公开(公告)号：US07569474B2

公开(公告)日：2009-08-04

申请号：US11483015

申请日：2006-07-07

Applicant: Keng Lee Teo ,  Wey Ngee Desmond Chin

Inventor： Keng Lee Teo ,  Wey Ngee Desmond Chin

IPC: H01L21/00 ,  H01L21/44

CPC classification number: H05K3/3478 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K2201/10689 ,  H05K2201/10719 ,  H05K2201/10727 ,  H05K2201/10984 ,  H05K2203/0156 ,  H05K2203/0338 ,  H05K2203/0415 ,  H05K2203/0485 ,  Y10T29/49149 ,  H01L2924/00014

Abstract: A method and apparatus for attaching a module such as a semiconductor device, having an array of contacts arranged thereon in a given pattern to a substrate such as a printed circuit board comprises applying an array of solder blocks to the array of contacts on the module. The module is then positioned on the substrate so that the array of solder blocks contacts the array of contact pads on the substrate. Heat is then applied to reflow the solder blocks to provide mechanical and electrical connection of the module to the substrate.

Abstract translation: 用于将具有以给定图案布置在其上的触点阵列的诸如半导体器件的模块附接到诸如印刷电路板的基板的方法和装置包括将焊料块阵列施加到模块上的触点阵列。 然后将该模块定位在衬底上，使得焊料块阵列接触衬底上的接触焊盘阵列。 然后施加热量以回流焊料块以提供模块与基板的机械和电连接。

公开(公告)号：US20090175008A1

公开(公告)日：2009-07-09

申请号：US12006618

申请日：2008-01-03

Applicant: Michael Rosenblatt ,  Amir Salehi

Inventor： Michael Rosenblatt ,  Amir Salehi

IPC: H05K7/00 ,  H05K3/30

CPC classification number: H05K1/181 ,  H01L25/105 ,  H01L2224/13 ,  H01L2224/1302 ,  H01L2224/16137 ,  H01L2225/1005 ,  H01L2225/1058 ,  H05K2201/1053 ,  H05K2201/10727 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/00012

Abstract: Electrical components, such as packaged integrated circuit devices that are mountable on a substrate surface, are provided with at least one exposed electrical contact on a side surface of the component that will be substantially perpendicular to the substrate surface when the component is mounted. Two such components can be mounted side-by-side on the substrate surface with the above-mentioned contacts close to one another between the above-mentioned side surfaces. An electrical connection between the contacts can be made (or perfected) by depositing an electrically conductive connector material in contact with both of the contacts between the above-mentioned side surfaces.

Abstract translation: 诸如可安装在基板表面上的封装的集成电路器件的电气部件在组件的侧表面上设置有至少一个暴露的电接触件，当组件被安装时，其将基本上垂直于衬底表面。 两个这样的部件可以并排安装在基板表面上，上述触头在上述侧表面之间彼此靠近。 可以通过沉积与上述侧表面之间的两个触点接触的导电连接器材料来（或完善）触点之间的电连接。

公开(公告)号：US07551386B2

公开(公告)日：2009-06-23

申请号：US10965783

申请日：2004-10-18

Applicant: MingGao Yao ,  Masashi Shiraishi

Inventor： MingGao Yao ,  Masashi Shiraishi

IPC: G11B21/02 ,  G11B21/24

CPC classification number: G11B5/5552 ,  G11B5/483 ,  G11B5/4853 ,  G11B5/6005 ,  H05K1/0268 ,  H05K3/303 ,  H05K3/3442 ,  H05K2201/10083 ,  H05K2201/10727 ,  H05K2203/306 ,  Y02P70/613

Abstract: A HGA comprises a slider, a suspension to load the slider, a flying height controller for controlling flying height of the slider; and a flexible cable to be electrically connected with the slider and the flying height controller. In the present invention, the flying height controller comprises at least one piezoelectric piece disposed between the slider and the suspension. The HGA further comprises ACF to connect the flying height controller with the suspension and the flexible cable. The invention also discloses a disk drive unit with the HGA, a method for flying height control with the HGA, and a system for controlling flying height.

Abstract translation: HGA包括滑块，用于装载滑块的悬架，用于控制滑块的飞行高度的飞行高度控制器; 以及与滑块和飞行高度控制器电连接的柔性电缆。 在本发明中，飞行高度控制器包括设置在滑块和悬架之间的至少一个压电片。 HGA还包括ACF，用于将飞行高度控制器与悬架和柔性电缆连接起来。 本发明还公开了一种具有HGA的盘驱动单元，用于使用HGA进行高度控制的方法，以及用于控制飞行高度的系统。

公开(公告)号：US20090139755A1

公开(公告)日：2009-06-04

申请号：US12063732

申请日：2006-08-17

Applicant: Tomoyuki Kusano ,  Kazuhiro Ishibashi ,  Takaaki Onizuka

Inventor： Tomoyuki Kusano ,  Kazuhiro Ishibashi ,  Takaaki Onizuka

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K3/3442 ,  H01L24/81 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/49171 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H05K2201/09181 ,  H05K2201/10106 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00

Abstract: The present invention provides a surface mounted semiconductor device 1 formed by cutting an assembly board together with cathode wiring patterns 8 and anode wiring patterns 10 arranged on the assembly board on which light-emitting elements are mounted. When the surface mounted semiconductor device 1 is mounted on a mounting board with the cutting plane (bonding surface) facing the mounting board, the cathode wiring patterns 8 serve as cathode connection electrodes 15 and the anode wiring patterns 10 serve as anode connection electrodes 12. A substantially semi-elliptical notch 16 is formed in each of the anode connection electrodes 12. A substantially fan-shaped notch 14 is formed in the corner of each of the cathode connection electrodes 15. Thus, it is possible to provide a surface mounted semiconductor device that can prevent a poor connection and ensure the bond strength by forming a solder fillet reliably, even if burrs are produced on the connection electrodes formed by cutting the assembly board.

Abstract translation: 本发明提供一种表面安装半导体器件1，其通过与阴极布线图案8和布置在其上安装有发光元件的组装板上的阳极布线图案10一起切割组装板而形成。 当表面安装的半导体器件1以切割面（接合面）与安装基板相对的方式安装在安装基板上时，阴极布线图案8用作阴极连接电极15，阳极布线图案10用作阳极连接电极12。 在每个阳极连接电极12中形成大致半椭圆形的凹口16.在每个阴极连接电极15的角部形成有大致扇形的凹口14.因此，可以提供表面安装的半导体 即使在通过切割组装板形成的连接电极上产生毛刺，也能够防止连接不良，并且能够可靠地形成焊接圆角来确保接合强度。

公开(公告)号：US07542301B1

公开(公告)日：2009-06-02

申请号：US11159574

申请日：2005-06-22

Applicant: Lily Liong ,  Kenneth D. Schatz ,  Gordon Craig ,  Mark A. Hadley ,  Eric Kanemoto

Inventor： Lily Liong ,  Kenneth D. Schatz ,  Gordon Craig ,  Mark A. Hadley ,  Eric Kanemoto

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H01L24/19 ,  H01L24/24 ,  H01L24/95 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24101 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K3/0014 ,  H05K3/321 ,  H05K3/368 ,  H05K2201/09036 ,  H05K2201/0949 ,  H05K2201/09827 ,  H05K2201/10674 ,  H05K2201/10727 ,  H05K2203/0108 ,  H05K2203/0143 ,  H05K2203/1545 ,  H01L2224/82 ,  H01L2924/00

Abstract: An embossing die, the die comprises one or more protruding features configured to create one or more corresponding recessed regions in a substrate; and a left side edge and a right side edge. Either the left side edge or the right side edge is a gradually sloping edge. The embossing die can be used to form an assembly. The assembly comprises a substrate including a more than one defined frames. Each of the defined frames comprises a plurality of recessed regions and a plurality of functional blocks, each functional block being deposited in one of the recessed regions. Each of the defined frames is separated from another frame by a region. The region can be a flattened region, a sloped region, or a plateau shaped region having a plateau top and two sloped sides, wherein each sloped side forms about 10-15 degree angle to a surface of the substrate.

Abstract translation: 压模包括一个或多个突出特征，其被配置为在基底中产生一个或多个相应的凹陷区域; 以及左侧边缘和右侧边缘。 左侧边缘或右侧边缘都是逐渐倾斜的边缘。 压花模具可用于形成组件。 组件包括包括多于一个定义的框架的基板。 每个定义的框架包括多个凹陷区域和多个功能块，每个功能块被沉积在一个凹进区域中。 每个定义的帧与另一个帧分开一个区域。 该区域可以是具有平台顶部和两个倾斜侧面的扁平区域，倾斜区域或平台形区域，其中每个倾斜侧面与基底的表面形成约10-15度的角度。

公开(公告)号：US20090129034A1

公开(公告)日：2009-05-21

申请号：US12061913

申请日：2008-04-03

Applicant: CHUN-FANG CHENG

Inventor： CHUN-FANG CHENG

IPC: H05K1/14

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L2924/0002 ,  H05K1/183 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10121 ,  H05K2201/10727 ,  H01L2924/00

Abstract: An imaging device includes a lens module and a printed circuit board. The lens module includes a substrate with a lens unit and an imaging sensor mounted on a same side thereof. The substrate defines a groove therein. The printed circuit board defines a recessed portion accommodating the substrate therein, and includes a locking member engaging in the groove to detachably secure the lens module thereto.

Abstract translation: 成像装置包括透镜模块和印刷电路板。 透镜模块包括具有透镜单元的基板和安装在其同一侧的成像传感器。 衬底在其中限定凹槽。 印刷电路板限定在其中容纳基板的凹部，并且包括接合在凹槽中的锁定构件，以可拆卸地将透镜模块固定到其上。

公开(公告)号：US20090040368A1

公开(公告)日：2009-02-12

申请号：US12013916

申请日：2008-01-14

Applicant: WEN-HWA LIN ,  CHEN-KUANG YEH ,  XIANG HUANG ,  WAN-CHENG XIE ,  SHAO-GUANG MO

Inventor： WEN-HWA LIN ,  CHEN-KUANG YEH ,  XIANG HUANG ,  WAN-CHENG XIE ,  SHAO-GUANG MO

IPC: H04N5/225 ,  G03B17/00

CPC classification number: H04N5/2253 ,  H01L27/14618 ,  H01L2924/0002 ,  H04N5/2257 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/303 ,  H05K2201/09045 ,  H05K2201/09054 ,  H05K2201/10121 ,  H05K2201/10727 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: An image sensor module includes a circuit board (20), an image sensor (10) and a supporting board (30). The circuit board has a plurality of circuits formed thereon. The image sensor is arranged on one side of the circuit board and is electrically connected to the circuit board. The circuit board defines at least one through opening (22) therein. The supporting board is arranged on an opposite side of the circuit board. A protrusion (31) extends outwardly from the supporting board through the at least one through opening of the circuit board. The image sensor is mounted on the protrusion.

Abstract translation: 图像传感器模块包括电路板（20），图像传感器（10）和支撑板（30）。 电路板上形成有多个电路。 图像传感器布置在电路板的一侧并电连接到电路板。 电路板在其中限定至少一个通孔（22）。 支撑板布置在电路板的相对侧。 突起（31）从支撑板向外延伸穿过电路板的至少一个通孔。 图像传感器安装在突起上。

公开(公告)号：US20090025205A1

公开(公告)日：2009-01-29

申请号：US12220746

申请日：2008-07-25

Applicant: Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Hideto Imai ,  Tamaki Ushimoto

Inventor： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Hideto Imai ,  Tamaki Ushimoto

IPC: G11B5/127

CPC classification number: B23K20/007 ,  H05K3/3442 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/041 ,  H05K2203/086 ,  H05K2203/107 ,  Y02P70/613 ,  Y10T29/49021 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4903 ,  Y10T29/49032 ,  Y10T29/49169 ,  Y10T29/5313

Abstract: Embodiments of the present invention help to decrease the amount of inactive gas necessary for reflow to interconnect connection terminals of a head slider and a suspension. In an embodiment of the present invention, inactive gas is blown from a nozzle of a reflow apparatus toward interconnection joints of a head slider and a suspension. The head slider is bonded onto a gimbal tongue. The nozzle comprises a duct through which the inactive gas passes and a porous member fitted in an ejection outlet of the tube. Placing the porous member close to the head slider achieves effective reduction of oxygen concentration around solder balls.

Abstract translation: 本发明的实施例有助于减少回流到磁头滑块和悬架的互连连接端子所需的非活性气体的量。 在本发明的一个实施方案中，惰性气体从回流装置的喷嘴吹向磁头滑块和悬架的互连接头。 磁头滑块被粘合到万向节舌头上。 喷嘴包括惰性气体通过的管道和装配在管的喷射出口中的多孔构件。 将多孔构件放置在头部滑块附近实现有效地减少焊球周围的氧浓度。

公开(公告)号：US20080237313A1

公开(公告)日：2008-10-02

申请号：US12021586

申请日：2008-01-29

Applicant: Hiroshi FUKAYA ,  Satoshi YAMAGUCHI

Inventor： Hiroshi FUKAYA ,  Satoshi YAMAGUCHI

IPC: B23K31/02 ,  G11B5/127 ,  B23K26/20

CPC classification number: B23K1/0056 ,  B23K2101/40 ,  H01L2224/11003 ,  H01L2224/742 ,  H05K3/3442 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/041 ,  H05K2203/107 ,  Y02P70/613 ,  Y10T29/4903

Abstract: To improve the quality of the products that are manufactured by soldering, through enabling highly reliable soldering while suppressing damages to the bonding targets caused due to the soldering. Provided is a soldering method for bonding each of bonding pads formed in respective bonding targets with solder. The method comprises: a bonding target placing step for placing each of bonding targets to a bonding position; a soldering step for placing solder between each of the bonding pads formed in each of the bonding targets, and for performing soldering by irradiating a heating beam to the solder; and a bonding target heating step for heating at least one of the bonding targets, which is executed before the soldering step and/or simultaneously with the soldering step.

Abstract translation: 为了提高通过焊接制造的产品的质量，通过实现高可靠性焊接，同时抑制由于焊接而导致的接合目标的损坏。 提供了一种焊接方法，用于将形成在各个接合靶中的每个接合焊盘与焊料接合。 该方法包括：将接合目标各自放置在接合位置的接合目标放置步骤; 焊接步骤，用于在形成在每个接合靶中的每个接合焊盘之间放置焊料，并且通过向焊料照射加热束来进行焊接; 以及用于加热在焊接步骤之前执行的和/或与焊接步骤同时进行的至少一个接合目标的接合目标加热步骤。

公开(公告)号：US20080203546A1

公开(公告)日：2008-08-28

申请号：US12115051

申请日：2008-05-05

Applicant: John J. Maloney ,  Robert M. Smith ,  Charles H. Wilson

Inventor： John J. Maloney ,  Robert M. Smith ,  Charles H. Wilson

IPC: H01L23/495 ,  H01L21/56

CPC classification number: H01L23/49548 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K3/341 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A QFN package with improved joint solder thickness for improved second level attachment fatigue life. The copper leadframe of a QFN chip carrier is provided with rounded protrusions in both the chip attach pad region and the surrounding lead regions before second level attachment. The rounded stand-off protrusions are formed from the copper itself of the copper of the leadframe. This may be achieved by punching dimples into one surface of the copper plate of the leadframe before plating to form protrusions on the opposing surface. This method of forming the rounded protrusions simplifies the process of forming stand-offs. The protrusions provide a structure that increases wetting area and allows the use of a larger quantity of solder for increased solder joint thickness and better die paddle solder joint area coverage. As a result of the increased solder joint thickness, second level fatigue life is significantly improved. As a result of the improved die paddle solder joint area coverage, improved thermal performance of the chip carrier is also significantly improved.

Abstract translation: QFN封装，具有改进的焊点厚度，可提高二级附着疲劳寿命。 QFN芯片载体的铜引线框架在第二级附接之前在芯片连接焊盘区域和周围的引线区域中设置有圆形突起。 圆形的突出突起由引线框架的铜的铜本身形成。 这可以通过在电镀之前将凹坑冲压到引线框架的铜板的一个表面中以在相对表面上形成突起来实现。 形成圆形突起的这种方法简化了形成支座的过程。 突起提供了增加润湿面积的结构，并且允许使用更大量的焊料以增加焊接接​​头厚度和更好的焊盘焊接区域覆盖。 由于焊接接头厚度的增加，二级疲劳寿命显着提高。 由于焊盘焊接区域覆盖率的提高，芯片载体的热性能也得到了显着提高。