公开(公告)号：US11888279B2

公开(公告)日：2024-01-30

申请号：US16540229

申请日：2019-08-14

Applicant: TE Connectivity Germany GmbH

Inventor： Andre Martin Dressel ,  Gunther Chritz ,  Jens Huber

IPC: H01R43/02 ,  H01R4/02 ,  H01R9/03 ,  H01R12/57 ,  H01R13/15 ,  H05K1/18 ,  H05K3/32

CPC classification number: H01R43/0221 ,  H01R4/02 ,  H01R9/03 ,  H01R12/57 ,  H01R13/15 ,  H05K1/181 ,  H05K3/328 ,  H05K2201/10628

Abstract: PROBLEM TO BE SOLVED: To provide a laser jointing method that joints two materials while imparting a sufficient strength thereto and minimizing heat influence. SOLUTION: The method overlaps first and second materials (V1, V2) on each other and irradiates the surface of the first material (V1) with a laser light (103) from the side of the first material (V1). When jointing both materials (V1, V2), the method intermittently irradiating an overlapped part of the first and second materials (V1, V2) with the laser light while moving the laser light (103) to form a welding bead (1) on the surface of the first material (V1), wherein the length of the welding bead (1) is formed gradually shorter.

公开(公告)号：US11744020B2

公开(公告)日：2023-08-29

申请号：US17537721

申请日：2021-11-30

Applicant: Texas Instruments Incorporated

Inventor： Kyle Brent Norell ,  Claude Albert Fernandez ,  Charles Allen DeVries

IPC: H05K3/22 ,  H05K1/18 ,  H05K1/11 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K1/111 ,  H05K3/222 ,  H05K3/284 ,  H05K3/288 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10015 ,  H05K2201/1031 ,  H05K2201/10174 ,  H05K2201/10628 ,  H05K2203/1316

Abstract: An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.

公开(公告)号：US20230171894A1

公开(公告)日：2023-06-01

申请号：US17537721

申请日：2021-11-30

Applicant: Texas Instruments Incorporated

Inventor： Kyle Brent Norell ,  Claude Albert Fernandez ,  Charles Allen DeVries

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/22 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K1/111 ,  H05K3/222 ,  H05K3/284 ,  H05K3/288 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10015 ,  H05K2201/10174 ,  H05K2201/1031 ,  H05K2201/10628 ,  H05K2203/1316

Abstract: An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.

公开(公告)号：US20190096582A1

公开(公告)日：2019-03-28

申请号：US16134805

申请日：2018-09-18

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Naoki SAITO

IPC: H01G4/248 ,  H01G4/30 ,  H05K1/18

CPC classification number: H01G4/248 ,  H01G4/1218 ,  H01G4/1227 ,  H01G4/1236 ,  H01G4/232 ,  H01G4/30 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10628 ,  H05K2201/10946

Abstract: In an exemplary embodiment, an electronic component with metal terminals includes a multilayer ceramic capacitor 10 having a pair of external electrodes 12, and a pair of metal terminals 20 each having, integrally, a plate-like supporting part 21 and a plate-like connecting part 22, and is constituted so that the supporting part 21 of each of the metal terminals 20 is joined to each of the external electrodes 12 in a manner allowing the connecting parts 22 to face each other, wherein two projecting parts 23 are provided on the connecting face of the connecting part 22 of each of the metal terminals 20.

公开(公告)号：US10057985B2

公开(公告)日：2018-08-21

申请号：US15617082

申请日：2017-06-08

Applicant: DENSO CORPORATION

Inventor： Kenji Ochi

IPC: H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K5/00

CPC classification number: H05K1/092 ,  H05K1/09 ,  H05K1/111 ,  H05K1/181 ,  H05K3/4007 ,  H05K5/0069 ,  H05K2201/0338 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10636

Abstract: A printed substrate includes a land that is to be soldered. The land includes a plating film that defines a surface of the land. The plating film includes a metal as a main constituent and a pi-acceptor molecule that is dispersed in the plating film. The pi-acceptor molecule has pi-acceptability and causes ligand field splitting equal to or greater than that of 2,2′-bipyridyl in spectrochemical series. A content of the pi-acceptor molecule in the plating film is equal to or greater than 0.1 weight percent, in terms of carbon atoms, with respect to the metal of the plating film.

公开(公告)号：US20170251913A1

公开(公告)日：2017-09-07

申请号：US15057767

申请日：2016-03-01

Applicant: KARL STORZ Endovision, Inc.

Inventor： Dashiell Birnkrant ,  Gerard Vadenais ,  Jordan He ,  Jason Curtis

IPC: A61B1/05 ,  H05K3/34 ,  A61B1/00 ,  H04N5/335

CPC classification number: A61B1/0011 ,  A61B1/051 ,  H04N5/2253 ,  H04N2005/2255 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10356 ,  H05K2201/10628 ,  H05K2201/10757

Abstract: An image sensor module includes a circuit board, image sensor, electronic component assembly, and cable assembly. The circuit board includes a center section located between two end sections. The end sections each extend away from the center section and define an interior area there between. The image sensor is secured to an outer face of the circuit board in the center section with sensor contact fingers being connected at the circuit board outer face in one or both end sections. The electronic component arrangement is mounted on an inner face of the circuit board in the center section. A number of wires of the cable assembly extend through an end gap between the circuit board end sections and are connected to the inner face of the circuit board so as to overlap with the sensor contact fingers along a module longitudinal axis.

公开(公告)号：US20170150595A1

公开(公告)日：2017-05-25

申请号：US14947437

申请日：2015-11-20

Applicant: Hamilton Sundstrand Corporation

Inventor： Tran Lin

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/50 ,  H05K3/22 ,  H05K1/18 ,  H05K1/11 ,  G01R31/02 ,  G01R31/04 ,  H01L23/15 ,  H01L23/498

CPC classification number: H05K1/0268 ,  G01R31/026 ,  G01R31/046 ,  H01L23/15 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/50 ,  H05K1/0206 ,  H05K1/0215 ,  H05K1/111 ,  H05K1/181 ,  H05K3/225 ,  H05K3/3421 ,  H05K2201/094 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2203/16 ,  H05K2203/162 ,  Y02P70/613

Abstract: A printed circuit board includes a body and a belly pad seated within with the body. The belly pad is electrically separated into a first pad and a second pad. The first pad and the second pad are arranged to be electrically connected to one another by an interconnect electrically connecting the belly pad to a conductive plane of an electrical component, thereby allowing continuity testing across an interface between the first pad and the interconnect.

公开(公告)号：US20170135226A1

公开(公告)日：2017-05-11

申请号：US14981961

申请日：2015-12-29

Applicant: FUJIAN JOY SOLAR TECHNOLOGY CORPORATION

Inventor： Guangyan Chen

IPC: H05K3/30 ,  F21S9/03 ,  H05K3/00 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K3/34 ,  F21S9/037 ,  F21Y2101/00 ,  H05K1/111 ,  H05K1/181 ,  H05K1/183 ,  H05K3/0044 ,  H05K3/301 ,  H05K3/3421 ,  H05K2201/09072 ,  H05K2201/09845 ,  H05K2201/10037 ,  H05K2201/10106 ,  H05K2201/10143 ,  H05K2201/10628 ,  H05K2201/10651 ,  H05K2203/0228 ,  H05K2203/04 ,  Y02P70/613

Abstract: A PCB adaptation for a solar lamp, characterized in that, at least one slot is set on the PCB, both sides of the slot comprises a pad, the pad connects to an inner circuit on the PCB, two leads of a leaded component is respectively soldered to the pad which is located on the both skies of the slot. By cutting a slot on the PCB in the present invention, auto surface-mount technology can be implemented to automatically solder the leaded component to the PCB. Low-cost leaded component and surface-mount technology are used in above technical solution, which can decrease the cost and increase the productivity and product quality.

公开(公告)号：US09560757B2

公开(公告)日：2017-01-31

申请号：US14718367

申请日：2015-05-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiromi Murayama ,  Kazuaki Higashibata ,  Noboru Kato

IPC: H01L23/48 ,  H05K1/11 ,  G06K19/077 ,  H01Q1/22 ,  H01Q9/20 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/111 ,  G06K19/0772 ,  G06K19/07754 ,  G06K19/07756 ,  H01L23/49855 ,  H01L2224/16225 ,  H01L2924/15313 ,  H01Q1/2225 ,  H01Q9/20 ,  H05K1/0259 ,  H05K1/028 ,  H05K1/0295 ,  H05K1/03 ,  H05K2201/09427 ,  H05K2201/0979 ,  H05K2201/09954 ,  H05K2201/10628 ,  Y02P70/611

Abstract: A chip component includes external terminals on a mounting surface thereof at positions that are rotationally symmetric to each other by 180 degrees with respect to a center of the mounting surface. A substrate includes first and second mounting terminals on the mounting surface of the substrate at first diagonal positions of a square indicated by a two dot chain line, and third and fourth mounting terminals on the surface of the substrate at second diagonal positions of the square. The first and fourth mounting terminals are connected by a first terminal connecting portion, and the second and third mounting terminals are connected by a second terminal connecting portion. The chip component is configured to be mounted in any of four directions obtained by rotating the chip component every 90 degrees and achieves the same electrical characteristics.

Abstract translation: 芯片部件在其安装表面上包括相对于安装表面的中心相互旋转对称180度的位置的外部端子。 衬底包括在由两点划线表示的正方形的第一对角位置处的衬底的安装表面上的第一和第二安装端子，以及在正方形的第二对角线位置处的衬底的表面上的第三和第四安装端子。 第一和第四安装端子通过第一端子连接部分连接，第二和第三安装端子通过第二端子连接部分连接。 芯片部件被配置为安装在通过每90度旋转芯片部件而获得的四个方向中的任一个，并且实现相同的电特性。

公开(公告)号：US09549467B1

公开(公告)日：2017-01-17

申请号：US14041407

申请日：2013-09-30

Applicant: The United States of America, as represented by the Administrator of the National Aeronautics and Space Administration

Inventor： David J. Petrick ,  Luan Vo ,  Dennis Albaijes

IPC: H05K7/10 ,  H05K7/12 ,  H05K1/11

CPC classification number: G06F1/185 ,  G06F1/189 ,  H02H3/087 ,  H02J1/00 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/115 ,  H05K1/181 ,  H05K3/4644 ,  H05K2201/09409 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10628 ,  Y02P70/611

Abstract: An electronic assembly for use in space missions that includes a PCB and one or more multi-pin CGA devices coupled to the PCB. The PCB has one or more via-in-pad features and each via-in-pad feature comprises a land pad configured to couple a pin of the one or more multi-pin CGA devices to the via. The PCB also includes a plurality of layers arranged symmetrically in a two-halves configuration above and below a central plane of the PCB.

Abstract translation: 一种用于太空任务的电子组件，包括PCB和耦合到PCB的一个或多个多针CGA器件。 PCB具有一个或多个通孔在焊盘特征中，并且每个通孔内焊盘特征包括焊盘焊盘，其被配置为将一个或多个多引脚CGA器件的引脚耦合到通孔。 PCB还包括在PCB的中心平面上方和下方两个对称配置的多个层。