公开(公告)号：US09974158B2

公开(公告)日：2018-05-15

申请号：US15410081

申请日：2017-01-19

Applicant: Qorvo US, Inc.

Inventor： Tarak A. Railkar ,  Kevin J. Anderson ,  Walid M. Meliane

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/46 ,  H05K1/14 ,  H05K3/36 ,  H01L23/367 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01L23/00 ,  H01L23/04 ,  H01L23/10 ,  H01L25/00 ,  H01L21/50

CPC classification number: H05K1/0206 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2924/01029 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19102 ,  H01L2924/19105 ,  H05K1/115 ,  H05K1/144 ,  H05K1/18 ,  H05K3/30 ,  H05K3/368 ,  H05K3/4697 ,  H05K2201/042 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10674 ,  H01L2924/00

Abstract: The present disclosure relates to an air-cavity package, which includes a bottom substrate with a first heat dissipation interface, a top substrate with a second heat dissipation interface, a perimeter wall, a bottom electronic component, and a top electronic component. The perimeter wall extends between a periphery of the top substrate and a periphery of the bottom substrate to form a cavity. The bottom electronic component is mounted on the bottom substrate, exposed to the cavity, and thermally coupled to a bottom thermally conductive structure, which extends through the bottom substrate and towards the first heat dissipation interface. The top electronic component is mounted on the top substrate, exposed to the cavity, and thermally coupled to a top thermally conductive structure, which extends through the top substrate and towards the second heat dissipation interface.

公开(公告)号：US20180131330A1

公开(公告)日：2018-05-10

申请号：US15808014

申请日：2017-11-09

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Naoki ITABASHI

IPC: H03F1/14 ,  H03F3/45 ,  H03F3/54 ,  H05K1/18 ,  H05K1/11 ,  H01F27/29

CPC classification number: H03F1/14 ,  H01F27/29 ,  H01F2005/006 ,  H03F3/245 ,  H03F3/45475 ,  H03F3/45928 ,  H03F3/54 ,  H03F3/68 ,  H03F2200/391 ,  H03F2200/42 ,  H03L7/0807 ,  H04B10/50 ,  H04B10/502 ,  H04B10/504 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10287 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611

Abstract: An amplifier includes a printed circuit board that includes an output terminal for outputting a electrical signal to an outside and a bias terminal for receiving a bias of the electrical signal from the outside, and an integrated circuit, a capacitor, an inductor, and a ferrite bead element mounted on the printed circuit board. The integrated circuit includes a driving circuit and an output end, and outputs the electrical signal generated by the driving circuit from the output end. The capacitor is connected between the output end and the output terminal A series circuit including the inductor and the ferrite bead element connected to each other in series, the inductor is connected to the output end, and the ferrite bead element is connected to the bias terminal.

公开(公告)号：US09964294B2

公开(公告)日：2018-05-08

申请号：US13838076

申请日：2013-03-15

Applicant: Samsung Pay, Inc.

Inventor： John Osborne ,  David W Russell

IPC: F21V23/00 ,  H05K1/18

CPC classification number: F21V23/005 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10522

Abstract: A display screen assembly is suitable for use in a digital device that lacks the processing power, memory, or both needed to carry out light-simulated bar code processing. The display screen assembly includes a display screen having a display area and mounted to a flexible circuit. The flexible circuit includes numerous conductive circuit traces including terminal ends, and various electronic components such as a controller and a screen driver. The various components may be covered by a cover layer, and the display screen including the display area may be covered by a sheet of transparent material. An LED may be generally positioned near an edge or corner of the display screen, and may be may be controlled by a digital device processor or by the controller on the flexible circuit, as desired, for producing light-simulated bar codes.

公开(公告)号：US20180063940A1

公开(公告)日：2018-03-01

申请号：US15410081

申请日：2017-01-19

Applicant: Qorvo US, Inc.

Inventor： Tarak A. Railkar ,  Kevin J. Anderson ,  Walid M. Meliane

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/46 ,  H05K1/14 ,  H05K3/36 ,  H01L23/367 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01L23/00 ,  H01L23/04 ,  H01L23/10 ,  H01L25/00 ,  H01L21/50

CPC classification number: H05K1/0206 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2924/01029 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19102 ,  H01L2924/19105 ,  H05K1/115 ,  H05K1/144 ,  H05K1/18 ,  H05K3/30 ,  H05K3/368 ,  H05K3/4697 ,  H05K2201/042 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10674 ,  H01L2924/00

Abstract: The present disclosure relates to an air-cavity package, which includes a bottom substrate with a first heat dissipation interface, a top substrate with a second heat dissipation interface, a perimeter wall, a bottom electronic component, and a top electronic component. The perimeter wall extends between a periphery of the top substrate and a periphery of the bottom substrate to form a cavity. The bottom electronic component is mounted on the bottom substrate, exposed to the cavity, and thermally coupled to a bottom thermally conductive structure, which extends through the bottom substrate and towards the first heat dissipation interface. The top electronic component is mounted on the top substrate, exposed to the cavity, and thermally coupled to a top thermally conductive structure, which extends through the top substrate and towards the second heat dissipation interface.

公开(公告)号：US20180049311A1

公开(公告)日：2018-02-15

申请号：US15713705

申请日：2017-09-25

Applicant: Apple Inc.

Inventor： Lan H. Hoang ,  Takayoshi Katahira

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K9/00 ,  H05K1/14 ,  H05K3/36 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/0218 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4867 ,  H01L23/295 ,  H01L23/49811 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/112 ,  H01L25/16 ,  H01L25/162 ,  H01L25/165 ,  H01L2224/131 ,  H01L2224/16105 ,  H01L2224/16106 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8184 ,  H01L2225/1023 ,  H01L2225/1047 ,  H01L2225/1058 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15322 ,  H01L2924/16251 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0203 ,  H05K1/0216 ,  H05K1/111 ,  H05K1/144 ,  H05K1/181 ,  H05K3/284 ,  H05K3/341 ,  H05K3/368 ,  H05K3/4038 ,  H05K9/0024 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10287 ,  H05K2201/10371 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y02P70/611 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Vertical shielding and interconnect structures for system-in-a-package modules, where the vertical shielding and interconnect structures are readily manufactured and are space efficient.

公开(公告)号：US20180048255A1

公开(公告)日：2018-02-15

申请号：US15790561

申请日：2017-10-23

Applicant: LCDRIVES CORP.

Inventor： Russel Hugh Marvin ,  David H. Leach

IPC: H02P27/06 ,  H05K1/02 ,  H02M7/00 ,  H05K1/18 ,  H03K17/16 ,  H02P29/02

CPC classification number: H02P27/06 ,  H02M7/003 ,  H02M2007/4835 ,  H02P27/14 ,  H02P29/02 ,  H03K17/161 ,  H05K1/0204 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10545

Abstract: One example includes a half-bridge switching circuit system. The system includes a first plurality of switches arranged between a first rail voltage and an output on which an output voltage is provided and a second plurality of switches arranged between a second rail voltage and the output, the first and second pluralities of switches being controlled via a plurality of switching signals. The system also includes a plurality of flying capacitors arranged to interconnect the first and second pluralities of switches, and further includes a plurality of snubber circuits that are each arranged in parallel with a respective one of the plurality of flying capacitors, the first plurality of switches, and the second plurality of switches.

公开(公告)号：US09894816B2

公开(公告)日：2018-02-13

申请号：US15115868

申请日：2015-02-04

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Tetsuo Saji ,  Yohei Ichikawa ,  Hiroshi Nakamura

IPC: H05K7/00 ,  H05K9/00 ,  H01L23/00 ,  H01L23/28 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K9/0024 ,  H01L23/00 ,  H01L23/28 ,  H01L23/3121 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K1/185 ,  H05K2201/10371 ,  H05K2201/10522 ,  H01L2924/00

Abstract: One object is to prevent electromagnetic wave interference between electronic components with restricted increase of the size of a circuit module. A circuit module according to an embodiment includes a circuit board, a plurality of electronic components provided on the circuit board, a resin mold provided on the circuit board so as to seal the plurality of electronic components in an insulating manner, a conductive shield covering the top surface and the side surfaces of the resin mold, and a plurality of conductive poles having a columnar shape provided in the resin mold and connecting the top surface of the conductive shield and the ground of the circuit board. The resonance caused by frequencies equal to or less than a predetermined maximum usable frequency is restricted.

公开(公告)号：US20180042122A1

公开(公告)日：2018-02-08

申请号：US15669042

申请日：2017-08-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masahiro WAKASHIMA ,  Yuta SAITO ,  Kohei SHIMADA ,  Naobumi IKEGAMI

IPC: H05K3/34 ,  H01G4/12 ,  H01G4/005 ,  H05K1/02 ,  H01G2/06 ,  H05K1/18 ,  H01G4/232

CPC classification number: H05K3/3442 ,  H01G2/065 ,  H01G4/005 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H01G4/40 ,  H05K1/0271 ,  H05K1/0295 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10522 ,  Y02P70/611

Abstract: An electronic component is able to be mounted on a mounting substrate on which a first electronic component and a second electronic component are able to be mounted. When dimensions of the first electronic component and the second electronic component in a width direction is designated as W1 and W2, respectively, and dimensions of the first electronic component and the second electronic component in a length direction are designated as L1 and L2, respectively, dimensions of the electronic component in the width direction and the length direction are any one of combinations of W1 and L2, and of W2 and L1. The electronic component includes a third laminate including a pair of third principal surfaces, a pair of third side surfaces, and a pair of third end surfaces, and a pair of third external electrodes. Each of the pair of third external electrodes includes a fired layer, and a resin layer provided on an external surface of the fired layer. On each of the pair of third principal surfaces and on each of the pair of third side surfaces, a length of the resin layer along the length direction from a corresponding one of the third end surfaces to a leading end of the resin layer is less than a length of the fired layer along the length direction from a corresponding one of the third end surfaces to a leading end of the fired layer.

公开(公告)号：US20170354036A1

公开(公告)日：2017-12-07

申请号：US15674137

申请日：2017-08-10

Applicant: Conti Temic microelectronic GmbH

Inventor： Andreas Albert ,  Mathias Strecker ,  Andreas Plach ,  Matthias Wieczorek

IPC: H05K1/14 ,  H05K3/36 ,  H05K3/28 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/144 ,  H01L23/053 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0271 ,  H05K1/142 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/366 ,  H05K3/368 ,  H05K5/0082 ,  H05K2201/0129 ,  H05K2201/041 ,  H05K2201/10287 ,  H05K2201/10522 ,  H05K2203/049 ,  H05K2203/107 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The disclosure provides an electronic assembly that includes: a carrier element, a circuit carrier having a number of electronic components, a circuit board, which is electrically conductively connected to the circuit carrier, and a covering element for covering the circuit carrier. The covering element is arranged on one flat side of the circuit board and the carrier element is arranged on an opposite flat side of the circuit board. The circuit board is welded respectively to the carrier element and to the covering element. The disclosure further relates to a method for producing such an electronic assembly.

公开(公告)号：US20170353646A1

公开(公告)日：2017-12-07

申请号：US15627408

申请日：2017-06-19

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie ZHAO ,  Zhenyu CHEN ,  Nan GUO ,  Takehiko TANAKA

IPC: H04N5/225 ,  H05K1/18 ,  H01L27/146

CPC classification number: H04N5/2254 ,  G02B5/208 ,  G02B7/006 ,  G02B7/02 ,  G02B7/09 ,  G03B13/36 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14645 ,  H02K41/0354 ,  H02N2/026 ,  H04N5/2253 ,  H04N5/2257 ,  H04N5/2258 ,  H04N5/247 ,  H05K1/0274 ,  H05K1/181 ,  H05K1/182 ,  H05K2201/10083 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10522

Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.