公开(公告)号：US07382216B2

公开(公告)日：2008-06-03

申请号：US10555674

申请日：2004-09-27

Applicant: Kenichi Saito ,  Hisato Oshima ,  Takaaki Ooi ,  Toshinori Murakami ,  Yoshimi Tanaka

Inventor： Kenichi Saito ,  Hisato Oshima ,  Takaaki Ooi ,  Toshinori Murakami ,  Yoshimi Tanaka

IPC: H03H7/01

CPC classification number: H01G4/35 ,  H01F17/06 ,  H01F27/40 ,  H01F2017/065 ,  H01G4/40 ,  H03H1/0007 ,  H05K1/0243 ,  H05K1/18 ,  H05K2201/1006 ,  H05K2201/10969

Abstract: A noise filter includes a capacitor having a hot side input terminal, a hot side output terminal, a ground side input terminal, and a ground side output terminal. A circuit board includes a hot side input electrode connected to the hot side input terminal, a hot side output electrode connected to the hot side output terminal, a ground side input electrode connected to the ground side input terminal, and a ground side output electrode connected to the ground side output terminal. The impedance of the ground side input terminal seen from the ground side output electrode is larger than both the impedance of the ground side output terminal seen from the ground side output electrode and the impedance of the hot side output terminal seen from the ground side output electrode. For this purpose, a stray capacitance formed between the ground side input electrode and the ground side output electrode is reduced by increasing a gap therebetween. Accordingly, excellent noise-reducing characteristics are provided.

Abstract translation: 噪声滤波器包括具有热侧输入端子，热侧输出端子，接地侧输入端子和接地侧输出端子的电容器。 电路板包括连接到热侧输入端子的热侧输入电极，连接到热侧输出端子的热侧输出电极，连接到接地侧输入端子的接地侧输入电极和连接到接地侧输出端子的接地侧输出电极 到地侧输出端子。 从地侧输出电极看到的接地侧输入端子的阻抗大于从接地侧输出电极看到的接地侧输出端子的阻抗和从接地侧输出电极看到的热侧输出端子的阻抗 。 为此，通过增加接地侧输入电极和接地侧输出电极之间的间隙而减小形成的杂散电容。 因此，提供优异的降噪特性。

公开(公告)号：US07378743B2

公开(公告)日：2008-05-27

申请号：US11453163

申请日：2006-06-13

Applicant: Sheng-Yuan Lee

Inventor： Sheng-Yuan Lee

IPC: H01L23/48

CPC classification number: H01L23/3107 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0243 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3442 ,  H05K2201/0792 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/10931 ,  H05K2201/10969 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A circuit board suitable for being electrically connected to a chip package is provided. The chip package has a chip pad and a plurality of inner leads. The circuit board includes at least one patterned conductive layer and at least one insulating layer. The patterned conductive layer has at least one first pad and at least one second pad. The first pad has an extension part and is suitable for being electrically connected to the chip pad. The second pad is suitable for being electrically connected to one end of at least one of the inner leads, while the other end of the inner lead suitable for being electrically connected to the second pad has a projection at least partially overlapping the extension part on the patterned conductive layer. Moreover, the patterned conductive layer is disposed outside the insulating layer.

Abstract translation: 提供了适于电连接到芯片封装的电路板。 芯片封装具有芯片焊盘和多个内部引线。 电路板包括至少一个图案化导电层和至少一个绝缘层。 图案化导电层具有至少一个第一焊盘和至少一个第二焊盘。 第一焊盘具有延伸部分，并且适于电连接到芯片焊盘。 第二垫适于电连接到至少一个内引线的一端，而内引线的另一端适于与第二焊盘电连接，其突出部分至少部分地与第二焊盘上的延伸部分重叠 图案化导电层。 此外，图案化导电层设置在绝缘层的外部。

公开(公告)号：US20080032455A1

公开(公告)日：2008-02-07

申请号：US11873146

申请日：2007-10-16

Applicant: William Murphy ,  Ryan Riegle ,  Richard Shields ,  David Vos

Inventor： William Murphy ,  Ryan Riegle ,  Richard Shields ,  David Vos

IPC: H01L21/768

CPC classification number: H05K1/0209 ,  B23K1/0016 ,  B23K2101/40 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/341 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2224/0401

Abstract: A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.

Abstract translation: 公开了一种用印刷线路板封装半导体部件的方法。 该方法包括确定第一距离，将薄膜施加到半导体部件的表面上，使得薄膜与半导体的支撑体间隔开，将焊盘焊接到印刷线路板上，将半导体部件放置在 将薄膜贴到印刷电路板上，并将薄膜定位在焊盘附近。

公开(公告)号：US20070230078A1

公开(公告)日：2007-10-04

申请号：US11693316

申请日：2007-03-29

Applicant: Shin-ya Nakano ,  Yoh Takano ,  Tetsuro Sawai ,  Ryosuke Usui

Inventor： Shin-ya Nakano ,  Yoh Takano ,  Tetsuro Sawai ,  Ryosuke Usui

IPC: H02H5/04

CPC classification number: H01L23/142 ,  H01L23/3737 ,  H01L23/467 ,  H01L23/498 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0203 ,  H05K1/0265 ,  H05K3/06 ,  H05K3/202 ,  H05K3/4602 ,  H05K2201/0352 ,  H05K2201/10969 ,  H05K2203/0369 ,  H05K2203/049 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A circuit device includes a metal substrate; and a plurality of circuit elements, mounted on the metal substrate, which electrically connects to the metal substrate. The metal substrate is made of a copper plate of high thermal conductivity. The metal substrate is demarcated into a plurality of sections by insulating films added with a filler for enhancing the thermal conductivity in resin. The circuit elements, which have respective independent operating potentials on a side of the metal substrate of the circuit elements, are respectively provided on separated copper plates.

Abstract translation: 电路装置包括金属基板; 以及多个电路元件，安装在与金属基板电连接的金属基板上。 金属基板由具有高导热性的铜板制成。 通过添加有填充剂的绝缘膜将金属基板划分为多个部分，以提高树脂中的导热性。 在电路元件的金属基板的一侧具有各自的独立工作电位的电路元件分别设置在分离的铜板上。

公开(公告)号：US20070217175A1

公开(公告)日：2007-09-20

申请号：US11374994

申请日：2006-03-15

Applicant: Thomas Young ,  Brian Kearns

Inventor： Thomas Young ,  Brian Kearns

IPC: H05K7/00

CPC classification number: H01P1/047 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0243 ,  H05K2201/09618 ,  H05K2201/10727 ,  H05K2201/10969 ,  H01L2924/00

Abstract: An RF electronic component for mounting on a substrate includes a housing; and at least one electronic device having an input and/or output incorporated in the housing. At least one input/output terminal connects to a connection pad on the substrate; and an electrical transition provides an electrical connection between the input/output terminal and an input/output of an electronic device incorporated in the electronic component. The electrical transition comprises a side termination at least partially located on an outer surface of the housing; and an array of conductive through holes formed inside the housing at an offset from the side termination. The array is arranged so that the axes of the through holes are substantially mutually parallel and coplanar, and the array of through holes is connected to form a ground plane at the offset from the side termination.

Abstract translation: 用于安装在基板上的RF电子部件包括壳体; 以及至少一个电子设备，其具有并入壳体中的输入和/或输出。 至少一个输入/输出端子连接到基板上的连接焊盘; 并且电转换提供输入/输出端子与结合在电子部件中的电子设备的输入/输出之间的电连接。 电转变包括至少部分地位于外壳的外表面上的侧端接件; 以及形成在壳体内部的与侧面终端偏移的导电通孔阵列。 阵列被布置成使得通孔的轴线基本上相互平行和共面，并且通孔阵列被连接以形成与侧面终端偏移的接地平面。

公开(公告)号：US20070205017A1

公开(公告)日：2007-09-06

申请号：US11307283

申请日：2006-01-30

Applicant: Sadamichi Takakusaki ,  Noriaki Sakamoto ,  Motoichi Nezu ,  Yusuke Igarashi

Inventor： Sadamichi Takakusaki ,  Noriaki Sakamoto ,  Motoichi Nezu ,  Yusuke Igarashi

IPC: H05K1/16 ,  H05K7/00

CPC classification number: H05K3/341 ,  H01L24/83 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K3/243 ,  H05K3/244 ,  H05K3/284 ,  H05K3/3463 ,  H05K2201/0391 ,  H05K2201/10969 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

Abstract: In a hybrid integrated circuit device that is a circuit device of the present invention, a conductive pattern including pads is formed on a surface of a substrate. A first pad is formed to be relatively large since a heat sink is mounted thereon. A second pad is a small pad to which a chip component or a small signal transistor is fixed. In the present invention, a plated film made of nickel is formed on a surface of the first pad. Therefore, the first pad and a solder never come into contact with each other. Thus, a Cu/Sn alloy layer having poor soldering properties is not generated but a Ni/Sn alloy layer having excellent soldering properties is generated. Consequently, occurrence of sink in the melted solder is suppressed.

Abstract translation: 在作为本发明的电路装置的混合集成电路装置中，在基板的表面上形成包括焊盘的导电图案。 由于在其上安装散热器，所以形成第一焊盘相对较大。 第二焊盘是固定芯片部件或小信号晶体管的小焊盘。 在本发明中，在第一焊盘的表面上形成由镍制成的镀膜。 因此，第一焊盘和焊料不会彼此接触。 因此，不会产生焊接性差的Cu / Sn合金层，而是产生焊接性优异的Ni / Sn合金层。 因此，抑制熔融焊料中的沉陷的发生。

公开(公告)号：US07217159B2

公开(公告)日：2007-05-15

申请号：US11406544

申请日：2006-04-14

Applicant: Yung-Chien Chung

Inventor： Yung-Chien Chung

IPC: H01R13/648

CPC classification number: H01R12/707 ,  H01R13/6582 ,  H01R13/6594 ,  H05K1/182 ,  H05K3/341 ,  H05K3/3421 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10969 ,  Y02P70/613

Abstract: An electrical connector (100) adapted for being assembled in a notch (4) of a Printed Circuit Board (PCB) (200) comprises a dielectric housing (1) defining passageways (12) thereon, a plurality of contacts (2) received in corresponding passageways, and a retaining device (31) retaining the electrical connector to the PCB. Each contact comprises a soldering section (22) extending out the dielectric housing and retained on the PCB. The retaining device has a same thickness W to that of each soldering section of the contact.

Abstract translation: 适于组装在印刷电路板（PCB）（200）的凹口（4）中的电连接器（100）包括在其上限定通道（12）的介电壳体（1），多个接触件（2） 相应的通道以及将电连接器保持在PCB上的保持装置（31）。 每个接触件包括从介电壳体延伸并保持在PCB上的焊接部分（22）。 保持装置具有与接触件的每个焊接部分相同的厚度W。

公开(公告)号：US20070092999A1

公开(公告)日：2007-04-26

申请号：US11614167

申请日：2006-12-21

Applicant: John Tellkamp

Inventor： John Tellkamp

IPC: H01L21/00

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0204 ,  H05K1/0206 ,  H05K3/0005 ,  H05K3/341 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K2203/162 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of reducing a likelihood that a die pad will be delaminated from a die in an integrated circuit die package for a structure design during an attachment of a heat sink member to the die pad using solder, is provided. A sample structure of the structure design is evaluated to determine whether a volume of last solidification for the solder is centrally located with respect to the die pad and is located at or near an interface of the solder and the die pad. If the last solidification volume is centrally located and is located at or near the interface of the solder and the die pad, and if the die pad is delaminated from the die, the structure design is modified so that less metal of the heat sink member is centrally located than before the modifying.

Abstract translation: 提供了一种降低在使用焊料将散热构件附接到裸片焊盘期间用于结构设计的集成电路管芯封装中的管芯焊盘从管芯剥离的可能性的方法。 评估结构设计的样品结构以确定焊料的最后凝固体积是否相对于芯片焊盘位于中心位置，并且位于焊料和管芯焊盘的界面处或附近。 如果最后一个凝固体位于中心位置并且位于焊料和管芯焊盘的界面处或附近，并且如果管芯焊盘从模具分层，则结构设计被修改，使得散热构件的金属少于 位于中心位置比修改前。

公开(公告)号：US07195145B2

公开(公告)日：2007-03-27

申请号：US11180188

申请日：2005-07-13

Applicant: John M. Waldvogel ,  Herman J. Miller

Inventor： John M. Waldvogel ,  Herman J. Miller

IPC: B23K31/02 ,  B21D39/00 ,  H01L23/10 ,  H01L23/34

CPC classification number: B23K1/0016 ,  B23K2101/36 ,  H05K1/0206 ,  H05K1/0271 ,  H05K3/0061 ,  H05K3/305 ,  H05K3/341 ,  H05K3/386 ,  H05K2201/0305 ,  H05K2201/09318 ,  H05K2201/09554 ,  H05K2201/10022 ,  H05K2201/10636 ,  H05K2201/10969 ,  H05K2203/0455 ,  Y02P70/611

Abstract: A method for assembling an electrical circuit apparatus that includes; a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture; a heat sink; and an adhesive layer for mechanically coupling the heat sink to the ground layer of the substrate, the adhesive layer having at least one aperture wherein aligning the at least one substrate solder aperture with the at least one adhesive layer aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

Abstract translation: 一种组装电路装置的方法，包括： 衬底，具有顶侧，接地层，至少一个热孔和至少一个焊接孔; 散热器 以及用于将散热器机械地耦合到基底的接地层的粘合剂层，所述粘合剂层具有至少一个孔，其中使所述至少一个基底焊接孔与所述至少一个粘合剂层孔对准使得焊料在预定区域中润湿 在散热片和衬底的接地层之间。

公开(公告)号：US20060234530A1

公开(公告)日：2006-10-19

申请号：US11406544

申请日：2006-04-14

Applicant: Yung-Chien Chung

Inventor： Yung-Chien Chung

IPC: H05K1/00

CPC classification number: H01R12/707 ,  H01R13/6582 ,  H01R13/6594 ,  H05K1/182 ,  H05K3/341 ,  H05K3/3421 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10969 ,  Y02P70/613

Abstract: An electrical connector (100) adapted for being assembled in a notch (4) of a Printed Circuit Board (PCB) (200) comprises a dielectric housing (1) defining passageways (12) thereon, a plurality of contacts (2) received in corresponding passageways, and a retaining device (31) retaining the electrical connector to the PCB. Each contact comprises a soldering section (22) extending out the dielectric housing and retained on the PCB. The retaining device has a same thickness W to that of each soldering section of the contact.

Abstract translation: 适于组装在印刷电路板（PCB）（200）的凹口（4）中的电连接器（100）包括在其上限定通道（12）的介电壳体（1），多个接触件（2） 相应的通道以及将电连接器保持在PCB上的保持装置（31）。 每个接触件包括从介电壳体延伸并保持在PCB上的焊接部分（22）。 保持装置具有与接触件的每个焊接部分相同的厚度W。