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公开(公告)号：US12074357B2
公开(公告)日：2024-08-27
申请号：US17389605
申请日：2021-07-30
Applicant: BOARDTEK ELECTRONICS CORPORATION
Inventor： Chung-Hsing Liao
CPC classification number: H01P3/121 , H01P5/107 , H01Q9/045 , H05K1/0218 , H05K1/0298 , H05K1/18 , H05K3/243 , H05K3/429 , H05K3/4652 , H05K3/4664 , H05K3/4697 , H05K2201/0367 , H05K2201/0723 , H05K2201/09981 , H05K2201/09985 , H05K2201/10098 , H05K2201/10507 , H05K2203/0723
Abstract: An electromagnetic wave transmission board proofed against internal signal leakage includes an inner plate, a first outer plate, a second outer plate, a first plate bump, a first conductive bump, a second plate bump, and a second conductive bump. The inner plate defines a first through hole with a plated metal layer on the hole wall. The first and second plated bumps are disposed between the first outer and inner plates. The second plate bump and the second conductive bump are disposed between the second outer plate and the inner plate. The plate metal layer, the first plate bump, the first conductive bump, the first outer plate, the second outer plate, the second conductive bump, and the second plated bump jointly form an air-filled chamber. A method for manufacturing the electromagnetic wave transmission board is also provided.
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公开(公告)号：US20240237211A9
公开(公告)日：2024-07-11
申请号：US18483929
申请日：2023-10-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yoshihito OTSUBO , Hideo NAKAGOSHI , Hiroki YOSHIMORI
CPC classification number: H05K1/144 , H05K1/0203 , H05K2201/0379 , H05K2201/10507 , H05K2201/10977
Abstract: An upper circuit board body has a first upper main surface and a first lower main surface. A lower circuit board body has a second upper main surface and a second lower main surface. A lower circuit board first mounting electrode and one or more lower circuit board second mounting electrodes are disposed on the second upper main surface. A first component is mounted on the one or more lower circuit board second mounting electrodes. A first conductor member is mounted on the lower circuit board first mounting electrode and is disposed on the left of the first component. A second conductor member is disposed on the first lower main surface, is connected to the upper end of the first conductor member, and overlaps at least a part of the first component as viewed in the downward direction.
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公开(公告)号：US11824048B2
公开(公告)日：2023-11-21
申请号：US17251153
申请日：2018-09-20
Applicant: Mitsubishi Electric Corporation
Inventor： Shigeto Fujita , Tetsuya Matsuda
CPC classification number: H01L25/072 , H01L23/50 , H05K1/181 , H05K2201/10272 , H05K2201/10507
Abstract: An uneven current distribution among a plurality of provided power semiconductor chips is to be suppressed. A power semiconductor module includes a module main body, a plurality of power semiconductor chips arranged on an upper surface of the module main body, and peripheral structures being insulating ferromagnets surrounding parts of a periphery of the module main body in a plan view, in which the plurality of power semiconductor chips are arranged in a vertical direction and a horizontal direction in a plan view, and at least one of the plurality of power semiconductor chips is arranged so as to be surrounded by other power semiconductor chips.
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公开(公告)号：US11792933B2
公开(公告)日：2023-10-17
申请号：US17389306
申请日：2021-07-29
Applicant: Fermi Research Alliance, LLC
Inventor： Juan Estrada , Guillermo Fernandez Moroni , Andrew G. Lathrop , Javier Tiffenberg
CPC classification number: H05K1/18 , H01R43/205 , H01R43/26 , H05K1/0216 , H05K3/282 , H01R13/6215 , H05K3/02 , H05K2201/0715 , H05K2201/09063 , H05K2201/09227 , H05K2201/10189 , H05K2201/10507
Abstract: Systems, methods, and apparatus that employ a connector assembly having a substrate layer with an inner aperture and an outer periphery, and one or more signal traces disposed on the substrate that extend from an inner first location to an outer second location of the apparatus, for communicating data between electronic devices positioned within an interior volume of an enclosed vessel and complementary electronic devices positioned in an ambient environment external to the enclosed vessel. An inner connector is conductively connected the signal traces at the inner first location of each signal trace, and an outer connector is conductively connected to the one or more signal traces at the outer second location of each signal trace. A substantially flat exterior surface extends radially over at least a portion of a region between the respective first locations and the respective second locations.
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公开(公告)号：US20190223287A1
公开(公告)日：2019-07-18
申请号：US16244566
申请日：2019-01-10
Applicant: Mitsubishi Electric Corporation
Inventor： Mitsunori NISHIDA , Michihiro TAKATA , Tomonori KURIYAMA , Keita TAKAHASHI
CPC classification number: H05K1/0259 , B60R16/06 , H05K1/0215 , H05K1/0231 , H05K1/116 , H05K1/181 , H05K5/0052 , H05K5/006 , H05K5/0069 , H05K5/0073 , H05K5/061 , H05K2201/093 , H05K2201/09609 , H05K2201/10015 , H05K2201/10022 , H05K2201/10507
Abstract: A fourth layer outer frame protection pattern of a multilayer circuit board housed in a conductive base and a nonconductive cover is in contact with an inner surface of the base via a selection layer, and is connected to a second layer planar ground pattern via a coupling capacitor, outer peripheral portions of respective layer patterns including a first and third layer annular ground patterns are overlapped with each other, and the planar ground pattern is wire connected to a reference ground point of a vehicle body. When the base is conductively attached to the vehicle body, a selection layer is a solder resist film, and when it is non-conductively attached, the selection layer is a solder film, so that the planar ground pattern does not conduct with the base at the time of short circuit abnormality of the coupling capacitor.
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Patent Agency Ranking
公开(公告)号：US20180310398A1
公开(公告)日：2018-10-25
申请号：US16019702
申请日：2018-06-27
Applicant: Kardium Inc.
CPC classification number: H05K1/028 , G01K1/026 , G01K7/16 , G01K13/002 , H05K1/115 , H05K1/18 , H05K2201/10151 , H05K2201/10507
Abstract: Some aspects of this disclosure generally are related to improving the robustness of a flexible circuit structure, for example, by providing fault-tolerant electrical pathways for flow of electric current through the flexible circuit structure. In some embodiments, such fault tolerance is enhanced by way of a conductive mesh provided between an adjacent pair of resistive elements. Some aspects are related to improved voltage, current, or voltage and current measurement associated with various pairs of adjacent resistive elements at least when the various pairs have differing distances between them.
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公开(公告)号：US20180146540A1
公开(公告)日：2018-05-24
申请号：US15862010
申请日：2018-01-04
Applicant: Kardium Inc.
CPC classification number: H05K1/028 , G01K1/026 , G01K7/16 , G01K13/002 , H05K1/115 , H05K1/18 , H05K2201/10151 , H05K2201/10507
Abstract: Some aspects of this disclosure generally are related to improving the robustness of a flexible circuit structure, for example, by providing fault-tolerant electrical pathways for flow of electric current through the flexible circuit structure. In some embodiments, such fault tolerance is enhanced by way of a conductive mesh provided between an adjacent pair of resistive elements. Some aspects are related to improved voltage, current, or voltage and current measurement associated with various pairs of adjacent resistive elements at least when the various pairs have differing distances between them.
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公开(公告)号：US09959994B1
公开(公告)日：2018-05-01
申请号：US15410943
申请日：2017-01-20
Applicant: PRIMAX ELECTRONICS LTD.
Inventor： Chien-Hung Liu
CPC classification number: H01H13/81 , H01H3/12 , H01H13/52 , H05K1/181 , H05K2201/10053 , H05K2201/10507
Abstract: A keyboard includes a base plate, a pressure sensing layer, plural key structures, a circuit board, a flexible layer and a controlling unit. The pressure sensing layer is disposed on the base plate and located under the circuit board. The flexible layer is disposed on the pressure sensing layer and located under the circuit board. While a key structure is depressed, a part of the key structure is penetrated through the circuit board to press the flexible layer, and a force is transmitted from the flexible layer to the pressure sensing layer. The controlling unit compares the force with a predetermined force value. According to the comparing result, the controlling unit generates a corresponding pressure sensing signal. Consequently, the use of a single key structure can achieve the functions of multiple keys.
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公开(公告)号：US09894756B2
公开(公告)日：2018-02-13
申请号：US15366422
申请日：2016-12-01
Applicant: Kardium Inc.
CPC classification number: H05K1/028 , G01K1/026 , G01K7/16 , G01K13/002 , H05K1/115 , H05K1/18 , H05K2201/10151 , H05K2201/10507
Abstract: Some aspects of this disclosure generally are related to improving the robustness of a flexible circuit structure, for example, by providing fault-tolerant electrical pathways for flow of electric current through the flexible circuit structure. In some embodiments, such fault tolerance is enhanced by way of a conductive mesh provided between an adjacent pair of resistive elements. Some aspects are related to improved voltage, current, or voltage and current measurement associated with various pairs of adjacent resistive elements at least when the various pairs have differing distances between them.
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公开(公告)号：US09609787B2
公开(公告)日：2017-03-28
申请号：US14474909
申请日：2014-09-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Bongjae Rhee
IPC: H05K7/20 , H05K1/02 , H01M2/10 , H01M10/615 , H01M10/623 , H01M10/42 , H01M10/667 , H05K1/18 , H04M1/02
CPC classification number: H05K7/2039 , H01M2/1022 , H01M2/1066 , H01M10/425 , H01M10/615 , H01M10/623 , H01M10/667 , H01M2200/00 , H01M2220/30 , H04M1/0262 , H05K1/0203 , H05K1/0209 , H05K1/0296 , H05K1/181 , H05K2201/066 , H05K2201/10037 , H05K2201/10507
Abstract: A portable electronic device and a battery pack for the portable electronic device are provided. The portable electronic device includes a Printed Circuit Board (PCB) in which at least one electronic component is disposed, and a battery pack including a heat conductor separately disposed at a gap from the PCB and that transfers heat generated in the electronic component to a battery cell.
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