰减来自系统的电磁干扰。