公开(公告)号：US09997486B2

公开(公告)日：2018-06-12

申请号：US15115827

申请日：2015-02-03

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi Akutsu ,  Reiji Tsukao

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  B32B27/18 ,  C09J4/00 ,  C09J7/00 ,  C09J9/02 ,  C09J163/00 ,  C09J201/00 ,  H01B1/02 ,  C08F220/18 ,  B32B27/08 ,  B32B27/20 ,  B32B27/38 ,  B32B27/14 ,  H01R4/04 ,  H05K3/32

CPC classification number: H01L24/29 ,  B32B27/08 ,  B32B27/14 ,  B32B27/18 ,  B32B27/20 ,  B32B27/38 ,  B32B2307/202 ,  B32B2457/00 ,  C08F220/18 ,  C08K2201/001 ,  C09J4/00 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J163/00 ,  C09J201/00 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01B1/02 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27848 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83204 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2924/06 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/2021 ,  H01L2924/2064 ,  H01L2924/3511 ,  H01R4/04 ,  H05K3/323 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/066 ,  H01L2924/0675 ,  H01L2924/069 ,  H01L2924/07025 ,  H01L2924/061 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An anisotropic conductive film has a first connection layer and a second connection layer formed on surface of the first connection layer. The first connection layer is a photopolymerized resin layer, and the second connection layer is a thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of first connection layer on the side of second connection layer, conductive particles for anisotropic conductive connection are arranged in a single layer. A region in which the curing ratio is lower than that of the surface of the first connection layer exists in a direction oblique to the thickness direction of the first connection layer. Alternatively, the curing ratio of a region relatively near another surface of the first connection layer among regions of the first connection layer in the vicinity of the conductive particles is lower than that of the surface of the first connection layer.

公开(公告)号：US20180151935A1

公开(公告)日：2018-05-31

申请号：US15429487

申请日：2017-02-10

Applicant: TennVac Inc. ,  TennMAX America Inc.

Inventor： Pai-Lee CHANG ,  Guan-Yu CHEN

IPC: H01P3/12 ,  H01P11/00 ,  C09J123/06 ,  C09J5/04

CPC classification number: H01P3/12 ,  C09J5/04 ,  C09J123/06 ,  C09J2201/602 ,  C09J2423/04 ,  H01P1/042 ,  H01P11/002

Abstract: The present invention provides a method of manufacturing a waveguide assembly and a structure thereof, wherein the manufacturing method comprises the steps of: providing at least two waveguide units and combining the waveguide units, wherein each waveguide unit has at least one bonding portion formed at a position where each two said waveguide units are combined; and at least one adhesive is applied to the bonding portion to combine the waveguide units into the waveguide assembly. With the practice of the present invention, many advanced functions such as rapid design, rapid manufacture, rapid verification and cost reduction can be achieved.

公开(公告)号：US20180134920A1

公开(公告)日：2018-05-17

申请号：US15572778

申请日：2016-05-23

Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

Inventor： Kouji TAKAMI ,  Yoshihisa YAMAMOTO ,  Kenji KAMINO

IPC: C09J7/30 ,  B32B7/12 ,  B32B15/04 ,  B32B15/08 ,  C09J7/28 ,  C09J9/02 ,  H05K1/02

CPC classification number: C09J7/30 ,  B32B7/12 ,  B32B15/04 ,  B32B15/08 ,  B32B15/092 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2307/212 ,  B32B2457/08 ,  C08K3/32 ,  C08K2201/001 ,  C09J7/28 ,  C09J9/02 ,  C09J153/005 ,  C09J163/00 ,  C09J2201/602 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2400/163 ,  C09J2453/00 ,  C09J2463/00 ,  C09K17/42 ,  H05K1/02 ,  H05K1/0216 ,  H05K9/0086 ,  C08L63/00 ,  C08K2003/329

Abstract: There is provided a shielding film that simultaneously satisfies excellent high-speed transmission characteristics and excellent flame retardancy. A shielding film according to the present invention includes: a metal layer; and a conductive adhesive layer arranged on one side of the metal layer. The conductive adhesive layer contains a cured product of an epoxy resin and a carboxyl group-containing elastomer, an organic phosphorus-based flame retardant, and a conductive filler; the metal layer has a thickness of from 0.3 μm to 7 μm; and a conductive adhesive forming the conductive adhesive layer contains 10 parts by weight to 50 parts by weight of the organic phosphorus-based flame retardant and 10 parts by weight to 80 parts by weight of the conductive filler with respect to 100 parts by weight of a total of the epoxy resin and the carboxyl group-containing elastomer.

公开(公告)号：US20180086954A1

公开(公告)日：2018-03-29

申请号：US15705470

申请日：2017-09-15

Applicant: NITTO DENKO CORPORATION

Inventor： Ryo MORIOKA ,  Akira HIRAO ,  Mitsuhiro KANADA

IPC: C09J133/08 ,  C09J9/02 ,  C09J11/04

CPC classification number: C09J133/08 ,  C08K3/013 ,  C08K2201/001 ,  C09J7/385 ,  C09J9/02 ,  C09J11/04 ,  C09J2201/602 ,  C09J2201/622 ,  C09J2203/318 ,  C09J2203/322 ,  C09J2203/326 ,  C09J2205/102

Abstract: Provided is a filler-containing pressure-sensitive adhesive tape having an excellent pressure-sensitive adhesive strength while suppressing the occurrence of a volatile component. The filler-containing pressure-sensitive adhesive tape includes a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive resin containing an acrylic polymer and a filler dispersed in the pressure-sensitive adhesive resin, in which the acrylic polymer contains at least a constituent unit derived from a (meth)acrylic acid alkyl ester having a linear or branched alkyl group having 1 to 20 carbon atoms, a constituent unit derived from a nitrogen-containing monomer, and a constituent unit derived from a carboxyl group-containing monomer, and has a ratio (mass ratio) of the constituent unit derived from the carboxyl group-containing monomer to the constituent unit derived from the nitrogen-containing monomer of from 0.01 to 40.

公开(公告)号：US09902880B2

公开(公告)日：2018-02-27

申请号：US14997130

申请日：2016-01-15

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Koji Motomura

IPC: H01L23/00 ,  C09J9/02 ,  H05K3/32 ,  C09J163/00 ,  H05K1/14

CPC classification number: C09J9/02 ,  C09J163/00 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2481/00 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/2939 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2924/351 ,  H05K1/141 ,  H05K3/323 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  H05K2201/10674 ,  H05K2201/10727 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A film material includes a substrate and a film layer arranged on one main surface of the substrate. The film layer contains a fibrous first resin and a thermosetting second resin in an uncured or semi-cured state, and a linear expansion coefficient CF of the first resin is smaller than a linear expansion coefficient CR of the second resin in cured state.

公开(公告)号：US20170306187A1

公开(公告)日：2017-10-26

申请号：US15526119

申请日：2015-10-29

Applicant: TESA SE

Inventor： Nicolai BÖHM ,  Michael MIES ,  Dennis SEITZER ,  Daniel WIENKE

IPC: C09J7/04 ,  C09J11/04 ,  C08K3/34 ,  C09J133/20 ,  B60R16/02

CPC classification number: C09J11/04 ,  B60R16/0215 ,  C08K3/34 ,  C08K9/04 ,  C09J7/21 ,  C09J7/38 ,  C09J133/06 ,  C09J133/20 ,  C09J2201/122 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2203/302 ,  C09J2205/102 ,  C09J2400/263 ,  C09J2433/00

Abstract: Pressure-sensitive adhesive material comprising an acrylate dispersion wherein the acrylate dispersion comprises (i) an aqueous acrylate polymer dispersion containing polymers composed of a) acrylate monomers and, optionally, b) ethylenically unsaturated comonomers that are not acrylates, and (ii) modified phylosilicates

公开(公告)号：US09735299B2

公开(公告)日：2017-08-15

申请号：US13989087

申请日：2011-11-23

Applicant: Donald Herr ,  Brian A. Harkins

Inventor： Donald Herr ,  Brian A. Harkins

IPC: C09J7/02 ,  H01L31/05 ,  C09J9/02 ,  H01L31/0224 ,  C08K3/04 ,  C08K3/08

CPC classification number: H01L31/0512 ,  C08K3/04 ,  C08K3/08 ,  C09J7/22 ,  C09J7/28 ,  C09J7/385 ,  C09J9/02 ,  C09J2201/602 ,  C09J2203/322 ,  C09J2205/102 ,  C09J2400/163 ,  C09J2433/00 ,  H01L31/022425 ,  Y02E10/50 ,  Y10T428/252 ,  Y10T428/256 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/287 ,  Y10T428/2874 ,  Y10T428/2887 ,  Y10T428/2891 ,  Y10T428/2896 ,  Y10T442/10

Abstract: A reactive pressure sensitive adhesive composition is disclosed. A tape formed using the reactive pressure sensitive adhesive is also disclosed. In its cured state, the pressure sensitive adhesive shows superior mechanical and electrical properties compared to conventional, non-curable charge collection tapes. The tape has a cure profile pre-selected to correspond to that of a photovoltaic cell fabrication process, such that curing can take place during cell fabrication and may occur simultaneously with one or more other curing steps employed in cell fabrication.

公开(公告)号：US20170210947A1

公开(公告)日：2017-07-27

申请号：US15124900

申请日：2015-02-10

Applicant: DEXERIALS CORPORATION

Inventor： Yasunobu Yamada ,  Morio Sekiguchi ,  Susumu Kumakura

IPC: C09J7/00 ,  C09J11/04 ,  H01B1/12 ,  C09J9/02 ,  H01R4/04 ,  H01L23/00

CPC classification number: C09J7/00 ,  C08K2201/001 ,  C08L75/04 ,  C09J7/10 ,  C09J9/02 ,  C09J11/04 ,  C09J167/00 ,  C09J175/04 ,  C09J2201/602 ,  C09J2201/61 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2467/00 ,  C09J2475/00 ,  H01B1/124 ,  H01B1/22 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2924/01047 ,  H01R4/04

Abstract: An anisotropic conductive film for anisotropically conductively connecting a terminal of a first electronic component and a terminal of a second electronic component, the anisotropic conductive film including: a conductive particle-containing layer, which contains an adhesive layer-forming component and conductive particles, wherein the conductive particle-containing layer has two endothermic peaks in differential scanning calorimetry where endothermic peak temperatures are measured under conditions that a measuring temperature range is from 10° C. to 250° C. and a heating speed is 10° C./min, and wherein T2 is 30° C. or higher, and T4−T2 is greater than 0° C. but 80° C. or less, where T2 is a temperature of the endothermic peak present at a lower temperature side, and T4 is a temperature of the endothermic peak present at a higher temperature side.

公开(公告)号：US20170170526A1

公开(公告)日：2017-06-15

申请号：US15358150

申请日：2016-11-22

Applicant: Xiaomi Inc.

Inventor： Zongqiang WANG ,  Xianmin ZHANG ,  Shasha SHI

IPC: H01M10/42 ,  B23K26/21 ,  C09J9/02 ,  C09J7/00 ,  C09J5/00 ,  H01M10/44 ,  H01M10/04

CPC classification number: H01M10/425 ,  B23K26/21 ,  C09J5/00 ,  C09J7/00 ,  C09J9/02 ,  C09J2201/602 ,  C09J2203/33 ,  H01M2/021 ,  H01M2/30 ,  H01M2/34 ,  H01M10/04 ,  H01M10/443 ,  H01M2220/20 ,  H01M2220/30 ,  H05K1/117 ,  H05K1/181 ,  H05K3/321 ,  H05K3/325 ,  H05K3/3442 ,  H05K2201/10037 ,  H05K2201/10181 ,  H05K2201/10409

Abstract: Disclosed are a protective main board for a battery cell, an electronic terminal and a method for assembling a battery cell of an electronic terminal. The protective main board for a battery cell includes a main board body and a conducting component. The main board body includes a main board circuit and a protection circuit configured to protect the battery cell, and the protection circuit is connected with the main board circuit. The conducting component is arranged on the main board body, and includes a first conducting member and a second conducting member, and the battery cell is electrically connected with the protection circuit through the first conducting member and the second conducting member respectively.

公开(公告)号：US09660131B2

公开(公告)日：2017-05-23

申请号：US13835018

申请日：2013-03-15

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Naoki Fukushima ,  Isao Tsukagoshi ,  Takehiro Shimizu

IPC: H01L31/18 ,  C09J5/06 ,  C09J7/02 ,  C09J9/02 ,  H01L31/05

CPC classification number: H01L31/186 ,  C09J5/06 ,  C09J7/22 ,  C09J7/35 ,  C09J9/02 ,  C09J2201/128 ,  C09J2201/602 ,  C09J2203/322 ,  C09J2400/163 ,  H01L31/0512 ,  Y02E10/50 ,  Y10T29/49194

Abstract: The electric conductor connection method of the invention is a method for electrical connection between a mutually separated first electric conductor and second electric conductor, comprising a step of hot pressing a metal foil, a first adhesive layer formed on one side of the metal foil and a first electric conductor, arranged in that order, to electrically connect and bond the metal foil and first electric conductor, and hot pressing the metal foil, the first adhesive layer or second adhesive layer formed on the other side of the metal foil, and the second electric conductor, arranged in that order, to electrically connect and bond the metal foil and the second electric conductor.