公开(公告)号：US10325877B2

公开(公告)日：2019-06-18

申请号：US15959619

申请日：2018-04-23

Applicant: Invensas Corporation

Inventor： Javier A. Delacruz ,  Abiola Awujoola ,  Ashok S. Prabhu ,  Christopher W. Lattin ,  Zhuowen Sun

IPC: H01L23/00 ,  H05K1/02 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01L23/552 ,  H01L25/10 ,  H01L25/00

Abstract: In a vertically integrated microelectronic package, a first microelectronic device is coupled to an upper surface of a circuit platform in a wire bond-only surface area thereof. Wire bond wires are coupled to and extends away from an upper surface of the first microelectronic device. A second microelectronic device in a face-down orientation is coupled to upper ends of the wire bond wires in a surface mount-only area. The second microelectronic device is located above and at least partially overlaps the first microelectronic device. A protective layer is disposed over the circuit platform and the first microelectronic device. An upper surface of the protective layer has the surface mount-only area. The upper surface of the protective layer has the second microelectronic device disposed thereon in the face-down orientation in the surface mount-only area for coupling to the upper ends of the first wire bond wires.

公开(公告)号：US20180315735A1

公开(公告)日：2018-11-01

申请号：US15499557

申请日：2017-04-27

Applicant: Invensas Corporation

Inventor： Javier A. Delacruz ,  Belgacem Haba

IPC: H01L25/065 ,  H01L25/16 ,  H01L25/00 ,  H01L23/498

CPC classification number: H01L25/0655 ,  H01L23/49894 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H05K1/0243 ,  H05K1/185 ,  H05K3/4694 ,  H05K2201/09227 ,  H05K2201/10015 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/10674

Abstract: Embedded organic interposers for high bandwidth are provided. Example embedded organic interposers provide thick conductors with more dielectric space, and more routing layers of such conductors than conventional interposers, in order to provide high bandwidth transmission capacity over longer spans. The embedded organic interposers provide high bandwidth transmission paths between components such as HBM, HBM2, and HBM3 memory stacks, and other components. To provide the thick conductors and more routing layers for greater transmission capacity, extra space is achieved by embedding the organic interposers in the core of the package. Example embedded organic interposers lower a resistive-capacitive (RC) load of the routing layers to provide improved signal transmission of 1-2 GHz up to 20-60 GHz bandwidth for each 15 mm length, for example. The embedded organic interposers are not limited to use with memory modules.

公开(公告)号：US20180197834A1

公开(公告)日：2018-07-12

申请号：US15914617

申请日：2018-03-07

Applicant: Invensas Corporation

Inventor： Shaowu Huang ,  Javier A. Delacruz

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/552 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/566 ,  H01L23/3121 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00014

Abstract: Apparatuses relating generally to a microelectronic package having protection from electromagnetic interference are disclosed. In an apparatus thereof, a platform has an upper surface and a lower surface opposite the upper surface and has a ground plane. A microelectronic device is coupled to the upper surface of the platform. Wire bond wires are coupled to the ground plane with a pitch. The wire bond wires extend away from the upper surface of the platform with upper ends of the wire bond wires extending above an upper surface of the microelectronic device. The wire bond wires are spaced apart from one another to provide a fence-like perimeter to provide an interference shielding cage. A conductive layer is coupled to at least a subset of the upper ends of the wire bond wires for electrical conductivity to provide a conductive shielding layer to cover the interference shielding cage.

公开(公告)号：US09972582B2

公开(公告)日：2018-05-15

申请号：US15670382

申请日：2017-08-07

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Sangil Lee ,  Craig Mitchell ,  Gabriel Z. Guevara ,  Javier A. Delacruz

IPC: H01L23/488 ,  H01L23/00 ,  H01L21/48 ,  B23K1/00 ,  H01L23/498

CPC classification number: H01L23/562 ,  B23K1/0008 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012

Abstract: Representative implementations of devices and techniques provide reinforcement for a carrier or a package. A reinforcement layer is added to a surface of the carrier, often a bottom surface of the carrier that is generally under-utilized except for placement of terminal connections. The reinforcement layer adds structural support to the carrier or package, which can be very thin otherwise. In various embodiments, the addition of the reinforcement layer to the carrier or package reduces warpage of the carrier or package.

公开(公告)号：US20180040589A1

公开(公告)日：2018-02-08

申请号：US15227361

申请日：2016-08-03

Applicant: Invensas Corporation

Inventor： Shaowu Huang ,  Zhuowen Sun ,  Javier A. Delacruz ,  Belgacem Haba

IPC: H01L25/065 ,  H01L23/538 ,  G11C5/06 ,  H01L25/10

CPC classification number: H01L25/0657 ,  G11C5/025 ,  G11C5/06 ,  G11C5/063 ,  H01L23/5386 ,  H01L25/105 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/1035 ,  H01L2225/1064

Abstract: A microelectronic assembly includes a circuit panel having a plurality of first contacts at a major surface thereof. One or more microelectronic packages comprise a plurality of microelectronic elements, the one or more packages having terminals electrically coupled with the first contacts, wherein each package includes at least one microelectronic element having a face, and element contacts at the face which are electrically coupled with the plurality of terminals. A repeater (redriver or retimer) assembly is configured to condition one or more signals received from a memory channel control element including one or more signals selected from: an address signal, a command signal, or a data signal, such that the plurality of the microelectronic elements are coupled to the at least one repeater assembly to receive the conditioned signals.

公开(公告)号：US09859257B2

公开(公告)日：2018-01-02

申请号：US15358380

申请日：2016-11-22

Applicant: Invensas Corporation

Inventor： Javier A. Delacruz ,  Belgacem Haba ,  Tu Tam Vu ,  Rajesh Katkar

IPC: H01L23/495 ,  H01L21/00 ,  H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49575 ,  H01L23/49838 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49051 ,  H01L2224/4909 ,  H01L2224/49113 ,  H01L2224/49173 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/06 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: Stacked microelectronic packages comprise microelectronic elements each having a contact-bearing front surface and edge surfaces extending away therefrom, and a dielectric encapsulation region contacting an edge surface. The encapsulation defines first and second major surfaces of the package and a remote surface between the major surfaces. Package contacts at the remote surface include a first set of contacts at positions closer to the first major surface than a second set of contacts, which instead are at positions closer to the second major surface. The packages are configured such that major surfaces of each package can be oriented in a nonparallel direction with the major surface of a substrate, the package contacts electrically coupled to corresponding contacts at the substrate surface. The package stacking and orientation can provide increased packing density.

公开(公告)号：US09659848B1

公开(公告)日：2017-05-23

申请号：US15086899

申请日：2016-03-31

Applicant: Invensas Corporation

Inventor： Grant Villavicencio ,  Sangil Lee ,  Roseann Alatorre ,  Javier A. Delacruz ,  Scott McGrath

IPC: H01L23/48 ,  H01L21/00 ,  H01L23/498 ,  H01L23/31 ,  H01L23/495 ,  H01L23/043 ,  H01L23/053 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49811 ,  H01L21/4825 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/043 ,  H01L23/053 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/4952 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/81805 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/15313 ,  H01L2924/15333 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/014 ,  H01L2924/00012

Abstract: A component can include a generally planar element, a reinforcing dielectric layer overlying the generally planar element, an encapsulation overlying the reinforcing dielectric layer, and a plurality of wire bonds. Each wire bond can have a tip at a major surface of the encapsulation. The wire bonds can have first portions extending within the reinforcing dielectric layer. The first portions of at least some of the wire bonds can have bends that change an extension direction of the respective wire bond. The reinforcing dielectric layer can have protruding regions surrounding respective ones of the wire bonds, the protruding regions extending to greater peak heights from the first surface of the generally planar element than portions of the reinforcing dielectric layer between adjacent ones of the protruding regions. The peak heights of the protruding regions can coincide with points of contact between the reinforcing dielectric layer and individual wire bonds.